Packaging base, composition board and electronic device
Through innovative designs of conductive wiring and interconnect wiring, the problems of thermal stress cracking and coating uniformity in miniaturized packaging substrates caused by traditional electroplating wiring solutions have been solved, achieving stability and size reduction of the packaging substrate.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 德阳三环科技有限公司
- Filing Date
- 2025-05-16
- Publication Date
- 2026-05-22
AI Technical Summary
Traditional electroplating wiring solutions lead to thermal stress cracking of the frame and poor plating uniformity in miniaturized and thinner packaging substrates. Furthermore, they are not suitable for the preparation of single insulating film layers, thus limiting the reduction in the size of the packaging substrate.
The design employs conductive wiring, toroidal interconnect wiring, and pad interconnect wiring, eliminating the through-hole conductors within the frame. It connects to the outside through the toroidal metal layer to achieve electroplating conductivity of the internal conductive layer of the package substrate, and exposes the conductive portion on the insulating substrate to simplify the electroplating wiring structure.
It avoids cracking caused by differences in thermal expansion of the frame, ensures the uniformity of the coating, is suitable for the preparation of a single insulating film layer, and improves the stability and versatility of the packaging base.
Smart Images
Figure CN224267271U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electronic packaging technology, and in particular to a packaging base, a combination board, and an electronic device. Background Technology
[0002] Packaging substrates are commonly used to encapsulate electronic components such as quartz crystals and semiconductor chips. The encapsulated components (such as semiconductor devices, temperature-compensated oscillators (TCXOs), tuning fork resonators, thermistor resonators, automotive components, general-purpose oscillators (OSCs), and pressure-compensated oscillators (VCXOs)) are widely used in a wide variety of electronic devices. A typical packaging substrate consists of an insulating substrate and conductive patterns on the substrate. The insulating substrate includes a main body and a frame, which together form a cavity for housing the electronic component. After the electronic component is placed in the cavity, a cover plate is sealed to the cavity opening using soldering, thus achieving the encapsulation of the electronic component.
[0003] The packaging substrate is typically fabricated on a large-size insulating substrate to obtain a packaging substrate assembly board composed of multiple packaging substrates. Electroplated wiring on the packaging substrate assembly board connects the conductive patterns on adjacent packaging substrates to achieve electroplating of all packaging substrates. After electroplating, the assembly board can be divided into individual packaging substrates using pre-set dividing slots.
[0004] Traditional electroplated wiring schemes require printing electroplated wiring onto multiple insulating film layers, then stacking these layers to fabricate the desired package substrate. Through-hole conductors within the frame are used to connect the annular metal layer on the upper surface of the frame to other electroplated wiring within the substrate. As electronic devices become increasingly miniaturized, package substrates also need to be miniaturized and thinner to meet application requirements. However, in miniaturized and thinner package substrates, the overall volume reduction leads to a decrease in the mechanical strength of the frame. If traditional electroplated wiring schemes are used, the difference in thermal expansion between the through-hole conductors within the frame and the insulator inside the frame can cause thermal stress cracking of the frame. Secondly, traditional electroplated wiring requires the package substrate to be composed of multiple stacked insulating film layers, which is unsuitable for cases where a single insulating film layer is used to fabricate the package substrate, limiting further reduction in package substrate size. Furthermore, due to the complexity of the circuitry, traditional electroplated wiring schemes can easily lead to poor plating uniformity when applied to smaller (miniaturized and thinner) package substrates. Utility Model Content
[0005] The purpose of this invention is to provide a packaging base, a combination board, and electronic devices that eliminate the need for through-hole conductors within the frame, thus avoiding frame cracking. This invention is applicable to the preparation of packaging bases with a single insulating film layer, further reducing the size of the packaging base, simplifying the electroplating wiring structure, and maintaining plating uniformity when the packaging base is small in size.
[0006] To achieve the above objectives, this utility model provides an encapsulation base, including...
[0007] An insulating substrate includes a main body and a frame disposed in a first direction. The main body has a first end face at one end away from the frame, and the frame has a second end face at the first end away from the main body. The main body and the frame have an outer side that is connected to each other around their periphery. The outer side is disposed between the first end face and the second end face. The frame and the main body together form a receiving cavity.
[0008] A ring-shaped metal layer is disposed on the second end face and surrounds the receiving cavity;
[0009] Multiple external connection terminals are disposed on the first end face;
[0010] An electrode pad is disposed within the receiving cavity and can be connected to an external connection terminal via a through-hole conductor;
[0011] A conductive wiring has one end located within the frame and connected to the annular metal layer, and the other end extending to the main body and connected to another external terminal.
[0012] A toroidal interconnect wiring is provided within the frame, with one end connected to the toroidal metal layer and the other end extending to the outer surface to form a first exposed portion;
[0013] The interconnect wiring for the pads is located within the insulating substrate. One end of the wiring extends within the main body and is connected to the electrode pads, while the other end extends within the frame and is exposed on the outer side to form a second exposed portion.
[0014] Furthermore, one end of the toroidal interconnect wiring is connected to the toroidal metal layer, and the other end of the conductive wiring is connected to the toroidal metal layer.
[0015] Furthermore, the first end face is connected to one end of the outer side face via a dividing bevel, and the second end face is connected to the other end of the outer side face via a dividing bevel.
[0016] The first exposed portion and / or the second exposed portion are disposed away from the dividing slope.
[0017] Furthermore, the insulating substrate includes a first corner region and a third corner region arranged diagonally, as well as a second corner region and a fourth corner region arranged diagonally, with a side region between adjacent corner regions.
[0018] Furthermore, the second corner region and the fourth corner region are both provided with interconnecting wiring for the pads.
[0019] Furthermore, the toroidal interconnect wiring is provided in both the first corner region and the third corner region.
[0020] Furthermore, the conductive wiring is provided in the first corner region and / or the third corner region.
[0021] Furthermore, the electrode pads include a first pad and a second pad, which are arranged diagonally within the receiving cavity.
[0022] This utility model also provides a packaging base assembly plate, comprising the packaging bases described in any of the above claims arranged together, wherein the insulating substrate has a first corner region and a third corner region arranged diagonally, and a second corner region and a fourth corner region arranged diagonally; and a side region is provided between adjacent corner regions.
[0023] The edge region is provided with the toroidal interconnect wiring and the pad interconnect wiring, and the toroidal interconnect wiring is electrically connected between adjacent package bases on opposite sides; the pad interconnect wiring is electrically connected between adjacent package bases on opposite sides.
[0024] or,
[0025] The toroidal interconnect wiring is provided in the edge region, and the pad interconnect wiring is provided in the second corner region and the third corner region, respectively.
[0026] The package bases with opposite sides are electrically connected to each other through toroidal interconnect wiring, and the package bases with opposite sides are electrically connected to each other through pad interconnect wiring.
[0027] or,
[0028] The toroidal interconnect wiring is provided in both the first corner region and the third corner region, and the pad interconnect wiring is provided in both the second corner region and the fourth corner region;
[0029] The package bases arranged diagonally adjacent to each other have toroidal interconnect wiring that is electrically connected to each other, and the package bases arranged diagonally adjacent to each other have pad interconnect wiring that is electrically connected to each other.
[0030] This utility model also provides an electronic device, including the packaging base described in any of the above claims, further including electronic components disposed in the receiving cavity, and a cover plate sealing the receiving cavity.
[0031] Compared with the prior art, the present invention discloses a packaging base, a composite board, and electronic devices, which have the following advantages: It includes conductive wiring, toroidal interconnect wiring, and pad interconnect wiring. One end of the conductive wiring is located within the frame and connected to the toroidal metal layer, while the other end extends to the main body and connects to another external terminal. The toroidal interconnect wiring is located within the frame, with one end connected to the toroidal metal layer and the other end extending to the outer surface to form a first exposed portion. The pad interconnect wiring is located within the insulating substrate, with one end extending within the main body and connected to the electrode pads, and the other end extending within the frame to the outer surface to form a second exposed portion. By providing the first and second exposed portions, electroplated conductive lines are formed in the composite board composed of multiple packaging bases, and electroplated conductive connections can be achieved between adjacent packaging bases. Simultaneously, electroplated conductive connections can also be achieved between different conductive layers within a single packaging base. Furthermore, by using conductive wiring instead of through-hole conductors in the frame, cracking of the frame due to thermal expansion differences is avoided, improving the stability of the packaging base structure. In addition, it simplifies the electroplating wiring, ensures the uniformity of the plating layer when applied to small-sized packaging substrates, and is also suitable for packaging substrates made with a single insulating film layer, making it highly versatile. Attached Figure Description
[0032] Figure 1 This is a perspective view of the packaging base according to an embodiment of the present invention;
[0033] Figure 2 This is a schematic diagram of the structure of the packaging base according to an embodiment of the present invention;
[0034] Figure 3 This is a top-view perspective view of the packaging base of this utility model embodiment;
[0035] Figure 4 yes Figure 3 Sectional view at point BB;
[0036] Figure 5 yes Figure 3 Sectional view at CC;
[0037] Figure 6 yes Figure 3 Sectional view at point DD;
[0038] Figure 7 This is a top view of the packaging base according to an embodiment of the present invention;
[0039] Figure 8This is a schematic diagram of the packaging base of this utility model without the insulating substrate;
[0040] Figure 9 This is a partial structural schematic diagram of the packaging base assembly plate according to an embodiment of the present utility model;
[0041] Figure 10 This is a schematic diagram of the packaging base assembly plate of this utility model without an insulating substrate;
[0042] Figure 11 This is a schematic diagram of the packaging base assembly plate of this utility model, excluding the insulating substrate and the annular metal layer;
[0043] Figure 12 This is a partial top perspective view of the packaging base assembly plate according to an embodiment of the present utility model;
[0044] Figure 13 yes Figure 12 Sectional view at EE;
[0045] Figure 14 yes Figure 12 Sectional view at FF;
[0046] Figure 15 yes Figure 12 Sectional view at point GG.
[0047] In the figure: 1. Insulating substrate; 100. Outer side; 101. Receiving cavity; 102. Dividing slope; 103. First corner region; 104. Second corner region; 105. Third corner region; 106. Fourth corner region; 107. Edge region; 11. Main body; 12. Frame; 111. First end face; 121. Second end face; 2. Annular metal layer; 3. External connection terminal; 4. Electrode pad; 41. First pad; 42. Second pad; 5. Through-hole conductor; 6. Conductive wiring; 7. Annular interconnect wiring; 71. First exposed portion; 8. Pad interconnect wiring; 81. Second exposed portion; 9. Terminal interconnect wiring; X. First direction; Y. Second direction; Z. Third direction; K. Dividing groove. Detailed Implementation
[0048] The specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit its scope.
[0049] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "inner", "outer" and other terms used in this utility model to indicate the orientation or positional relationship are based on the positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device and element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.
[0050] In the description of this utility model, it should be understood that the terms "first," "second," etc., are used to describe various information, but this information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this utility model, "first" information can also be referred to as "second" information, and similarly, "second" information can also be referred to as "first" information.
[0051] like Figures 1 to 15 As shown, a preferred embodiment of the present invention includes an insulating substrate 1, a toroidal metal layer 2, multiple external connection terminals 3, electrode pads 4, conductive wiring 6, toroidal interconnect wiring 7, and pad interconnect wiring 8. For ease of explanation, please refer to... Figure 1 The height direction of the packaging base is defined as the first direction X, the length direction as the second direction Y, and the width direction as the third direction Z. For details, please refer to... Figure 1 , Figure 4 , Figure 5 , Figure 6 The insulating substrate 1 includes a main body 11 and a frame 12 disposed in a first direction X. The main body 11 has a first end face 111 at its end away from the frame 12, and the frame 12 has a second end face 121 at its first end away from the main body 11. The main body 11 and the frame 12 have connecting outer surfaces 100 around their peripheries, located between the first end face 111 and the second end face 121. The frame 12 and the main body 11 together form a receiving cavity 101 for housing electronic components. A ring-shaped metal layer 2 is disposed on the second end face 121 and surrounds the receiving cavity 101. Multiple external connection terminals 3 are disposed on the first end face 111 and can be connected to external electronic components. Electrode pads 4 are disposed within the receiving cavity 101 and can be connected to an external connection terminal 3 through a through-hole conductor 5, enabling electrical connection between the electronic components inside the packaging substrate and external electronic components.
[0052] To achieve conductivity between the toroidal metal layer 2 and other conductive layers within the packaging base, the packaging base of this invention is provided with conductive wiring 6. One end of the conductive wiring 6 is located inside the frame 12 and connected to the toroidal metal layer 2, while the other end extends to the main body 11 and is connected to another external terminal through a through-hole conductor 5, thereby achieving conductivity between the toroidal metal layer 2 and other conductive layers within the packaging base. Compared to the traditional solution of using through-hole conductors inside the frame 12 to achieve conductivity between the toroidal metal layer 2 and other conductive layers within the packaging base, the conductive wiring 6 can effectively reduce the thermal expansion differences between different materials in the packaging base frame area, greatly reducing the risk of thermal stress cracking in the frame. Meanwhile, in order to facilitate the conductive wiring between the various packaging bases within the packaging base assembly board, the packaging base of this utility model includes a toroidal interconnect wiring 7 and a pad interconnect wiring 8. The toroidal interconnect wiring 7 is disposed within the frame 12, with one end connected to the toroidal metal layer 2 and the other end extending to the outer side 100 to form a first exposed portion 71. The pad interconnect wiring 8 is located within the insulating substrate 1, with one end extending within the main body 11 and connected to the electrode pad 4, and the other end extending within the frame 12 to the outer side 100 to form a second exposed portion 81.
[0053] To facilitate the explanation of the encapsulation base in this utility model, the preparation method of the encapsulation base in this utility model includes the following steps:
[0054] S1. Processing ceramic slurry into ceramic green bodies;
[0055] S2. Based on the through-hole conductor 5 structure of the main body 11 of the insulating substrate 1, through-holes are made in the ceramic green body, and through-hole conductor 5 is printed in the through-holes.
[0056] S3. Based on the conductive pattern structure of the insulating substrate 1, a conductive coating and a ceramic slurry layer covering part of the conductive coating are formed on the ceramic green body obtained in step S2 through multiple printing processes.
[0057] S4. Based on the cavity 101 and the conductive pattern structure, the ceramic green body obtained in step S3 is heated and pressed into shape using a mold to form an insulating substrate assembly green body with wiring structures such as internal conductive wiring and toroidal interconnect wiring 7.
[0058] S5. Remove the glue from the green insulating substrate assembly board and sinter it to obtain the semi-finished packaging base assembly board;
[0059] S6. Electroplating a metal coating onto the semi-finished packaging base assembly board to obtain the finished packaging base assembly board;
[0060] S7. Use the dividing slot to cut the packaging base assembly board into individual packaging bases.
[0061] When the packaging base is prepared by hot pressing, the formation process of the electroplated wiring (conductive wiring, terminal interconnect wiring, toroidal interconnect wiring, etc.) and the receiving cavity 11 inside the packaging base is as follows: a conductive coating and a ceramic slurry coating covering part or all of the conductive coating are sequentially printed on the upper / lower surface of the insulating substrate. Then, the substrate is heated and pressed into shape using a mold. The insulating substrate and the coating on it will deform according to the mold structure and fill the mold cavity. The ceramic slurry layer that was originally raised on the surface of the insulating substrate will sink to be flush with the surface of the insulating substrate due to pressure, thereby forming the receiving cavity 11 and the structure in which the conductive coating is located inside the packaging base.
[0062] Furthermore, in this embodiment, one end of the toroidal interconnect wiring 7 connected to the toroidal metal layer 2 and the other end of the conductive wiring 6 connected to the toroidal metal layer 2 are connected. Specifically, when the ends of the toroidal interconnect wiring 7 and the conductive wiring 6 connected to the toroidal metal layer 2 are not connected, the toroidal metal layer 2 is connected to both the toroidal interconnect wiring 7 and the conductive wiring 6, forming two connection points. Increasing the number of connection points will result in poor resistance uniformity of the electroplated wiring, affecting the uniformity of the electroplated layer thickness in step S6 of the packaging substrate. Moreover, parasitic capacitance may also be generated between the conductive wiring 6 and the toroidal interconnect wiring 7, causing the packaging substrate to be affected by its own signal interference during actual application, thus affecting the normal function of the packaging substrate.
[0063] Therefore, in this embodiment, the conductive wiring 6 is connected to the toroidal interconnect wiring 7, and there is only one connection point between it and the toroidal metal layer 2. This reduces the number of connection points, improves the resistance uniformity of the electroplated wiring, and enhances the overall symmetry of the electroplated wiring of the package substrate, thereby improving the current uniformity and ensuring the thickness uniformity of the electroplated layer of the package substrate. Simultaneously, it avoids the generation of parasitic capacitance between the conductive wiring 6 and the toroidal interconnect wiring 7, reducing signal interference in the actual use of the package substrate.
[0064] Furthermore, the encapsulation base assembly plate needs to be divided into multiple encapsulation bases by a dividing groove K. The dividing slopes 102 of adjacent encapsulation bases are arranged opposite each other to form the dividing groove K. If there is an electroplated wiring structure exposed in the dividing groove K, the adjacent encapsulation bases will stick together during electroplating due to the exposed electroplated wiring. Therefore, in this embodiment, the first end face 111 is connected to one end of the outer side face 100 through the dividing slope 102, and the second end face 121 is connected to the other end of the outer side face 100 through the dividing slope 102; the first exposed part 71 and / or the second exposed part 81 are disposed away from the dividing slope 102, that is, the first exposed part 71 and / or the second exposed part 81 are not exposed on the dividing slope 102.
[0065] Furthermore, to facilitate the arrangement of the wiring structure within the insulating substrate 1, the insulating substrate 1 is divided into regions. In this embodiment, the insulating substrate 1 has a rectangular parallelepiped shape. Therefore, referring to... Figure 1 , Figure 7 The insulating substrate 1 includes a first corner region 103 and a third corner region 105 arranged diagonally, and a second corner region 104 and a fourth corner region 106 arranged diagonally, with a side region 107 between adjacent corner regions. Furthermore, both the second corner region 104 and the fourth corner region 106 are provided with pad interconnect wiring 8, and one end of the pad interconnect wiring 8 extending from the main body 11 is connected to the electrode pad 4. Specifically, the electrode pad 4 includes a first pad 41 and a second pad 42, which are diagonally arranged within the receiving cavity 101. The first pad 41 and the second pad 42 are connected to external connection terminals 3 through through-hole conductors 5, with one pad corresponding to one external connection terminal, and each pad corresponding to at least one pad interconnect wiring 8.
[0066] Specifically, because the upper surface of the insulating substrate needs to undergo a hot-pressing process to form a cavity, the upper surface undergoes a high degree of deformation during hot-pressing. Simultaneously, the corner regions of the insulating substrate share corners with three adjacent insulating substrates in the combined board structure. Compared to the side regions that share an edge with only one adjacent insulating substrate, the corner regions require more filler material; otherwise, the corner regions of the packaged substrate will exhibit depressions after molding, resulting in poor flatness. This invention effectively increases the filler volume in the corner regions by placing the interconnecting wiring for the solder pads in the corner regions, ensuring sufficient filling during hot-pressing and resulting in a packaged substrate with excellent flatness.
[0067] In some other embodiments, the interconnect wiring 8 for the pads can also be disposed in the edge region 107 and adjacent corner regions (such as the second corner region 104 and the third corner region 105), and can be disposed accordingly according to the position of the electrode pads 4, and the position of the interconnect wiring 8 for the pads can be preferred. When the electrode pads 4 are disposed diagonally, for example, the first pad 41 is disposed in the second corner region 104 and the second pad 42 is disposed in the fourth corner region 106, it is preferred that the interconnect wiring 8 for the pads be disposed in the second corner region 104 and the fourth corner region 106 respectively. For example, when the first pad 41 and the second pad 42 are respectively set in adjacent corner regions, specifically, the first pad 41 is set in the second corner region 104 and the second pad 42 is set in the third corner region 105. In this case, the pad interconnect wiring 8 is set in the second corner region 104 and the third corner region 105 respectively, or the pad interconnect wiring 8 is set in the edge region 107 between the second corner region 104 and the third corner region 105. The setting area of the pad interconnect wiring 8 can be adjusted according to the actual design requirements.
[0068] Furthermore, in this embodiment, both the first corner region 103 and the third corner region 105 are provided with toroidal interconnect wiring 7. In some other embodiments, the toroidal interconnect wiring 7 may also be provided in the edge region 107. In step S4, since the insulating substrate 1 forms the receiving cavity 101 through the mold hot pressing process, the side of the insulating substrate 1 near the frame is formed to a higher degree. At the same time, since one corner region of the insulating substrate 1 shares an angle with the other three adjacent insulating substrates 1 in the structure of the combined plate, compared with the edge region 107 of the insulating substrate 1 which is only adjacent to the edge region 107 of another insulating substrate 1, the corner region requires more filler (such as coating or ceramic green body) to fill it. Otherwise, the corner region of the encapsulation base will be concave after molding, resulting in poor flatness. In this embodiment, by providing the toroidal interconnect wiring 7 in the corner region, the filling volume of the corner region can be effectively increased, so that the corner region is fully filled during the hot pressing process, and the encapsulation base has better flatness.
[0069] Similarly, to avoid the corner areas of the package base from becoming concave after molding, which would lead to a decrease in its flatness, conductive wiring 6 is provided in the first corner area 103 and / or the third corner area 105. One end of the conductive wiring 6 located in the main body 11 is connected to the external connection terminal 3 through the through-hole conductor 5. The specific reason for this is the same as that for the toroidal interconnect wiring 7, and will not be elaborated here.
[0070] Furthermore, in some other embodiments, to facilitate the connection between external connection terminals 3 in adjacent package bases, see [reference needed]. Figures 1 to 11 It also includes terminal interconnection wiring 9. Specifically, the terminal interconnection wiring 9 can be set in the corner area or the side area 107, and can be adjusted according to the number and position of the external connection terminals 3.
[0071] This utility model also provides a packaging base assembly plate, comprising the packaging bases of any of the above-mentioned embodiments arranged together. Specifically, see [link to relevant documentation]. Figures 9 to 15 The insulating substrate 1 has a first corner region 103 and a third corner region 105 arranged diagonally, as well as a second corner region 104 and a fourth corner region 106 arranged diagonally; a side region 107 is provided between adjacent corner regions. For ease of explanation, the encapsulation base assembly board includes an adjacent first encapsulation base A1, a second encapsulation base A2, a third encapsulation base A3, and a fourth encapsulation base A4, wherein the first encapsulation base A1 and the second encapsulation base A2, the third encapsulation base A3 and the fourth encapsulation base A4 are adjacent in the third direction Z, and the first encapsulation base A1 and the fourth encapsulation base A4, the second encapsulation base A2 and the third encapsulation base A3 are adjacent in the second direction Y.
[0072] Furthermore, in some embodiments, the edge region 107 is provided with toroidal interconnect wiring 7 and pad interconnect wiring 8, and adjacent package bases on opposite sides are electrically connected to each other with toroidal interconnect wiring 7 and adjacent package bases on opposite sides are electrically connected to each other with pad interconnect wiring 8.
[0073] In some embodiments, a toroidal interconnect wiring 7 (not shown in the figure) is provided in the edge region 107, and pad interconnect wiring 8 is provided in the second corner region 104 and the third corner region 105 respectively; toroidal interconnect wiring 7 is electrically connected between adjacent package bases on opposite sides, and pad interconnect wiring 8 is electrically connected between adjacent package bases on opposite sides; specifically, the toroidal interconnect wiring 7 on opposite sides of the first package base and the second package base are electrically connected, and the pad interconnect wiring 8 on opposite sides are electrically connected.
[0074] In other embodiments, toroidal interconnect wiring 7 is provided in both the first corner region 103 and the third corner region 105, and pad interconnect wiring 8 is provided in both the second corner region 104 and the fourth corner region 106; toroidal interconnect wiring 7 is electrically connected between diagonally adjacent package bases, and pad interconnect wiring 8 is electrically connected between diagonally adjacent package bases. Specifically, see [reference needed]. Figures 9 to 11 The first package base A1, the second package base A2, the third package base A3, and the fourth package base A4 are connected by a toroidal interconnect with diagonally arranged wiring 7 between the first package base A1 and the third package base A3, and by a pad interconnect with diagonally arranged wiring 8 between the second package base A2 and the fourth package base A4. Figures 12 to 15 As shown, the toroidal interconnect wiring 7 in the first package base A1 is electrically connected to the toroidal interconnect wiring 7 in the third package base A3 through the pad interconnect wiring 8 in the fourth package base A4; the pad interconnect wiring 8 in the fourth package base A4 is electrically connected to the pad interconnect wiring 8 in the second package base A2 through the toroidal interconnect wiring 7 in the first package base A1.
[0075] The present invention also provides an electronic device, including the packaging base described in any of the above claims, further including electronic components disposed in the receiving cavity 101, and a cover plate sealing the receiving cavity 101.
[0076] In summary, this utility model embodiment provides a packaging base, a composite board, and an electronic device, comprising conductive wiring 6, toroidal interconnect wiring 7, and pad interconnect wiring. One end of the conductive wiring 6 is located within the frame 12 and connected to the toroidal metal layer 2, while the other end extends to the main body 11 and connects to another external terminal. The toroidal interconnect wiring 7 is located within the frame 12, with one end connected to the toroidal metal layer 2 and the other end extending to the outer side 100 to form a first exposed portion 71. The pad interconnect wiring 8 is located within the insulating substrate 1, with one end extending within the main body 11 and connected to the electrode pad 4, and the other end extending within the frame 12 to the outer side 100 to form a second exposed portion 81. By providing the first exposed portion 71 and the second exposed portion 81, electroplated conductive lines are formed in the composite board composed of multiple packaging bases, and electroplated conductive connections can be achieved between adjacent packaging bases. Simultaneously, electroplated conductive connections can also be achieved between different conductive layers within a single packaging base. Furthermore, by using conductive wiring 6 instead of through-hole conductors 5 in the frame 12, cracking of the frame 12 due to thermal expansion differences is avoided, thus improving the stability of the packaging substrate structure. In addition, the electroplating wiring is simplified, ensuring the uniformity of the plating layer when applied to smaller packaging substrates, and it is also suitable for packaging substrates made with a single insulating film layer, demonstrating good versatility.
[0077] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and substitutions can be made without departing from the technical principles of the present utility model, and these improvements and substitutions should also be considered within the protection scope of the present utility model.
Claims
1. A packaging base, characterized in that: include An insulating substrate includes a main body and a frame disposed in a first direction. The main body has a first end face at one end away from the frame, and the frame has a second end face at the first end away from the main body. The main body and the frame have an outer side that is connected to each other around their periphery. The outer side is disposed between the first end face and the second end face. The frame and the main body together form a receiving cavity. A ring-shaped metal layer is disposed on the second end face and surrounds the receiving cavity; Multiple external connection terminals are disposed on the first end face; An electrode pad is disposed within the receiving cavity and can be connected to an external connection terminal via a through-hole conductor; A conductive wiring has one end located within the frame and connected to the annular metal layer, and the other end extending to the main body and connected to another external terminal. A toroidal interconnect wiring is provided within the frame, with one end connected to the toroidal metal layer and the other end extending to the outer surface to form a first exposed portion; The interconnect wiring for the pads is located within the insulating substrate. One end of the wiring extends within the main body and is connected to the electrode pads, while the other end extends within the frame and is exposed on the outer side to form a second exposed portion.
2. The packaging base as described in claim 1, characterized in that: One end of the toroidal interconnect wiring is connected to the toroidal metal layer, and the other end of the conductive wiring is connected to the toroidal metal layer.
3. The packaging base as described in claim 1, characterized in that: The first end face is connected to one end of the outer side face via a dividing bevel, and the second end face is connected to the other end of the outer side face via a dividing bevel; The first exposed portion and / or the second exposed portion are disposed away from the dividing slope.
4. The packaging base as described in claim 1, characterized in that: The insulating substrate includes a first corner region and a third corner region arranged diagonally, as well as a second corner region and a fourth corner region arranged diagonally, with a side region between adjacent corner regions.
5. The packaging base as described in claim 4, characterized in that: The second corner region and the fourth corner region are both provided with the interconnection wiring for the pads.
6. The packaging base as described in claim 4, characterized in that: The toroidal interconnect wiring is provided in both the first corner region and the third corner region.
7. The packaging base as described in claim 4, characterized in that: The conductive wiring is provided in the first corner region and / or the third corner region.
8. The packaging base as described in claim 1, characterized in that: The electrode pads include a first pad and a second pad, which are arranged diagonally within the receiving cavity.
9. A packaging base assembly board, comprising a plurality of packaging bases as described in any one of claims 1-8 arranged together, characterized in that: The insulating substrate has a first corner region and a third corner region arranged diagonally, as well as a second corner region and a fourth corner region arranged diagonally; a side region is provided between adjacent corner regions; The edge region is provided with the toroidal interconnect wiring and the pad interconnect wiring, and the toroidal interconnect wiring is electrically connected between adjacent package bases on opposite sides; the pad interconnect wiring is electrically connected between adjacent package bases on opposite sides. or, The toroidal interconnect wiring is provided in the edge region, and the pad interconnect wiring is provided in the second corner region and the third corner region, respectively. The package bases with opposite sides are electrically connected to each other through toroidal interconnect wiring, and the package bases with opposite sides are electrically connected to each other through pad interconnect wiring. or, The toroidal interconnect wiring is provided in both the first corner region and the third corner region, and the pad interconnect wiring is provided in both the second corner region and the fourth corner region; The package bases arranged diagonally adjacent to each other have toroidal interconnect wiring that is electrically connected to each other, and the package bases arranged diagonally adjacent to each other have pad interconnect wiring that is electrically connected to each other.
10. An electronic device comprising the packaging base according to any one of claims 1-8, characterized in that: It also includes electronic components disposed in the cavity, and a cover plate that seals the cavity.