Rotary chuck device

Abstract

The utility model discloses a rotary chuck device, which relates to the technical field of semiconductors and comprises a rotary chuck, a chuck pin, electromagnets, strong magnets and a sliding mechanism, the strong magnets and the electromagnets are correspondingly arranged at intervals, and one of the electromagnets and the strong magnets is connected with the chuck pin; the sliding mechanism comprises a first rod piece fixed to the rotating chuck and extends in the radial direction of the rotating chuck, the end, away from the clamped wafer, of the chuck pin is slidably connected to the first rod piece, the chuck pin can slide in the extending direction of the first rod piece, and the chuck pin is driven to move by controlling the magnetic force between an electromagnet and a strong magnet; therefore, the wafer is clamped or loosened. According to the rotary chuck device, the chuck pin is driven to move through the magnetic action between the electromagnet and the strong magnet, the problem of particle pollution caused by abrasion due to direct contact is avoided, particle removing equipment does not need to be additionally arranged, the whole structure is simple, and the complexity and cost of maintenance work are reduced.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a rotary chuck device. Background Technology

[0002] In recent years, the proportion of single-rotation-cavity processes in semiconductor wet processes has increased significantly, demonstrating superior performance in etching uniformity and particle removal. In the single-rotation cleaning process, a rotating chuck needs to rotate continuously. The chuck is equipped with chuck pins or lifting pins to clamp and fix the wafer onto the chuck. The movement of the chuck pins or lifting pins on the chuck is driven by actuators such as cylinders through direct contact transmission. However, this structure is not only complex and costly to maintain, but the mechanically contacting parts are also prone to wear, leading to particle contamination. This necessitates additional particle removal equipment, further increasing production costs. Utility Model Content

[0003] The purpose of this invention is to provide a rotary chuck device that achieves a simple structure while avoiding particulate contamination caused by contact wear.

[0004] To achieve the above objectives, this utility model provides the following technical solution:

[0005] A rotary chuck device includes a rotary chuck, a chuck pin, an electromagnet, a strong magnet, and a sliding mechanism. The strong magnet and the electromagnet are arranged at intervals and corresponding to each other, and one of the electromagnet and the strong magnet is connected to the chuck pin.

[0006] The sliding mechanism includes a first rod fixed to the rotating chuck, the first rod extending radially along the rotating chuck, and the end of the chuck pin away from the wafer clamping point slidably connected to the first rod, and the chuck pin can slide along the extension direction of the first rod. By controlling the magnetic force between the electromagnet and the strong magnet, the movement of the chuck pin is driven to clamp or release the wafer.

[0007] Optionally, in the above-mentioned rotary chuck device, the sliding mechanism further includes a second rod and a third rod, wherein the first rod has a sliding hole extending along the moving direction of the chuck pin;

[0008] The second rod is slidably connected to the rotary chuck. The second rod extends and slides along the extension direction of the chuck pin. The first end of the second rod is hinged to the second end of the third rod. The strong magnet is fixed to the second end of the second rod.

[0009] The first end of the third rod passes through the sliding hole and is hinged to the chuck pin, and the first end of the third rod can slide along the extension direction of the sliding hole.

[0010] Optionally, in the above-described rotary chuck device, the sliding mechanism includes a second rod, a third rod, a slider, and a slide rail;

[0011] The second rod is slidably connected to the rotary chuck. The second rod extends and slides along the extension direction of the chuck pin. The first end of the second rod is hinged to the second end of the third rod. The strong magnet is fixed to the second end of the second rod.

[0012] The slider is slidably connected to the slide rail, the slide rail is disposed on the first rod, the slide rail extends along the extension direction of the first rod, the chuck pin is fixed to the slider, and the first end of the third rod is hinged to the slider.

[0013] Optionally, in the above-mentioned rotary chuck device, the sliding mechanism further includes a tightening nut. The first end of the third rod and the chuck pin are both provided with connecting holes. The first end of the third rod and the chuck pin are connected to the tightening nut through the connecting holes. During the movement of the chuck pin, the third rod and the chuck pin are hinged. When the chuck pin clamps the wafer, the tightening nut secures the third rod to the chuck pin.

[0014] Optionally, in the above-described rotary chuck device, when the third rod is parallel to the first rod, the chuck pin releases the wafer.

[0015] Optionally, in the above-described rotary chuck device, when the electromagnet and the strong magnet repel each other magnetically, the strong magnet moves away from the electromagnet to push the chuck pin towards the wafer; when the electromagnet and the strong magnet attract each other magnetically, the strong magnet moves closer to the electromagnet to push the chuck pin away from the wafer.

[0016] In the rotary chuck device provided by this utility model, the chuck pin is connected to the rotary chuck via a first rod. The first rod, fixed to the rotary chuck, extends radially along the rotary chuck. The end of the chuck pin away from the wafer is slidably connected to the first rod. The chuck pin can slide along the extension direction of the first rod. Electromagnets and strong magnets are arranged alternately, and one of the electromagnets and strong magnets is connected to the chuck pin. Therefore, after the electromagnet is energized with current and generates a magnetism opposite to that of the strong magnet, the chuck pin connected to the strong magnet or electromagnet is pushed to slide along the extension direction of the first rod under the action of magnetic force until the chuck pin abuts against the wafer, clamping the wafer and fixing it in place. By switching the direction of the current in the electromagnet, the magnetism is changed, so that the magnetic force between the electromagnet and the strong magnet is opposite to that before, pushing the chuck pin to move in the opposite direction, causing the chuck pin to disengage from the wafer, thereby releasing the clamping and fixing of the wafer. At this time, the wafer can be removed. Compared with the prior art, the rotary chuck device provided by this utility model drives the movement of the chuck pin through the magnetic force between the electromagnet and the strong magnet. The electromagnet and the strong magnet are arranged at intervals and do not make direct contact, thus avoiding the problem of particle contamination caused by wear due to direct contact. There is no need to configure additional particle removal equipment, which not only improves the efficiency of semiconductor wet process operation, but also avoids additional costs. At the same time, the whole structure is simple, further reducing the complexity and cost of maintenance. Attached Figure Description

[0017] The accompanying drawings, which are included to provide a further understanding of the present invention and constitute a part of this invention, illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the present invention and do not constitute an undue limitation thereof. In the drawings:

[0018] Figure 1 This is a schematic diagram of the structure of the rotary chuck device disclosed in the embodiment of this utility model;

[0019] Figure 2 This is a schematic diagram of the chuck pin releasing the wafer according to an embodiment of the present utility model;

[0020] Figure 3 This is a schematic diagram of a chuck pin clamping a wafer, as disclosed in an embodiment of this utility model.

[0021] Figure label:

[0022] 10 is an electromagnet, 20 is a strong magnet, 30 is a sliding mechanism, 31 is the first rod, 32 is the second rod, 33 is the third rod, 40 is a chuck pin, 50 is a wafer, and 60 is a rotary chuck. Detailed Implementation

[0023] To make the technical problem to be solved, the technical solution, and the beneficial effects of this utility model clearer and more understandable, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0024] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0025] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified. "Several" means one or more, unless otherwise explicitly specified.

[0026] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0027] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0028] like Figure 1As shown in the figure, this utility model discloses a rotary chuck device, including a rotary chuck 60, a chuck pin 40, an electromagnet 10, a strong magnet 20, and a sliding mechanism 30. The strong magnet 20 and the electromagnet 10 are arranged alternately, and one of the strong magnet 20 and the electromagnet 10 is connected to the chuck pin 40. A first rod 31 in the sliding mechanism 30 is fixed to the rotary chuck 60 and extends radially along the rotary chuck 60. The end of the chuck pin 40 away from the end used for clamping the wafer 50 is slidably connected to the first rod 31. The chuck pin 40 can slide along the extension direction of the first rod 31 to approach or move away from the wafer 50, so that the chuck pin 40 is slidably mounted on the rotary chuck 60 via the first rod 31. One of the strong magnet 20 and the electromagnet 10 is connected to the chuck pin 40. When current is passed through the electromagnet 10, the electromagnet 10 generates magnetism. At this time, a magnetic force is generated between the electromagnet 10 and the strong magnet 20. Under the action of the magnetic force, the chuck pin 40 is pushed to move along the extension direction of the first rod 31. The chuck pin 40 moves closer to the wafer 50 until the chuck pin 40 abuts against the wafer 50, thereby realizing the clamping and fixing of the wafer 50 by the chuck pin 40. Then, by controlling the direction of the current passed through the electromagnet 10, the magnetic force between the electromagnet 10 and the strong magnet 20 is reversed, driving the chuck pin 40 away from the wafer 50 and releasing the clamping and fixing of the wafer 50. The rotary chuck device provided by this utility model drives the movement of the chuck pin through the magnetic force between an electromagnet and a strong magnet. The electromagnet and the strong magnet are arranged at intervals and do not make direct contact, thus avoiding the problem of particle contamination caused by wear due to direct contact. There is no need to configure additional particle removal equipment, which not only improves the efficiency of semiconductor wet process operation, but also avoids additional costs. At the same time, the whole structure is simple, further reducing the complexity and cost of maintenance.

[0029] like Figure 2 and Figure 3As shown, in a specific embodiment, the sliding mechanism 30 further includes a second rod 32 and a third rod 33. The first rod 31 has a sliding hole that extends along the moving direction of the chuck pin 40. The second rod 32 is arranged along the extending direction of the chuck pin 40, that is, the second rod 32 is arranged parallel to the chuck pin 40. The second rod 32 can slide up and down along the extending direction of the chuck pin 40 and is connected to the rotating chuck 60. The first end of the second rod 32 is hinged to the second end of the third rod 33, so that the second rod 32 and the third rod 33 can rotate relative to each other. The strong magnet 20 is fixed to the second end of the second rod 32 and corresponds to the electromagnet 10 at intervals. The first end of the third rod 33 is hinged to the chuck pin 40 through the sliding hole, and the first end of the third rod 33 can slide along the extending direction of the sliding hole. Therefore, after the electromagnet 10 generates magnetic force through the current, the strong magnet 20, under the magnetic force generated by the electromagnet 10 and the strong magnet 20, pushes the second rod 32 to slide upward. The upward sliding of the second rod 32 then causes the second end of the third rod 33 to move upward, while the first end of the third rod 33 slides along the sliding hole on the first rod 31, thereby pulling the chuck pin 40 closer to the wafer 50 until the chuck pin 40 abuts against the wafer 50 and clamps and fixes the wafer 50. And because the second rod 32 and the third rod The second rod 32, the third rod 33, and the chuck pin 40 are hinged together. The relative rotation between the second rod 32, the third rod 33, and the chuck pin 40 ensures timely adjustment of the relative angle between the second rod 32, the third rod 33, and the chuck pin 40. After adjusting the magnetic force between the electromagnet 10 and the strong magnet 20, the strong magnet 20 drives the second rod 32 to move downward. The second rod 32 pushes the chuck pin 40 away from the wafer 50 through the third rod 33, thereby releasing the clamping and fixing of the chuck pin 40 on the wafer 50, and the wafer 50 can be removed.

[0030] In another specific embodiment, the sliding mechanism 30 in the rotary chuck device provided in this embodiment includes a second rod 32, a third rod 33, a slider, and a slide rail. The second rod 32 is arranged along the extending direction of the chuck pin 40 and is slidably connected to the rotary chuck 60 along the extending direction of the chuck pin 40. The first end of the second rod 32 is hinged to the second end of the third rod 33. A strong magnet 20 is fixed to the second end of the second rod 32. The slider is slidably connected to the slide rail, which is disposed on the first rod 31. The slide rail extends along the extension direction of the first rod 31. The end of the chuck pin 40 away from the wafer 50 is fixed to the slider, while the first end of the third rod 33 is hinged to the slider. Therefore, under the magnetic force of the strong magnet 20 and the electromagnet 10, the strong magnet 20 drives the second rod 32 to move upward. The second rod 32 then pushes the slider to slide on the slide rail through the third rod 33. Subsequently, the chuck pin 40, which is fixedly connected to the slider, moves closer to the wafer 50 until it abuts against the wafer 50, thus clamping and fixing the wafer 50.

[0031] In one specific embodiment, the sliding mechanism 30 provided in this embodiment includes a tightening nut. Connecting holes are provided on the first end of the third rod 33 and the chuck pin 40. The first end of the third rod 33 and the chuck pin 40 are connected and assembled through the connecting holes and the tightening nut. The tightness of the connection between the third rod 33 and the chuck pin 40 can be adjusted by rotating the tightening nut. Under the magnetic force of the strong magnet 20 and the electromagnet 10, during the movement of the chuck pin 40, the connection between the third rod 33 and the chuck pin 40 is relatively loose, making the third rod 33 and the chuck pin 40 a hinged connection, ensuring relative rotation between the third rod 33 and the chuck pin 40 during movement. When the chuck pin 40 clamps the wafer 50, the tightness between the third rod 33 and the chuck pin 40 is increased by rotating the tightening nut, so that the third rod 33 and the chuck pin 40 are firmly connected and cannot rotate relative to each other. This achieves the limiting and fixing of the chuck pin 40, ensuring that the chuck pin 40 can firmly clamp the wafer 50 during the process and reducing the occurrence of wafer 50 loosening. When it is necessary for the chuck pin 40 to release the wafer 50, the tightness between the third rod 33 and the chuck pin 40 is reduced by rotating the tightening nut in the opposite direction, so that the third rod 33 and the chuck pin 40 can return to the hinged connection.

[0032] like Figure 2 As shown, in the rotary chuck device provided in this embodiment, when the chuck pin 40 needs to release the wafer 50, current is passed through the electromagnet 10. Under the action of magnetic force, the strong magnet 20 drives the second rod 32 to slide downward. At this time, the second rod 32 pushes the chuck pin 40 away from the wafer 50 through the third rod 33. During the process of the chuck pin 40 moving away from the wafer 50, the angle between the third rod 33 and the first rod 31 gradually decreases until the third rod 33 and the first rod 31 are parallel. At this time, the distance between the chuck pin 40 and the wafer 50 reaches the maximum, which facilitates the removal of the wafer 50. Furthermore, the second rod 32 moves to the lowest position, and the distance between the strong magnet 20 and the electromagnet 10 is the shortest.

[0033] In one specific embodiment, when current is applied to the electromagnet 10, the electromagnet 10 generates magnetism. When the magnetism of the electromagnet 10 and the strong magnet 20 repel each other, the strong magnet 20 moves away from the electromagnet 10 under the influence of magnetic force. The second rod 32, fixedly connected to the strong magnet 20, moves upward, and the third rod 33 pulls the chuck pin 40 to slide on the first rod. The chuck pin 40 moves closer to the wafer 50 until it abuts against the wafer 50, securing it in place. When the current applied to the electromagnet 10 is changed, the electromagnet 10 generates magnetism and attracts the strong magnet 20. Under the influence of magnetic force, the strong magnet 20 moves closer to the electromagnet 10. The second rod 32, fixedly connected to the strong magnet 20, moves downward, and the third rod 33 pushes the chuck pin 40 away from the wafer 50, thus releasing the chuck pin 40 from the wafer 50, allowing the wafer 50 to be removed.

[0034] In the description of the above embodiments, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0035] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. A rotary chuck device, characterized in that, It includes a rotary chuck, a chuck pin, an electromagnet, a strong magnet, and a sliding mechanism. The strong magnet and the electromagnet are arranged at intervals and corresponding to each other, and one of the electromagnet and the strong magnet is connected to the chuck pin. The sliding mechanism includes a first rod fixed to the rotating chuck, the first rod extending radially along the rotating chuck, and the end of the chuck pin away from the wafer clamping point slidably connected to the first rod, and the chuck pin can slide along the extension direction of the first rod. By controlling the magnetic force between the electromagnet and the strong magnet, the movement of the chuck pin is driven to clamp or release the wafer.

2. The rotary chuck device according to claim 1, characterized in that, The sliding mechanism further includes a second rod and a third rod, wherein the first rod has a sliding hole extending along the moving direction of the chuck pin; The second rod is slidably connected to the rotary chuck. The second rod extends and slides along the extension direction of the chuck pin. The first end of the second rod is hinged to the second end of the third rod. The strong magnet is fixed to the second end of the second rod. The first end of the third rod passes through the sliding hole and is hinged to the chuck pin, and the first end of the third rod can slide along the extension direction of the sliding hole.

3. The rotary chuck device according to claim 1, characterized in that, The sliding mechanism includes a second rod, a third rod, a slider, and a slide rail; The second rod is slidably connected to the rotary chuck. The second rod extends and slides along the extension direction of the chuck pin. The first end of the second rod is hinged to the second end of the third rod. The strong magnet is fixed to the second end of the second rod. The slider is slidably connected to the slide rail, the slide rail is disposed on the first rod, the slide rail extends along the extension direction of the first rod, the chuck pin is fixed to the slider, and the first end of the third rod is hinged to the slider.

4. The rotary chuck device according to claim 2, characterized in that, The sliding mechanism also includes a tightening nut. Both the first end of the third rod and the chuck pin have connecting holes. The first end of the third rod and the chuck pin are connected to the tightening nut through the connecting holes. During the movement of the chuck pin, the third rod and the chuck pin are hinged. When the chuck pin clamps the wafer, the tightening nut makes the third rod and the chuck pin securely connected.

5. The rotary chuck device according to claim 2, characterized in that, When the third member is parallel to the first member, the chuck pin releases the wafer.

6. The rotary chuck device according to any one of claims 1-5, characterized in that, When the electromagnet and the strong magnet are magnetically repelled, the strong magnet moves away from the electromagnet, thus pushing the chuck pin toward the wafer. When the electromagnet and the strong magnet are magnetically attracted, the strong magnet moves closer to the electromagnet, thus pushing the chuck pin away from the wafer.

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