Novel power module

Abstract

The utility model discloses a novel power module. The novel power module comprises a housing and a power circuit unit. The interior of the shell is hollow and used for installing a power circuit unit, a cooling liquid outlet is formed in the upper portion of the shell, and a cooling liquid inlet is formed in the lower portion of the shell; the power circuit unit comprises a plurality of plate-shaped electrode terminals which are arranged in parallel, a group of chips are arranged between adjacent electrode terminals, and two working surfaces of the chips are electrically connected with adjacent electronic terminals through heat dissipation columns respectively; one side of each group of chips is provided with a group of signal terminals, and the signal terminals are electrically connected with the corresponding chips; one end of the electrode terminal and one end of the signal terminal extend to the outside of the shell; a cooling liquid outlet is formed in the upper portion of the shell, a cooling liquid inlet is formed in the lower portion of the shell, and a reasonable cooling liquid circulation path is formed. By means of the design, it can be guaranteed that the power module is kept at a low temperature in the working process, and the reliability and stability of the power module are improved.

Description

Technical Field

[0001] This utility model belongs to the field of power module technology, and specifically relates to a novel power module. Background Technology

[0002] Currently, the performance advantages of conventional power modules on the market are not obvious. This is mainly due to the single cooling method of the modules, which results in insufficient heat dissipation capacity and the inability to reduce the operating junction temperature of the modules. Secondly, the modules must be equipped with a heat dissipation channel structure to maintain normal operation, which increases the size and weight of the entire system. As a result, the performance improvement of existing modules is not significant, and the SiC chip cannot exert its maximum advantage.

[0003] Therefore, this application provides a novel power module designed to solve the problems of low heat dissipation efficiency and low system integration of existing power modules. Utility Model Content

[0004] This invention provides a novel power module designed to solve the problems mentioned in the background section.

[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0006] A novel power module includes: a housing and a power circuit unit;

[0007] The housing is hollow inside for mounting the power circuit unit. The upper part of the housing has a coolant outlet, and the lower part has a coolant inlet.

[0008] The power circuit unit includes: a plurality of plate-shaped parallel electrode terminals, a set of chips is provided between adjacent electrode terminals, and the two working surfaces of the chips are electrically connected to adjacent electronic terminals through heat dissipation pillars; a set of signal terminals is provided on one side of each set of chips, and the signal terminals are electrically connected to the corresponding chips.

[0009] One end of both the electrode terminal and the signal terminal extends to the outside of the housing.

[0010] Furthermore, an inner shell is provided inside the outer shell, which is used to fix the power circuit unit.

[0011] Furthermore, the number of electrode terminals is three, and the corresponding chips and signal terminals are in two sets.

[0012] Furthermore, the inner shell is L-shaped, and a mounting groove is provided in the middle of the lower side wall of the inner shell. A first support plate is provided at the upper end of the higher side wall and a second support plate is provided at the upper end of the lower side wall. The mounting groove is used to install the lowermost electrode terminal of the power circuit unit, and the first and second support plates are used to install adjacent signal terminals.

[0013] Furthermore, the coolant outlet and coolant inlet are located on opposite sides of the length of the housing.

[0014] Furthermore, the chip is located in the middle of the two corresponding electrode terminals.

[0015] Furthermore, the chip is electrically connected to the corresponding signal terminal via bonding wires.

[0016] Compared with the prior art, the present invention has the following technical effects:

[0017] 1. The novel power module of this utility model features a coolant outlet at the top and a coolant inlet at the bottom of the casing, forming a rational coolant circulation path. Coolant flows in from the bottom inlet, and due to the principle of thermal convection, the hot coolant naturally rises and flows out from the top outlet, effectively carrying away the heat generated inside the power module. This design ensures that the power module maintains a low temperature during operation, improving its reliability and stability.

[0018] 2. The novel power module of this utility model electrically connects the two working surfaces of the chip to adjacent electrode terminals via heat sinks. The heat sinks not only serve as electrical connections but also as efficient heat dissipation channels. They rapidly conduct heat generated by the chip to the electrode terminals, increasing the heat dissipation area and allowing heat to be dissipated more quickly into the surrounding coolant, further improving heat dissipation efficiency.

[0019] 3. The novel power module described in this utility model integrates the cooling channel with the module's internal cavity structure, eliminating the need for an additional cooling channel structure. By using a specified insulating coolant, the module's insulation and cooling functions can be integrated, reducing the overall size of the electrical control system. Attached Figure Description

[0020] Figure 1 This is a cross-sectional view of a novel power module according to the present invention;

[0021] Figure 2 This is an isometric view of the internal components of a novel power module according to this utility model;

[0022] Figure 3 This is a schematic diagram of the inner shell structure of a novel power module according to this utility model;

[0023] Figure 4 This is an overall external isometric view of a novel power module as described in this utility model;

[0024] Figure 5 This is a perspective view of a novel power module according to the present invention.

[0025] In the picture:

[0026] 1. Casing; 101. Coolant outlet; 102. Coolant inlet;

[0027] 2. Inner shell; 201. First support plate; 202. Mounting slot; 203. Second support plate;

[0028] 3. Power circuit unit; 301. Electrode terminal; 302. Chip; 303. Heat sink; 304. Signal terminal; 305. Bonding wire. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to specific embodiments of this application and the accompanying drawings.

[0030] like Figure 1-5 As shown, a novel power module includes: a housing 1 and a power circuit unit 3;

[0031] The interior of the outer casing 1 is hollow and is used to install the power circuit unit 3. The upper part of the outer casing 1 has a coolant outlet 101 and the lower part has a coolant inlet 102.

[0032] The power circuit unit 3 includes: a plurality of plate-shaped parallel electrode terminals 301, a set of chips 302 is provided between adjacent electrode terminals 301, and the two working surfaces of the chips 302 are electrically connected to the adjacent electronic terminals 301 through heat dissipation pillars 303 respectively; a set of signal terminals 304 is provided on one side of each set of chips 302, and the signal terminals 304 are electrically connected to the corresponding chips 302.

[0033] One end of both the electrode terminal 301 and the signal terminal 304 extends to the outside of the housing 1.

[0034] Electrode terminal 301 is made of all-copper material and serves as an electrical terminal to bring out the module's electrical properties and connect to the outside world (DC+, DC-, AC terminals);

[0035] Chip 302 uses a SiC MOS chip, a third-generation wide-bandgap semiconductor chip;

[0036] The heat sink (303) is made of copper: used for electrical and heat transfer of chip 302;

[0037] Signal terminal 304 serves as an electrical terminal, bringing out the module's electrical properties and connecting it to the outside world (GS signal terminal);

[0038] A coolant outlet 101 is located at the top of the casing 1, and a coolant inlet 102 is located at the bottom, forming a reasonable coolant circulation path. The coolant flows in from the bottom inlet, and due to the principle of thermal convection, the hot coolant naturally rises and flows out from the top outlet, effectively carrying away the heat generated inside the power module. This design ensures that the power module maintains a low temperature during operation, improving its reliability and stability. In one specific embodiment, the coolant can be a fluorocarbon liquid, used for internal electrical insulation and junction cooling of the module.

[0039] The two working surfaces of chip 302 are electrically connected to adjacent electrode terminals 301 via heat sinks 303. The heat sinks 303 not only serve as electrical connections but also act as efficient heat dissipation channels. They rapidly conduct heat generated by chip 301 to the electrode terminals 301, increasing the heat dissipation area and allowing heat to be dissipated more quickly into the surrounding coolant, further improving heat dissipation efficiency.

[0040] In one specific embodiment, one side of the housing 1 is detachable for installing the power circuit unit 3 and facilitating subsequent maintenance. The portions of the electrode terminals 301 and signal terminals 304 in the power circuit unit 3 that extend out of the housing 1 are sealed to prevent leakage of internal coolant.

[0041] like Figure 1-3 As shown, an inner shell 2 is provided inside the outer shell 1, and the inner shell 2 is used to fix the power circuit unit 3.

[0042] like Figure 1-2 As shown, there are three electrode terminals 301, and two sets of corresponding chips 302 and signal terminals 304.

[0043] like Figure 2 As shown, the inner shell 2 is L-shaped. A mounting groove 202 is provided in the middle of the lower side wall of the inner shell 2. A first support plate 201 is provided at the upper end of the higher side wall and a second support plate 203 is provided at the upper end of the lower side wall. The mounting groove 202 is used to install the lowermost electrode terminal 301 of the power circuit unit 3. The first support plate 201 and the second support plate 203 are used to install adjacent signal terminals 304.

[0044] This inner shell 2 structure makes the assembly of the power circuit unit 3 more modular. Each electrode terminal 301 and signal terminal 304 can be installed in a specific position within the inner shell 2, forming a relatively independent unit. When assembling the power module, the power circuit unit 3 can be installed in the inner shell 2 first, and then the inner shell 2 can be placed entirely into the outer shell 1, simplifying the assembly process and improving production efficiency. Simultaneously, the modular design facilitates later maintenance and repair. When a component needs to be replaced or repaired, the inner shell 2 can be easily removed from the outer shell 1 for targeted operation.

[0045] The first support plate 201 and the second support plate 203 are respectively disposed at the upper ends of the two vertical side walls of the L-shaped inner shell 2, for mounting adjacent signal terminals 304. This structure provides stable support for the signal terminals 304, ensuring they remain in the correct position and preventing displacement or loosening due to vibration, impact, or other factors during use. A stable mounting position is crucial for ensuring the stability of signal transmission, effectively reducing signal interference and transmission errors, and ensuring that the power module can accurately receive and process control signals.

[0046] like Figure 4 As shown, the coolant outlet 101 and coolant inlet 102 are located on opposite sides of the length of the housing 1. After flowing in from the inlet, the coolant needs to flow along the entire length of the housing 1 before flowing out from the outlet. This longer flow path allows the coolant sufficient time to exchange heat effectively with the power circuit unit 3. The coolant can sequentially contact each electrode terminal 301, chip 302, and other components, uniformly removing heat and preventing localized overheating, thus resulting in a more uniform temperature distribution across the power module. Compared to designs with a closer inlet and outlet, this approach improves heat exchange efficiency and more effectively reduces the temperature of the power module.

[0047] If the coolant inlet and outlet positions are not properly positioned, coolant short-circuiting may occur, meaning the coolant doesn't flow sufficiently through all parts of the power module before exiting directly from the outlet, resulting in poor cooling in certain areas. Positioning the inlet and outlet on opposite sides of the length direction minimizes the risk of short-circuiting, ensuring the coolant fully covers power circuit unit 3 and improving cooling reliability. Coolant is more prone to turbulence along a longer flow path. Turbulence disrupts the laminar boundary layer of the coolant, allowing for more thorough contact between the coolant and the surface of heat-generating components, thus enhancing the convective heat transfer coefficient. Compared to laminar flow, turbulent flow transfers heat from heat-generating components to the coolant more quickly, thereby improving cooling efficiency.

[0048] like Figure 1 As shown, the chip 302 is located in the middle of the two corresponding electrode terminals 301.

[0049] like Figure 2 As shown, the chip 302 is electrically connected to the corresponding signal terminal 304 via a bonding wire 305.

[0050] In summary, the novel power module provided in this application has a junction temperature that is 30% to 40% lower than that of a conventional module at the same operating current. When applied in electronic control systems, the space occupied by this module is equivalent to that of a conventional module plus cooling water channels, thus optimizing the volume by 30%.

[0051] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several modifications and improvements can be made without departing from the inventive concept of the present utility model, and these all fall within the protection scope of the present utility model.

Claims

1. A novel power module, characterized in that, include: The outer casing (1) and the power circuit unit (3); The interior of the outer casing (1) is hollow and is used to install the power circuit unit (3). The upper part of the outer casing (1) is provided with a coolant outlet (101) and the lower part is provided with a coolant inlet (102). The power circuit unit (3) includes: a plurality of plate-shaped parallel electrode terminals (301), a set of chips (302) is provided between adjacent electrode terminals (301), and the two working surfaces of the chip (302) are electrically connected to the adjacent electrode terminals (301) through heat sinks (303); a set of signal terminals (304) is provided on one side of each set of chips (302), and the signal terminals (304) are electrically connected to the corresponding chip (302); One end of both the electrode terminal (301) and the signal terminal (304) extends to the outside of the housing (1).

2. The novel power module according to claim 1, characterized in that, The outer casing (1) has an inner casing (2) inside, which is used to fix the power circuit unit (3).

3. A novel power module according to claim 2, characterized in that, The number of electrode terminals (301) is three, and the corresponding chips (302) and signal terminals (304) are two sets.

4. A novel power module according to claim 3, characterized in that, The inner shell (2) is L-shaped. A mounting groove (202) is provided in the middle of the lower side wall of the inner shell (2). A first support plate (201) is provided at the upper end of the higher side wall of the two vertical side walls, and a second support plate (203) is provided at the upper end of the lower side wall. The mounting groove (202) is used to install the lowermost electrode terminal (301) in the power circuit unit (3). The first support plate (201) and the second support plate (203) are used to install adjacent signal terminals (304).

5. A novel power module according to claim 1, characterized in that, The coolant outlet (101) and coolant inlet (102) are located on both sides of the length direction of the outer casing (1).

6. A novel power module according to claim 1, characterized in that, The chip (302) is located in the middle of the two corresponding electrode terminals (301).

7. A novel power module according to claim 1, characterized in that, The chip (302) is electrically connected to the corresponding signal terminal (304) via a bonding wire (305).

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