A multi-point temperature acquisition system and a data center cabinet

Abstract

This utility model provides a multi-point temperature acquisition system and a data center cabinet. The system includes multiple temperature acquisition modules, connecting cables, and a concentrator. The connecting cables are two-wire systems, including a power supply line and a communication line. The multiple temperature acquisition modules and the concentrator are connected via the connecting cables in a free topology. Each temperature acquisition module includes an address allocation chip. Through the system of this embodiment, the temperature acquisition modules and the concentrator are connected in a free topology, eliminating the need for a separate cable for each temperature acquisition module or multiple folding of the wiring. This saves on the amount of wiring used in multi-point temperature detection and solves the problem of high wiring consumption in temperature acquisition.

Description

Technical Field

[0001] This utility model relates to the field of measurement technology, and in particular to a multi-point temperature acquisition system and a data center cabinet. Background Technology

[0002] Current temperature acquisition devices generally employ either direct wiring or bus connection technology. Direct wiring ensures real-time performance but requires a large number of wires. Furthermore, multiple acquisition modules require power, and the wiring configuration involving both data and power cables further complicates installation. Bus connections, typically using a daisy-chain configuration and master-slave communication, require strict adherence to connection methods in multi-point acquisition scenarios. In locations such as data center exhaust temperature monitoring, bus connections often involve multiple routing steps, again resulting in a large number of wires and increased installation difficulty. Utility Model Content

[0003] The purpose of this utility model embodiment is to provide a multi-point temperature acquisition system and a data center cabinet to solve the problem of large wiring requirements in multi-point temperature acquisition. The specific technical solution is as follows:

[0004] In a first aspect, this utility model provides a multi-point temperature acquisition system, the system comprising: multiple temperature acquisition modules, connecting lines, and a concentrator;

[0005] The connection cable is a two-wire system, including a power supply line and a communication line;

[0006] The multiple temperature acquisition modules and concentrators are connected via the connecting lines in a free topology configuration, wherein the free topology configuration is one of star, ring, or tree topology.

[0007] The temperature acquisition module includes an address allocation chip.

[0008] In one possible implementation, the concentrator includes a power supply module;

[0009] The power supply module is electrically connected to each temperature acquisition module in a free topology via the power supply line.

[0010] In one possible implementation, the concentrator further includes a module;

[0011] The communication module is connected to each temperature acquisition module via the communication line in a free topology.

[0012] In one possible implementation, the temperature acquisition module further includes a temperature value display screen.

[0013] In one possible implementation, the temperature acquisition module further includes a query address button.

[0014] In one possible implementation, the free topology is tree-shaped;

[0015] The connecting line includes a main section, one or more branch sections, and one or more sub-branch sections;

[0016] One end of the trunk of the tree structure is connected to the concentrator;

[0017] The other end of the trunk of the tree structure is connected to one end of one or more branches; the other end of each branch is connected to one or more sub-branches.

[0018] Each branch has a temperature acquisition module connected to its other end.

[0019] In one possible implementation, the temperature acquisition module further includes a listening module;

[0020] Each temperature acquisition module's listening module communicates with other temperature acquisition modules and the concentrator via the connecting line.

[0021] In one possible implementation, the temperature acquisition module further includes a storage module, a power supply module, an interrupt module, a listening module, a transmitting module, a step-down module, a constant current module, and a rectifier circuit.

[0022] In one possible implementation, the system further includes a host computer;

[0023] The concentrator is communicatively connected to the host computer.

[0024] The concentrator includes a communication module, a storage module, a listening module, a power supply module, a voltage conversion module, and an output circuit.

[0025] A second aspect of this application provides a data center cabinet, the cabinet including any of the multi-point temperature acquisition systems described above.

[0026] This utility model provides a multi-point temperature acquisition system and a data center cabinet. The system includes multiple temperature acquisition modules, connecting cables, and a concentrator. The connecting cables are two-wire systems, including a power supply line and a communication line. The multiple temperature acquisition modules and the concentrator are connected via the connecting cables in a free topology. Each temperature acquisition module includes an address allocation chip. Through the system of this embodiment, the temperature acquisition modules and the concentrator are connected in a free topology, eliminating the need for a separate cable for each temperature acquisition module or multiple folding of the wiring. This saves on the amount of wiring used in multi-point temperature detection and solves the problem of high wiring consumption in temperature acquisition.

[0027] Of course, any product implementing this utility model does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings.

[0029] Figure 1 A schematic diagram of a multi-point temperature acquisition system provided in an embodiment of this utility model;

[0030] Figure 2 A schematic diagram of a data structure for temperature data provided in an embodiment of this application;

[0031] Figure 3 This is a schematic diagram of data transmission timing provided for an embodiment of this application;

[0032] Figure 4 A schematic diagram of the structure of a temperature acquisition module provided in an embodiment of this utility model;

[0033] Figure 5 This is a schematic diagram of a concentrator provided in an embodiment of the present utility model. Detailed Implementation

[0034] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art based on this application are within the protection scope of the present utility model.

[0035] To address the issue of excessive wiring during multi-point temperature acquisition, this application provides a multi-point temperature acquisition system and a data center cabinet.

[0036] In a first aspect, this utility model provides a multi-point temperature acquisition system, see [link to relevant documentation]. Figure 1 The system includes: multiple temperature acquisition modules 101, connecting lines 102, and a concentrator 103;

[0037] The connecting line 102 is a two-wire system, including a power supply line and a communication line;

[0038] The multiple temperature acquisition modules 101 and the concentrator 103 are connected via the connecting line 102 in a free topology, wherein the free topology is one of star, ring, or tree topology.

[0039] The temperature acquisition module 101 includes an address allocation chip.

[0040] In this embodiment, the temperature acquisition module can be of various types, such as a capacitive temperature sensor or a resistive temperature sensor. After acquiring the analog temperature signal, the module can convert it into a digital signal in a standard data format using a built-in chip and then transmit it. In one example, data conversion can be performed using an address allocation chip.

[0041] The power supply line and communication line are used to power and communicate with the temperature acquisition module, respectively. In one example, the concentrator includes a power supply module, which powers the temperature acquisition module via the power supply line. Simultaneously, the temperature acquisition module can send the acquired temperature data to the concentrator via the communication line. Specifically, this temperature data can be a digital signal in a standard data format after format conversion by the address allocation module. When the temperature acquisition module sends this standard data format digital signal to the concentrator, it can also send the address information corresponding to the current temperature acquisition module. Therefore, when the concentrator receives the standard temperature data format digital signal, it can determine which temperature acquisition module corresponds to it based on the received address information, enabling the differentiation of temperatures corresponding to different temperature acquisition modules even when receiving multiple sets of temperature information through a single signal line. The address allocation chip can perform random address allocation, automatic addressing, and other functions, and uses a time-division multiplexing mechanism to automatically upload the acquired temperature data within the allocated time period based on the temperature acquisition module's own address. In this application, automatic addressing refers to a technology in network communication where the temperature acquisition modules in the multi-point temperature acquisition system can automatically obtain valid network addresses through specific protocols or algorithms without manual intervention. Its core objective is to ensure accurate device positioning and communication within the network. Specifically, this can be achieved through mechanisms such as dynamic allocation and backup address generation. The transmission timing of different temperature acquisition modules can be set according to actual conditions or using methods from existing technologies, such as setting the transmission frequency and order of different temperature acquisition modules.

[0042] In practical use, the free topology in this embodiment can be one of bus, star, ring, or tree topologies. In a bus topology, all temperature acquisition modules are connected to a single connection line and then to a concentrator. This structure requires fewer connecting cables, has shorter cable lengths, is easy to wire and maintain, and multiple nodes share a single transmission channel, resulting in high channel utilization. In a star topology, there is a center and multiple sub-nodes. The center can be a concentrator, and the sub-nodes correspond to different temperature acquisition modules. This method is relatively easy to manage and maintain, has strong scalability, low network latency, and low transmission error. As long as the center point is fault-free, there are generally no problems. However, the sharing capability is poor, and the communication line utilization is low. In a ring topology, the nodes form a closed loop, and the concentrator can be a node of this type. This method requires fewer nodes and saves equipment, but if one or more nodes malfunction, a failure will occur. In the tree structure, the shape resembles an inverted number, with the root at the top. The root is connected to the concentrator, and the root can include multiple branches. Each branch can include one or more sub-branches, and each sub-branch is connected to a temperature acquisition model. The root receives temperature data collected by each temperature acquisition module.

[0043] For example, see Figure 1 The multi-point temperature acquisition system provided in this application embodiment may include multiple temperature acquisition modules and a concentrator. The concentrator and the multiple temperature acquisition modules are connected to each other via connecting lines in a free topology. As shown in the figure, the connecting lines include multiple branches, each branch connecting to one or more temperature acquisition modules through sub-branches. Finally, the lines are aggregated and connected to the concentrator via a main line. In this application embodiment, an address allocation chip assigns an address to each temperature acquisition module, so that when a temperature acquisition module sends the acquired temperature information, it can simultaneously send its own address information. When the concentrator receives temperature data sent by multiple temperature acquisition modules, it can identify the corresponding temperature acquisition module based on the address information corresponding to each set of temperature data, so as to distinguish the temperature of different detection areas corresponding to different temperature acquisition modules.

[0044] As can be seen, through the system of this application embodiment, the temperature acquisition module and the concentrator can be connected in a free topology, without the need to set up a separate line for each temperature acquisition module or to fold the wiring multiple times, which can save the amount of wiring in the multi-point temperature detection process and solve the problem of large wiring in the temperature acquisition process.

[0045] In one possible implementation, the concentrator includes a power supply module; the power supply module is electrically connected to each temperature acquisition module in a free topology via the power supply line.

[0046] In one possible implementation, the concentrator further includes a module; the communication module is connected to each temperature acquisition module in a free topology via the communication line.

[0047] In one example, in the system of this application embodiment, the temperature acquisition module is powered by the concentrator power supply, and the power supply and communication are connected using a two-wire system. Specifically, communication information can be loaded via the rising and falling edges of the voltage on the communication line, and Manchester encoding can be used for encoding. In one example, the encoding method can be address + temperature data + checksum, sending 18 bytes each time, including 2 bytes of address data and 16 bytes of temperature data and checksum data. See also Figure 2 , Figure 2 This is a schematic diagram of a data structure for temperature data provided in an embodiment of this application. The first two bytes correspond to the address of the data acquisition module, and the last sixteen bytes correspond to the temperature data acquired by the temperature acquisition module. Each timing interval is 22 bytes. In actual use, the address of the acquisition module can be set to be between 1 and FF (Failure Factor), while the concentrator can be at address 00. See also... Figure 3 , Figure 3 This is a data transmission timing diagram provided in an embodiment of this application. The temperature acquisition module can upload temperature data in time periods. Within the time period that matches the address of the acquisition module, it can automatically and sequentially send the current temperature acquisition module address bytes and temperature data bytes. The transmission timing 01, 02…0F…FE, FF correspond to the transmission timing of temperature acquisition module 1, temperature acquisition module 2…temperature acquisition module 0F…temperature acquisition module FE, and temperature acquisition module FF, respectively. When the concentrator receives the maximum address or FF, it can send the data at address 00.

[0048] In one possible implementation, the temperature acquisition module further includes a temperature value display screen. In one example, the temperature acquisition module may have its own display function; for instance, it can be connected to a display screen, which can display temperature information and / or the current address information of the temperature acquisition module. In another possible implementation, the temperature acquisition module also includes a query address button. The display screen and the query address button can be used to switch between display states and query addresses. In one example, the concentrator may have fully automatic addressing capabilities, sending addressing information during the concentrator's 00 time period, and all online modules can automatically generate unique module addresses according to rules. The acquisition module may also have a manual addressing function; after pressing and holding the query address button, the display screen may flash, indicating the manual addressing process has begun. The module automatically generates a unique address according to rules based on the listening results. This unique address is then used for temperature data transmission and differentiation.

[0049] In one possible implementation, the temperature acquisition module further includes a listening module; the listening module of each temperature acquisition module is communicatively connected to other temperature acquisition modules and the concentrator via the connecting line. The temperature acquisition module can perform a listening function through this listening module, for example, listening to the address information of other modules and the configuration information sent by the concentrator. It can also automatically send its own address information and the acquired temperature information after the transmission of the address equal to its own address has ended. In one example, the acquisition module automatically listens for address information during transmission for automatic addressing. When the acquisition module is powered on, it automatically listens for address information and generates its own address according to rules; the address can be displayed on the current temperature acquisition module's screen. In actual use, the temperature acquisition module can listen to the transmission timing of other temperature acquisition modules or receive the transmission timing allocated by the concentrator, so that each temperature acquisition module can transmit the acquired temperature data in different time periods.

[0050] In one possible implementation, the free topology is tree-shaped; the connecting lines include a trunk, one or more branches, and one or more sub-branches; one end of the trunk of the tree structure is connected to the concentrator; the other end of the trunk is connected to one end of the one or more branches; the other end of each branch is connected to one end of one or more sub-branches; and the other end of each branch is connected to a temperature acquisition module. See also Figure 1 The root of this tree structure is connected to the concentrator, and the root is connected to multiple branches via a trunk. Each branch has one or more sub-branches, which in turn are connected to temperature acquisition modules. Temperature data collected by each module is sent to the concentrator in time slots, and each module also sends its address information along with the data. Therefore, after receiving the temperature data, the concentrator can identify the corresponding temperature acquisition module based on the address information sent with the temperature data.

[0051] In one possible implementation, the temperature acquisition module further includes a storage module, a power supply module, an interrupt module, a listening module, a transmitting module, a step-down module, a constant current module, and a rectifier circuit. See also Figure 4The temperature acquisition module may include an MCU (Microcontroller Unit), which can correspond to the digital chip in the above embodiments. The temperature acquisition module includes a display module, a power supply module, an interrupt module, a storage module, a listening module, a transmitting module, a buck module, a constant current module, and a rectifier circuit. The display module can also be connected to a display screen, such as an LCD screen or other existing displays. The interrupt module can be connected to an external button and can trigger an interrupt when a preset interrupt condition is met. For example, an interrupt is triggered when the temperature data acquired by the temperature acquisition module is equal to preset data or meets a certain condition; another example is when the temperature data acquired by the temperature acquisition module exceeds or falls below a set threshold; yet another example is when the temperature data from the temperature acquisition module is continuously collected for a certain period of time or reaches a certain duration. The interrupt module can effectively improve the real-time performance and accuracy of the temperature acquisition module, and also protect the temperature acquisition module. The listening module can listen to the addresses of other temperature acquisition modules, thereby allocating an address for the current temperature acquisition module. The transmitting module is used to send the digital signal in the standard data format converted by the digital chip, i.e., the address allocation chip, to the concentrator. The storage module stores the acquired temperature information for format conversion by the digital chip. The buck module, constant current module, power supply module, and rectifier circuit respectively implement buck, constant current, power supply, and rectification functions. The digital chip acquires the analog temperature signal and converts it into a standard data format, specifically including address and temperature information.

[0052] In one possible implementation, the system further includes a host computer; the concentrator is communicatively connected to the host computer; the concentrator includes a communication module, a storage module, a listening module, a power supply module, a voltage conversion module, and an output circuit. For details, please refer to... Figure 5 The concentrator may include a communication module, a storage module, a listening module, a power supply module, a voltage conversion module, and an output circuit. The communication module, storage module, listening module, and transmitting module can form an MCU. The concentrator communicates with a host computer via the communication module, allowing it to transmit the temperatures received from each temperature acquisition module to the host computer. Simultaneously, the concentrator communicates with each temperature acquisition module via the listening module and is electrically connected to each temperature acquisition module via the output circuit. The communication module communicates with the host computer. The listening module listens to the temperature data and address information acquired by each temperature acquisition module. The storage module stores the acquired temperature data and address information. The concentrator includes a power supply and a communication module, providing power to each acquisition module, communicating with the acquisition modules, converting the module's address and temperature information into a data list format, storing it, and uploading it.

[0053] A second aspect of this application provides a data center cabinet, the cabinet including any of the multi-point temperature acquisition systems described above.

[0054] In practical use, servers housed in server racks often generate a significant amount of heat, necessitating close monitoring of rack temperature. This embodiment of the application improves rack safety by monitoring data center rack exhaust temperatures and other routine checks, preventing issues such as abnormal equipment overheating or even fires. The multi-point temperature acquisition system, as described in the above embodiment, features a built-in display, automatic address allocation and matching, time-sharing automatic data upload, two-wire wiring, and characteristics such as rapid installation, convenient configuration, and real-time high-speed communication.

[0055] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of protection of this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model are included within the scope of protection of this utility model.

Claims

1. A multi-point temperature acquisition system, characterized in that, The system includes: multiple temperature acquisition modules, connecting cables, and a concentrator; The connection cable is a two-wire system, including a power supply line and a communication line; The multiple temperature acquisition modules and concentrators are connected via the connecting lines in a free topology configuration, wherein the free topology configuration is one of star, ring, or tree topology. The temperature acquisition module includes an address allocation chip.

2. The system according to claim 1, characterized in that, The concentrator includes a power supply module; The power supply module is electrically connected to each temperature acquisition module in a free topology via the power supply line.

3. The system according to claim 2, characterized in that, The concentrator also includes a communication module; The communication module is connected to each temperature acquisition module via the communication line in a free topology.

4. The system according to claim 1, characterized in that, The temperature acquisition module also includes a temperature value display screen.

5. The system according to claim 1, characterized in that, The temperature acquisition module also includes a query address button.

6. The system according to claim 1, characterized in that, The free topology is tree-shaped; The connecting line includes a main section, one or more branch sections, and one or more sub-branch sections; One end of the trunk of the tree structure is connected to the concentrator; The other end of the trunk of the tree structure is connected to one end of one or more branches; the other end of each branch is connected to one or more sub-branches. Each branch has a temperature acquisition module connected to its other end.

7. The system according to claim 1, characterized in that, The temperature acquisition module also includes a listening module; Each temperature acquisition module's listening module communicates with other temperature acquisition modules and the concentrator via the connecting line.

8. The system according to claim 1, characterized in that, The temperature acquisition module also includes a storage module, a power supply module, an interrupt module, a listening module, a transmitting module, a step-down module, a constant current module, and a rectifier circuit.

9. The system according to claim 1, characterized in that, The system also includes a host computer; The concentrator is communicatively connected to the host computer. The concentrator includes a communication module, a storage module, a listening module, a power supply module, a voltage conversion module, and an output circuit.

10. A data center cabinet, characterized in that, The cabinet includes: the multi-point temperature acquisition system as described in any one of claims 1-9.

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