Grounding circuit, circuit board and display device

Abstract

The utility model discloses a grounding circuit, a circuit board and a display device, and the grounding circuit comprises a resistor which is disposed between a copper-exposed region and a ground wire and is used for connecting the copper-exposed region and the ground wire; and the regulation and control circuit is selectively connected between the copper exposing area and the ground wire and is used for filtering clutter signals on the copper exposing area. Through the above structure, the electromagnetic compatibility of the electronic product is improved.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a grounding circuit, a circuit board, and a display device. Background Technology

[0002] EMC (Electromagnetic Compatibility) refers to the ability of a device or system to operate within its electromagnetic environment without causing unacceptable electromagnetic interference to any other device in that environment. EMC includes EMI (Electromagnetic Interference) and EMS (Electromagnetic Susceptibility), which are electromagnetic interference and electromagnetic immunity, respectively. EMI describes the degree of electromagnetic radiation interference a product may cause to other products, and whether it will affect the normal operation of other electronic and electrical products in the same electrical environment. EMI includes conducted emission (CE), radiated emission (RE), and harmonics. EMS describes whether an electronic or electrical product is affected by interference from its surrounding environment or other electronic or electrical products in the same electrical environment, thus affecting its normal operation. EMS includes related items such as electrostatic discharge (ESD) immunity, radio frequency immunity (EFT), electrical fast transient / burst immunity, surge immunity, and voltage sag immunity (Dip).

[0003] In existing circuit board (PCB) designs, exposed copper is grounded. The purpose of exposed copper is to connect the noise on the board to the entire device and conduct it out. The disadvantage is that noise from the entire device can also interfere with the signals on the PCB. Utility Model Content

[0004] The purpose of this invention is to provide a grounding circuit, a circuit board, and a display device to improve the EMC capability of the display panel.

[0005] To address the aforementioned technical problems, the first aspect of this application provides a grounding circuit, comprising: a resistor disposed between an exposed copper area and a grounding terminal for grounding the exposed copper area; and a regulating circuit selectively connected across the two ends of the resistor, connected in parallel with the resistor between the exposed copper area and the grounding terminal for filtering noise signals between the exposed copper area and the grounding terminal.

[0006] Preferably, the control circuit includes: a capacitor, selectively connected between the exposed copper area and the ground terminal via a switching circuit; and an inductor, selectively connected between the exposed copper area and the ground terminal via the switching circuit.

[0007] Preferably, the values ​​of the capacitor and the inductor are adjustable.

[0008] To address the aforementioned technical problems, a second aspect of this application also provides a circuit board, the circuit board comprising: a plurality of exposed copper areas, a ground copper layer, and a grounding circuit disposed between each of the exposed copper areas and the ground copper layer, wherein the grounding circuit comprises the grounding circuit as described in any embodiment of the first aspect.

[0009] Preferably, the exposed copper area and the grounded copper layer are located on the same layer and are spaced apart from each other.

[0010] Preferably, the circuit board includes multiple layers of exposed copper areas, each of which is connected by vias.

[0011] Preferably, the circuit board includes a first module and a second module, and a plurality of first exposed copper areas connected to the first module and a plurality of second exposed copper areas connected to the second module; wherein each first exposed copper area is connected to a first grounded copper layer through a grounding circuit, and each second exposed copper area is connected to a second grounded copper layer through a grounding circuit.

[0012] Preferably, the first ground copper layer and the second ground copper layer are located on different layers of the circuit board.

[0013] Preferably, the first module is a power supply module and the second module is a signal module.

[0014] To address the aforementioned technical problems, a third aspect of this application also provides a display device, the display device comprising a display panel and a circuit board connected to the display panel via a flip-chip film, wherein the circuit board comprises the circuit board described in any embodiment of the second aspect above.

[0015] The beneficial effects of this application are: by designing multiple independent exposed copper areas on the circuit board, and selectively connecting a control circuit between each exposed copper area and the ground copper layer, when the interference signal is too large, the noise signal between the exposed copper area and the ground terminal can be filtered out by connecting the control circuit, thereby improving the EMC performance of the display panel; when the interference signal is not large, the exposed copper area and the ground copper layer can also be connected by a resistor to ensure that the exposed copper area can be grounded normally. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 A schematic diagram of the structure of an embodiment of the grounding circuit provided in this application;

[0018] Figure 2 This is a schematic diagram of a specific embodiment of the grounding circuit provided in this application;

[0019] Figure 3 A schematic diagram of the structure of an embodiment of the circuit board provided in this application;

[0020] Figure 4 A schematic diagram of a circuit board grounding circuit according to an embodiment of the present application;

[0021] Figure 5 A cross-sectional structural schematic diagram of an embodiment of the circuit board provided in this application;

[0022] Figure 6 A schematic diagram of the structure of a specific embodiment of the circuit board provided in this application;

[0023] Figure 7 This is a schematic diagram of the structure of an embodiment of the display device provided in this application.

[0024] Symbol explanation:

[0025] Grounding circuit 10; Control circuit 11; Exposed copper area 100; Grounding terminal GND; Resistor R; Capacitor C; Inductor L; Switching circuit 12;

[0026] Circuit board 1000; ground copper layer 200; first module 301; second module 302; first exposed copper area 101; second exposed copper area 102; first ground copper layer 201; second ground copper layer 202; display panel 2000; COF (Chip-on-Foil) film. Detailed Implementation

[0027] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0028] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to limit the application. The singular forms “a,” “said,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms, unless otherwise clearly indicated above. “Multiple” generally includes at least two, but does not exclude the inclusion of at least one.

[0029] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0030] It should be understood that the terms "comprising," "including," or any other variations used herein are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0031] It should be noted that if the embodiments of this application involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0032] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in every place in the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0033] The present application will now be further described in conjunction with the accompanying drawings and specific embodiments.

[0034] This application provides a grounding circuit; please refer to [link / reference]. Figure 1 , Figure 1 A schematic diagram of an embodiment of the grounding circuit provided in this application is shown below. Figure 1 As shown, the grounding circuit 10 includes a resistor R and a regulating circuit 11. The resistor R is positioned between the exposed copper area 100 and the grounding terminal GND to ground the exposed copper area 100. The regulating circuit 11 is selectively connected across the two ends of the resistor R, and is connected in parallel with the resistor R between the exposed copper area 100 and the grounding terminal GND. It is used to filter noise signals between the exposed copper area 100 and the grounding terminal GND, thereby preventing noise signals from the outdoor unit (equivalent to the grounding terminal GND) from being transmitted back to the exposed copper area on the PCB board, thus interfering with the signals on the PCB board and improving the EMC capability of the electronic product.

[0035] Among them, the exposed copper area 100 is the copper layer in the circuit board that performs the grounding function.

[0036] It should be noted that GND (Ground) on circuit diagrams and circuit boards represents the ground wire or neutral wire. GND means common terminal, or ground, but this ground is not a true ground in the strictest sense; it is an assumed ground for application purposes. For the power supply, it is the negative terminal. It is different from earth ground. In this embodiment, the ground terminal GND is an assumed ground.

[0037] In this embodiment, when interference is detected during EMC testing, the control circuit 11 is connected to both ends of the resistor to filter out noise signals, optimize the grounding performance of the exposed copper area, and improve the EMC capability of the electronic product; when no interference is detected, the control circuit 11 is not connected to both ends of the resistor to ensure that the exposed copper area is properly grounded.

[0038] Further, please refer to Figure 2 , Figure 2 This is a schematic diagram of a specific embodiment of the grounding circuit provided in this application. Figure 2 As shown, the control circuit 11 includes a capacitor C and an inductor L. The capacitor C is selectively connected between the exposed copper area 100 and the ground terminal GND via a switching circuit 12. The inductor L is also selectively connected between the exposed copper area 100 and the ground terminal GND via a switching circuit 12. While the capacitor C and inductor L are controlled by the same switching circuit 12 to determine whether they are connected between the exposed copper area 100 and the ground terminal GND, in other embodiments, different switching circuits 12 may be used, which is not limited here. The switching circuit 12 includes a switching transistor or a MOSFET, etc.

[0039] The values ​​of capacitor C and inductor L are adjustable. Specifically, the capacitance value of capacitor C and the inductance value of inductor L are adjustable. The adjustment method includes connecting different capacitors C and inductors L between the exposed copper area 100 and the ground terminal GND, thereby enabling the control circuit 11 to adjust the anti-interference performance between the exposed copper area 100 and the ground terminal GND. In other words, different values ​​of capacitor C and inductor L are preset, and different values ​​of capacitor C and inductor L are selectively activated, thus achieving adjustability.

[0040] This application also provides a circuit board, please refer to the details. Figure 3 , Figure 3 This is a schematic diagram of the structure of one embodiment of the circuit board provided in this application. Figure 3 As shown, the circuit board includes multiple exposed copper areas 100, a ground copper layer 200, and a grounding circuit 10 disposed between each exposed copper area 100 and the ground copper layer 200.

[0041] In one specific embodiment, the grounding copper layer 200 is a full-surface copper layer on the circuit board, used to connect with the external unit of the display device, thereby transmitting interference signals. In other embodiments, the grounding copper layer 200 may also be the back plate, metal casing, or cover plate of the display device, etc., and is not limited here.

[0042] Please refer to further information. Figure 4 , Figure 4 This is a schematic diagram of an embodiment of the circuit board grounding circuit provided in this application. Figure 4 As shown, each grounding circuit 10 includes a resistor R, a capacitor C, and an inductor L. Each resistor R is connected between each exposed copper area 100 and the grounded copper layer 200, each capacitor C is connected between each exposed copper area 100 and the grounded copper layer 200, and each inductor L is connected between each exposed copper area 100 and the grounded copper layer 200.

[0043] In one embodiment, the exposed copper area 100 and the ground copper layer 200 are located on the same layer and are spaced apart from each other. In another embodiment, the exposed copper area 100 and the ground copper layer 200 are located on different layers.

[0044] Furthermore, the circuit board includes multiple layers of exposed copper areas 100, each layer of exposed copper areas 100 being interconnected via vias. See details for further information. Figure 5 , Figure 5 This is a cross-sectional structural diagram of an embodiment of the circuit board provided in this application. Figure 5 As shown, the circuit board specifically includes a first layer of exposed copper area L1, a second layer of exposed copper area L2, a third layer of exposed copper area L3, and a fourth layer of exposed copper area L4. The multiple layers of exposed copper areas are electrically connected through vias 111.

[0045] In one specific embodiment, the circuit board includes at least a first module 301 and a second module 302, wherein the first module 301 and the second module 302 are electronic components disposed on the circuit board. Please refer to the following for details. Figure 6 , Figure 6 This is a schematic diagram of a specific embodiment of the circuit board provided in this application. Figure 6 As shown, the circuit board includes a first module 301 and a second module 302, as well as a plurality of first exposed copper areas 101 connected to the first module 301 and a plurality of second exposed copper areas 102 connected to the second module 302. Each first exposed copper area 101 is connected to a first grounded copper layer 201 through a grounding circuit 10, and each second exposed copper area 102 is connected to a second grounded copper layer 202 through a grounding circuit 10.

[0046] In this embodiment, the first ground copper layer 201 and the second ground copper layer 202 are located on different layers. However, in other embodiments, they may be located on the same layer. That is, the first ground copper layer 201 and the second ground copper layer 202 may be the same copper layer or different copper layers.

[0047] In one application scenario, the first module 301 is a power module, which supplies power to the display panel; the second module 302 is a signal module, which transmits signals to the display panel. The power module and the signal module are the two main functional modules in the display device. By improving the EMC capability of the power module and the signal module through a grounding circuit, the EMC capability of the display device can be significantly improved.

[0048] This application also provides a display device, please refer to the details. Figure 7 , Figure 7 This is a schematic diagram of the structure of an embodiment of the display device provided in this application. Figure 7 As shown, the display device includes a display panel 2000, a chip-on-film (COF) film, and a circuit board 1000. The circuit board 1000 is electrically connected to the display panel 2000 through the COF film.

[0049] In this embodiment, the grounding copper layer can be the metal backplate of the display device, and is not limited thereto.

[0050] The beneficial effects of this application are: by designing multiple independent exposed copper areas on the circuit board, and selectively connecting a control circuit between each exposed copper area and the ground copper layer, when the interference signal is too large, the noise signal between the exposed copper area and the ground terminal can be filtered out by connecting the control circuit, thereby improving the EMC performance of the display panel; when the interference signal is not large, the exposed copper area and the ground copper layer can also be connected by a resistor to ensure that the exposed copper area can be grounded normally.

[0051] The above description is merely an embodiment of this application and does not limit the scope of patent protection of this application. Any equivalent structural or procedural changes made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of this application.

Claims

1. A grounding circuit, characterized in that, The grounding circuit includes: A resistor is placed between the exposed copper area and the grounding terminal to connect the exposed copper area to the ground. The control circuit is selected to be connected across the two ends of the resistor, and is connected in parallel with the resistor between the exposed copper area and the ground terminal, for filtering noise signals between the exposed copper area and the ground terminal.

2. The grounding circuit according to claim 1, characterized in that, The control circuit includes: A capacitor is selectively connected between the exposed copper area and the ground terminal via a switching circuit. An inductor is selectively connected between the exposed copper area and the ground terminal via the switching circuit.

3. The grounding circuit according to claim 2, characterized in that, The values ​​of the capacitor and the inductor are adjustable.

4. A circuit board, characterized in that, The circuit board includes: a plurality of exposed copper areas, a ground copper layer, and a grounding circuit disposed between each of the exposed copper areas and the ground copper layer, wherein the grounding circuit includes the grounding circuit according to any one of claims 1 to 3.

5. The circuit board according to claim 4, characterized in that, The exposed copper area and the grounded copper layer are located on the same layer and are spaced apart from each other.

6. The circuit board according to claim 4, characterized in that, The circuit board includes multiple layers of exposed copper areas, and each layer of exposed copper areas is connected by vias.

7. The circuit board according to claim 4, characterized in that, The circuit board includes a first module and a second module, as well as a plurality of first exposed copper areas connected to the first module and a plurality of second exposed copper areas connected to the second module; Each of the first exposed copper areas is connected to the first grounded copper layer through a grounding circuit, and each of the second exposed copper areas is connected to the second grounded copper layer through a grounding circuit.

8. The circuit board according to claim 7, characterized in that, The first ground copper layer and the second ground copper layer are located on different layers of the circuit board.

9. The circuit board according to claim 7, characterized in that, The first module is a power supply module, and the second module is a signal module.

10. A display device, characterized in that, The display device includes a display panel and a circuit board connected to the display panel via a flip-chip film, wherein the circuit board includes the circuit board according to any one of claims 4 to 9.

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