Radio frequency adjusting structure

Abstract

The radio frequency adjusting structure comprises a base, a double-layer cover plate, an adjustable screw rod and a chip collecting component. The double-layer cover plate comprises an upper cover plate and a lower cover plate, the upper cover plate covers the lower cover plate, and the lower cover plate covers the base. A clamping cavity is formed between the upper cover plate and the lower cover plate, and a functional cavity is formed between the lower cover plate and the base. The upper cover plate is provided with a first through hole, and the lower cover plate is provided with a second through hole. The chip collecting component comprises a flange plate part and an annular wall part which are integrally formed, the flange plate part is arranged in the clamping cavity and provided with a first opening, and the annular wall part is arranged in the functional cavity and provided with a second opening. And the adjustable screw rod penetrates through the first through hole, the first opening, the second through hole and the second opening and partially extends into the functional cavity. The annular wall part is provided with an inner wall surface and an outer wall surface, the inner wall surface faces the adjustable screw rod, barbs are arranged at the position, close to the flange plate part, of the outer wall surface, and the barbs are located below the lower cover plate and can abut against the lower cover plate. According to the utility model, the risk that the chip collecting component is separated from the lower cover plate and falls off in the prefabrication and turnover processes is reduced.

Description

Technical Field

[0001] This utility model relates to the field of radio frequency, and in particular to a radio frequency modulation structure. Background Technology

[0002] Existing RF adjustment structures use double-layer cover plates to clamp and fix chip-collecting components. The chip-collecting component has a flange portion, which is clamped between upper and lower cover plates to secure it. The inner hole of the chip-collecting component is serrated to block metal foreign objects. This solution has the following drawbacks: Since there are numerous screw hole locations (up to 200+ for some products), the number of locations requiring chip-collecting components is also very large. After assembly, the chip-collecting component is prone to falling off during prefabrication and handling before being assembled with the upper cover plate, thus losing its chip-blocking function. Prefabrication refers to the entire assembly process; handling refers to moving it from one workstation to another during assembly. Existing RF adjustment structures rely on an interference fit between the chip-collecting component and the lower cover plate to reduce the risk of the chip-collecting component detaching and falling off. Utility Model Content

[0003] The purpose of this invention is to provide a radio frequency conditioning structure that has a chip collection component and a double-layer cover plate, and reduces the risk of the chip collection component falling off the lower cover plate during prefabrication and turnover.

[0004] To achieve the above objectives, this utility model adopts the following technical solution: a radio frequency adjustment structure, comprising: a base; a double-layer cover plate, having a through hole and including an upper cover plate and a lower cover plate, the upper cover plate covering the lower cover plate and the lower cover plate covering the base; a clamping cavity between the upper cover plate and the lower cover plate and a functional cavity between the lower cover plate and the base, the through hole including a first through hole on the upper cover plate and a second through hole on the lower cover plate; an adjustable screw; a chip collecting component, including an integrally formed flange portion and an annular wall portion, the flange portion being disposed within the clamping cavity and having a location located on the... The chip collecting component has a first opening at its top, and the annular wall portion is disposed within the functional cavity and has a second opening at the bottom of the chip collecting component. The first opening communicates with the first through hole and the second through hole, and the second opening communicates with the functional cavity. The adjustable screw sequentially passes through the first through hole, the first opening, the second through hole, and the second opening and partially extends into the functional cavity. The annular wall portion has an inner wall surface and an outer wall surface. The inner wall surface faces the adjustable screw, and the outer wall surface is provided with barbs near the flange portion. The barbs extend toward the lower cover plate and can abut against the lower cover plate.

[0005] As a further improvement of the present invention, the upper cover plate has a first top surface and a first bottom surface, and the lower cover plate has a second top surface and a second bottom surface. The first top surface, the first bottom surface, the second top surface and the second bottom surface are arranged in sequence. The barb has a top plane and a guide slope. The top plane faces the second bottom surface and is in contact with the second bottom surface. The guide slope is located below the top plane and extends obliquely relative to the top plane.

[0006] As a further improvement of the present invention, one end of the top plane is connected to the outer wall surface and the other end is connected to the guide slope, one end of the guide slope is connected to the top plane and the other end is connected to the outer wall surface, and the guide slope and the outer wall surface form an obtuse angle θ facing outward.

[0007] As a further improvement of this utility model, the annular wall portion surrounds the adjustable screw, and the barbs surround the annular wall portion.

[0008] As a further improvement of this utility model, the clamping cavity is formed by the upper cover plate and / or the lower cover plate using one of the methods of clearance and stretching.

[0009] As a further improvement of the present invention, both the upper cover plate and the lower cover plate are provided with clearance positions λ to form the clamping cavity. The first clearance position λ1 of the upper cover plate is formed on the first bottom surface, and the second clearance position λ2 of the lower cover plate is formed on the second top surface. The first bottom surface and the second top surface are in contact with each other except for the parts that avoid the clearance position λ.

[0010] As a further improvement of the present invention, the adjustable screw includes an upper threaded rod portion and a lower smooth rod portion. The smooth rod portion and the threaded rod portion are integrally formed and their central axes are consistent. The radial dimension of the smooth rod portion is smaller than that of the threaded rod portion. The smooth rod portion and the chip collecting member abut against each other at the second opening.

[0011] As a further improvement of the present invention, the inner wall surface has a middle section that contacts the adjustable screw, and a stepped portion is provided between the middle section and the first opening at the top of the chip collecting component, and a first chip receiving groove is formed between the threaded rod portion and the stepped portion.

[0012] As a further improvement of the present invention, the inner wall surface has a middle section that contacts the adjustable screw, and a constricted portion is formed between the middle section and the second opening at the bottom of the chip collecting component, and a second chip receiving groove is formed between the smooth rod portion and the constricted portion.

[0013] As a further improvement of this utility model, the through hole has an internal thread, and the threaded rod above the adjustable screw has an external thread. The adjustable screw is adjusted and positioned on the cover plate by the cooperation between the internal thread and the external thread.

[0014] As a further improvement of this utility model, it also includes a nut fixed to the cover plate, the adjustable screw passing through the nut and into the through hole, the threaded part above the adjustable screw having an external thread and the nut having an internal thread, the adjustable screw being adjustablely positioned and connected to the cover plate by the cooperation between the internal thread and the external thread.

[0015] As a further improvement of this utility model, it also includes a resonant rod located inside the functional cavity and fixed to the base, with the adjustable screw located directly above the resonant rod.

[0016] Compared to existing technologies, in the radio frequency adjustment structure of this invention, the flange portion of the chip collection component is located within the clamping cavity of the upper and lower cover plates. There is no welding or fixing between the chip collection component and the upper cover plate, nor between the chip collection component and the lower cover plate. Therefore, by providing barbs on the outer wall surface of the annular portion of the chip collection component, with the barbs located below the lower cover plate and close to the flange portion, the barbs can abut against the lower cover plate. In other words, before the upper cover plate is assembled onto the lower cover plate and the flange portion of the chip collection component is clamped within the clamping cavity of the upper and lower cover plates, the flange portion and barbs of the chip collection component clamp and fix the lower cover plate. Therefore, this invention reduces the risk of the chip collection component detaching and falling from the lower cover plate during prefabrication and turnover. Attached Figure Description

[0017] Figure 1 This is a three-dimensional composite diagram of the radio frequency modulation structure of this utility model;

[0018] Figure 2 This is an exploded perspective view of the radio frequency modulation structure of this utility model;

[0019] Figure 3 This is a top view of the radio frequency modulation structure of this utility model;

[0020] Figure 4 This is the first embodiment of the radio frequency modulation structure of this utility model. Figure 3 A sectional view with the AA line in the exploded state;

[0021] Figure 5 This is the first embodiment of the radio frequency modulation structure of this utility model. Figure 3 A sectional view of the center AA line in a combined state;

[0022] Figure 6 yes Figure 5 Enlarged view of section B;

[0023] Figure 7 This is the second embodiment of the radio frequency modulation structure of this utility model. Figure 3 A sectional view of the center AA line in a combined state;

[0024] Figure 8 yes Figure 7 Enlarged view of section C;

[0025] Figure 9 This is the third embodiment of the radio frequency modulation structure of this utility model. Figure 3 A sectional view of the center AA line in a combined state;

[0026] Figure 10 yes Figure 9 Enlarged view of section D;

[0027] Figure 11 This is a perspective view of the chip collection component in the radio frequency modulation structure of this utility model;

[0028] Figure 12 This is a front view of the chip collection component in the radio frequency conditioning structure of this utility model;

[0029] Figure 13 This is a cross-sectional view of the chip collection component in the radio frequency modulation structure of this utility model;

[0030] Figure 14 yes Figure 13 Enlarged view of section F in the middle;

[0031] Figures 15 to 17 Is it separate from Figure 6 , Figure 8 , Figure 10 Similar magnified images, compared to Figure 6 , Figure 8 , Figure 10 , Figures 15 to 17 The lines related to the adjustable screw were removed simply to make the clamping cavity between the double cover plates visible.

[0032] Figure 18 This is a partial combined state cross-sectional view of Embodiment 4 of the radio frequency modulation structure of this utility model, which shows the stretching space;

[0033] Figure 19 yes Figure 18 A magnified view of section G in the middle. Detailed Implementation

[0034] The exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. If several embodiments exist, features in these embodiments may be combined with each other without conflict. When the description refers to the drawings, unless otherwise stated, the same numbers in different drawings represent the same or similar elements. The descriptions in the following exemplary embodiments do not represent all embodiments consistent with the present invention; rather, they are merely examples of apparatuses, products, and / or methods consistent with some aspects of the present invention as set forth in the claims.

[0035] The terminology used in this invention is for the purpose of describing particular embodiments only and is not intended to limit the scope of protection of this invention. The singular forms “a,” “the,” or “the” used in the specification and claims of this invention are also intended to include the plural forms, unless the context clearly indicates otherwise.

[0036] It should be understood that the terms "first," "second," and similar words used in the specification and claims of this utility model do not indicate any order, quantity, or importance, but are merely used to distinguish the features. Similarly, the terms "an" or "a" do not indicate a quantity limitation, but rather indicate the presence of at least one. Unless otherwise stated, the terms "front," "back," "left," "right," "upper," "lower," and similar words appearing in this utility model are for ease of explanation only and are not limited to a specific location or spatial orientation. The terms "comprising" or "including" are an open-ended expression, meaning that the element preceding "comprising" or "including" covers the element following "comprising" or "including" and its equivalents, which does not exclude that the element preceding "comprising" or "including" may also include other elements. If "several" appears in this utility model, it means two or more.

[0037] Please refer to Figures 1 to 17As shown, this utility model discloses a radio frequency adjustment structure, which includes: an adjustable screw 1, a double-layer cover plate 2, a base 3, and a chip collection component 4. The double-layer cover plate 2 includes an upper cover plate 21 and a lower cover plate 22, with the upper cover plate 21 covering the lower cover plate 22 and the lower cover plate 22 covering the base 3. A clamping cavity 201 is provided between the upper cover plate 21 and the lower cover plate 22, and a functional cavity 301 is provided between the lower cover plate 22 and the base 3. The double-layer cover plate 2 is provided with a through hole penetrating the upper cover plate 21 and the lower cover plate 22. Specifically, the upper cover plate 21 is provided with a first through hole 2021, and the lower cover plate 22 is provided with a second through hole 2022. The through hole includes the first through hole 2021 and the second through hole 2022. The clamping cavity 201 extends laterally, the through hole extends vertically, and the clamping cavity 201 and the through hole are staggered. The adjustable screw 1 passes through the through hole and partially extends into the functional cavity 301. Because in the radio frequency adjustment structure of this utility model, a portion of the chip-collecting component 4 (the flange portion 41 described below) is disposed within the clamping cavity 201 of the upper cover plate 21 and the lower cover plate 22, the chip-collecting component 4 is not welded or fixed to the upper cover plate 21 or the lower cover plate 22. This is to facilitate the assembly and disassembly of the upper cover plate 21, the lower cover plate 22, and the chip-collecting component 4, thereby reducing costs. In the actual assembly process, the chip-collecting component 4 is first assembled onto the lower cover plate 22, and then the lower cover plate 22 is closed onto the lower cover plate 22, thus clamping a portion of the chip-collecting component 4 (the flange portion 41 described below).

[0038] Please refer to Figures 1 to 17 And specifically refer to Figure 6 , Figure 8 , Figure 10 , Figures 11 to 13The chip collecting component 4 includes an integrally formed flange portion 41 and an annular wall portion 42. The flange portion 41 is arranged laterally within the clamping cavity 201 and has a first opening 401 located at the top of the chip collecting component 4. The annular wall portion 42 is arranged vertically within the functional cavity 301 and has a second opening 402 located at the bottom of the chip collecting component 4. Specifically, the first opening 401 communicates with the first through hole 2021 and the second through hole 2022, and the second opening 402 communicates with the functional cavity 301. The adjustable screw 1 sequentially passes through the first through hole 2021, the first opening 401, the second through hole 2022, and the second opening 402 and partially extends into the functional cavity 301. The annular wall portion 42 has an inner wall surface 421 and an outer wall surface 422. The inner wall surface 421 faces the adjustable screw 1, and the outer wall surface 422 has barbs 423 near the flange portion 41. The barbs 423 are located below the lower cover plate 22 and can abut against the lower cover plate 22. By providing barbs 423 on the outer wall surface 422 of the annular wall portion 42 of the chip collecting component 4, this invention ensures that the flange portion 41 and barbs 423 of the chip collecting component 4 are clamped and fixed to the lower cover plate 22 before the upper cover plate 21 is assembled onto the lower cover plate 22 and before the flange portion 41 of the chip collecting component 4 is clamped in the clamping cavity 201 of the upper cover plate 21 and the lower cover plate 22. Therefore, this invention reduces the risk of the chip collecting component 4 detaching from the lower cover plate 22 during prefabrication and turnover.

[0039] Please refer to Figure 6 , Figure 8 , Figure 10 as well as Figures 11 to 13As shown, the upper cover plate 21 has a first top surface 211 and a first bottom surface 212, and the lower cover plate 22 has a second top surface 221 and a second bottom surface 222. The first top surface 211, the first bottom surface 212, the second top surface 221, and the second bottom surface 222 are arranged sequentially in the vertical direction. The second bottom surface 222 faces the functional cavity 301. The barb 423 has a top plane 4231 and a guide slope 4232. The top plane 4231 faces the second bottom surface 222 and contacts the second bottom surface 222. The guide slope 4232 is located below the top plane 4231 and extends obliquely relative to the top plane 4231. The guide ramp 4232 plays a guiding role in the assembly process of the chip collecting component 4 from top to bottom to the lower cover plate 22; after the lower cover plate 22 crosses the guide ramp 4232 and reaches the top plane 4231, the chip collecting component 4 is assembled in place on the lower cover plate 22. At this time, because the flange portion 41 and the barbs 423 of the chip collecting component 4 clamp and fix the lower cover plate 22, the present invention reduces the risk of the chip collecting component 4 falling off the lower cover plate 22 during prefabrication and turnover.

[0040] Please refer to Figures 11 to 13 As shown, one end of the top plane 4231 is connected to the outer wall surface 422 and the other end is connected to the guide slope 4232. One end of the guide slope 4232 is connected to the top plane 4231 and the other end is connected to the outer wall surface 422. An acute angle α is formed between the top plane 4231 and the guide slope 4232, pointing inward. A right angle β is formed between the top plane 4231 and the outer wall surface 422. An obtuse angle θ is formed between the guide slope 4232 and the outer wall surface 422, pointing outward. The obtuse angle θ ensures that the guide slope 4232 guides the chip-collecting component 4 as it is assembled from top to bottom onto the lower cover plate 22. The acute angle α and the right angle β ensure that the chip-collecting component 4 can be assembled into place on the lower cover plate 22 after passing over the guide slope 4232 and reaching the top plane 4231. The flange portion 41 and the barbs 423 of the chip-collecting component 4 clamp and fix the lower cover plate 22, reducing the risk of the chip-collecting component 4 detaching from the lower cover plate 22 during prefabrication and turnover.

[0041] Please refer to Figures 1 to 13 As shown, the annular wall portion 42 surrounds the adjustable screw 1, and the barbs 423 surround the annular wall portion 42. This arrangement indicates that the barbs 423 are not a point, but a ring of protruding ribs; this arrangement ensures the positioning stability between the lower cover plate 22 and the chip collecting component 4, and the chip collecting component 4 is not easy to fall off the lower cover plate 22.

[0042] Please refer to Figures 5 to 10As shown, the clamping cavity 201 is formed using an open-circuit design. Wherein, Figure 5 and Figure 6 The first embodiment shown illustrates a first method of air avoidance; Figure 7 and Figure 8 The second embodiment shown is the second method of air avoidance; Figure 9 and Figure 10 The third embodiment shown is the third type of clearance method. The difference between the above three clearance methods lies in the location of the clearance. Here, "clearance" refers to creating clearance space through machining. Machining refers to the process of cutting, shaping, and grinding a workpiece using mechanical equipment to achieve the required shape and precision. This section focuses on the second clearance method; please refer to... Figure 7 and Figure 8 As shown, both the upper cover plate 21 and the lower cover plate 22 are provided with clearance positions λ. The first clearance position λ1 of the upper cover plate 21 is formed on the first bottom surface 212, and the second clearance position λ2 of the lower cover plate 22 is formed on the second top surface 221. The first bottom surface 212 and the second top surface 221 are in contact with each other except for the parts that avoid the clamping cavity 201. It can be understood that... Figure 5 and Figure 6 The first type of clearance method revealed is where the clearance position λ is specifically formed on the upper cover plate 21, while the lower cover plate 22 does not have a clearance; conversely, Figure 9 and Figure 10 The third type of clearance method revealed is that the clearance position λ is formed on the lower cover plate 22, while the upper cover plate 21 does not have clearance.

[0043] exist Figure 18 and Figure 19 In the illustrated embodiment four, the clamping cavity 201 is formed by stretching. Here, "stretching" refers to creating a stretching space through stretching. Stretching is a process in industrial production where external force is used to plastically deform a material or component to improve its mechanical properties or shape and dimensions. Therefore, the clamping cavity 201 in this invention is formed by either a space-avoiding method or a stretching method using the upper cover plate 21 and / or the lower cover plate 22. Thus, the clamping cavity 201 has at least two different implementations.

[0044] Please refer to Figures 1 to 17 As shown, the upper cover plate 21 and / or the lower cover plate 22 are made of either metal or plastic, the adjustable screw 1 is made of metal, and the chip collecting component 4 is made of plastic. Please refer to... Figure 2 , Figure 4 , Figure 6 , Figure 8 and Figure 10As shown, the adjustable screw 1 includes an upper threaded rod portion 11 and a lower smooth rod portion 12. The smooth rod portion 12 is integrally formed with the threaded rod portion 11, and their central axes are aligned. The radial dimension of the smooth rod portion 12 is smaller than that of the threaded rod portion 11. The inner wall surface 421 has a middle section 4210 that contacts the adjustable screw 1. A first chip-receiving groove 4211 is formed above the middle section 4210, and a second chip-receiving groove 4212 is formed below the middle section 4210. The middle section 4210 has an interference fit with the threaded rod portion 11 of the adjustable screw 1. Since the chip-collecting component 4 is made of plastic and the plastic material is relatively soft, the threaded rod portion 11 of the adjustable screw 1 will easily screw into the plastic part, forming a similar threaded fit. The first chip-receiving groove 4211 is located at the top of the inner wall surface 421. Please refer to [reference needed] for details. Figure 13 The top end has a stepped portion 4201 recessed towards the outer wall surface 422, which forms the first chip-receiving groove 4211. Alternatively, it can be understood that because the stepped portion 4201 exists between the intermediate section 4210 and the first opening 401 at the top of the chip-collecting member 4, the first chip-receiving groove 4211 is formed between the threaded rod portion 11 and the stepped portion 4201. The second chip-receiving groove 4212 is located at the bottom end of the inner wall surface 421. Please refer to [reference needed] for details. Figure 13 The bottom end is provided with a constricted portion 4202 inclined toward the polished rod portion 12, and the constricted portion 4202 is used to form the second chip-receiving groove 4212. Alternatively, it can be understood that because the constricted portion 4202 exists between the intermediate section 4210 and the second opening 402 at the bottom end of the chip-collecting member 4, the second chip-receiving groove 4212 is formed between the polished rod portion 12 and the constricted portion 4202.

[0045] In specific embodiment one, the through hole has an internal thread, and the threaded rod portion 11 above the adjustable screw 1 has an external thread. The adjustable screw 1 is adjustablely positioned and connected to the double-layer cover plate 2 (the upper cover plate 21 and the lower cover plate 22) through the cooperation between the internal thread and the external thread. In specific embodiment two, the present invention also includes a nut 5 fixed to the double-layer cover plate 2, specifically the upper cover plate 21. The adjustable screw 1 passes through the nut 5 and into the through hole. The threaded rod portion 11 above the adjustable screw 1 has an external thread, and the nut 5 has an internal thread. The adjustable screw 1 is adjustablely positioned and connected to the double-layer cover plate 2, i.e., the upper cover plate 21 and the lower cover plate 22, through the cooperation between the internal thread and the external thread. In both of these methods, the adjustable screw 1 can be positioned on the double-layer cover plate 2, i.e., the upper cover plate 21 and the lower cover plate 22, and the depth can be adjusted by the threaded engagement. Therefore, friction occurs during the thread engagement and tightening process of the adjustable screw 1, the double-layer cover plate 2, and the nut 5, generating metal wires and metal powder, among other debris. Please refer to... Figure 6 , Figure 8 and Figure 10 The cross-section shown shows that the outer edge of the threaded rod 11 of the adjustable screw 1 overlaps with the inner edge of the hole of the nut 5, the inner edge of the hole of the double-layer cover plate 2, and the inner wall surface 421 of the chip collecting member 4, and this overlap reflects the threaded connection.

[0046] Please refer to Figure 2 and Figure 4 As shown, this utility model also includes a resonant rod 6 located within the functional cavity 301 and fixed to the base 3. The resonant rod 6 is fixed to a protruding post 31 extending upward from the inner bottom surface of the base 3 by screws or the like. The adjustable screw 1 is located directly above the resonant rod 6. Therefore, the frequency of the radio frequency modulation structure can be adjusted by changing the depth to which the adjustable screw 1 extends into the double-layer cover plate 2, specifically below the lower cover plate 22.

[0047] In summary, the present invention mainly achieves this by providing barbs 423 on the outer wall surface 422 of the annular wall portion 42 of the chip collection component 4. This ensures that before the upper cover plate 21 is assembled onto the lower cover plate 22 and the flange portion 41 of the chip collection component 4 is clamped in the clamping cavity 201 of the upper cover plate 21 and the lower cover plate 22, the flange portion 41 and the barbs 423 of the chip collection component 4 are clamped and fixed to the lower cover plate 22. Therefore, the present invention reduces the risk of the chip collection component 4 detaching from the lower cover plate 22 during prefabrication and turnover.

[0048] The above embodiments are only used to illustrate the present utility model and are not intended to limit the technical solutions described in the present utility model. The understanding of the present utility model should be based on those skilled in the art. Although the present utility model has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still make modifications or equivalent substitutions to the present utility model. All technical solutions and improvements that do not depart from the spirit and scope of the present utility model should be covered within the scope of the claims of the present utility model.

Claims

1. A radio frequency modulation structure, characterized in that: include: Base (3); A double-layer cover plate (2) is provided with a through hole and includes an upper cover plate (21) and a lower cover plate (22). The upper cover plate (21) covers the lower cover plate (22) and the lower cover plate (22) covers the base (3). There is a clamping cavity (201) between the upper cover plate (21) and the lower cover plate (22) and a functional cavity (301) between the lower cover plate (22) and the base (3). The through hole includes a first through hole (2021) provided on the upper cover plate (21) and a second through hole (2022) provided on the lower cover plate (22). Adjustable screw (1); The chip collecting component (4) includes an integrally formed flange portion (41) and an annular wall portion (42). The flange portion (41) is disposed within the clamping cavity (201) and has a first opening (401) located at the top of the chip collecting component (4). The annular wall portion (42) is disposed within the functional cavity (301) and has a second opening (402) located at the bottom of the chip collecting component (4). The first opening (401) communicates with the first through hole (2021) and the second through hole (2022), and the second opening (402) communicates with the functional cavity (301). The adjusting screw (1) passes sequentially through the first through hole (2021), the first opening (401), the second through hole (2022) and the second opening (402) and partially extends into the functional cavity (301). The annular wall portion (42) has an inner wall surface (421) and an outer wall surface (422). The inner wall surface (421) faces the adjusting screw (1). The outer wall surface (422) is provided with barbs (423) near the flange portion (41). The barbs (423) extend toward the lower cover plate (22) and can abut against the lower cover plate (22).

2. The radio frequency modulation structure as described in claim 1, characterized in that: The upper cover plate (21) has a first top surface (211) and a first bottom surface (212), and the lower cover plate (22) has a second top surface (221) and a second bottom surface (222). The first top surface (211), the first bottom surface (212), the second top surface (221) and the second bottom surface (222) are arranged sequentially. The barb (423) has a top plane (4231) and a guide slope (4232). The top plane (4231) faces the second bottom surface (222) and is in contact with the second bottom surface (222). The guide slope (4232) is located below the top plane (4231) and extends obliquely relative to the top plane (4231).

3. The radio frequency conditioning structure as described in claim 2, characterized in that: One end of the top plane (4231) is connected to the outer wall surface (422) and the other end is connected to the guide slope (4232). One end of the guide slope (4232) is connected to the top plane (4231) and the other end is connected to the outer wall surface (422). The guide slope (4232) and the outer wall surface (422) form an obtuse angle θ facing outward.

4. The radio frequency conditioning structure as described in claim 2, characterized in that: The annular wall portion (42) surrounds the adjustable screw (1), and the barbs (423) surround the annular wall portion (42).

5. The radio frequency conditioning structure as described in claim 2, characterized in that: The clamping cavity (201) is formed by the upper cover plate (21) and / or the lower cover plate (22) using one of the methods of clearance and stretching.

6. The radio frequency conditioning structure as described in claim 5, characterized in that: Both the upper cover plate (21) and the lower cover plate (22) are provided with clearance positions λ for forming the clamping cavity (201). The first clearance position λ1 of the upper cover plate (21) is formed on the first bottom surface (212), and the second clearance position λ2 of the lower cover plate (22) is formed on the second top surface (221). The first bottom surface (212) and the second top surface (221) are in contact with each other except for the portion that avoids the clearance position λ.

7. The radio frequency conditioning structure as described in claim 1, characterized in that: The adjustable screw (1) includes an upper threaded rod portion (11) and a lower smooth rod portion (12). The smooth rod portion (12) is integrally formed with the threaded rod portion (11) and their central axes are aligned. The radial dimension of the smooth rod portion (12) is smaller than that of the threaded rod portion (11). The smooth rod portion (12) and the chip collecting member (4) abut against each other at the second opening (402).

8. The radio frequency conditioning structure as described in claim 7, characterized in that: The inner wall surface (421) has an intermediate section (4210) that contacts the adjustable screw (1), and a stepped portion (4201) is provided between the intermediate section (4210) and the first opening (401) at the top of the chip collecting member (4), and a first chip receiving groove (4211) is formed between the threaded rod portion (11) and the stepped portion (4201).

9. The radio frequency conditioning structure as described in claim 7, characterized in that: The inner wall surface (421) has an intermediate section (4210) that contacts the adjustable screw (1), and a constriction portion (4202) is formed between the intermediate section (4210) and the second opening (402) at the bottom end of the chip collecting member (4), and a second chip receiving groove (4212) is formed between the smooth rod portion (12) and the constriction portion (4202).

10. The radio frequency modulation structure as described in claim 1, characterized in that: The through hole has an internal thread, and the threaded rod portion (11) above the adjustable screw (1) has an external thread. The adjustable screw (1) is adjustablely positioned and connected to the cover plate (2) through the cooperation between the internal thread and the external thread.

11. The radio frequency modulation structure as described in claim 1, characterized in that: It also includes a nut (5) fixed to the cover plate (2), the adjustable screw (1) passes through the nut (5) and into the through hole, the threaded rod (11) above the adjustable screw (1) has an external thread and the nut (5) has an internal thread, the adjustable screw (1) is adjustablely positioned and connected to the cover plate (2) by the cooperation between the internal thread and the external thread.

12. The radio frequency modulation structure as described in claim 1, characterized in that: It also includes a resonant rod (6) located inside the functional cavity (301) and fixed to the base (3), with the adjustable screw (1) located directly above the resonant rod (6).

Images