Efficient water-cooling base of high-power component

Abstract

The utility model provides a high-efficiency water-cooling base of a high-power component, which comprises a radiating base and a water-cooling channel distributed in the radiating base, and diamond radiating fins are embedded in the water-cooling channel at intervals. According to the application, the diamond radiating fins are embedded into the water cooling channel of the radiating base, so that the diamond is in direct contact with the cooling water for heat conduction, the heat of the component is quickly conducted to the cooling water from the diamond and is transferred to the outside of the radiating base, the radiating conduction performance of the whole base is improved, and the heat is prevented from being accumulated in the base; and the heat dissipation base is a copper base in which diamond particles are uniformly distributed, so that the heat dissipation performance of the water-cooling base is further improved. According to the water-cooling base, the mounting grooves and the mounting holes or the upper base and the lower base are arranged on the surface of the radiating base corresponding to the water-cooling channels, so that the diamond radiating fins are mounted, and industrial production is facilitated; the product has high heat dissipation performance, and is especially suitable for heat dissipation requirements of high-power and high-performance components.

Description

Technical Field

[0001] This utility model belongs to the field of heat dissipation technology, and in particular relates to a high-efficiency water-cooling base for high-power components. Background Technology

[0002] For electrical products, heat dissipation has always been a significant factor affecting their operational efficiency. This is especially true for certain precision instruments, where inadequate heat dissipation directly impacts performance or can even damage the instrument. For example, under high-power-density electron beam bombardment, X-ray targets generate a large amount of heat. If this heat cannot be dissipated quickly enough, it can ablate or even melt the target surface, ultimately leading to a severe deterioration in the X-ray output quality. While existing diamond-based substrates can rapidly transfer heat from high-temperature components to the substrate, current water-cooling systems cannot quickly dissipate this heat, causing it to accumulate on the substrate and hindering further heat dissipation from the components. Utility Model Content

[0003] This invention provides a high-efficiency water-cooled base for high-power components, which can effectively solve the above-mentioned problems.

[0004] This utility model is implemented as follows:

[0005] A high-efficiency water-cooled base for high-power components includes a heat dissipation base and water-cooling channels distributed within the heat dissipation base, wherein diamond heat sinks are embedded at intervals within the water-cooling channels.

[0006] As a further improvement, the surface of the heat dissipation base is provided with an installation groove corresponding to the water cooling channel, and the installation groove is provided with installation holes that communicate with the water cooling channel at intervals. The diamond heat sink is inserted into the water cooling channel through the installation holes, and a sealing block is provided in the installation groove.

[0007] As a further improvement, the sealing block can be a thermally conductive sealant, a metal block, or a rubber plug.

[0008] As a further improvement, the heat dissipation base is made of pure copper, or the copper base has diamond particles evenly distributed inside.

[0009] As a further improvement, the heat dissipation base is composed of an upper base and a lower base, with a sintered layer between the upper base and the lower base; the upper base has an upper water channel, and the lower base has a lower water channel, which together form a water cooling channel; the upper and lower water channels have insertion holes, and the diamond heat sink is fixed in the insertion holes.

[0010] As a further improvement, the diamond heat sink is a polycrystalline diamond sheet; the diamond heat sink is provided with a metal sheet and a diamond film, the diamond film covering the metal sheet.

[0011] As a further improvement, the diamond heat sink is inclined perpendicular to the water flow direction or in the downstream direction; the length of the diamond heat sink extending into the water cooling channel is 1 / 20 to 1 / 50 of the diameter of the water cooling channel.

[0012] As a further improvement, the diamond heat sink is arranged parallel to the water flow direction or at a certain angle to the water flow direction; the length of the diamond heat sink extending into the water cooling channel is not less than 1 / 10 of the diameter of the water cooling channel.

[0013] As a further improvement, the water-cooling channel is provided with at least two types of diamond heat sinks that are parallel to the water flow direction, at a positive angle, or at a negative angle.

[0014] As a further improvement, the diamond heat sinks, which are set at a certain angle to the water flow direction, are spirally distributed in the water cooling channels of the upper and lower bases.

[0015] As a further improvement, a limiting head is provided at one end of the metal sheet.

[0016] The beneficial effects of this utility model are as follows: This application embeds a diamond heat sink into the water-cooling channel of the heat sink base, allowing the diamond to directly contact the cooling water for heat conduction. This enables rapid heat transfer from the diamond to the cooling water and then to the outside of the heat sink base, improving the overall heat dissipation performance of the base and preventing heat accumulation within it. The water-cooling base allows for the installation of the diamond heat sink by providing mounting grooves and holes on the surface of the heat sink corresponding to the water-cooling channel, or by providing an upper and lower base, facilitating industrial production. This product boasts high heat dissipation performance and is particularly suitable for the heat dissipation requirements of high-power, high-performance components. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0018] Figure 1 This is a structural schematic diagram of an embodiment of a high-efficiency water-cooled base for a high-power component according to this utility model;

[0019] Figure 2 This is a partial structural schematic diagram of an embodiment of a high-efficiency water-cooled base for a high-power component according to this utility model;

[0020] Figure 3 This is a partial structural schematic diagram of another embodiment of the high-efficiency water-cooled base for a high-power component of this utility model;

[0021] Figure 4 This is a schematic cross-sectional view of the water-cooling channel provided in an embodiment of a high-efficiency water-cooling base for a high-power component according to this utility model.

[0022] Figure 5 This is a schematic cross-sectional view of the water-cooling channel provided in an embodiment of a high-efficiency water-cooling base for a high-power component according to this utility model;

[0023] Figure 6 This is another cross-sectional schematic diagram parallel to the water cooling channel provided in an embodiment of a high-efficiency water-cooled base for a high-power component according to this utility model;

[0024] Figure 7 This is a cross-sectional schematic diagram of a high-efficiency water-cooled base for a high-power component according to another embodiment of the present invention, perpendicular to the water-cooling channel;

[0025] Figure 8 This is a cross-sectional schematic diagram of a high-efficiency water-cooled base for a high-power component according to another embodiment of the present invention, which is parallel to the water-cooling channel.

[0026] Figure 9 This is a cross-sectional view provided by an embodiment of a high-efficiency water-cooled base for a high-power component according to this utility model;

[0027] Figure 10 This is a cross-sectional view of another embodiment of the high-efficiency water-cooled base for a high-power component of this utility model;

[0028] Figure 11 This is a partial cross-sectional view of an embodiment of a high-efficiency water-cooled base for a high-power component according to this utility model;

[0029] Figure 12 This is a partial structural schematic diagram of an embodiment of a high-efficiency water-cooled base for a high-power component according to this utility model.

[0030] Figure label:

[0031] Heat dissipation base 1; upper base 11; lower base 12; sintered layer 13; water cooling channel 2; upper water channel 21; lower water channel 22; diamond heat sink 3; metal sheet 31; diamond film 32; limit head 33; mounting groove 4; mounting hole 5; sealing block 6; insertion hole 7. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model. Therefore, the following detailed description of the embodiments of this utility model provided in the accompanying drawings is not intended to limit the scope of the claimed utility model, but merely to represent selected embodiments of this utility model.

[0033] In the description of this utility model, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0034] In the description of this utility model, the terms "upper", "middle", "side", "side", "upper side", "end", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0035] Reference Figure 1-12 As shown, a high-efficiency water-cooled base for high-power components includes a heat dissipation base 1 and water-cooling channels 2 distributed within the heat dissipation base 1, wherein diamond heat sinks 3 are embedded at intervals within the water-cooling channels 2.

[0036] The diamond heat sink 3 is embedded in the heat dissipation base 1 of the water cooling channel 2, so that the heat conducted from the components by the diamond heat sink 3 can be quickly transferred to the cooling water, and the heat on the diamond heat sink 3 can be quickly removed. Thus, the diamond heat sink 3 can further conduct the heat of the components and prevent heat from accumulating on the heat dissipation base 1.

[0037] Furthermore, combined Figure 2-9 The surface of the heat dissipation base 1 is provided with an installation groove 4 corresponding to the water cooling channel 2. The installation groove 4 is provided with installation holes 5 that communicate with the water cooling channel 2 at intervals. The diamond heat sink 3 is inserted into the water cooling channel 2 through the installation holes 5. The installation groove 4 is provided with a sealing block 6.

[0038] By setting the mounting slot 4, the length of the diamond heat sink 3 can be reduced on the one hand, and it can also be used to fix the diamond heat sink 3 on the other hand.

[0039] Furthermore, the sealing block 6 is a thermally conductive sealant, a metal block, or a rubber stopper.

[0040] The seal is used to fix the diamond heat sink 3, and the use of a high thermal conductivity material allows for rapid heat transfer to the diamond heat sink 3. The metal block can be fixed and sealed to the mounting groove 4 by sintering, and the rubber plug and metal block can be sealed together by applying adhesive. The metal block can be formed by adding metal powder into the mounting groove 4 and then sintering it.

[0041] Furthermore, combined Figure 4 The heat dissipation base 1 is made of pure copper, or a copper base in which diamond particles are evenly distributed.

[0042] Diamond particles are evenly distributed inside the copper base, which can increase the thermal conductivity of the base, improve the speed at which heat dissipation components transfer heat to the heat dissipation base 1, and improve the speed at which heat is transferred to the diamond heat sink 3, thereby improving the overall performance of the heat dissipation base 1.

[0043] Furthermore, combined Figure 1 , 10 The heat dissipation base 1 is composed of an upper base 11 and a lower base 12, with a sintered layer 13 between the upper base 11 and the lower base 12; the upper base 11 is provided with an upper water channel 21, and the lower base 12 is provided with a lower water channel 22, which together form a water cooling channel 2; the upper water channel 21 and the lower water channel 22 are provided with insertion holes 7, and the diamond heat sink 3 is fixed in the insertion holes 7.

[0044] The upper and lower bases 12 are designed to accommodate diamond heat sinks 3 within the cold water channel. After installation, the upper and lower bases 12 are bonded together by high-temperature sintering.

[0045] After the diamond heat sink 3 is inserted into the mounting hole 5 or the insertion hole 7, it can be fixed by soldering, glue, or high-temperature treatment to fuse the heat sink base 1 and the diamond heat sink 3 together. A tungsten plating layer can be applied to the connection point between the diamond heat sink and the solder or heat sink base 1 to increase the bonding strength.

[0046] Furthermore, combined Figure 12 The diamond heat sink 3 is a polycrystalline diamond sheet; the diamond heat sink 3 is provided with a metal sheet 31 and a diamond film 32, and the diamond film 32 covers the metal sheet 31.

[0047] Polycrystalline diamond sheets have good compressive strength. By setting a metal sheet 31 support layer inside the diamond heat sink 3, a high-strength metal is provided to prevent the diamond film 32 from deforming and breaking. The diamond can be monocrystalline diamond or polycrystalline diamond.

[0048] Furthermore, combined Figure 1 , 2 4, 5, 6, 10, 12, the diamond heat sink 3 is set perpendicular to the water flow direction or inclined in the downstream direction; the length of the diamond heat sink 3 extending into the water cooling channel 2 is 1 / 20-1 / 50 of the diameter of the water cooling channel 2.

[0049] The cooling water flow directly impacts the diamond heat sink 3. If it extends too far, it can easily damage the diamond heat sink 3, and the water flow resistance is also relatively large. Extending it to a certain length can ensure the heat transfer effect and has a certain disturbance effect on the water flow, which is beneficial to the mixing of hot and cold water.

[0050] Furthermore, combined Figure 3 , 7 8, 9, 11, the diamond heat sink 3 is set parallel to the water flow direction or at a certain angle to the water flow direction; the length of the diamond heat sink 3 extending into the water cooling channel 2 is not less than 1 / 10 of the diameter of the water cooling channel 2.

[0051] The diamond heat sink 3 is positioned in the direction of water flow to reduce the impact of water flow on the diamond heat sink 3 and also to increase the contact time.

[0052] Furthermore, combined Figure 11 The water-cooling channel 2 is provided with at least two types of diamond heat sinks 3 that are parallel to the water flow direction, at a positive angle, or at a negative angle.

[0053] The arrangement of diamond heat sinks at different angles can increase the turbulence of water flow and improve the transfer of hot and cold water.

[0054] Furthermore, the diamond heat sink 3, which is set at a certain angle to the water flow direction, is spirally distributed in the water cooling channel 2 of the upper base 11 and the lower base 12.

[0055] The spiral distribution allows the cooling water to flow in a spiral pattern, increasing the contact time between the water flow and the diamond heat sink 3.

[0056] Furthermore, combined Figure 12 The metal sheet 31 is provided with a limiting head 33 at one end.

[0057] The limit head 33 facilitates the installation and positioning of the diamond heat sink 3.

[0058] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A high-efficiency water-cooled base for a high-power component, characterized in that, It includes a heat dissipation base and water-cooling channels distributed within the heat dissipation base, wherein diamond heat sinks are embedded at intervals within the water-cooling channels.

2. The high-efficiency water-cooled base for a high-power component according to claim 1, characterized in that, The surface of the heat dissipation base is provided with an installation groove corresponding to the water cooling channel. The installation groove is provided with installation holes that connect to the water cooling channel at intervals. The diamond heat sink is inserted into the water cooling channel through the installation holes. The installation groove is provided with a sealing block. The sealing block is a thermally conductive sealant, a metal block, or a rubber plug.

3. The high-efficiency water-cooled base for a high-power component according to claim 2, characterized in that, The heat dissipation base is made of pure copper, or a copper base with diamond particles evenly distributed inside.

4. The high-efficiency water-cooled base for a high-power component according to claim 1, characterized in that, The heat dissipation base is composed of an upper base and a lower base, with a sintered layer between the upper base and the lower base; the upper base has an upper water channel, and the lower base has a lower water channel, which together form a water cooling channel; the upper and lower water channels have insertion holes, and the diamond heat sink is fixed in the insertion holes.

5. A high-efficiency water-cooled base for a high-power component according to claim 1, 2, or 4, characterized in that, The diamond heat sink is a polycrystalline diamond sheet; the diamond heat sink has a metal sheet and a diamond film, and the diamond film covers the metal sheet.

6. A high-efficiency water-cooled base for a high-power component according to claim 1, 2, or 4, characterized in that, The diamond heat sink is positioned perpendicular to the water flow direction or inclined downstream; the length of the diamond heat sink extending into the water cooling channel is 1 / 20 to 1 / 50 of the diameter of the water cooling channel.

7. A high-efficiency water-cooled base for a high-power component according to claim 1, 2, or 4, characterized in that, The diamond heat sink is arranged parallel to the water flow direction or at a certain angle to the water flow direction; the length of the diamond heat sink extending into the water cooling channel is not less than 1 / 10 of the diameter of the water cooling channel.

8. The high-efficiency water-cooled base for a high-power component according to claim 7, characterized in that, The water-cooling channel is equipped with at least two types of diamond heat sinks that are parallel to the water flow direction, at a positive angle, or at a negative angle.

9. The high-efficiency water-cooled base for a high-power component according to claim 8, characterized in that, The diamond heat sinks, which are set at a certain angle to the direction of water flow, are spirally distributed in the water cooling channels of the upper and lower bases.

10. The high-efficiency water-cooled base for a high-power component according to claim 5, characterized in that, One end of the metal sheet is provided with a limiting head.

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