Ceramic substrate with heat conduction function

Abstract

The utility model discloses a ceramic substrate with a heat conduction function. The ceramic substrate comprises an insulating layer, a first ceramic base layer, a second ceramic base layer, a heat dissipation copper pipe, a first circuit layer, a second circuit layer and a heat dissipation assembly. A first heat dissipation plate is attached to the upper surface of the first circuit layer; the second heat dissipation plate is attached to the lower surface of the second circuit layer; the heat conduction plate is arranged in the mounting hole and is in contact with the first heat dissipation plate and the second heat dissipation plate, heat on the inner side and the outer side of the ceramic substrate in the using process can be dissipated outwards through cooperation of the first heat dissipation plate, the second heat dissipation plate and the heat conduction plate, and ventilation grooves penetrate through the heat dissipation copper pipes; the heat dissipation efficiency in the ceramic substrate is further improved by matching with the heat dissipation copper pipe; the overall heat dissipation effect is better; the normal working state of the ceramic substrate is prevented from being influenced by heat accumulation, and the internal structure of the ceramic substrate is prevented from being damaged by long-time heat accumulation.

Description

Technical Field

[0001] This utility model relates to the field of ceramic substrates, and in particular to a ceramic substrate with thermal conductivity. Background Technology

[0002] Ceramic substrates are special boards made by directly bonding copper foil to the surface (single-sided or double-sided) of an alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate at high temperatures. The resulting ultra-thin composite substrates possess excellent electrical insulation properties, high thermal conductivity, excellent solderability, and high adhesion strength. Like PCB boards, they can be etched with various patterns and have a large current-carrying capacity. Therefore, ceramic substrates have become a fundamental material for high-power power electronic circuit structure and interconnection technologies.

[0003] Existing ceramic substrates typically dissipate heat using external cooling fans or heat sinks attached to the surface. However, both methods only remove heat from the surface of the substrate, leaving heat trapped inside. This traps heat inside the substrate, affecting its normal operation and potentially damaging its structure over time. Therefore, further improvements to the existing ceramic substrate structure are necessary. Utility Model Content

[0004] In view of this, the present invention addresses the deficiencies of the existing technology, and its main purpose is to provide a ceramic substrate with thermal conductivity, which can effectively solve the problems of poor heat dissipation, easy heat accumulation, impact on the working process of the ceramic substrate, and easy damage to the ceramic substrate due to heat accumulation.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A ceramic substrate with thermal conductivity includes an insulating layer, a first ceramic base layer, a second ceramic base layer, a heat dissipation copper pipe, a first circuit layer, a second circuit layer, and a heat dissipation assembly. The first and second ceramic base layers are respectively attached to the upper and lower surfaces of the insulating layer. The heat dissipation copper pipe is embedded in the insulating layer, extending front to back, with both ends of the copper pipe protruding outward from the end face of the insulating layer. A ventilation groove runs through the copper pipe, and multiple copper pipes are arranged horizontally at intervals. The first circuit layer covers the upper surface of the first ceramic base layer, and the second circuit layer covers the lower surface of the second ceramic base layer. A through-insulating layer and a first ceramic base layer connect the first and second circuit layers. The ceramic substrate and the second ceramic substrate have through holes, and the through holes are filled with conductive paste that connects the first circuit layer and the second circuit layer; the heat dissipation components are multiple horizontally spaced, and the heat dissipation copper pipes are arranged horizontally and sequentially at intervals with the heat dissipation components; each heat dissipation component includes a first heat dissipation plate, a second heat dissipation plate, and a heat-conducting plate; the first heat dissipation plate is attached to the upper surface of the first circuit layer; the second heat dissipation plate is attached to the lower surface of the second circuit layer; the first heat dissipation plate and the second heat dissipation plate are connected by a mounting hole that penetrates the insulating layer, the first ceramic substrate, and the second ceramic substrate, and the heat-conducting plate is disposed in the mounting hole and contacts the first heat dissipation plate and the second heat dissipation plate respectively.

[0007] As a preferred embodiment, the insulating layer is a carbon fiber insulating layer.

[0008] As a preferred embodiment, it also includes two symmetrically arranged edge-wrapping structures. Each edge-wrapping structure includes a body, and a first fixing part and a second fixing part extending outward integrally from the upper and lower end faces of the body towards the same side of the body. The body of each edge-wrapping structure is attached to the corresponding sidewalls of the insulating layer, the first ceramic base layer and the second ceramic base layer. The first fixing part and the second fixing part clamp the upper surface of the first ceramic base layer and the lower surface of the second ceramic base layer, respectively.

[0009] As a preferred embodiment, the edging structure is made of carbon fiber.

[0010] As a preferred embodiment, the inner diameter of the heat dissipation copper pipe is half the thickness of the insulation layer.

[0011] As a preferred embodiment, the upper surface of the first circuit layer is covered with a first antioxidant layer; and the lower surface of the second circuit layer is covered with a second antioxidant layer.

[0012] As a preferred embodiment, the first heat sink, the second heat sink, and the heat-conducting plate are all made of graphene.

[0013] Compared with the prior art, this utility model has obvious advantages and beneficial effects. Specifically, as can be seen from the above technical solution:

[0014] A first heat sink is attached to the upper surface of the first circuit layer; a second heat sink is attached to the lower surface of the second circuit layer; and a heat-conducting plate is disposed in the mounting hole and in contact with the first and second heat sinks respectively. Through the cooperation of the first heat sink, the second heat sink, and the heat-conducting plate, heat from both the inside and outside of the ceramic substrate during use can be dissipated outwards. A heat dissipation copper pipe is embedded in the insulating layer, extending forward and backward. Both ends of the heat dissipation copper pipe protrude outwards from the end face of the insulating layer, and ventilation grooves penetrate the copper pipe. The use of the heat dissipation copper pipe further increases the heat dissipation efficiency inside the ceramic substrate, resulting in better overall heat dissipation. This prevents heat accumulation from affecting the normal operation of the ceramic substrate and also avoids long-term heat accumulation from damaging the internal structure of the ceramic substrate.

[0015] To more clearly illustrate the structural features and effects of this utility model, the following detailed description of this utility model is provided in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description

[0016] Figure 1 This is a cross-sectional schematic diagram of a preferred embodiment of the present invention.

[0017] Explanation of reference numerals in the attached diagram:

[0018] 10. Insulating layer 101. Through hole

[0019] 102, Mounting Hole 20, First Ceramic Base

[0020] 30. Second ceramic base layer; 40. Copper heat dissipation pipe

[0021] 401, Ventilation slot; 50, First circuit layer

[0022] 51. First antioxidant layer; 60. Second circuit layer

[0023] 61. Second anti-oxidation layer; 70. Heat dissipation component

[0024] 71. First heat sink 72. Second heat sink

[0025] 73. Heat-conducting plate; 80. Edge-wrapping structure

[0026] 81. Main body 82. First fixing part

[0027] 83. Second fixing part. Detailed Implementation

[0028] Please refer to Figure 1 As shown, it illustrates the specific structure of a preferred embodiment of the present invention, which includes an insulating layer 10, a first ceramic base layer 20, a second ceramic base layer 30, a heat dissipation copper pipe 40, a first circuit layer 50, a second circuit layer 60, and a heat dissipation component 70.

[0029] The first ceramic base layer 20 and the second ceramic base layer 30 are respectively attached to the upper and lower surfaces of the insulating layer 10; in this embodiment, the insulating layer 10 is a carbon fiber insulating layer.

[0030] The heat dissipation copper pipe 40 is embedded in the insulating layer 10, extending forward and backward. Both ends of the heat dissipation copper pipe 40 protrude outward from the end face of the insulating layer 10. A ventilation groove 401 runs through the heat dissipation copper pipe 40, and multiple heat dissipation copper pipes 40 are arranged laterally at intervals. Furthermore, both ends of the heat dissipation copper pipe 40 extend outward from the insulating layer 10, and the water-cooling process is achieved through cooperation with an external water-cooling structure. In this embodiment, the inner diameter of the heat dissipation copper pipe 40 is half the thickness of the insulating layer, thereby ensuring the ventilation volume and heat dissipation efficiency of the ventilation groove 401.

[0031] The first circuit layer 50 is applied to the upper surface of the first ceramic substrate 20, and the second circuit layer 60 is applied to the lower surface of the second ceramic substrate 30. A through-hole 101 is provided between the first circuit layer 50 and the second circuit layer 60, penetrating the insulating layer 10, the first ceramic substrate 20, and the second ceramic substrate 30. The through-hole 301 is filled with a conductive paste that connects the first circuit layer 50 and the second circuit layer 60, thereby enabling conductivity between the first circuit layer 50 and the second circuit layer 60. The upper surface of the first circuit layer 50 is covered with a first anti-oxidation layer 51, and the lower surface of the second circuit layer 60 is covered with a second anti-oxidation layer 61. The first anti-oxidation layer 51 and the second anti-oxidation layer 61 are used to prevent the first circuit layer 50 and the second circuit layer 60 from being oxidized during use.

[0032] The heat dissipation components 70 are arranged in multiple horizontally spaced groups, with the heat dissipation copper pipes 40 arranged horizontally in sequence with the heat dissipation components 70. Each heat dissipation component 70 includes a first heat dissipation plate 71, a second heat dissipation plate 72, and a heat-conducting plate 73. The first heat dissipation plate 71 is attached to the upper surface of the first circuit layer 50, and the second heat dissipation plate 72 is attached to the lower surface of the second circuit layer 60. A mounting hole 102, penetrating the insulating layer 10, the first ceramic substrate 20, and the second ceramic substrate 30, connects the first heat dissipation plate 71 and the second heat dissipation plate 72. The heat-conducting plate 73 is disposed in the mounting hole 102 and contacts the first heat dissipation plate 71 and the second heat dissipation plate 72, thereby transferring heat from the inside of the ceramic substrate to the outside of the ceramic substrate through the heat-conducting plate 73, thus improving its heat dissipation performance. The first heat dissipation plate 71, the second heat dissipation plate 72, and the heat-conducting plate 73 are all made of graphene.

[0033] Furthermore, it also includes two symmetrically arranged edge-binding structures 80. Each edge-binding structure 80 includes a body 81, and a first fixing part 82 and a second fixing part 83 extending integrally outward from the upper and lower end faces of the body 81 towards the same side. The body 81 of each edge-binding structure is attached to the corresponding sidewalls of the insulating layer 10, the first ceramic base layer 20, and the second ceramic base layer 30. The first fixing part 82 and the second fixing part 83 respectively clamp the upper surface of the first ceramic base layer 20 and the lower surface of the second ceramic base layer 30. This edge-binding structure 80 is used to clamp and fix both ends of the ceramic substrate, thereby ensuring the overall structural strength of the ceramic substrate and further improving the overall service life. The edge-binding structure 80 is made of carbon fiber.

[0034] The key design features of this invention are: a first heat sink is attached to the upper surface of the first circuit layer; a second heat sink is attached to the lower surface of the second circuit layer; and a heat-conducting plate is disposed in the mounting hole and contacts the first and second heat sinks respectively. Through the cooperation of the first heat sink, the second heat sink, and the heat-conducting plate, heat from both the inner and outer sides of the ceramic substrate during use can be dissipated outwards. A heat-dissipating copper pipe is embedded in the insulating layer, extending forward and backward. Both ends of the copper pipe protrude outwards from the end faces of the insulating layer, and a ventilation groove runs through the copper pipe. The use of the heat-dissipating copper pipe further increases the heat dissipation efficiency inside the ceramic substrate, resulting in better overall heat dissipation. This prevents heat accumulation from affecting the normal operation of the ceramic substrate and also avoids long-term heat accumulation from damaging the internal structure of the ceramic substrate.

[0035] The above description is merely a preferred embodiment of the present utility model and does not constitute any limitation on the technical scope of the present utility model. Therefore, any minor modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model shall still fall within the scope of the technical solution of the present utility model.

Claims

1. A ceramic substrate with thermal conductivity, characterized in that: The device includes an insulating layer, a first ceramic base layer, a second ceramic base layer, a heat dissipation copper pipe, a first circuit layer, a second circuit layer, and a heat dissipation assembly. The first and second ceramic base layers are respectively attached to the upper and lower surfaces of the insulating layer. The heat dissipation copper pipe is embedded in the insulating layer, extending front to back, with both ends of the copper pipe protruding outwards from the end face of the insulating layer. A ventilation groove runs through the copper pipe, and multiple copper pipes are arranged horizontally at intervals. The first circuit layer covers the upper surface of the first ceramic base layer, and the second circuit layer covers the lower surface of the second ceramic base layer. A connection is provided between the first and second circuit layers, penetrating the insulating layer, the first ceramic base layer, and the second ceramic base layer. The ceramic substrate has through holes filled with conductive paste connecting the first and second circuit layers; the heat dissipation components are arranged in multiple horizontally spaced groups, with the heat dissipation copper pipes arranged horizontally and sequentially at intervals; each heat dissipation component includes a first heat dissipation plate, a second heat dissipation plate, and a heat-conducting plate; the first heat dissipation plate is attached to the upper surface of the first circuit layer; the second heat dissipation plate is attached to the lower surface of the second circuit layer; a mounting hole penetrating the insulating layer, the first ceramic substrate, and the second ceramic substrate is connected between the first and second heat dissipation plates, and the heat-conducting plate is disposed in the mounting hole and in contact with the first and second heat dissipation plates respectively.

2. The ceramic substrate with thermal conductivity according to claim 1, characterized in that: The insulating layer is a carbon fiber insulating layer.

3. The ceramic substrate with thermal conductivity according to claim 1, characterized in that: It also includes two symmetrically arranged edge structures. Each edge structure includes a body and a first fixing part and a second fixing part that extend outward from the upper and lower end faces of the body towards the same side of the body. The body of each edge structure is attached to the corresponding side wall of the insulating layer, the first ceramic base layer and the second ceramic base layer. The first fixing part and the second fixing part clamp the upper surface of the first ceramic base layer and the lower surface of the second ceramic base layer, respectively.

4. The ceramic substrate with thermal conductivity according to claim 3, characterized in that: The edging structure is made of carbon fiber.

5. The ceramic substrate with thermal conductivity according to claim 1, characterized in that: The inner diameter of the heat dissipation copper pipe is half the thickness of the insulation layer.

6. The ceramic substrate with thermal conductivity according to claim 1, characterized in that: The upper surface of the first circuit layer is covered with a first antioxidant layer; the lower surface of the second circuit layer is covered with a second antioxidant layer.

7. The ceramic substrate with thermal conductivity according to claim 1, characterized in that: The first heat sink, the second heat sink, and the heat conduction plate are all made of graphene.

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