Wafer infrared radiation type heating device

Abstract

The utility model relates to a wafer infrared radiation type heating device which comprises an infrared heating rotating shaft mechanism, a horizontal heating mechanism I and a horizontal heating mechanism II, the horizontal heating mechanism I and the horizontal heating mechanism II are identical in structure, and the left side and the right side of the infrared heating rotating shaft mechanism are connected with the horizontal heating mechanism I which rotates synchronously with the infrared heating rotating shaft mechanism. The front side and the rear side of the infrared heating rotating shaft mechanism are both connected with second horizontal heating mechanisms rotating synchronously with the infrared heating rotating shaft mechanism. According to the utility model, the working efficiency can be improved.

Description

Technical Field

[0001] This utility model relates to a wafer infrared radiation heating device. Background Technology

[0002] With the development of the semiconductor industry, especially the miniaturization of die size and the trend towards high integration and miniaturization in semiconductor packaging, many high-requirement packaging processes have begun to use stealth dicing. This involves completely separating the wafer or chip with the film attached along predetermined lines to obtain individual units. To avoid quality issues such as burrs during dicing and to ensure the required spacing between the dies in the wafer, the film will bulge to a certain height after wafer expansion. Heating is then used to retract the bulging film, fixing the separated dies in their required positions and preventing them from shifting due to film retraction after unloading. To solve these problems, a heating device is needed after wafer expansion. Utility Model Content

[0003] To solve the above-mentioned technical problems, the purpose of this utility model is to provide a wafer infrared radiation heating device.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] A wafer infrared radiation heating device includes an infrared heating rotating shaft mechanism, a horizontal heating mechanism one and a horizontal heating mechanism two with the same structure. The left and right sides of the infrared heating rotating shaft mechanism are connected to the horizontal heating mechanism one, which rotates synchronously with it. The front and rear sides of the infrared heating rotating shaft mechanism are connected to the horizontal heating mechanism two, which rotates synchronously with it.

[0006] The horizontal heating mechanism includes a heating mounting plate, a guide rail fixing plate connected to the heating mounting plate, a guide rail connected to the guide rail fixing plate, a slider slidably connected to the guide rail, a guide groove provided on the heating mounting plate along the direction of the guide rail, an adapter plate movable in the guide groove connected to the slider, and a heating head assembly for heating the wafer connected below the adapter plate.

[0007] Preferably, in the wafer infrared radiation heating device, a sensor sheet metal is connected to the heating mounting plate, and a position sensor for sensing the slider is connected to the sensor sheet metal.

[0008] Preferably, in the wafer infrared radiation heating device, a positioning plate opposite to the position sensor is connected to the heating mounting plate, the positioning plate has a positioning hole, a sliding plate that slides synchronously with it is connected to the adapter plate, and an indexing pin that is inserted and engaged with the positioning hole is connected to the sliding plate.

[0009] Preferably, in the wafer infrared radiation heating device, there are two position sensors, which correspond to the sliders at the 8-inch steel ring and the 12-inch steel ring respectively. There are also two positioning plates, each of which is set in a one-to-one correspondence with the position sensor.

[0010] Preferably, in the wafer infrared radiation heating device, a connecting block is connected to the side of the heater mounting plate, and a reinforcing plate is installed on the connecting block.

[0011] Preferably, in the wafer infrared radiation heating device, the heating head assembly includes a heat insulation fixing plate connected to an adapter plate. The heat insulation fixing plate has a heating through hole, and an internal heat insulation plate one and an internal heat insulation plate two are connected inside the heating through hole. An infrared heater is connected to the heat insulation frame formed by the internal heat insulation plate one and the internal heat insulation plate two through a ceramic terminal. The ceramic terminal is connected to the heat insulation fixing plate through a terminal fixing plate.

[0012] Preferably, in the wafer infrared radiation heating device, a temperature sensor is connected to the heat insulation fixing plate.

[0013] Preferably, in the wafer infrared radiation heating device, the infrared heating rotating shaft mechanism includes a heating rotating support. A bearing mounting seat is connected to one side of the heating rotating support plate. A bearing is connected inside the bearing mounting seat, and a fixed rotating shaft passes through the bearing. The lower end of the fixed rotating shaft is connected to a rotating base plate via a shaft clip. A first synchronous pulley is connected to the upper end of the fixed rotating shaft. A motor mounting bracket is connected to the other side of the bearing mounting seat. A speed reducer is connected to the motor mounting bracket. The speed reducer is connected to the motor. The rotating shaft of the speed reducer passes through the motor mounting bracket and is connected to a second synchronous pulley. A synchronous belt connects the second synchronous pulley and the first synchronous pulley. Reinforcing ribs for connecting a horizontal heating mechanism are connected to the rotating base plate.

[0014] Preferably, in the wafer infrared radiation heating device, the motor mounting bracket is connected to two angle sensors, which respectively cooperate with the angle sensing plates on the adjacent horizontal heating mechanism one and horizontal heating mechanism two.

[0015] By means of the above solution, this utility model has at least the following advantages:

[0016] This utility model's infrared radiation heating device has a high heating temperature, reaching 600-700 degrees Celsius, and the heating temperature is controllable. It can be adjusted to accommodate 8 / 12-inch wafers via slide rails, slider adapter plates, and wind pins. This infrared heating device does not require blowing air, has good radiation effect on the film, and provides uniform heating, enabling the wafers to be separated evenly, ensuring normal production in the next process, and effectively improving work efficiency.

[0017] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the preferred embodiments of this utility model are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of this utility model;

[0020] Figure 2 This is a schematic diagram of the horizontal heating mechanism of this utility model;

[0021] Figure 3 This is a top view of the heating head assembly of this utility model;

[0022] Figure 4 This is a schematic diagram of the infrared heating rotating shaft mechanism of this utility model. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The mechanisms of the embodiments of this application described and shown in the accompanying drawings can be arranged and designed in various different configurations.

[0024] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0025] like Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, a wafer infrared radiation heating device includes an infrared heating rotating shaft mechanism 3, a horizontal heating mechanism 1 with the same structure, and a horizontal heating mechanism 2. The left and right sides of the infrared heating rotating shaft mechanism 3 are connected to the horizontal heating mechanism 1, which rotates synchronously with it. The front and rear sides of the infrared heating rotating shaft mechanism 3 are connected to the horizontal heating mechanism 2, which rotates synchronously with it.

[0026] Furthermore, this utility model can heat the product, and its structure is as follows: the horizontal heating mechanism 1 includes a heating mounting plate 105, a guide rail fixing plate 106 connected to the heating mounting plate 105, a guide rail 104 connected to the guide rail fixing plate 106, a slider 102 slidably connected to the guide rail 104, a guide groove opened on the heating mounting plate 105 along the direction of the guide rail, a transition plate 110 movable in the guide groove connected to the slider 102, a heating head assembly 107 for heating the wafer connected below the transition plate 110, a connecting block 112 connected to the side of the heater mounting plate 105, and a reinforcing plate 111 installed on the connecting block 112.

[0027] The heating head assembly connector is as follows: the heating head assembly 107 includes a heat insulation fixing plate 10703, which is connected to an adapter plate. The heat insulation fixing plate 10703 has a heating through hole, and an internal heat insulation plate 10704 and an internal heat insulation plate 10706 are connected in the heating through hole. An infrared heater 10705 is connected to the heat insulation frame formed by the internal heat insulation plate 10704 and the internal heat insulation plate 10706 through a ceramic terminal 10702. The ceramic terminal 10702 is connected to the heat insulation fixing plate 10703 through a terminal fixing plate 10701.

[0028] The temperature of the infrared heater 10705 can be controlled between 600 and 700°C. Furthermore, the working end of the infrared heater 10705 faces directly towards the product, allowing for direct contact and thus accelerating product processing. Simultaneously, a temperature sensor 10707 is connected to the heat insulation mounting plate 10703. This enables real-time monitoring of the product, ensuring consistent temperature control and improving product quality.

[0029] During the heating process described above, positioning can be matched for the 8-inch steel ring 4 (the steel ring is used to fix the wafer) or the 12-inch steel ring 5. The structure is as follows: a sensor sheet metal 103 is connected to the heating mounting plate 105, and a position sensor 101 for sensing the slider is connected to the sensor sheet metal 103. There are two position sensors, which correspond to the sliders at the 8-inch steel ring and the 12-inch steel ring, respectively. At the same time, there are also two positioning plates 108, and each positioning plate 108 is set in a one-to-one correspondence with the position sensor.

[0030] Meanwhile, the positioning accuracy of the 8-inch steel ring 4 or the 12-inch steel ring 5 can be further improved. The newly added structure is as follows: a positioning plate 108 opposite to the position sensor is connected to the heating mounting plate 105. The positioning plate 108 has a positioning hole. A sliding plate 109 that slides synchronously with the adapter plate 110 is connected to the adapter plate 110. An indexing pin 113 that inserts into the positioning hole is connected to the sliding plate 109.

[0031] By using the positioning structures at different locations, precise positioning of 8 / 12-inch wafers can be achieved.

[0032] Furthermore, the infrared heating rotating shaft mechanism of this utility model can drive the horizontal heating mechanism 1 and the horizontal heating mechanism 2 around it to rotate. The specific structure is as follows: the infrared heating rotating shaft mechanism 3 includes a heating rotating support plate 301. A bearing fixing seat 302 is connected to one side of the heating rotating support plate 301. A bearing is connected inside the bearing fixing seat 302. A fixed rotating shaft 304 passes through the bearing. The lower end of the fixed rotating shaft 304 is connected to the rotating base plate 305 via a shaft clip. A first synchronous pulley 306 is connected to the upper end of the fixed rotating shaft 304. The other side of the bearing fixing seat 302 is connected to... A motor mounting bracket 307 is provided, on which a reducer 308 is connected. The reducer 308 is connected to a motor 309. The shaft of the reducer 308 passes through the motor mounting bracket 3207 and is connected to a second synchronous pulley 310. A synchronous belt 311 connects the second synchronous pulley 310 and the first synchronous pulley 306. A reinforcing rib for connecting the horizontal heating mechanism is connected to the rotating base plate 305. Two angle sensors 312 are connected to the motor mounting bracket 307, which respectively cooperate with the angle sensing plates 303 on the adjacent horizontal heating mechanism 1 and horizontal heating mechanism 2.

[0033] The working principle of this utility model is as follows:

[0034] In actual operation, the motor in the infrared heating rotating shaft mechanism starts working, driving the second synchronous wheel to rotate. The second synchronous wheel drives the first synchronous wheel to rotate via a synchronous belt. The first synchronous wheel drives the fixed rotating shaft 3 to rotate. The fixed rotating shaft drives the rotating base plate connected to the shaft card to rotate. The rotating base plate drives the horizontal heating mechanism one and the horizontal heating assembly two on it to rotate. At the same time, the infrared heaters on the heating head assemblies in the horizontal heating mechanism one and the horizontal heating mechanism two are turned on, heating the convex film in the 8-inch steel ring and / or the 12-inch steel ring, causing it to retract.

[0035] When in operation, it can only work on one size (8 inches and / or 12 inches) and cannot operate on both at the same time.

[0036] This utility model's infrared radiation heating device has a high heating temperature, reaching 600-700 degrees Celsius, and the heating temperature is controllable. It can be adjusted to accommodate 8 / 12-inch wafers via slide rails, slider adapter plates, and wind pins. This infrared heating device does not require blowing air, has good radiation effect on the film, and provides uniform heating, enabling the wafers to be separated evenly, ensuring normal production in the next process, and effectively improving work efficiency.

[0037] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0038] In the description of this application, it should be noted that the terms "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0039] Furthermore, terms such as "horizontal" and "vertical" do not imply that components must be absolutely horizontal or vertical, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0040] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0041] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A wafer infrared radiation heating device, characterized in that: It includes an infrared heating rotating shaft mechanism (3), a horizontal heating mechanism one (1) and a horizontal heating mechanism two (2) with the same structure. The left and right sides of the infrared heating rotating shaft mechanism (3) are connected to the horizontal heating mechanism one (1) that rotates synchronously with it, and the front and rear sides of the infrared heating rotating shaft mechanism (3) are connected to the horizontal heating mechanism two (2) that rotates synchronously with it. The horizontal heating mechanism (1) includes a heating mounting plate (105), a guide rail fixing plate (106) connected to the heating mounting plate (105), a guide rail (104) connected to the guide rail fixing plate (106), a slider (102) slidably connected to the guide rail (104), a guide groove is provided on the heating mounting plate (105) along the direction of the guide rail, an adapter plate (110) movable in the guide groove is connected to the slider (102), and a heating head assembly (107) for heating the wafer is connected below the adapter plate (110).

2. The wafer infrared radiation heating device according to claim 1, characterized in that: A sensor sheet metal (103) is connected to the heating mounting plate (105), and a position sensor (101) for sensing the slider is connected to the sensor sheet metal (103).

3. The wafer infrared radiation heating device according to claim 2, characterized in that: The heating mounting plate (105) is connected to a positioning plate (108) opposite to the position sensor. The positioning plate (108) has a positioning hole. The adapter plate (110) is connected to a sliding plate (109) that slides synchronously with it. The sliding plate (109) is connected to an indexing pin (113) that is inserted into the positioning hole.

4. The wafer infrared radiation heating device according to claim 3, characterized in that: Two position sensors are provided, which correspond to the sliders at the 8-inch steel ring and the 12-inch steel ring respectively. At the same time, two positioning plates (108) are also provided, with each positioning plate (108) corresponding to a position sensor.

5. The wafer infrared radiation heating device according to claim 1, characterized in that: A connecting block (112) is connected to the side of the heating mounting plate (105), and a reinforcing plate (111) is installed on the connecting block (112).

6. The wafer infrared radiation heating device according to claim 1, characterized in that: The heating head assembly (107) includes a heat insulation fixing plate (10703), which is connected to an adapter plate. The heat insulation fixing plate (10703) has a heating through hole, and an internal heat insulation plate one (10704) and an internal heat insulation plate two (10706) are connected inside the heating through hole. An infrared heater (10705) is connected to the heat insulation frame formed by the internal heat insulation plate one (10704) and the internal heat insulation plate two (10706) through a ceramic terminal (10702). The ceramic terminal (10702) is connected to the heat insulation fixing plate (10703) through a terminal fixing plate (10701).

7. The wafer infrared radiation heating device according to claim 6, characterized in that: A temperature sensor (10707) is connected to the heat insulation fixing plate (10703).

8. The wafer infrared radiation heating device according to claim 1, characterized in that: The infrared heating rotating shaft mechanism (3) includes a heating rotating support plate (301). A bearing fixing seat (302) is connected to one side of the heating rotating support plate (301). A bearing is connected inside the bearing fixing seat (302). A fixed rotating shaft (304) passes through the bearing. The lower end of the fixed rotating shaft (304) is connected to the rotating base plate (305) through a shaft clip. A first synchronous pulley (306) is connected to the upper end of the fixed rotating shaft (304). The other side of the bearing fixing seat (302)... A motor mounting bracket (307) is connected to the side, and a reducer (308) is connected to the motor mounting bracket (307). The reducer (308) is connected to the motor (309). The shaft of the reducer (308) passes through the motor mounting bracket (307) and is connected to the second synchronous pulley (310). A synchronous belt (311) is connected between the second synchronous pulley (310) and the first synchronous pulley (306). A reinforcing rib for connecting the horizontal heating mechanism is connected to the rotating base plate (305).

9. The wafer infrared radiation heating device according to claim 8, characterized in that: Two angle sensors (312) are connected to the motor mounting bracket (307), which cooperate with the angle sensing plates (303) on the adjacent horizontal heating mechanism one (1) and horizontal heating mechanism two (2), respectively.

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