Adsorbable solid welding bottom plate device

Abstract

The utility model relates to the technical field of LED packaging production equipment, in particular to an adsorbable solid welding bottom plate device which comprises a bottom plate body, and a magnetic vacuum adsorption structure, a standardized interface, a control system and a high-precision positioning structure are arranged on the bottom plate body. The bottom plate body is used for bearing the LED support, through a magnetic vacuum adsorption structure, a traditional mode of repeatedly disassembling and assembling a special clamp is abandoned, the LED support is rapidly fixed and released by means of partitioned independent control of the vacuum adsorption small holes and the multi-channel vacuum cavity, the remodeling time is greatly shortened, the situation that the production takt is affected due to frequent disassembling and assembling of the clamp is avoided, and the production efficiency is improved. The standardized interface is arranged to be a universal clamping groove, LED supports of different models can be matched by replacing an adaptive module, a special clamp bottom plate does not need to be customized for each model, the purchase number of clamps is reduced, and the purchase cost is reduced; meanwhile, the number of clamps is reduced, and the clamp management cost is reduced.

Description

Technical Field

[0001] This utility model relates to the field of LED packaging production equipment technology, and in particular to an adsorbable bonding base plate device. Background Technology

[0002] With the rapid development of LED lighting technology, LED, as the fourth generation of green lighting source, has been widely used in the market due to its significant advantages such as energy saving, environmental protection, and long lifespan, showing great potential for development.

[0003] In the existing technology, the structures of different LED brackets vary greatly during the LED packaging production process. To ensure welding quality, it is usually necessary to customize a special fixture base plate. However, in actual production, when frequently changing LED bracket models, it is necessary to repeatedly disassemble and assemble the special fixture. This operation brings many problems, namely, low production efficiency, long time consumption due to frequent disassembly and assembly of fixtures, which seriously affects the production cycle and reduces the overall production efficiency. Moreover, in order to adapt to multiple LED bracket models, multiple sets of special fixtures are required, which not only significantly increases the procurement cost of fixtures, but also increases the management cost of fixtures.

[0004] Therefore, we provide an adsorption-bonded base plate device. Utility Model Content

[0005] The purpose of this invention is to address the aforementioned technical problems by providing an adsorption-based bonding base plate device. By employing vacuum adsorption technology and modular design, it enables rapid fixing and precise welding of different types of LED brackets, effectively solving the problem of fixture universality for multiple LED bracket models, improving production efficiency, and reducing production costs.

[0006] In view of this, the present invention provides an adsorption-bonding base plate device, including a base plate body, wherein the base plate body is provided with a magnetic vacuum adsorption structure, a standardized interface, a control system and a high-precision positioning structure.

[0007] The base plate is used to support the LED bracket and provide stable support for the welding process.

[0008] Preferably, the magnetic vacuum adsorption structure includes vacuum adsorption holes disposed on the surface of the base plate and a multi-channel vacuum cavity integrated at the bottom of the base plate. The diameter of the vacuum adsorption holes is 0.5 mm and the hole spacing is 1.5 mm. The multi-channel vacuum cavity adopts a partitioned suction plate independent control design.

[0009] Preferably, the magnetic vacuum adsorption structure can automatically adjust the vacuum level according to the weight of the support, and the magnetic vacuum adsorption structure is also equipped with a real-time pressure sensor, which is installed in the multi-channel vacuum chamber.

[0010] Preferably, the standardized interface is a universal slot provided on the base plate body, and the universal slot is detachably connected to the adapter module.

[0011] Preferably, the high-precision positioning structure is a laser calibration system built into the base plate body.

[0012] Preferably, the control system is a PLC control system integrated on the base plate body.

[0013] Preferably, the substrate of the base plate is made of aerospace aluminum, and the adsorption surface is covered with a wear-resistant ceramic coating.

[0014] Compared with the prior art, the present invention provides a device for adsorbing and bonding a base plate, which has the following beneficial effects:

[0015] 1. This utility model, through a magnetic vacuum adsorption structure, abandons the traditional method of repeatedly disassembling and assembling special fixtures. By utilizing vacuum adsorption orifices and multi-channel vacuum chambers with independent zone control, it achieves rapid fixing and release of LED brackets, significantly shortening changeover time and eliminating the impact of frequent fixture disassembly and assembly on production rhythm, thereby significantly improving overall production efficiency.

[0016] 2. This utility model sets the standardized interface as a universal card slot, which can match different models of LED brackets by changing the adapter module. There is no need to customize a special fixture base plate for each model, which reduces the number of fixtures to be purchased and lowers the procurement cost. At the same time, reducing the number of fixtures also reduces the fixture management cost.

[0017] 3. This utility model uses a laser calibration system built into the base plate body through a high-precision positioning structure to avoid positioning errors introduced by manual fixture replacement, ensuring accurate alignment between the bracket and the wire bonding machine, thereby guaranteeing the quality of die bonding and wire bonding and reducing the product defect rate.

[0018] The parts of this device not covered herein are the same as or can be implemented using existing technologies. This utility model has a simple structure and is easy to operate. Attached Figure Description

[0019] Figure 1 This is the overall view of the present utility model;

[0020] Figure 2 This is a schematic diagram of the magnetic vacuum adsorption structure proposed in this utility model;

[0021] Figure 3 This is a schematic diagram of the vacuum adsorption pore structure proposed in this utility model;

[0022] Figure 4 This is a schematic diagram of the installation of the high-precision positioning structure proposed in this utility model.

[0023] In the diagram: 1. Base plate; 2. Magnetic vacuum adsorption structure; 21. Vacuum adsorption orifice; 22. Multi-channel vacuum cavity; 23. Partitioned suction plate; 3. Standardized interface; 4. Control system; 5. High-precision positioning structure; 51. Laser calibration system. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model. Example

[0025] Please see Figure 1 - Figure 4 The adsorption-bonding base plate device in this embodiment includes: a base plate body 1, on which a magnetic vacuum adsorption structure 2, a standardized interface 3, a control system 4, and a high-precision positioning structure 5 are provided; the base plate body 1 is used to support the LED bracket and provide stable support for the welding process.

[0026] The magnetic vacuum adsorption structure 2 includes vacuum adsorption holes 21 set on the surface of the base plate body 1 and a multi-channel vacuum chamber 22 integrated at the bottom of the base plate body 1. The vacuum adsorption holes 21 have a diameter of 0.5 mm and a hole spacing of 1.5 mm. The multi-channel vacuum chamber 22 adopts a partitioned suction plate 23 for independent control design and can be divided into 4×4 partitions. Each partition can be opened and closed independently.

[0027] The design employs vacuum adsorption orifices 21 and a multi-channel vacuum chamber 22, enabling the fixing and release of LED brackets in a very short time. When different models of LED brackets need to be replaced, there is no need for cumbersome disassembly and assembly operations. Simply by turning on or off the vacuum adsorption device in the corresponding zone, the changeover can be completed quickly. Compared with the traditional mechanical locking method, the changeover time is greatly shortened, effectively avoiding the impact of frequent disassembly and assembly of fixtures on the production cycle, greatly improving the overall production efficiency, and significantly increasing the average number of changeovers per day. The vacuum adsorption device is a mature product and technology in this field, so it will not be described in detail here.

[0028] The magnetic vacuum adsorption structure 2 can automatically adjust the vacuum level according to the weight of the support. In addition, the magnetic vacuum adsorption structure 2 is also equipped with a real-time pressure sensor, which is installed in the multi-channel vacuum chamber 22.

[0029] When the LED bracket is placed on the base plate 1, the pressure sensor installed on the base plate 1 senses the pressure of the bracket on the base plate, which is then converted into weight information. The weight of the LED bracket is detected in real time, and the weight signal is converted into an electrical signal. The electrical signal generated by the pressure sensor is transmitted to the PLC control system 4 integrated on the base plate 1 through a data line. The PLC control system 4 has a pre-stored vacuum degree parameter table corresponding to different weight ranges. After receiving the weight signal, the control system 4 compares and analyzes the signal with the preset parameter table to quickly determine the range to which the current weight of the LED bracket belongs, and then determines the matching vacuum degree value.

[0030] The standardized interface 3 is a universal slot set on the base plate body 1. By replacing the adapter module that adapts to different bracket widths, it is possible to quickly match different models of LED brackets. The adapter module and the universal slot are detachably connected.

[0031] Among them, the high-precision positioning structure 5 is a laser calibration system 51 built into the base plate body 1.

[0032] In this case, the traditional manual replacement of fixtures is prone to introducing positioning errors, which affect the quality of die bonding and wire bonding. However, the laser calibration system 51 built into the base plate body 1 can use the high collimation and stability of the laser to achieve precise calibration of the LED bracket position. By accurately detecting the deviation between the actual position of the bracket and the preset position, the accuracy can reach ±0.02mm. Compared with manual operation, this greatly improves the positioning accuracy and ensures that the bracket and the wire bonding machine can be accurately aligned, laying the foundation for a high-quality die bonding and wire bonding process.

[0033] Among them, the control system 4 is a PLC control system integrated on the base plate body 1.

[0034] In LED packaging production, the fixing and welding requirements for different types of LED brackets vary. By integrating the PLC control system onto the base plate 1, the bracket model can be automatically identified, and the corresponding adsorption force and positioning program can be triggered quickly and accurately according to the preset program.

[0035] The base plate body 1 is made of aviation aluminum, which can effectively reduce the weight of the base plate body compared with traditional materials, making the clamp base plate more convenient to change, reducing the labor intensity of workers and improving the changeover efficiency. The adsorption surface is covered with a wear-resistant ceramic coating, which greatly enhances the wear resistance of the adsorption surface of the base plate body 1 and can effectively resist the friction and scratches between the support and the adsorption surface.

[0036] The installation, connection, or setting methods disclosed in this embodiment are all common mechanical connection methods. As long as they can achieve their beneficial effects, they can be implemented. Therefore, this embodiment will not elaborate on their specific structural composition and working principle.

[0037] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A device for adsorbing and bonding a base plate, characterized in that, include: The base plate body (1) is provided with a magnetic vacuum adsorption structure (2), a standardized interface (3), a control system (4) and a high-precision positioning structure (5). The base plate body (1) is used to support the LED bracket and provide stable support for the welding process.

2. The adsorbable bonding base plate device according to claim 1, characterized in that, The magnetic vacuum adsorption structure (2) includes a vacuum adsorption hole (21) set on the surface of the base plate body (1) and a multi-channel vacuum cavity (22) integrated at the bottom of the base plate body (1). The diameter of the vacuum adsorption hole (21) is 0.5 mm and the hole spacing is 1.5 mm. The multi-channel vacuum cavity (22) adopts a partitioned suction plate (23) independent control design.

3. The adsorbable bonding base plate device according to claim 2, characterized in that, The magnetic vacuum adsorption structure (2) can automatically adjust the vacuum level according to the weight of the support, and the magnetic vacuum adsorption structure (2) is also equipped with a real-time pressure sensor, which is installed in the multi-channel vacuum chamber (22).

4. The adsorbable bonding base plate device according to claim 1, characterized in that, The standardized interface (3) is a universal card slot set on the base plate body (1), and the universal card slot is detachably connected to the adapter module.

5. The adsorbable bonding base plate device according to claim 1, characterized in that, The high-precision positioning structure (5) is a laser calibration system (51) built into the base plate body (1).

6. The adsorption-adhesive bonding base plate device according to claim 1, characterized in that, The control system (4) is a PLC control system integrated on the base plate body (1).

7. The adsorbable bonding base plate device according to claim 6, characterized in that, The base plate body (1) is made of aviation aluminum, and the adsorption surface is covered with a wear-resistant ceramic coating.

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