Integrated filtering and amplification device for quantum computing measurement and control

Abstract

This application relates to an integrated filtering and amplification device for quantum computing measurement and control, comprising: a device housing, a circuit board, a front-end attenuation component, a front-end bandpass filter component, a microwave amplification component, a rear-end attenuation component, and a rear-end bandpass filter component. The front-end bandpass filter component, the front-end attenuation component, the microwave amplification component, the rear-end attenuation component, and the rear-end bandpass filter component are sequentially connected to the circuit board and are all integrated within the device housing. By integrating a microwave front-end module with a bandpass filter, attenuator, and microwave amplifier, the complexity of external circuitry is greatly reduced. Furthermore, the integrated front-end module is small in size and can be directly integrated into electronic devices, allowing the measurement and control pulses generated from the electronic devices to be directly connected to the dilution refrigerator, greatly simplifying external wiring and improving system reliability.

Description

Technical Field

[0001] This application relates to the field of filtering technology, and in particular to an integrated filtering and amplification device for quantum computing measurement and control. Background Technology

[0002] Precise measurement and control of superconducting qubits requires transmitting microwave pulses to the vicinity of the corresponding qubit to achieve specific rotation operations of the qubit state and entanglement operations between two qubits. This process involves the generation and transmission of pulses. Typically, pulses are generated by room-temperature electronics and then transmitted via coaxial cables to an extremely low temperature close to absolute zero. During transmission, to prevent noise from propagating along the transmission line to the vicinity of the qubit and causing decoherence, multiple stages of attenuators and filters are inserted in the transmission line to ensure that room-temperature blackbody radiation noise and other stray noise are suppressed to a sufficiently low level to avoid significantly affecting qubit decoherence. In this process, the control pulse signal is also subject to equivalent attenuation suppression. Currently, in practical superconducting qubit measurement and control, typical attenuation values ​​are -50 to -70 dB, and the power of the control pulse is generally between -10 and -30 dBm.

[0003] To achieve enhanced controllability and better noise suppression, it is necessary to further increase signal power without compromising signal quality. Currently, several commonly used microwave pulse generation techniques, including low-frequency arbitrary wave generators with IQ mixing and upconversion, and direct microwave generation, typically output peak power below -10 dBm in the 4-8 GHz operating frequency range for qubits. To obtain clean spectral components and reduce echo distortion caused by reflections, low-pass or band-pass filters, attenuators, and isolators need to be inserted into the circuitry. The control pulses generated from the electronics must also pass through external circuitry before entering the dilution cooler and finally being transmitted to the qubits. These external circuits increase system complexity, and as the scale of quantum computing increases, the resulting decrease in reliability becomes an increasingly serious problem. Summary of the Invention

[0004] To address the issue of complex circuitry, this invention provides an integrated filtering and amplification device for quantum computing measurement and control, comprising: a device housing, a circuit board, a front-end attenuation component, a front-end bandpass filter component, a microwave amplification component, a rear-end attenuation component, and a rear-end bandpass filter component;

[0005] The front-end bandpass filter component, the front-end attenuation component, the microwave amplification component, the rear-end attenuation component, and the rear-end bandpass filter component are sequentially connected and disposed on the circuit board, and are all integrated within the device housing.

[0006] In one specific embodiment, one end of the device housing along its length is provided with an input connector, suitable for connecting to a pre-amplifier signal or other RF components, and the other end along its length is provided with an output connector, suitable for connecting to a post-amplifier device or other RF components.

[0007] In one specific embodiment, an amplifier power terminal is provided at one end of the length direction of the device housing, which is suitable for connecting a power supply, and the amplifier power terminal is electrically connected to the microwave amplification component.

[0008] In one specific embodiment, a front mounting groove and a rear mounting groove are provided on the bottom wall of the mounting groove;

[0009] The front-end mounting slot is formed between the front-end attenuation component and the microwave amplification component, and the front-end bandpass filter component is embedded in the front-end mounting slot. The rear-end mounting slot is formed between the rear-end attenuation component and the microwave amplification component, and the rear-end bandpass filter component is embedded in the rear-end mounting slot.

[0010] Both the front-end bandpass filter component and the back-end bandpass filter component include at least one bandpass filter.

[0011] In one specific embodiment, the operating frequency bands of the front-end bandpass filter component and the back-end bandpass filter component are typical frequency bands for quantum bit manipulation / reading. Depending on the application scenario, the center frequency can be designed to be 4 GHz, 7 GHz or 14 GHz, and the passband bandwidth can be designed to be 1 GHz or 2 GHz.

[0012] In one specific embodiment, both the front-end attenuation component and the back-end attenuation component include at least one attenuator;

[0013] The microwave amplification assembly includes at least one microwave amplifier.

[0014] In one specific embodiment, the input connector and the output connector include at least one of the SMA, SMP, or SSMP types.

[0015] In one specific embodiment, it further includes: a cover;

[0016] The cover matches the mounting slot and can cover the mounting slot, and is detachably connected to the device housing.

[0017] In one specific embodiment, the volume of the device housing is less than 100 cubic centimeters.

[0018] The beneficial effects of the integrated filtering and amplification device for quantum computing measurement and control in this application embodiment are as follows: By integrating a bandpass filter, attenuator, and microwave amplifier into a microwave front-end module, the complexity of external circuitry is greatly reduced. Furthermore, this integrated front-end module is small in size and can be directly integrated into electronic devices, allowing the measurement and control pulses generated from the electronic devices to be directly connected to the dilution cooler, greatly simplifying external wiring and improving system reliability. In addition, the integrated filtering and amplification module of this invention can boost the peak power of the control pulse to over 10 dBm, significantly enhancing control capability and allowing for the addition of more attenuation in the control circuitry, further suppressing external noise and improving qubit performance. Specifically, integrating the front-end bandpass filter component, front-end attenuation component, microwave amplification component, back-end attenuation component, and back-end bandpass filter component onto the same circuit board reduces the complexity of external circuitry, simplifies the system structure, and the device housing volume is less than 100 cubic centimeters, making it easy to carry and integrate into other devices.

[0019] Other features and aspects of this application will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0020] The accompanying drawings, which are included in and form part of this specification, illustrate exemplary embodiments, features, and aspects of this application together with the specification and serve to explain the principles of this application.

[0021] Figure 1 This invention provides a block diagram of an integrated filtering and amplification device for quantum computing measurement and control, according to an embodiment of this application.

[0022] Figure 2 This diagram shows the main structure of an integrated filtering and amplification device for quantum computing measurement and control according to an embodiment of this application.

[0023] Figure 3 This diagram shows a cross-sectional view of an integrated filtering and amplification device for quantum computing measurement and control, according to an embodiment of this application.

[0024] Figure 4 The image shows a bottom view of an integrated filtering and amplification device for quantum computing measurement and control according to an embodiment of this application. Detailed Implementation

[0025] Various exemplary embodiments, features, and aspects of this application will now be described in detail with reference to the accompanying drawings. The same reference numerals in the drawings denote elements that have the same or similar functions. Although various aspects of the embodiments are shown in the drawings, they are not necessarily drawn to scale unless specifically indicated otherwise.

[0026] It should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the present invention or simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0027] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0028] The term “exemplary” as used herein means “serving as an example, embodiment, or illustration.” Any embodiment illustrated herein as “exemplary” is not necessarily to be construed as superior to or better than other embodiments.

[0029] Furthermore, to better illustrate this application, numerous specific details are provided in the following detailed embodiments. Those skilled in the art should understand that this application can be implemented without certain specific details. In some instances, methods, means, components, and circuits well-known to those skilled in the art have not been described in detail in order to highlight the main points of this application.

[0030] like Figures 1-4 As shown, the integrated filtering and amplification device for quantum computing measurement and control in this embodiment of the application includes: a device housing 10, a circuit board, a front-end attenuation component 200, a front-end bandpass filter component 300, a microwave amplification component 400, a rear-end attenuation component 600, and a rear-end bandpass filter component 500. The front-end bandpass filter component 300, the front-end attenuation component 200, the microwave amplification component 400, the rear-end attenuation component 600, and the rear-end bandpass filter component are sequentially connected and integrated on the circuit board, which is built into the device housing 10.

[0031] The circuit board integrates a front-end bandpass filter component 300, a front-end attenuation component 200, a microwave amplification component 400, a rear-end attenuation component 600, and a rear-end bandpass filter component 500. The front-end bandpass filter component 300 is used to filter out image, harmonic, and spurious frequency components contained in the waveform output by the pulse output unit. The front-end attenuation component 200 is used to suppress the echo between the pulse output unit and the microwave amplification component 400 and control the output signal strength. The microwave amplification component 400 is used to amplify the filtered signal. The rear-end attenuation component 600 is used to suppress the echo distortion generated at the back end of the amplifier. The rear-end bandpass filter component 500 is used to suppress the additional intermodulation introduced during the amplification process and further suppress unwanted out-of-band noise such as images, harmonics, and spurious signals.

[0032] In this specific embodiment, the microwave front-end module, which integrates a bandpass filter, attenuator, and microwave amplifier, significantly reduces the complexity of external circuitry. Furthermore, this integrated front-end module is small in size and can be directly integrated into electronic devices, allowing the control pulses generated from the electronic devices to be directly connected to the dilution cooler, greatly simplifying external wiring and improving system reliability. In addition, the integrated filter and amplification module of this invention can boost the peak power of the control pulse to over 10 dBm, significantly enhancing control capabilities and allowing for the addition of more attenuation in the control circuitry, further suppressing external noise and improving qubit performance. Specifically, the front-end bandpass filter component 300, the front-end attenuator component 200, the microwave amplifier component 400, the back-end attenuator component 600, and the back-end bandpass filter component 500 are integrated on the same circuit board, reducing the complexity of external circuitry, simplifying the system structure, and the device housing 10 has a volume of less than 100 cubic centimeters, making it easy to carry and integrate into other devices.

[0033] In one specific embodiment, one end of the device housing 10 along its length is provided with an input connector 100, suitable for connecting an IQ mixer and a front-end attenuation component 200, and the other end along its length is provided with an output connector 700, suitable for connecting downstream equipment and a downstream attenuation component 600. The signal generated is an arbitrary wave pulse up-converted by the IQ mixer, or it can be a directly digitally generated microwave pulse; its generation method is irrelevant to this invention, and it serves as the input to this filtering and amplification module.

[0034] In one specific embodiment, an amplifier power terminal 800 is provided at one end of the device housing 10 along its length, which is suitable for connecting to a power source, and the amplifier power terminal 800 is electrically connected to the microwave amplification component 400.

[0035] In one specific embodiment, a front-end mounting slot and a rear-end mounting slot are provided on the bottom wall of the mounting slot. The front-end mounting slot is located between the front-end attenuation component 200 and the microwave amplification component 400, and the front-end bandpass filter component 300 is embedded in the front-end mounting slot. The rear-end mounting slot is located between the rear-end attenuation component 600 and the microwave amplification component 400, and the rear-end bandpass filter component 500 is embedded in the rear-end mounting slot. This simplifies external wiring, reduces noise interference, and improves system reliability.

[0036] Furthermore, both the front-end bandpass filter component 300 and the back-end bandpass filter component 500 include at least one bandpass filter.

[0037] In one specific embodiment, the operating frequency bands of the front-end bandpass filter component 300 and the back-end bandpass filter component 500 are typical frequency bands for quantum bit manipulation / reading. Depending on the application scenario, the center frequency can be designed to be 4GHz, 7GHz or 14GHz, and the passband bandwidth can be designed to be 1GHz or 2GHz.

[0038] In one specific embodiment, both the front-end attenuation component 200 and the back-end attenuation component 600 include at least one attenuator, and the microwave amplification component 400 includes at least one microwave amplifier.

[0039] In one embodiment, the input connector 100 and the output connector 700 include at least one of SMA, SMP, or SSMP and other types of RF connectors or custom RF connectors.

[0040] In one embodiment, the device further includes a cover that mates with the mounting slot and is capable of covering the mounting slot, and is detachably connected to the device housing 10. The cover provides additional protection against dust and external interference from entering the device, improving the device's durability and reliability.

[0041] In one specific embodiment, the volume of the device housing 10 is less than 100 cubic centimeters, which can be directly integrated into the electronic device, so that the measurement and control pulse generated from the electronic device can be directly connected to the dilution refrigerator, which greatly simplifies the external wiring and improves the system reliability.

[0042] In one specific embodiment, the order in which the front-end attenuation component 200 and the front-end bandpass filter component 300 are swapped is not substantially different. Similarly, the order in which the back-end bandpass filter component 500 and the back-end attenuation component 600 are swapped is also the same.

[0043] The various embodiments of this application have been described above. These descriptions are exemplary and not exhaustive, nor are they limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen to best explain the principles, practical application, or improvement of the technology in the market, or to enable others skilled in the art to understand the embodiments disclosed herein.

Claims

1. An integrated filtering and amplification device for quantum computing measurement and control, characterized in that, include: Device housing, circuit board, front-end attenuation component, front-end bandpass filter component, microwave amplification component, rear-end attenuation component, and rear-end bandpass filter component; The front-end bandpass filter component, the front-end attenuation component, the microwave amplification component, the rear-end attenuation component, and the rear-end bandpass filter component are sequentially connected and disposed on the circuit board, and are all integrated within the device housing.

2. The integrated filtering and amplification device for quantum computing measurement and control according to claim 1, characterized in that, The device housing has an input connector at one end along its length, suitable for connecting to the pre-amplifier signal output or other RF components, and an output connector at the other end along its length, suitable for connecting to the post-amplifier equipment or other components.

3. The integrated filtering and amplification device for quantum computing measurement and control according to claim 2, characterized in that, The device housing has an amplifier power terminal at one end along its length, which is suitable for connecting to a power source, and the amplifier power terminal is electrically connected to the microwave amplification component.

4. The integrated filtering and amplification device for quantum computing measurement and control according to claim 2, characterized in that, The device housing has an installation groove, and the bottom wall of the installation groove has a front installation groove and a rear installation groove. The front-end mounting slot is formed between the front-end attenuation component and the microwave amplification component, and the front-end bandpass filter component is embedded in the front-end mounting slot. The rear-end mounting slot is formed between the rear-end attenuation component and the microwave amplification component, and the rear-end bandpass filter component is embedded in the rear-end mounting slot. Both the front-end bandpass filter component and the back-end bandpass filter component include at least one bandpass filter.

5. The integrated filtering and amplification device for quantum computing measurement and control according to claim 4, characterized in that, The operating frequency bands of the front-end bandpass filter component and the back-end bandpass filter component are typical frequency bands for quantum bit manipulation / reading. Depending on the application scenario, the center frequency can be designed to be 4 GHz, 7 GHz or 14 GHz, and the passband bandwidth can be designed to be 1 GHz or 2 GHz.

6. The integrated filtering and amplification device for quantum computing measurement and control according to claim 1, characterized in that, Both the front-end attenuation component and the back-end attenuation component include at least one attenuator; The microwave amplification assembly includes at least one microwave amplifier.

7. The integrated filtering and amplification device for quantum computing measurement and control according to claim 2, characterized in that, The input connector and the output connector include at least one of SMA, SSMA, SMP, SSMP and other types of RF connectors or custom RF connectors.

8. The integrated filtering and amplification device for quantum computing measurement and control according to claim 4, characterized in that, Also includes: Cover; The cover matches the mounting slot and can cover the mounting slot, and is detachably connected to the device housing.

Images