Miniaturized split type single-path broadband power amplifier assembly

Abstract

The utility model relates to a power amplifier assembly, in particular to a miniaturized split type single-path broadband power amplifier assembly, which comprises an aluminum shell, a power amplifier module shell, a gain control channel and a power supply control device are fixed in an inner cavity of the aluminum shell, a power amplifier module is fixed in the power amplifier module shell, and a third cover plate is fixed on the power amplifier module shell. A second cover plate is fixed above the third cover plate on the aluminum shell; a first cover plate is fixed above the second cover plate on the aluminum shell; according to the technical scheme provided by the utility model, the defects that the size is large, the weight is heavy and the power amplification module is inconvenient to replace in the prior art can be effectively overcome.

Description

Technical Field

[0001] This utility model relates to power amplifier components, specifically to a miniaturized split-type single-channel broadband power amplifier component. Background Technology

[0002] Traditional single-channel broadband power amplifier components typically integrate all modules into a single structure. To effectively dissipate heat, the integrated aluminum housing and heat sink are often quite large, resulting in a bulky and heavy design. Furthermore, when a power amplifier module fails and needs replacement, the large housing size makes replacement difficult. Utility Model Content

[0003] (a) Technical problems to be solved

[0004] In view of the above-mentioned shortcomings of the existing technology, the present invention provides a miniaturized split single-channel broadband power amplifier component, which can effectively overcome the defects of the existing technology, such as large size, heavy weight, and inconvenience in replacing power amplifier modules.

[0005] (II) Technical Solution

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A miniaturized split-type single-channel broadband power amplifier assembly includes an aluminum housing. The inner cavity of the aluminum housing is fixed with a power amplifier module housing, a gain control channel, and a power control device. The power amplifier module housing is fixed inside the power amplifier module housing. A third cover plate is fixed on the power amplifier module housing. A second cover plate is fixed on the aluminum housing above the third cover plate. A first cover plate is fixed on the aluminum housing above the second cover plate.

[0008] Preferably, the power amplifier module housing is fixed to the inner cavity of the aluminum housing by screws, and the power amplifier module is fixed to the inside of the power amplifier module housing by welding.

[0009] Preferably, the third cover plate is fixed to the power amplifier module housing by screws, and a first milled groove is provided on the side of the third cover plate opposite to the power amplifier module. The first milled groove is filled with a first wave-absorbing material that cooperates with the power amplifier module by silicone.

[0010] Preferably, the gain control channel is fixed to the inner cavity of the aluminum housing by welding.

[0011] Preferably, the second cover plate is fixed to the aluminum housing by screws, and a second milled groove is provided on the side of the second cover plate opposite to the gain control channel. A second absorbing material that cooperates with the gain control channel is glued inside the second milled groove with silicone. A cable tray is provided inside the second cover plate to accommodate the power cable that supplies power to the power amplifier module and is connected to the power control device.

[0012] Preferably, the first cover plate is laser-sealed onto the aluminum shell.

[0013] Preferably, the power control device is fixed to the inner cavity of the aluminum housing by screws, and the power control device adopts a multi-layer board method.

[0014] Preferably, insulators are welded and fixed to both the aluminum housing and the power amplifier module housing, and tetrachloroethylene sleeves are installed on the insulator pins.

[0015] Preferably, the back of the aluminum housing is fixed with removable heat dissipation teeth by screws.

[0016] (III) Beneficial Effects

[0017] Compared with the prior art, the miniaturized split-type single-channel broadband power amplifier component provided by this utility model has the following beneficial effects:

[0018] 1) This utility model adopts a miniaturized split structure layout design, which is simple in structure, convenient to process, effectively improves processing efficiency, and is easy to install and disassemble;

[0019] 2) When in use, this utility model is small in size, which saves space and is lightweight, making it suitable for different usage scenarios;

[0020] 3) When using this utility model, since the power amplifier module and the detachable heat dissipation fins are independent of the aluminum housing, they can be installed and disassembled separately, which effectively improves the heat dissipation efficiency and maintenance and replacement efficiency. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is an exploded view of the present invention;

[0023] Figure 2 This is a schematic diagram of the installation of the detachable heat dissipation teeth in this utility model. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0025] A miniaturized, split-type single-channel broadband power amplifier component, such as Figure 1 As shown, it includes an aluminum housing 1. Inside the aluminum housing 1, a power amplifier module housing 2, a gain control channel 6, and a power control device 9 are fixed. Inside the power amplifier module housing 2, a power amplifier module 3 is fixed. A third cover plate 4 is fixed on the power amplifier module housing 2. A second cover plate 7 is fixed on the aluminum housing 1 above the third cover plate 4. A first cover plate 10 is fixed on the aluminum housing 1 above the second cover plate 7.

[0026] In the technical solution of this application, the gain control channel 6 is used to receive external radio frequency signals, which are then converted into radio frequency signals with consistent amplitude after temperature attenuation compensation and equalization attenuation compensation; the power amplifier module 3 is used to convert the radio frequency signals with consistent amplitude into radio frequency signals with increased amplitude after passing through the driver amplifier and the power amplifier; the power control device 9 is used to provide the power amplifier module 3 with a stable DC power supply, control signals and protection circuits; the detachable heat dissipation teeth 12 are used to help the power amplifier module 3 dissipate heat quickly and effectively.

[0027] like Figure 1 As shown, the power amplifier module housing 2 is fixed to the inner cavity of the aluminum housing 1 by screws, and the power amplifier module 3 is fixed to the inside of the power amplifier module housing 2 by welding.

[0028] The third cover plate 4 is fixed to the power amplifier module housing 2 by screws. A first milled groove is provided on the side of the third cover plate 4 opposite to the power amplifier module 3. The first milled groove is filled with a first wave-absorbing material 5 that cooperates with the power amplifier module 3 by silicone.

[0029] like Figure 1 As shown, the gain control channel 6 is fixed to the inner cavity of the aluminum housing 1 by welding.

[0030] The second cover plate 7 is fixed to the aluminum housing 1 by screws. A second milled groove is provided on the side of the second cover plate 7 opposite to the gain control channel 6. The second milled groove is filled with a second absorbing material 8 that matches the gain control channel 6 by silicone. The second cover plate 7 is provided with a cable tray for accommodating the power supply cable that supplies power to the power amplifier module 3 and is connected to the power control device 9.

[0031] The first cover plate 10 is laser-sealed onto the aluminum shell 1.

[0032] In the technical solution of this application, the power amplifier module 3 and the gain control channel 6 adopt a micro-assembly design. All devices use bare chips, which are highly integrated, effectively reducing the size, improving space utilization, and realizing a miniaturized split structure layout design.

[0033] The first milled groove on the third cover plate 4 and the second milled groove on the second cover plate 7 are used to directly attach the corresponding wave-absorbing material, which facilitates positioning and installation and can absorb clutter signals. At the same time, the milled grooves on the cover plates make full use of three-dimensional space, effectively reducing volume, improving space utilization, and realizing a miniaturized split structure layout design.

[0034] like Figure 1 As shown, the power control device 9 is fixed to the inner cavity of the aluminum housing 1 by screws, and the power control device 9 adopts a multi-layer board method.

[0035] Insulators 11 are welded and fixed on both the aluminum housing 1 and the power amplifier module housing 2, and tetrachloroethylene sleeves are installed on the pins of insulators 11.

[0036] In this application's technical solution, the power control device 9 provides a stable DC power supply, control signal, and protection circuit to the power amplifier module 3 through the insulator 11 and the tetrachloroethylene sleeve. The tetrachloroethylene sleeve is installed on the pin of the insulator 11, which can isolate the power line solder joint from the external metal conductor of the insulator, prevent the power supply from being short-circuited to ground, shorten the pin length, effectively reduce the volume, improve space utilization, and realize a miniaturized split structure layout design.

[0037] The power control device 9 adopts a multi-layer board design, which is highly integrated, effectively reduces the size, improves space utilization, and realizes a miniaturized split structure layout design.

[0038] Both power supply and radio frequency signal transmission use sintered insulators, which are welded and fixed to the aluminum housing 1 and the power amplifier module housing 2. This ensures the reliability of signal transmission and the sealing of the product, while effectively reducing the volume, improving space utilization, and realizing a miniaturized split structure layout design.

[0039] like Figure 2 As shown, the back of the aluminum housing 1 is fixed with removable heat dissipation teeth 12 by screws.

[0040] In this application's technical solution, the structural layout design adopts a split structure consisting of an aluminum housing 1, a power amplifier module 3, and detachable heat dissipation fins 12. The power amplifier module housing 2, the power amplifier module 3, the gain control channel 6, and the power control device 9 are installed in the front inner cavity of the aluminum housing 1. The split cavity and cover design improves spatial isolation. The detachable heat dissipation fins 12 are installed on the back of the aluminum housing 1 for heat dissipation. The detachable heat dissipation fins 12 can also be removed to further reduce the size and weight. For the miniaturized split structural layout design, only a miniaturized aluminum housing 1 and detachable heat dissipation fins 12 need to be processed, which is convenient for processing, effectively improves processing efficiency, and facilitates installation and disassembly.

[0041] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A miniaturized, split-type single-channel broadband power amplifier component, characterized in that: The device includes an aluminum housing (1), an amplifier module housing (2), a gain control channel (6) and a power control device (9) fixed inside the aluminum housing (1), a power amplifier module (3) fixed inside the amplifier module housing (2), a third cover plate (4) fixed on the amplifier module housing (2), a second cover plate (7) fixed on the aluminum housing (1) above the third cover plate (4), and a first cover plate (10) fixed on the aluminum housing (1) above the second cover plate (7).

2. The miniaturized split-type single-channel broadband power amplifier component according to claim 1, characterized in that: The power amplifier module housing (2) is fixed to the inner cavity of the aluminum housing (1) by screws, and the power amplifier module (3) is fixed to the inside of the power amplifier module housing (2) by welding.

3. The miniaturized split-type single-channel broadband power amplifier component according to claim 1, characterized in that: The third cover plate (4) is fixed to the power amplifier module housing (2) by screws. A first milled groove is provided on the side of the third cover plate (4) opposite to the power amplifier module (3). A first absorbing material (5) that cooperates with the power amplifier module (3) is pasted inside the first milled groove with silicone.

4. The miniaturized split-type single-channel broadband power amplifier component according to claim 1, characterized in that: The gain control channel (6) is fixed to the inner cavity of the aluminum housing (1) by welding.

5. The miniaturized split-type single-channel broadband power amplifier component according to claim 1, characterized in that: The second cover plate (7) is fixed to the aluminum housing (1) by screws. A second milling groove is provided on the side of the second cover plate (7) opposite to the gain control channel (6). A second absorbing material (8) that cooperates with the gain control channel (6) is pasted inside the second milling groove with silicone. A wire passage is provided inside the second cover plate (7) for accommodating the power supply line that supplies power to the power amplifier module (3) and is connected to the power control device (9).

6. The miniaturized split-type single-channel broadband power amplifier component according to claim 1, characterized in that: The first cover plate (10) is laser-sealed onto the aluminum shell (1).

7. The miniaturized split-type single-channel broadband power amplifier component according to claim 1, characterized in that: The power control device (9) is fixed to the inner cavity of the aluminum housing (1) by screws, and the power control device (9) adopts a multi-layer board method.

8. The miniaturized split-type single-channel broadband power amplifier component according to claim 1, characterized in that: Insulators (11) are welded and fixed on both the aluminum housing (1) and the power amplifier module housing (2), and tetrachloroethylene sleeves are installed on the pins of the insulators (11).

9. The miniaturized split-type single-channel broadband power amplifier component according to claim 1, characterized in that: The back of the aluminum housing (1) is fixed with removable heat dissipation teeth (12) by screws.

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