Vacuum adsorption device and vacuum adsorption equipment

Abstract

This utility model discloses a vacuum adsorption device and a vacuum adsorption equipment, relating to the field of vacuum adsorption technology. The vacuum adsorption device includes a vacuum placement platform and at least one vacuum adsorption platform. The vacuum placement platform is configured to be mounted on a machine base, and multiple vacuum adsorption slots are provided on the top side of the vacuum placement platform. These multiple vacuum adsorption slots are configured to communicate with a vacuum pipe on the machine base. The vacuum adsorption platforms are detachably placed in at least one vacuum adsorption slot, and each vacuum adsorption platform is provided with a vacuum adsorption hole, each vacuum adsorption hole penetrating into a vacuum adsorption slot. The diameter of the vacuum adsorption hole is smaller than the width of the vacuum adsorption slot. Compared to the prior art, the vacuum adsorption device provided by this utility model can achieve adsorption on substrates of different thicknesses and can effectively alleviate the substrate adsorption depression phenomenon, thus having better applicability.

Description

Technical Field

[0001] This utility model relates to the field of vacuum adsorption technology, and more specifically, to a vacuum adsorption device and a vacuum adsorption equipment. Background Technology

[0002] With the rapid development of the semiconductor industry, electronic products are becoming increasingly miniaturized and thinner to meet user needs. As product performance and memory capacity increase, the substrate thickness is also decreasing (typically employing a core-less design).

[0003] In existing technologies, a vacuum platform is used to adsorb the substrate during chip mounting. When the substrate is thick, its structural strength is high, allowing for normal adsorption. However, when the substrate is thin, its structural strength is lower due to its thinness, and the vacuum holes on the vacuum platform exert excessive adsorption force, easily causing substrate deformation and indentation, resulting in poor soldering between the chip and the substrate pads. Furthermore, existing substrates exhibit unilateral warping, so larger vacuum holes are typically used to increase adsorption force, which further exacerbates the problem by subjecting the warped end to greater adsorption, leading to substrate indentation. Utility Model Content

[0004] The purpose of this invention is to provide a vacuum adsorption device and a vacuum adsorption platform that can adsorb substrates of different thicknesses and effectively reduce the adsorption depression phenomenon on the substrate, thus improving applicability.

[0005] The embodiments of this utility model are implemented as follows:

[0006] In one aspect, this utility model provides a vacuum adsorption device, comprising:

[0007] A vacuum placement platform is configured to be installed on a machine base, and a plurality of vacuum adsorption tanks are provided on the top side of the vacuum placement platform, and the plurality of vacuum adsorption tanks are configured to be connected to a vacuum pipe on the machine base.

[0008] At least one vacuum adsorption platform is provided, wherein the vacuum adsorption platform is detachably placed in at least one of the vacuum adsorption tanks, and the vacuum adsorption platform is provided with vacuum adsorption holes, each of the vacuum adsorption holes extending into the vacuum adsorption tank;

[0009] The diameter of the vacuum adsorption pore is smaller than the width of the vacuum adsorption groove.

[0010] In an optional embodiment, the plurality of vacuum adsorption tanks include a first adsorption tank and a second adsorption tank arranged at intervals, and there are a plurality of vacuum adsorption platforms, including a first adsorption platform and a second adsorption platform. The first adsorption platform is assembled in the first adsorption tank, and the second adsorption platform is assembled in the second adsorption tank.

[0011] In an optional embodiment, both the first adsorption platform and the second adsorption platform are flush with the surface of the vacuum placement platform.

[0012] In an optional embodiment, the first adsorption tank is rectangular, the second adsorption tank is L-shaped, the shape of the first adsorption platform is adapted to the shape of the first adsorption tank, and the shape of the second adsorption platform is adapted to the shape of the second adsorption tank.

[0013] In an optional embodiment, there are two first adsorption tanks and two second adsorption tanks. The two first adsorption tanks are arranged symmetrically around the center of the platform surface of the vacuum placement platform, and the two second adsorption tanks are arranged symmetrically around the center of the platform surface of the vacuum placement platform.

[0014] In an optional embodiment, the second adsorption platform includes a straight section and a bent section, the bent section being disposed at one end of the straight section and close to the center of the platform surface of the vacuum placement platform, and both the straight section and the bent section being provided with the vacuum adsorption holes.

[0015] In an optional embodiment, the bent portion is bent inward relative to the straight portion.

[0016] In an optional embodiment, the bottom wall of the vacuum adsorption tank is provided with a through hole, the size of which is smaller than the size of the vacuum adsorption platform, and is configured to connect to a vacuum pipe on the machine platform.

[0017] In an optional embodiment, the bottom side of the vacuum placement platform is provided with a positioning groove, which is configured to hold and position on the machine base.

[0018] In another aspect, this utility model embodiment provides a vacuum adsorption device, including a machine base and the aforementioned vacuum adsorption device. The machine base is provided with a vacuum pipe, the vacuum placement platform is installed on the machine base, and the vacuum adsorption tank is connected to the vacuum pipe.

[0019] The beneficial effects of this utility model embodiment include:

[0020] The vacuum adsorption device and equipment provided in this embodiment of the invention have a vacuum placement platform mounted on a machine base, and multiple vacuum adsorption slots are provided on the top side of the vacuum placement platform. These slots are all connected to vacuum pipes on the machine base. At least one vacuum adsorption slot contains a detachably placed vacuum adsorption platform, which has vacuum adsorption holes that are connected to the vacuum adsorption slot. The diameter of the vacuum adsorption holes is smaller than the width of the vacuum adsorption slot. In actual vacuum adsorption, if the substrate is thick, the vacuum adsorption slot can be used to directly adsorb the substrate. In this case, the vacuum adsorption platform can be selectively removed according to the substrate size. Because the vacuum adsorption slot is large, it can provide sufficient adsorption force to fix thicker and heavier substrates. If the substrate is thin, a suitable vacuum adsorption platform can be selected according to the substrate size and inserted into the vacuum adsorption slot. The vacuum adsorption holes of the platform are used to fix the substrate. Because the diameter of the vacuum adsorption holes is small, the adsorption force on the substrate can be reduced. Simultaneously, the vacuum adsorption holes on the vacuum adsorption platform can also locally adsorb the warped edges of the substrate, similarly reducing substrate adsorption depressions. Therefore, the vacuum adsorption device provided in this embodiment of the invention can adsorb substrates of different thicknesses and can effectively alleviate the adsorption depression phenomenon of the substrate, thus having better applicability. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the structure of the vacuum adsorption device provided in the embodiment of the present utility model;

[0023] Figure 2 This is an exploded structural diagram of the vacuum adsorption device provided in an embodiment of the present invention;

[0024] Figure 3 A schematic diagram of the vacuum adsorption device provided in an embodiment of this utility model from another perspective;

[0025] Figure 4 This is an exploded structural diagram of the vacuum adsorption device provided in an embodiment of the present invention from another perspective.

[0026] icon:

[0027] 100 - Vacuum adsorption device; 110 - Vacuum placement platform; 111 - Vacuum adsorption tank; 113 - First adsorption tank; 115 - Second adsorption tank; 130 - Vacuum adsorption platform; 131 - Vacuum adsorption hole; 133 - First adsorption platform; 135 - Second adsorption platform; 137 - Straight section; 139 - Bending section; 150 - Positioning groove; 170 - Through hole. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0029] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0030] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0031] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0032] Furthermore, terms such as "horizontal" and "vertical" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0033] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0034] As disclosed in the background section, existing chip mounting machines use a vacuum platform to adsorb the substrate. The vacuum holes on this platform are relatively large, making them suitable for relatively thick substrates. However, as the substrate becomes thinner, the adsorption force of the vacuum holes on the platform becomes too great, easily causing the substrate to deform due to adsorption. On the other hand, if smaller vacuum holes are used directly, it is impossible to adsorb relatively thick substrates, resulting in poor applicability.

[0035] To address the aforementioned problems, this invention provides a novel vacuum adsorption device and platform, capable of employing different vacuum adsorption methods for different types of substrates. The specific structure and working principle of this novel vacuum adsorption device and platform are further described below.

[0036] See Figures 1 to 4 This utility model provides a vacuum adsorption device 100, including a vacuum placement platform 110 and at least one vacuum adsorption platform 130. The vacuum placement platform 110 is configured to be mounted on a machine base, and a plurality of vacuum adsorption slots 111 are provided on the top side of the vacuum placement platform 110. The plurality of vacuum adsorption slots 111 are configured to communicate with a vacuum pipe on the machine base. The vacuum adsorption platform 130 is detachably placed in at least one vacuum adsorption slot 111. The vacuum adsorption platform 130 is provided with vacuum adsorption holes 131, and each vacuum adsorption hole 131 extends through the vacuum adsorption slot 111. The diameter of the vacuum adsorption hole 131 is smaller than the width of the vacuum adsorption slot 111.

[0037] In practical use, the vacuum placement platform 110 can be flexibly removed from or placed into the vacuum adsorption tank 111 according to the type and placement of the actual substrate. If the substrate is thick, the vacuum adsorption tank 111 can be used to directly adsorb the substrate. In this case, the vacuum adsorption platform 130 can be selectively removed according to the size of the substrate. Since the vacuum adsorption tank 111 is large, it can provide sufficient adsorption force to fix thicker and heavier substrates. If the substrate is thin, a suitable vacuum adsorption platform 130 can be selected according to the substrate size and placed into the vacuum adsorption tank 111. The vacuum adsorption holes 131 of the vacuum adsorption platform 130 are used to fix the substrate. Since the aperture of the vacuum adsorption holes 131 is small, the adsorption force on the substrate can be reduced. At the same time, the vacuum adsorption holes 131 on the vacuum adsorption platform 130 can also locally adsorb the warped edges of the substrate, which can also reduce substrate adsorption depression.

[0038] In some embodiments, the plurality of vacuum adsorption grooves 111 include first adsorption grooves 113 and second adsorption grooves 115 spaced apart, and the plurality of vacuum adsorption platforms 130 include first adsorption platforms 133 and second adsorption platforms 135. The first adsorption platforms 133 are assembled in the first adsorption grooves 113, and the second adsorption platforms 135 are assembled in the second adsorption grooves 115. Specifically, there can also be a plurality of vacuum adsorption platforms 130, and the position and number of vacuum adsorption platforms 130 can be adjusted according to actual conditions to suit substrates of different thicknesses and different assembly methods. For example, when the substrate is thin and has a large area, each first adsorption groove 113 can be equipped with a first adsorption platform 133, and each second adsorption groove 115 can be equipped with a second adsorption platform 135. Vacuum adsorption of the substrate can be achieved solely through the vacuum adsorption holes 131, which can effectively alleviate the adsorption depression phenomenon. When the substrate is thin and has a small area, the first adsorption platform 133 can be selectively installed in some of the first adsorption grooves 113 and the second adsorption platform 135 can be installed in some of the second adsorption grooves 115, depending on the shape of the substrate. When the substrate is thick and without warping, the first adsorption platform 133 and the second adsorption platform 135 can be removed, and the substrate can be adsorbed solely through the vacuum adsorption tank 111. When the substrate is thick and partially warped, a portion of the first adsorption platform 133 and / or the second adsorption platform 135 can be removed, and the main body of the substrate can be adsorbed using the vacuum adsorption tank 111, while the warped portion of the substrate can be adsorbed using the vacuum adsorption holes 131. The arrangement of the vacuum adsorption platforms 130 is not detailed here.

[0039] In some embodiments, both the first adsorption platform 133 and the second adsorption platform 135 are flush with the surface of the vacuum placement platform 110. Specifically, the height of the first adsorption platform 133 is the same as the depth of the first adsorption groove 113, and the height of the second adsorption platform 135 is the same as the depth of the second adsorption groove 115, thereby keeping the surface of the vacuum placement platform 110 flush, which is more conducive to forming a planar structure for the substrate.

[0040] In some embodiments, the first adsorption tank 113 is rectangular, the second adsorption tank 115 is L-shaped, the shape of the first adsorption platform 133 is adapted to the shape of the first adsorption tank 113, and the shape of the second adsorption platform 135 is adapted to the shape of the second adsorption tank 115. Specifically, the first adsorption tank 113 is a rectangular tank, and the first adsorption platform 133 is a rectangular platform, which can be adapted to fit into the first adsorption tank 113 to achieve assembly and adsorption. Similarly, the second adsorption tank 115 is an L-shaped tank, that is, the shape of the second adsorption tank 115 from the perspective of the attached drawings is L-shaped, and the second adsorption platform 135 is also L-shaped, which can be adapted to fit into the second adsorption tank 115. By designing vacuum adsorption tanks 111 and vacuum adsorption platforms 130 of different shapes, substrates of different shapes can be adapted, and adsorption can be performed adaptively for different positions of the substrate, resulting in better applicability.

[0041] In some embodiments, there are two first adsorption tanks 113 and two second adsorption tanks 115. The two first adsorption tanks 113 are arranged symmetrically along the center of the platform surface of the vacuum placement platform 110, and the two second adsorption tanks 115 are arranged symmetrically along the center of the platform surface of the vacuum placement platform 110. Specifically, the first adsorption tanks 113 and the second adsorption tanks 115 are staggered. The vacuum placement platform 110 is a rectangular platform, and the two first adsorption tanks 113 are diagonally distributed and arranged symmetrically; the two second adsorption tanks 115 are diagonally distributed and arranged symmetrically.

[0042] In some embodiments, the second adsorption platform 135 includes a straight portion 137 and a bent portion 139. The bent portion 139 is disposed at one end of the straight portion 137 and close to the center of the platform surface of the vacuum placement platform 110. Both the straight portion 137 and the bent portion 139 are provided with vacuum adsorption holes 131. Specifically, the bent portion 139 is provided with vacuum adsorption holes 131, so the bent portion 139 can serve as a vacuum adsorption enhancement area, working in conjunction with the straight portion 137 to fix the substrate.

[0043] In some embodiments, the bent portion 139 is bent inward relative to the straight portion 137. Specifically, the bent portion 139 is bent relative to the straight portion 137 toward the center of the vacuum placement platform 110, such that the two second adsorption platforms 135 are bent relative to each other. Of course, in other preferred embodiments of the present invention, the bent portion 139 may also be bent relative to the straight portion 137 toward a direction away from the center of the platform, thereby causing the two second adsorption platforms 135 to be bent away from each other.

[0044] In some embodiments, the bottom wall of the vacuum adsorption tank 111 is provided with a through hole 170. The size of the through hole 170 is smaller than the size of the vacuum adsorption platform 130, and it is configured to connect to a vacuum pipe on the machine. Specifically, the through hole 170 can be fitted onto the interface of the vacuum pipe, thereby realizing the connection between the vacuum pipe and the vacuum adsorption tank 111. At the same time, the size of the through hole 170 is smaller than that of the vacuum adsorption platform 130, so the vacuum adsorption platform 130 can be fitted into the vacuum adsorption tank 111 and placed on the bottom wall of the vacuum adsorption tank 111 for positioning.

[0045] In some embodiments, a positioning groove 150 is provided on the bottom side of the vacuum placement platform 110, and the positioning groove 150 is configured to hold and position on the machine tool. Specifically, the positioning groove 150 is provided on the bottom edge of the vacuum placement platform 110 and extends along the width direction of the vacuum placement platform 110, and the positioning groove 150 enables the positioning and installation of the vacuum placement platform 110.

[0046] This utility model embodiment also provides a vacuum adsorption device, including a machine base and the aforementioned vacuum adsorption apparatus 100. The vacuum adsorption apparatus 100 includes a vacuum placement platform 110 and at least one vacuum adsorption platform 130. The vacuum placement platform 110 is configured to be mounted on the machine base, and a plurality of vacuum adsorption grooves 111 are provided on the top side of the vacuum placement platform 110. The vacuum adsorption platform 130 is detachably placed in at least one vacuum adsorption groove 111, and the vacuum adsorption platform 130 is provided with vacuum adsorption holes 131, each of which extends to the vacuum adsorption groove 111. The diameter of the vacuum adsorption hole 131 is smaller than the width of the vacuum adsorption groove 111. The machine base is provided with a vacuum pipe, the vacuum placement platform 110 is mounted on the machine base, and the vacuum adsorption groove 111 is connected to the vacuum pipe.

[0047] In summary, the vacuum adsorption device 100 and vacuum adsorption equipment provided in this embodiment have a vacuum placement platform 110 mounted on a machine base, and a plurality of vacuum adsorption slots 111 are provided on the top side of the vacuum placement platform 110. All vacuum adsorption slots 111 are connected to vacuum pipes on the machine base. At least one vacuum adsorption slot 111 contains a detachably placed vacuum adsorption platform 130, which has a vacuum adsorption hole 131 that extends through and connects to the vacuum adsorption slot 111. The diameter of the vacuum adsorption hole 131 is smaller than the width of the vacuum adsorption slot 111. In actual vacuum adsorption, if the substrate is thick, the vacuum adsorption slot 111 can be used to directly adsorb the substrate. In this case, the vacuum adsorption platform 130 can be selectively removed according to the size of the substrate. Because the vacuum adsorption slot 111 is relatively large, it can provide sufficient adsorption force to fix thicker and heavier substrates. If the substrate thickness is small, a suitable vacuum adsorption platform 130 can be selected according to the substrate size and placed into the vacuum adsorption tank 111. The substrate is fixed using the vacuum adsorption holes 131 of the vacuum adsorption platform 130. Since the pore size of the vacuum adsorption holes 131 is small, the adsorption force on the substrate can be reduced. At the same time, the vacuum adsorption holes 131 on the vacuum adsorption platform 130 can also locally adsorb the warped edges of the substrate, which can also reduce substrate adsorption depression. Therefore, the vacuum adsorption device 100 provided in this embodiment of the present invention can adsorb substrates of different thicknesses and can effectively alleviate the substrate adsorption depression phenomenon, thus having better applicability.

[0048] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A vacuum adsorption device, characterized in that, include: A vacuum placement platform is configured to be installed on a machine base, and a plurality of vacuum adsorption tanks are provided on the top side of the vacuum placement platform, and the plurality of vacuum adsorption tanks are configured to be connected to a vacuum pipe on the machine base. At least one vacuum adsorption platform is provided, wherein the vacuum adsorption platform is detachably placed in at least one of the vacuum adsorption tanks, and the vacuum adsorption platform is provided with vacuum adsorption holes, each of the vacuum adsorption holes extending into the vacuum adsorption tank; The diameter of the vacuum adsorption pore is smaller than the width of the vacuum adsorption groove.

2. The vacuum adsorption device according to claim 1, characterized in that, The plurality of vacuum adsorption tanks include a first adsorption tank and a second adsorption tank arranged at intervals. There are a plurality of vacuum adsorption platforms, including a first adsorption platform and a second adsorption platform. The first adsorption platform is assembled in the first adsorption tank, and the second adsorption platform is assembled in the second adsorption tank.

3. The vacuum adsorption device according to claim 2, characterized in that, Both the first adsorption platform and the second adsorption platform are flush with the surface of the vacuum placement platform.

4. The vacuum adsorption device according to claim 2, characterized in that, The first adsorption tank is rectangular, the second adsorption tank is L-shaped, the shape of the first adsorption platform is adapted to the shape of the first adsorption tank, and the shape of the second adsorption platform is adapted to the shape of the second adsorption tank.

5. The vacuum adsorption device according to claim 4, characterized in that, There are two first adsorption tanks and two second adsorption tanks. The two first adsorption tanks are arranged symmetrically along the center of the platform surface of the vacuum placement platform. The two second adsorption tanks are also arranged symmetrically along the center of the platform surface of the vacuum placement platform.

6. The vacuum adsorption device according to claim 4, characterized in that, The second adsorption platform includes a straight section and a bent section. The bent section is located at one end of the straight section and close to the center of the platform surface of the vacuum placement platform. Both the straight section and the bent section are provided with vacuum adsorption holes.

7. The vacuum adsorption device according to claim 6, characterized in that, The bent portion bends inward relative to the straight portion.

8. The vacuum adsorption device according to claim 1, characterized in that, The bottom wall of the vacuum adsorption tank is provided with a through hole, the size of which is smaller than the size of the vacuum adsorption platform, and is configured to connect to a vacuum pipe on the machine platform.

9. The vacuum adsorption device according to claim 1, characterized in that, The bottom side of the vacuum placement platform is provided with a positioning groove, which is configured to hold and position the platform on the machine.

10. A vacuum adsorption device, characterized in that, The device includes a machine base and a vacuum adsorption apparatus as described in any one of claims 1-9, wherein the machine base is provided with a vacuum pipeline, the vacuum placement platform is installed on the machine base, and the vacuum adsorption tank is connected to the vacuum pipeline.

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