Sleeve pressing die structure for fixing MOS (Metal Oxide Semiconductor) tube

Abstract

The utility model relates to the production field of electric vehicle controllers, in particular to a sleeve pressing die structure for fixing MOS (Metal Oxide Semiconductor) tubes, which comprises a sleeve die body and a blending mechanism, the blending mechanism comprises an insertion block, a side block and an adaptive assembly, the insertion block is detachably connected with the cover die body, the side block is fixedly connected with the insertion block, the adaptive assembly comprises an auxiliary block, a T-shaped block, a sliding block, an adjusting bolt, an anti-skid pad and a pressing piece, the auxiliary block is fixedly connected with the cover die body, the T-shaped block is slidably connected with the cover die body, and the sliding block is slidably connected with the cover die body. The cover die body is provided with an adjusting groove matched with the sliding block, the adjusting bolt is in threaded connection with the T-shaped block and located on the outer side of the sliding block, the non-slip mat is fixedly connected with the adjusting bolt and located on the outer side of the adjusting bolt, and the downward pressing piece is fixedly connected with the side block, so that the nylon cover die can be adjusted in a matched mode according to MOS transistors of different sizes, and the nylon cover die can be compatible with elements of multiple models. And the manufacturing cost of the pressing die structure is effectively reduced.

Description

Technical Field

[0001] This utility model relates to the field of electric vehicle controller manufacturing technology, and in particular to a die-casting structure for fixing MOS transistors. Background Technology

[0002] The traditional method of fixing MOSFETs involves first fixing the MOSFET to an aluminum strip with insulating cloth. During production, the aluminum strip is then inserted into the core board. When using an integrated aluminum housing, the aluminum strip can be saved, eliminating the step of fixing the MOSFET to the aluminum strip. However, if the MOSFET is directly inserted into the core board and passed through the solder pot during production, due to the lack of a fixing device, the MOSFET coming out of the solder pot will tilt to varying degrees. If the tilt is severe, the upper and lower MOSFETs will touch and short-circuit, thus affecting the quality and appearance of the product.

[0003] To address the aforementioned issues, existing patent (CN205016510U) discloses a die for fixing MOSFETs. The die houses the MOSFET, which has positioning holes. The die comprises a nylon die and a stainless steel die. The nylon die is a strip-shaped structure with an upper row of positioning posts and a lower row of limiting protrusions on one side. A base is located at the bottom of the other side of the nylon die. The stainless steel die has an outwardly bent arc-shaped pressure plate at the bottom of one side, with a step in the middle of the same side. This invention is used to fix MOSFETs, allowing for accurate positioning and welding onto the circuit board without fixing the MOSFET to an aluminum strip. This ensures that the MOSFETs output from the solder bath are not tilted, are neat and aesthetically pleasing, and improve production quality.

[0004] However, in the aforementioned prior art, the nylon mold is of a fixed specification and cannot be compatible with MOSFETs of different sizes, which means that the mold needs to be changed frequently when performing molding operations on MOSFETs of different sizes. Utility Model Content

[0005] The purpose of this invention is to provide a die-casting structure for fixing MOSFETs, which solves the technical problem that the existing nylon die-casting is of a fixed specification and cannot be compatible with MOSFETs of different sizes, resulting in the need to frequently change the die when performing die-casting operations on MOSFETs of different sizes.

[0006] To achieve the above objectives, this utility model employs a die-fitting structure for fixing a MOS transistor, comprising a die body and an adjustment mechanism. The adjustment mechanism includes an insertion block, a side block, and an adapter component. The insertion block is detachably connected to the die body and located within the die body. The side block is fixedly connected to the insertion block and located outside the side block. The adapter component includes an auxiliary block, a T-shaped block, a sliding block, an adjusting bolt, an anti-slip pad, and a pressing component. The auxiliary block is fixedly connected to the die body and located on the side of the die body away from the side block. The T-shaped block is slidably connected to the die body and located outside the auxiliary block. The sliding block is connected to and penetrates the die body, and the die body has an adjustment groove adapted to the sliding block. The adjusting bolt is threadedly connected to the T-shaped block and located outside the sliding block. The anti-slip pad is fixedly connected to the adjusting bolt and located outside the adjusting bolt. The pressing component is fixedly connected to the side block and located above the T-shaped block.

[0007] The pressing component includes a MOS transistor body and a top plate. The MOS transistor body is detachably connected to the T-shaped block and is located above the T-shaped block. The top plate is fixedly connected to the mold body and is located above the MOS transistor body.

[0008] The pressing component further includes an adjusting block, a driving rod, and a fixed seat. The adjusting block is fixedly connected to one end of the driving rod and is located above the driving rod. The driving rod is threadedly connected to the top plate and passes through the top plate, and the surface of the driving rod has threads. The fixed seat is rotatably connected to the other end of the driving rod and is located below the driving rod.

[0009] The pressing component further includes a pressing plate and a ceramic fiber pad. The pressing plate is fixedly connected to the fixing seat and is located below the fixing seat. The ceramic fiber pad is fixedly connected to the pressing plate and is located below the pressing plate.

[0010] The pressing component further includes a limiting rod, which is fixedly connected to the pressing plate and located outside the driving rod, and the limiting rod passes through the top plate.

[0011] This utility model discloses a sleeve molding structure for fixing MOSFETs. In practical use, the required number of T-shaped blocks are installed from the adjustment slot into the sleeve mold body according to the needs. The insertion block is inserted into the sleeve mold body and fixed by bolts, so that the side block fits against the sleeve mold body. The sliding block slides in the adjustment slot. After the position of the T-shaped blocks is adjusted, the adjustment bolt is rotated. The sliding block ensures that the T-shaped blocks remain stable. The adjustment bolt pushes the anti-slip pad against the sleeve mold body to fix the T-shaped blocks. This method can effectively solve the problem that nylon sleeve molds cannot be compatible with MOSFETs of different sizes. Attached Figure Description

[0012] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 This is a schematic diagram of a sleeve molding structure for fixing a MOS transistor according to the present invention.

[0014] Figure 2 This is a front view of a sleeve molding structure for fixing a MOS transistor according to this utility model.

[0015] Figure 3 This is a rear view of a sleeve molding structure for fixing a MOS transistor according to this utility model.

[0016] Figure 4 This is a schematic diagram of the dispensing mechanism of this utility model.

[0017] 101-Mold body, 102-Insert block, 103-Side block, 104-Auxiliary block, 105-T-shaped block, 106-Sliding block, 107-Adjusting bolt, 108-Anti-slip pad, 109-MOS transistor body, 110-Top plate, 111-Adjusting block, 112-Drive rod, 113-Fixed seat, 114-Lower pressure plate, 115-Ceramic fiber pad, 116-Limiting rod, 117-Adjusting groove. Detailed Implementation

[0018] The embodiments of the present invention are described in detail below. Examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, but should not be construed as limiting the present invention.

[0019] Please see Figures 1-4 ,in Figure 1This is a schematic diagram of a sleeve molding structure for fixing a MOS transistor according to this utility model. Figure 2 This is a front view of a sleeve molding structure for fixing a MOS transistor according to this utility model. Figure 3 This is a rear view of a sleeve molding structure for fixing a MOS transistor according to this utility model. Figure 4 This is a schematic diagram of the dispensing mechanism of this utility model.

[0020] This utility model provides a die-fitting structure for fixing MOSFETs, including a die body 101 and an adjustment mechanism. The adjustment mechanism includes an insertion block 102, a side block 103, and an adapter component. The adapter component includes an auxiliary block 104, a T-shaped block 105, a sliding block 106, an adjusting bolt 107, an anti-slip pad 108, and a pressing component. The pressing component includes a MOSFET body 109, a top plate 110, an adjusting block 111, a drive rod 112, a fixing seat 113, a pressing plate 114, a ceramic fiber pad 115, and a limiting rod 116. The aforementioned solution solves the problem that nylon die-fitting is of a fixed specification and cannot be compatible with MOSFETs of different sizes, resulting in the need to frequently change the die when performing die-fitting operations on MOSFETs of different sizes.

[0021] In this specific embodiment, the adjusting mechanism includes an insertion block 102, a side block 103, and an adapter assembly. The insertion block 102 is detachably connected to the mold body 101 and is located inside the mold body 101. The side block 103 is fixedly connected to the insertion block 102 and is located outside the side block 103. The adapter assembly includes an auxiliary block 104, a T-shaped block 105, a sliding block 106, an adjusting bolt 107, an anti-slip pad 108, and a pressing component. The auxiliary block 104 is connected to the mold body... 101 is fixedly connected and located on the side of the mold body 101 away from the side block 103. The T-shaped block 105 is slidably connected to the mold body 101 and located outside the auxiliary block 104. The sliding block 106 is connected to the mold body 101 and passes through the mold body 101. The mold body 101 has an adjustment groove 117 adapted to the sliding block 106. The adjusting bolt 107 is threadedly connected to the T-shaped block 105 and located outside the sliding block 106. The anti-slip pad 108 is fixedly connected to the adjusting bolt 107 and is located outside the adjusting bolt 107. The pressing member is fixedly connected to the side block 103 and is located above the T-block 105. The required number of T-blocks 105 are installed from the adjusting groove 117 into the mold body 101 according to requirements. The insertion block 102 is inserted into the mold body 101 and fixed with bolts, so that the side block 103 fits against the mold body 101. Another auxiliary block 104 is provided on the outside of 103. The sliding block 106 slides in the adjustment groove 117. After the position of the T-shaped block 105 is adjusted, the adjustment bolt 107 is rotated. The sliding block 106 ensures that the T-shaped block 105 remains stable. The adjustment bolt 107 pushes the anti-slip pad 108 against the mold body 101 to fix the T-shaped block 105. This method can effectively solve the problem that nylon molds cannot be compatible with MOS transistors of different sizes.

[0022] The pressing component includes a MOS transistor body 109 and a top plate 110. The MOS transistor body 109 is detachably connected to the T-shaped block 105 and is located above the T-shaped block 105. The top plate 110 is fixedly connected to the mold body 101 and is located above the MOS transistor body 109. The MOS transistor body 109 is placed between the two T-shaped blocks 105 or between the auxiliary block 104 and the T-shaped block 105. The top plate is located above the MOS transistor body 109.

[0023] Secondly, the pressing component also includes an adjusting block 111, a driving rod 112, and a fixed seat 113. The adjusting block 111 is fixedly connected to one end of the driving rod 112 and is located above the driving rod 112. The driving rod 112 is threadedly connected to the top plate 110 and passes through the top plate 110. The surface of the driving rod 112 is threaded. The fixed seat 113 is rotatably connected to the other end of the driving rod 112 and is located below the driving rod 112. When the adjusting block 111 is rotated, the driving rod 112 is threadedly connected to the top plate, so that the driving rod 112 pushes the fixed seat 113 to adjust its height.

[0024] Meanwhile, the pressing component also includes a pressing plate 114 and a ceramic fiber pad 115. The pressing plate 114 is fixedly connected to the fixing seat 113 and is located below the fixing seat 113. The ceramic fiber pad 115 is fixedly connected to the pressing plate 114 and is located below the pressing plate 114. The fixing seat 113 pushes the pressing plate 114 downward, so that the ceramic fiber pad 115 fits against the upper part of the MOS transistor body 109, thereby fixing the MOS transistor body 109.

[0025] In addition, the pressing component also includes a limiting rod 116, which is fixedly connected to the pressing plate 114 and located outside the driving rod 112. The limiting rod 116 passes through the top plate 110. The pressing plate 114 drives the limiting rod 116 to adjust, and the limiting rod 116 ensures that the pressing plate 114 can be stably adjusted in height.

[0026] Using the MOSFET fixing molding structure of this embodiment, by setting the insertion block 102, the side block 103, and the adapter component, in specific use, the components used in this structure are uniformly high-temperature resistant parts. The required number of T-blocks 105 are installed from the adjustment groove 117 into the molding body 101 according to requirements. The insertion block 102 is inserted into the molding body 101 and fixed with bolts, so that the side block 103 fits against the molding body 101. The sliding block 106 slides within the adjustment groove 117. The spacing between the multiple T-blocks 105 is adjusted according to the size of the MOSFET body 109. After the position of the T-blocks 105 is adjusted, the adjustment bolt 107 is rotated. The sliding block 106 ensures the stability of the T-block 105. The adjusting bolt 107 pushes the anti-slip pad 108 against the mold body 101 to fix the T-block 105. The MOS tube body 109 is placed between the two T-blocks 105 or between the auxiliary block 104 and the T-block 105. The adjusting block 111 is rotated, and the driving rod 112 pushes the fixing seat 113 to press down the lower pressure plate 114, so that the ceramic fiber pad 115 is attached to the top of the MOS tube body 109 to fix the MOS tube body 109. In this way, the nylon mold can be adapted and adjusted according to the MOS tube of different sizes, which can be compatible with multiple models of components and effectively reduce the manufacturing cost of the molding structure.

[0027] The above-disclosed embodiments are merely preferred embodiments of the present utility model and should not be construed as limiting the scope of the present utility model. Those skilled in the art can understand that implementing all or part of the above-described embodiments and making equivalent changes in accordance with the claims of the present utility model are still within the scope of the utility model.

Claims

1. A molding die structure for fixing a MOS transistor, comprising a molding die body, characterized in that, It also includes allocation mechanisms; The adjusting mechanism includes an insertion block, a side block, and an adapter component. The insertion block is detachably connected to the mold body and located within the mold body. The side block is fixedly connected to the insertion block and located outside the side block. The adapter component includes an auxiliary block, a T-shaped block, a sliding block, an adjusting bolt, an anti-slip pad, and a pressing member. The auxiliary block is fixedly connected to the mold body and located on the side of the mold body away from the side block. The T-shaped block is slidably connected to the mold body and located outside the auxiliary block. The sliding block is connected to and penetrates the mold body, and the mold body has an adjusting groove that adapts to the sliding block. The adjusting bolt is threadedly connected to the T-shaped block and located outside the sliding block. The anti-slip pad is fixedly connected to the adjusting bolt and located outside the adjusting bolt. The pressing member is fixedly connected to the side block and located above the T-shaped block.

2. The die-casting structure for fixing a MOS transistor as described in claim 1, characterized in that, The pressing component includes a MOS transistor body and a top plate. The MOS transistor body is detachably connected to the T-shaped block and is located above the T-shaped block. The top plate is fixedly connected to the mold body and is located above the MOS transistor body.

3. The die-casting structure for fixing a MOS transistor as described in claim 2, characterized in that, The pressing component further includes an adjusting block, a driving rod, and a fixed seat. The adjusting block is fixedly connected to one end of the driving rod and is located above the driving rod. The driving rod is threadedly connected to the top plate and passes through the top plate. The surface of the driving rod has threads. The fixed seat is rotatably connected to the other end of the driving rod and is located below the driving rod.

4. The die-casting structure for fixing a MOS transistor as described in claim 3, characterized in that, The pressing component further includes a pressing plate and a ceramic fiber pad. The pressing plate is fixedly connected to the fixing seat and is located below the fixing seat. The ceramic fiber pad is fixedly connected to the pressing plate and is located below the pressing plate.

5. The die-casting structure for fixing a MOS transistor as described in claim 4, characterized in that, The pressing component also includes a limiting rod, which is fixedly connected to the pressing plate and located outside the driving rod, and the limiting rod passes through the top plate.

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