Wafer transmission device and electroplating equipment
By setting up a wafer transfer port in the electroplating equipment and utilizing the up-and-down movement of the sealing component, the problem of impurity particles entering during wafer transfer by the robotic arm is solved, thereby improving the cleanliness of the electroplating equipment and the coating quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIANGSU WUXI JINGWEI TIANDI SEMICONDUCTOR TECHNOLOGY CO LTD
- Filing Date
- 2025-05-28
- Publication Date
- 2026-05-22
AI Technical Summary
In existing technologies, when robotic arms move between electroplating equipment, external impurity particles can easily enter the electroplating equipment, affecting the quality of wafer coating.
A wafer transfer port is set between the robot arm, the fixture, and the electroplating chamber, and the wafer transfer frame is set at a target distance from the electroplating chamber. The wafer transfer port is opened or closed by the up-and-down movement of the sealing component to prevent impurity particles from entering.
It improves the cleanliness and electroplating yield of the electroplating equipment, ensuring the quality of wafer coating.
Smart Images
Figure CN224267237U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the semiconductor field, specifically to a device for wafer transfer and an electroplating apparatus. Background Technology
[0002] Electroplating is a process that uses the principle of electrolysis to plate thin films of metals or alloys. Taking electroplating wafers as an example, electroplating equipment typically has an electroplating chamber and a fixture. The fixture can hold the wafer, and then the fixture can immerse the surface of the wafer that needs to be plated into the electroplating solution flowing in the electroplating chamber, so that the electroplating chamber can electroplat the wafer through the electroplating solution.
[0003] In related technologies, robotic arms move back and forth between electroplating chambers, placing wafers into fixtures and removing them from the fixtures. However, electroplating equipment requires a high degree of cleanliness; impurities (commonly referred to as particulate matter) from the outside air and other equipment structures can easily enter the electroplating equipment, causing contamination and affecting the coating quality of the wafers. Therefore, how to prevent particulate matter from entering the electroplating equipment without affecting the robotic arm's wafer transport has become an urgent problem to be solved. Utility Model Content
[0004] To address the aforementioned technical problems, this application is proposed. Embodiments of this application provide an apparatus for wafer transfer and an electroplating device.
[0005] In a first aspect, one embodiment of this application provides a device for wafer transfer, applied to an electroplating equipment, comprising: a wafer transfer rack, disposed at a target distance from an electroplating chamber, the target distance being the horizontal distance between the center of the wafer transfer rack and the center of the electroplating chamber; the wafer transfer rack allows a robot arm to enter a fixture above the electroplating chamber from the wafer transfer rack to transfer a wafer, and to return from the wafer transfer rack after transferring the wafer; the target distance is sufficient to satisfy the robot arm's actions of transferring and returning the wafer through the wafer transfer rack; a wafer transfer port, disposed on the wafer transfer rack and configured to allow the robot arm to perform the actions of transferring and returning the wafer; and a closure, disposed on the wafer transfer rack and located below the wafer transfer port, configured to open or close the wafer transfer port by vertical movement.
[0006] In some embodiments, the center of the wafer transfer port has a target height, which enables the robot to transfer the wafer from the wafer transfer port to above the opening of the fixture, or to remove the wafer from the opening of the fixture, so that the robot and the fixture can complete the wafer handover.
[0007] In some embodiments, the wafer transfer rack includes: at least one crossbeam disposed at a target distance from the electroplating chamber; at least one guide rail extending in a vertical direction and connected to the crossbeam, the crossbeam and / or the guide rail together forming a wafer transfer port; wherein a closure member is slidably connected to the guide rail in a vertical direction so that the closure member can open or close the wafer transfer port by moving up and down.
[0008] In some embodiments, the guide rail has a groove extending in a vertical direction, and the closure extends into the groove; or, the closure includes: a slider, which is slidably connected to the guide rail in a vertical direction; and a closure body, which is connected to the slider.
[0009] In some embodiments, the device for wafer transfer further includes: a first locking member connected to the wafer transfer rack; and a second locking member connected to a closure member, wherein the closure member can drive the second locking member to move, and wherein the second locking member can be magnetically connected to the first locking member when the closure member closes the wafer transfer port.
[0010] In some embodiments, the second locking member includes: a second locking member body made of steel; and a plating layer located on the surface of the second locking member body, the plating layer being made of nickel.
[0011] In some embodiments, the device for wafer transfer further includes a position sensor disposed on the wafer transfer rack and configured to detect whether a closure is open or closed at the wafer transfer port.
[0012] In some embodiments, the wafer transfer frame is made of plastic, and / or the closure is made of plastic.
[0013] In some embodiments, the wafer transport frame is made of polyvinyl chloride, polyoxymethylene, or polycarbonate, and / or the enclosure is made of polyvinyl chloride, polyoxymethylene, or polycarbonate.
[0014] Secondly, one embodiment of this application provides an electroplating apparatus, including: an electroplating chamber configured to electroplat a wafer using an electroplating solution; a fixture disposed above the electroplating chamber, configured to carry the wafer and immerse at least a portion of the wafer in the electroplating solution; and a wafer transfer device according to any of the first aspects above, wherein a wafer transfer frame of the wafer transfer device is disposed at a target distance from the electroplating chamber, the target distance being the distance between the center of the wafer transfer frame and the center of the electroplating chamber, the wafer transfer frame allowing a robot arm to enter the fixture from the wafer transfer frame to transfer the wafer, and to return from the wafer transfer frame after transferring the wafer, the target distance being sufficient to satisfy the robot arm's actions of transferring and returning the wafer through the wafer transfer frame.
[0015] The wafer transfer device and electroplating equipment proposed in this application embodiment, by setting a wafer transfer port between the robot arm, the fixture, and the electroplating cavity, and setting the wafer transfer frame and the electroplating cavity at a target distance, allows the robot arm to pass through the wafer transfer port on the wafer transfer frame to pick up the wafer from the fixture or place the wafer in the fixture. Furthermore, since the closure can open or close the wafer transfer port by moving up and down, the wafer transfer port can be opened when the robot arm and the fixture transfer the wafer, and closed when the electroplating equipment is maintained, preventing impurity particles from entering the electroplating equipment through the wafer transfer port, thereby improving the cleanliness of the electroplating equipment and the electroplating yield. Attached Figure Description
[0016] The above and other objects, features, and advantages of this application will become more apparent from the more detailed description of the embodiments of this application in conjunction with the accompanying drawings. The drawings are provided to further illustrate the embodiments of this application and form part of the specification. They are used together with the embodiments of this application to explain this application and do not constitute a limitation thereof. In the drawings, the same reference numerals generally represent the same components or steps.
[0017] Figure 1 The diagram shown is a schematic representation of the device and electroplating cavity assembly for wafer transfer provided in an exemplary embodiment of this application.
[0018] Figure 2 The diagram shown is a schematic diagram of the structure of the closure component for opening the wafer transfer port provided in an exemplary embodiment of this application.
[0019] Figure 3 The diagram shown is a schematic diagram of the structure of a sealing component for sealing a wafer transmission port provided in an exemplary embodiment of this application.
[0020] Figure 4 The diagram shown is a schematic diagram of the structure of a wafer transport frame provided in an exemplary embodiment of this application.
[0021] Figure 5 The diagram shown is a schematic representation of a device for wafer transfer provided in an exemplary embodiment of this application.
[0022] Figure label:
[0023] 100. Device for wafer transfer; 110. Wafer transfer rack; 111. Crossbeam; 112. Guide rail; 1121. Slide rail; 120. Wafer transfer port; 130. Enclosure; 131. Plane of symmetry; 132. Slider; 133. Enclosure body; 140. First locking element; 150. Second locking element; 160. Position sensor; 200. Electroplating chamber assembly; 210. Electroplating chamber; 220. Fixture; 221. Opening. Detailed Implementation
[0024] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0025] Figure 1 The diagram shown is a schematic representation of the device and electroplating cavity assembly for wafer transfer provided in an exemplary embodiment of this application. Figure 2 The diagram shown is a schematic representation of the structure of a sealing member opening a wafer transfer port according to an exemplary embodiment of this application. Figure 3 The diagram shown is a schematic diagram of the structure of a sealing component for sealing a wafer transmission port provided in an exemplary embodiment of this application.
[0026] like Figures 1-3 As shown, this application embodiment provides a wafer transport device 100, applied to an electroplating equipment. The electroplating equipment includes at least an electroplating chamber assembly 200, which includes at least an electroplating chamber 210 and a fixture 220. The fixture 220 can carry the wafer in the electroplating chamber 210 for electroplating, so that the portion of the wafer with recessed features is electroplated with a corresponding metal layer. Figure 1 As shown, only the wafer transfer device 100 and the electroplating chamber assembly 200 are displayed; other structures are not shown. These other structures include a frame for mounting the wafer transfer device 100, etc. An electroplating machine has multiple electroplating chamber assemblies, and correspondingly, a corresponding number of wafer transfer devices 100 need to be installed. The wafer transfer device 100 includes: a wafer transfer frame 110, a wafer transfer port 120, and a closure 130. The wafer transfer rack 110 is spaced from the electroplating chamber 210 by a target distance (as shown by distance M in the figure). The target distance is the horizontal distance between the center of the wafer transfer rack 110 and the center of the electroplating chamber 210 (the dashed line L1 and dashed line L2 in the figure represent the center line of the wafer transfer rack 110 and the electroplating chamber 210, respectively). The wafer transfer rack 110 allows a robot arm to enter the clamp 220 above the electroplating chamber 210 to transfer wafers and return from the wafer transfer rack 110 after transferring the wafers. The target distance is sufficient to allow the robot arm to transfer wafers and return via the wafer transfer rack 110. The wafer transfer port 120 is provided on the wafer transfer rack 110 and configured to allow the robot arm to perform the wafer transfer and return actions. The closure member 130 is provided on the wafer transfer rack 110 and located below the wafer transfer port 120, and is configured to open or close the wafer transfer port 120 by vertical movement.
[0027] For example, the electroplating equipment includes multiple electroplating chamber assemblies 200, that is, multiple electroplating chambers 210, such as 8 to 30, for example, 8, 16, 22 or other different numbers.
[0028] For example, the electroplating equipment further includes a frame having a placement space within it. An electroplating chamber 210 is disposed within the placement space, and a wafer transfer rack 110 is connected to the frame.
[0029] For example, the robotic arm transfer of wafers includes: the robotic arm picking up the wafer from the fixture 220, and the robotic arm placing the wafer in the fixture 220.
[0030] For example, the wafer transfer port 120 is disposed at the upper end of the wafer transfer rack 110. The closure member 130 can close the wafer transfer port 120 by moving upward to the upper end of the wafer transfer rack 110, and the closure member 130 can open the wafer transfer port 120 by moving downward to the lower end of the wafer transfer rack 110.
[0031] For example, the target distance is 20 to 50 centimeters, such as 30 centimeters.
[0032] In the above embodiments, by providing a wafer transfer port 120 between the robot arm, the fixture 220, and the electroplating chamber 210, and setting the wafer transfer rack 110 and the electroplating chamber 210 at a target distance, the robot arm can pass through the wafer transfer port 120 on the wafer transfer rack 110 to pick up wafers from the fixture 220 or place wafers into the fixture 220. Furthermore, since the closure 130 can open or close the wafer transfer port 120 by moving up and down, the wafer transfer port 120 can be opened when the robot arm and the fixture 220 transfer wafers, and closed when the electroplating equipment is maintained, preventing impurity particles from entering the electroplating equipment through the wafer transfer port 120, thereby improving the cleanliness and electroplating yield inside the electroplating equipment.
[0033] During the electroplating process, the wafer transfer port 120 can be kept open to facilitate wafer transfer and operation, without having to open and close the wafer transfer port 120 repeatedly. Alternatively, the wafer transfer port 120 can be opened when wafer transfer is needed and closed when wafer transfer is not needed.
[0034] In some embodiments, the center position of the wafer transfer port 120 (as shown by point C in the figure) has a target height (as shown by distance H in the figure), which enables the robot to transfer the wafer from the wafer transfer port 120 to above the opening 221 of the fixture 220, or to remove the wafer from the opening 221 of the fixture 220, so that the robot and the fixture 220 can complete the transfer of the wafer.
[0035] For example, the target height enables the robot arm to transfer the wafer from the wafer transfer port 120 to above the opening 221 of the fixture 220 in a horizontal movement.
[0036] For example, the target height is 1 meter, and the height of the opening 221 of the clamp 220 is 0.95 meters. In this embodiment, the height is based on the distance from the ground or the distance from the mounting surface or mounting plate of the electroplating cavity assembly 200, which is shown by the solid line F in the figure.
[0037] For example, after the robotic arm places the wafer into the fixture 220, the distance between the wafer and the opening 221 of the fixture 220 is approximately 3 centimeters. The specific distance can be adjusted according to the actual situation. It should be noted that the distance between the wafer and the opening 221 of the fixture 220 specifically refers to the vertical distance between the wafer and the lower part of the opening 221 when the fixture 220 is opened to form the opening 221 and the wafer is placed into the opening 221, ensuring that the wafer can enter the opening 221 without obstruction. "Without obstruction" means that the wafer does not come into contact with or collide with any other components.
[0038] In the above embodiments, by making the center position of the wafer transfer port 120 have a target height, it can be ensured that the robot can smoothly pass through the wafer transfer port 120 to the top of the opening 221 of the fixture 220, thereby transferring the wafer with the fixture 220.
[0039] Figure 4 The diagram shown is a schematic diagram of the structure of a wafer transport frame provided in an exemplary embodiment of this application.
[0040] In some embodiments, such as Figure 4 As shown, the wafer transfer rack 110 includes at least one crossbeam 111 and at least one guide rail 112. The crossbeam 111 is positioned at a target distance from the electroplating chamber 210. The guide rail 112 extends vertically (as shown in the Z direction) and connects to the crossbeam 111, with the crossbeam 111 and / or the guide rail 112 forming a wafer transfer port 120. A closure 130 is slidably connected to the guide rail 112 vertically, allowing the closure 130 to open or close the wafer transfer port 120 via vertical movement.
[0041] For example, there are two crossbeams 111, which extend horizontally (as shown in the X direction in the figure) and are spaced apart vertically; there are also two guide rails 112, which are spaced apart horizontally. Each crossbeam 111 has a first end and a second end in the horizontal direction. The first end of the crossbeam 111 is connected to one guide rail 112, and the second end of the crossbeam 111 is connected to the other guide rail 112.
[0042] In the above embodiments, by setting the guide rail 112, the movement of the closure member 130 can be guided to prevent the closure member 130 from deviating.
[0043] In some embodiments, such as Figure 3 As shown, the closure 130 has a symmetrical plane 131 extending in the vertical direction, and there are two guide rails 112, which are symmetrically arranged with respect to the symmetrical plane 131.
[0044] In the above embodiment, by symmetrically arranging two guide rails 112, the movement of the closure 130 can be guided more stably, preventing the closure 130 from deflecting.
[0045] In some embodiments, such as Figure 4 As shown, the guide rail 112 has a groove 1121 extending in the vertical direction, and the closure 130 extends into the groove 1121.
[0046] In the above embodiments, with this structure, the closure 130 can slide along the extension direction of the slide groove 1121, thereby guiding the movement direction of the closure 130 by the guide rail 112. Moreover, this structure is simple and has a low cost.
[0047] Figure 5 The diagram shown is a schematic representation of a device for wafer transfer provided in an exemplary embodiment of this application.
[0048] In some embodiments, such as Figure 5 As shown, the closure 130 includes a slider 132 and a closure body 133. The slider 132 is slidably connected to the guide rail 112 in the vertical direction, and the closure body 133 is connected to the slider 132.
[0049] In the above embodiments, with this structure, the slider 132 can slide along the extension direction of the guide rail 112, thereby guiding the movement direction of the closure 130. Moreover, this structure is simple and has a low cost.
[0050] In some embodiments, such as Figure 2 and Figure 3 As shown, the device 100 for wafer transfer further includes a first locking member 140 and a second locking member 150. The first locking member 140 is connected to the wafer transfer rack 110. The second locking member 150 is connected to a closure member 130, and the closure member 130 can drive the second locking member 150 to move. When the closure member 130 closes the wafer transfer port 120, the second locking member 150 can be magnetically connected to the first locking member 140.
[0051] For example, the first locking member 140 is a magnetic device with magnetic attraction, and the second locking member 150 is a metal block; or, the first locking member 140 is a metal block and the second locking member 150 is a magnetic device.
[0052] For example, the first locking member 140 is disposed at the upper end of the wafer transfer rack 110, and the second locking member 150 is disposed at the upper end of the closure member 130.
[0053] In the above embodiments, by providing the first locking member 140 and the second locking member 150, the closure member 130 can be fixed after moving to the closed wafer transfer port 120, reducing the risk of the closure member 130 moving due to gravity or other external forces, thereby exposing the wafer transfer port 120; and, fixing the closure member 130 with this structure saves manpower and time compared to manually locking the closure member 130 with screws or bolts, thus improving production efficiency.
[0054] In some embodiments, the second locking member 150 includes a second locking member body and a plating layer. The second locking member body is made of steel. The plating layer is located on the surface of the second locking member body and is made of nickel.
[0055] For example, the material of the second locking member body is a carbon structural steel, such as Q235.
[0056] In the above embodiments, since both steel and nickel have good magnetism, the second locking member 150 can be magnetically connected to the first locking member 140; and, by providing a plating layer on the surface of the main body of the second locking member, the sealing member 130 can have good wear resistance, oxidation resistance and corrosion resistance.
[0057] In some embodiments, such as Figure 2 and Figure 3 As shown, the device 100 for wafer transfer also includes a position sensor 160. The position sensor 160 is disposed on the wafer transfer rack 110 and configured to detect whether the closure 130 is open or closed at the wafer transfer port 120.
[0058] For example, the position sensor 160 may be a photoelectric sensor, a proximity switch, an ultrasonic sensor, etc.
[0059] For example, the position sensor 160 can be disposed at the upper or lower end of the wafer transfer rack 110. For example... Figure 2 As shown, the position sensor 160 is located at the lower end of the wafer transfer rack 110. When the position sensor 160 detects the closure 130, it indicates that the closure 130 is open in the wafer transfer port 120; when the position sensor 160 does not detect the closure 130, it indicates that the closure 130 is closed in the wafer transfer port 120. Figure 3As shown, the position sensor 160 is located at the upper end of the wafer transfer rack 110. When the position sensor 160 detects the closure 130, it indicates that the closure 130 closes the wafer transfer port 120. When the position sensor 160 does not detect the closure 130, it indicates that the closure 130 opens the wafer transfer port 120.
[0060] In the above embodiments, by setting the position sensor 160, it is possible to accurately detect whether the closure 130 is open or closed on the wafer transfer port 120.
[0061] In some embodiments, the wafer transfer rack 110 is made of plastic, and / or the closure 130 is made of plastic.
[0062] For example, the wafer transfer frame 110 is made of polyvinyl chloride, polyoxymethylene, or polycarbonate, and / or the enclosure 130 is made of polyvinyl chloride, polyoxymethylene, or polycarbonate.
[0063] In the above embodiments, by using a wafer transfer frame 110 and / or a closure 130 made of plastic, frictional impurities generated by the wafer transfer frame 110 and / or the closure 130 are reduced, thereby reducing the impurity particles entering the electroplating equipment through the wafer transfer port 120 and improving the cleanliness and electroplating yield inside the electroplating equipment.
[0064] Based on the same concept, such as Figure 1 As shown in the illustration, this application also provides an electroplating apparatus, which includes an electroplating chamber 210, a fixture 220, and a wafer transfer device 100 as described in the above embodiments. The electroplating chamber 210 is configured to electroplat a wafer using an electroplating solution. The fixture 220 is disposed above the electroplating chamber 210 and configured to carry the wafer, immersing at least a portion of the wafer in the electroplating solution. The wafer transfer frame 110 of the wafer transfer device 100 is positioned at a target distance from the electroplating chamber 210. The target distance is the distance between the center of the wafer transfer frame 110 and the center of the electroplating chamber 210. The wafer transfer frame 110 allows a robot arm to enter the fixture 220 from the wafer transfer frame 110 to transfer the wafer, and to return from the wafer transfer frame 110 after transferring the wafer. The target distance satisfies the robot arm's actions of transferring and returning the wafer through the wafer transfer frame 110.
[0065] Specifically, the electroplating chamber 210 has a receiving chamber through which a flowing electroplating solution passes, allowing electroplating to be performed on the plating surface of the wafer. The fixture 220 seals the wafer via a sealing ring, thus sealing the non-plating surface of the wafer and preventing it from contacting the electroplating solution. After receiving and sealing the wafer, the fixture 220 can descend to at least partially immerse itself in the electroplating solution flowing through the receiving chamber, thereby bringing the plating surface of the wafer into contact with the electroplating solution for coating.
[0066] Since the electroplating equipment includes a device 100 for wafer transfer, all the technical features and effects of the electroplating equipment including the device 100 for wafer transfer will not be described in detail here.
[0067] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.
[0068] The block diagrams of devices, apparatuses, devices, and systems involved in this application are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, devices, and systems can be connected, arranged, and configured in any manner. Words such as “comprising,” “including,” “having,” etc., are open-ended terms meaning “including but not limited to,” and are used interchangeably with them. The terms “or” and “and” as used herein refer to the terms “and / or,” and are used interchangeably with them unless the context clearly indicates otherwise. The term “such as” as used herein refers to the phrase “such as but not limited to,” and is used interchangeably with it.
[0069] It should also be noted that in the apparatus, equipment, and methods of this application, the components or steps can be disassembled and / or recombined. These disassemblies and / or recombinations should be considered as equivalent solutions of this application.
[0070] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of this application. Therefore, this application is not intended to be limited to the aspects shown herein, but rather to be accorded the widest scope consistent with the principles and novel features disclosed herein.
[0071] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this application to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.
Claims
1. A device for wafer transfer, applied to electroplating equipment, characterized in that, include: A wafer transfer rack is positioned at a target distance from the electroplating chamber. The target distance is the horizontal distance between the center of the wafer transfer rack and the center of the electroplating chamber. The wafer transfer rack allows a robot arm to enter the fixture above the electroplating chamber from the wafer transfer rack to transfer wafers, and to return from the wafer transfer rack after transferring the wafers. The target distance is sufficient to allow the robot arm to transfer the wafers and return via the wafer transfer rack. A wafer transfer port, disposed on the wafer transfer rack, is configured to allow the robotic arm to perform the actions of transferring and returning the wafer; A closure component, disposed on the wafer transfer rack and located below the wafer transfer port, is configured to open or close the wafer transfer port by moving up and down.
2. The apparatus for wafer transfer according to claim 1, characterized in that, The center of the wafer transfer port has a target height, which enables the robot to transfer the wafer from the wafer transfer port to above the opening of the fixture, or to remove the wafer from the opening of the fixture, so that the robot and the fixture can complete the transfer of the wafer.
3. The apparatus for wafer transfer according to claim 1 or 2, characterized in that, The wafer transfer frame includes: At least one crossbeam is positioned at a target distance from the electroplating cavity; At least one guide rail extends vertically and is connected to the crossbeam, the crossbeam and / or the guide rail together forming the wafer transfer port; The closure is slidably connected to the guide rail along the vertical direction, so that the closure can open or close the wafer transfer port by moving up and down.
4. The apparatus for wafer transfer according to claim 3, characterized in that, The guide rail has a groove extending along the vertical direction, and the closure extends into the groove; or, The closure includes: The slider is slidably connected to the guide rail along the vertical direction; The main body of the closure is connected to the slider.
5. The apparatus for wafer transfer according to claim 1 or 2, characterized in that, Also includes: The first locking element is connected to the wafer transfer frame; The second locking member is connected to the closure member, and the closure member can drive the second locking member to move. When the closure member closes the wafer transmission port, the second locking member can be magnetically connected to the first locking member.
6. The apparatus for wafer transfer according to claim 5, characterized in that, The second locking element includes: The second locking component body is made of steel. A plating layer is located on the surface of the second locking member body, and the plating layer is made of nickel.
7. The apparatus for wafer transfer according to claim 1 or 2, characterized in that, Also includes: A position sensor, disposed on the wafer transfer rack, is configured to detect whether the enclosure is open or closed at the wafer transfer port.
8. The apparatus for wafer transfer according to claim 1 or 2, characterized in that, The wafer transport frame is made of plastic, and / or the closure is made of plastic.
9. The apparatus for wafer transfer according to claim 8, characterized in that, The wafer transport frame is made of polyvinyl chloride, polyoxymethylene, or polycarbonate, and / or the enclosure is made of polyvinyl chloride, polyoxymethylene, or polycarbonate.
10. An electroplating device, characterized in that, include: The electroplating chamber is configured to electroplat the wafer with an electroplating solution; A fixture, disposed above the electroplating chamber, is configured to support the wafer and immerse at least a portion of the wafer in the electroplating solution; The wafer transfer apparatus according to any one of claims 1 to 9, wherein the wafer transfer rack of the wafer transfer apparatus is disposed at a target distance from the electroplating cavity, the target distance being the distance between the center of the wafer transfer rack and the center of the electroplating cavity, the wafer transfer rack allowing a robot arm to enter the fixture from the wafer transfer rack to transfer the wafer, and to return from the wafer transfer rack after transferring the wafer, the target distance being sufficient to satisfy the robot arm's actions of transferring the wafer through the wafer transfer rack and returning.