Optical receiver and optical signal transmission device

Abstract

This application relates to an optical receiver and an optical signal transmission device. The optical receiver includes: a circuit board, at least one optical module receiver, and a multi-channel optical input component. The optical module receiver includes a metal structural component, an optical receiving component, and a photoelectric conversion component. The metal structural component is fixed to one side of the circuit board and forms a closed space with a portion of the circuit board. The photoelectric conversion component is disposed within the closed space on the circuit board. The optical receiving component is disposed on the surface of the metal structural component facing away from the circuit board. Both the metal structural component and the circuit board are grounded. The optical input component is connected to the optical module receiver via an optical fiber. Because the embodiments of this application can form a "Faraday cage," the receiving performance of the optical module receiver can be improved. Therefore, the optical module receiver can receive long-distance, multi-channel optical signals with high speed and anti-interference capabilities. When receiving long-distance transmitted optical signals, the signal quality of the received optical signal can be significantly improved.

Description

Technical Field

[0001] This application relates to the field of communication technology, and in particular to an optical receiver and an optical signal transmission device. Background Technology

[0002] With the development of communication technology, optical communication technology has been widely used in various fields due to its characteristics such as large communication capacity and low loss. When information is transmitted through optical fiber, various types of optical signal transmission devices are generated. Optical signal transmission devices include optical transmitters and optical receivers. Optical transmitters are used to convert electrical signals into optical signals, and optical receivers are used to convert optical signals into electrical signals.

[0003] However, current optical receivers suffer from poor optical signal reception performance when receiving optical signals transmitted over long distances. Utility Model Content

[0004] Therefore, it is necessary to provide an optical receiver and an optical signal transmission device that can improve the optical signal receiving performance in response to the above-mentioned technical problems.

[0005] In a first aspect, this application provides an optical receiver, which includes: a circuit board, at least one optical module receiver, and a multi-channel optical input component;

[0006] The optical module receiver includes a metal structural component, an optical receiving component, and a photoelectric conversion component. The metal structural component is fixed to one side of the circuit board and forms a closed space with a portion of one side of the circuit board. The photoelectric conversion component is disposed within the closed space on the circuit board. The optical receiving component is disposed on the surface of the metal structural component facing away from the circuit board. Both the metal structural component and the circuit board are grounded. The optical input component is connected to the optical module receiver via an optical fiber.

[0007] In one embodiment, the circuit board includes a plurality of grounding positioning holes, and the metal structural component includes a plurality of positioning pins, the metal structural component being fixed by the plurality of positioning pins being inserted into the plurality of grounding positioning holes.

[0008] In one embodiment, the light receiving component includes a plurality of optical components arranged sequentially along a first direction; the photoelectric conversion component includes a plurality of photoelectric components arranged sequentially along a second direction; the first direction and the second direction are opposite directions.

[0009] In one embodiment, the plurality of optical components include a fiber array assembly, an optical lens, and an optical prism arranged sequentially; the fiber array assembly, the optical lens, and the optical prism are fixed to the metal structure by UV-curing adhesive.

[0010] In one embodiment, the plurality of optoelectronic components include a transimpedance amplifier, a photodetector, and a filter assembly arranged sequentially. The transimpedance amplifier is electrically connected to the circuit board via gold wire bonding, the anode of the photodetector is electrically connected to the transimpedance amplifier via gold wire bonding, and the cathode of the photodetector is electrically connected to the filter assembly.

[0011] In one embodiment, the filtering component includes a filter capacitor and a filter resistor-capacitor combination;

[0012] The cathode of the photodetector is electrically connected to the filter capacitor via gold wire bonding, the filter capacitor is electrically connected to the filter resistor and capacitor via gold wire bonding, and the filter resistor and capacitor are electrically connected to the circuit board via gold wire bonding.

[0013] In one embodiment, the fiber spacing of the fiber array component in the optical receiving component is the same as the mounting spacing of the photodetector and the channel spacing of the signal input pad of the transimpedance amplifier.

[0014] In one embodiment, the optical receiver includes a first optical module receiver and a second optical module receiver arranged in parallel, and the optical input component is connected to the first optical module receiver and the second optical module receiver respectively via optical fiber.

[0015] In one embodiment, the photoelectric conversion component in the first optical module receiver is mounted on the first exposed copper grounding area of ​​the circuit board using conductive silver paste, and the photoelectric conversion component in the second optical module receiver is mounted on the second exposed copper grounding area of ​​the circuit board using conductive silver paste.

[0016] Secondly, this application also provides an optical signal transmission device, which includes: an optical transmitter and an optical receiver as described in any one of the first aspects above; the optical transmitter and another optical receiver in the other optical signal transmission device are connected by an optical fiber, and the optical receiver and another optical transmitter in the other optical signal transmission device are connected by an optical fiber, and both the optical signal transmission device and the other optical signal transmission device are used for long-distance optical signal transmission.

[0017] The aforementioned optical receiver and optical signal transmission device include an optical receiver comprising a circuit board, at least one optical module receiver, and a multi-channel optical input component. The optical module receiver comprises a metal structural component, an optical receiving component, and a photoelectric conversion component. The metal structural component is fixed to one side of the circuit board and forms a closed space with a portion of the circuit board. The photoelectric conversion component is disposed within the closed space on the circuit board, and the optical receiving component is disposed on the surface of the metal structural component facing away from the circuit board. Both the metal structural component and the circuit board are grounded. The optical input component is connected to the optical module receiver via an optical fiber. Because this embodiment can form a closed space with the metal structural component and a portion of the circuit board, and the photoelectric conversion component is disposed within the closed space on the circuit board, and both the metal structural component and the circuit board are grounded, a "Faraday cage" can be formed. This "Faraday cage" can effectively resist external electromagnetic interference, thereby improving the receiving performance of the optical module receiver. Therefore, when the optical input component inputs a long-distance, multi-channel optical signal to the optical module receiver, the optical module receiver can receive the long-distance, multi-channel optical signal with high speed and interference resistance. Thus, the optical receiver in this embodiment can significantly improve the signal quality of the received optical signal when receiving multi-channel optical signals transmitted over long distances. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the drawings used in the description of the embodiments of this application or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of the optical receiver in one embodiment;

[0020] Figure 2 This is a schematic diagram of the structure of a metal structural component in one embodiment;

[0021] Figure 3 This is a schematic diagram of the structure of an optical receiving component in one embodiment;

[0022] Figure 4 This is a schematic diagram of the structure of a photoelectric conversion component in one embodiment;

[0023] Figure 5 This is a schematic diagram of the optical receiver in another embodiment;

[0024] Figure 6 This is a schematic diagram of the structure of the optical receiving component in another embodiment;

[0025] Figure 7 This is a schematic diagram of the photoelectric conversion component in another embodiment;

[0026] Figure 8 This is a schematic diagram of the structure of an optical signal transmission device in one embodiment.

[0027] The attached figures are labeled as follows:

[0028] Circuit board 3; optical receiving component 1; photoelectric conversion component 2; first optical module receiver 10; second optical module receiver 20; optical input component 4; digital signal processor chip 5; first metal structure 11; second metal structure 21; first fiber array assembly 12; first optical lens 13; first optical prism 14; second fiber array assembly 22; second optical lens 23; second optical prism 24; first optical fiber 31; second optical fiber 32; first transimpedance amplifier 15; first photodetector 16; first filter capacitor 17; first filter resistor-capacitor 18; second transimpedance amplifier 25; second photodetector 26; second filter capacitor 27; second filter resistor-capacitor 28; first exposed copper grounding area 411; second exposed copper grounding area 412; first wire bonding pad 401; first grounding positioning hole 421; second wire bonding pad 402; second grounding positioning hole 422; optical transmitter 81; optical receiver 82. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0031] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0032] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0033] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0034] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0035] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0036] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0037] With the development of communication technology, optical communication technology has been widely used in various fields due to its characteristics of large communication capacity and low loss. When information is transmitted through optical fiber, high-speed optical signal transmission devices are increasingly used in long-distance transmission, resulting in various types of optical signal transmission devices. Optical signal transmission devices include optical transmitters and optical receivers. Optical transmitters are used to convert electrical signals into optical signals, and optical receivers are used to convert optical signals back into electrical signals.

[0038] However, traditional optical receivers face challenges such as signal attenuation and noise interference during long-distance transmission, leading to a decrease in optical signal reception efficiency and signal quality. Therefore, current optical receivers suffer from poor optical signal reception performance when receiving optical signals transmitted over long distances.

[0039] In one embodiment, such as Figure 1 As shown, an optical receiver is provided, comprising: a circuit board 3, at least one optical module receiver, and a multi-channel optical input component; the optical module receiver includes a metal structure 11, an optical receiving component 1, and a photoelectric conversion component 2. The metal structure 11 is fixed to one side of the circuit board 3 and forms a closed space with a portion of one side of the circuit board 3. The photoelectric conversion component 2 is disposed within the closed space on the circuit board 3. The optical receiving component 1 is disposed on the surface of the metal structure 11 facing away from the circuit board 3. Both the metal structure 11 and the circuit board 3 are grounded; the optical input component is connected to the optical module receiver via an optical fiber.

[0040] In this context, circuit board 3 refers to a PCB (Printed Circuit Board) board where the COB (Chip on Board) package itself carries the integrated circuit. The optical receiver may include, but is not limited to, one or more optical module receivers. Each optical module receiver includes a metal structural component 11, an optical receiving assembly 1, and a photoelectric conversion assembly 2. The metal structural component 11 is used to fix the optical receiving assembly 1 and forms a closed space with a portion of one side of the circuit board 3. The optical receiving assembly 1 is used to receive at least one optical signal through at least one optical fiber and transmit the optical signal to the photoelectric conversion assembly 2. The photoelectric conversion assembly 2 is used to perform photoelectric conversion on the optical signal to generate an electrical signal corresponding to the optical signal. Of course, this application embodiment does not limit the number of optical module receivers or the arrangement direction of each device in the optical receiving assembly and photoelectric conversion assembly.

[0041] In this application embodiment, for example, the multi-channel can be eight-channel or four-channel. For instance, the optical receiver can be a single parallel 8-channel receiver, or it can be two parallel 4-channel receivers. Of course, this application embodiment does not limit the number of channels. The optical input component can be an MPO (Multiple-Fiber Push-On) 16-fiber connector, or it can be a dual MPO 12 fiber connector. Of course, this application embodiment does not limit the specific type of optical input component. Multi-channel optical input component ( Figure 1 (Not shown) is connected to the optical module receiver via optical fiber. In this way, long-distance, multi-channel optical signals can be input to the optical module receiver through the optical input component, so that the optical module receiver can effectively receive long-distance, multi-channel optical signals.

[0042] It should be noted that by fixing the metal structure 11 to one side of the circuit board 3 and forming a closed space with a portion of one side of the circuit board 3, the photoelectric conversion component 2 is set in the closed space on the circuit board 3. Both the metal structure 11 and the circuit board 3 are grounded, which can form a "Faraday cage". The "Faraday cage" can effectively resist external electromagnetic interference, thereby improving the receiving performance of the optical module receiver. In turn, when receiving long-distance transmitted optical signals, it can significantly improve the signal quality of the received optical signals.

[0043] In the aforementioned optical receiver, the optical receiver includes a circuit board, at least one optical module receiver, and a multi-channel optical input component. The optical module receiver includes a metal structural component, an optical receiving component, and a photoelectric conversion component. The metal structural component is fixed to one side of the circuit board and forms a closed space with a portion of the circuit board. The photoelectric conversion component is disposed within the closed space on the circuit board, and the optical receiving component is disposed on the surface of the metal structural component facing away from the circuit board. Both the metal structural component and the circuit board are grounded. The optical input component is connected to the optical module receiver via an optical fiber. Because this embodiment can form a closed space with a portion of the circuit board through the metal structural component, and the photoelectric conversion component is disposed within the closed space on the circuit board, and both the metal structural component and the circuit board are grounded, a "Faraday cage" can be formed. The "Faraday cage" can effectively resist external electromagnetic interference, thereby improving the receiving performance of the optical module receiver. Therefore, when the optical input component inputs long-distance, multi-channel optical signals to the optical module receiver, the optical module receiver can receive long-distance, multi-channel optical signals with high speed and interference resistance. Thus, the optical receiver in this embodiment can significantly improve the signal quality of the received optical signal when receiving multi-channel optical signals transmitted over long distances.

[0044] In one embodiment, the circuit board 3 includes a plurality of grounding positioning holes, and the metal structure 11 includes a plurality of positioning pins. The metal structure 11 is fixed by the plurality of positioning pins being inserted into the plurality of grounding positioning holes.

[0045] For example, such as Figure 2 As shown, Figure 2 This is a schematic diagram of the metal structural component in one embodiment. The metal structural component 11 can be fixed to the circuit board 3 by correspondingly inserting multiple positioning pins into multiple grounding positioning holes. In this way, by correspondingly inserting multiple positioning pins into multiple grounding positioning holes, the metal structural component and the circuit board can be effectively fixed.

[0046] In one embodiment, the light receiving component 1 includes a plurality of optical components arranged sequentially along a first direction; the photoelectric conversion component 2 includes a plurality of photoelectric components arranged sequentially along a second direction; the first direction and the second direction are opposite directions.

[0047] In one embodiment, such as Figure 3 As shown, Figure 3 This is a schematic diagram of the structure of a light receiving component in one embodiment. Multiple optical components include a fiber array assembly 12, an optical lens 13, and an optical prism 14 arranged sequentially. The fiber array assembly 12, the optical lens 13, and the optical prism 14 are fixed to the metal structural component 11 by UV-curing adhesive.

[0048] The fiber optic array assembly 12 receives multiple optical signals via multiple optical fibers 31 and transmits these signals to the optical lens 13. For example, the multiple optical fibers 31 can be four or eight fibers. The optical lens 13 converges the multiple optical signals into the optical prism 14. The optical prism 14 then redirects the multiple optical signals to the photoelectric conversion assembly 2. The first direction is the sequential arrangement from the fiber optic array assembly 12, the optical lens 13, to the optical prism 14.

[0049] In one embodiment, such as Figure 4 As shown, Figure 4 This is a schematic diagram of the structure of a photoelectric conversion component in one embodiment. Multiple photoelectric components include a transimpedance amplifier 15, a photodetector 16 and a filter component arranged sequentially. The transimpedance amplifier 15 is electrically connected to the circuit board 3 by gold wire bonding. The anode of the photodetector 16 is electrically connected to the transimpedance amplifier 15 by gold wire bonding. The cathode of the photodetector 16 is electrically connected to the filter component.

[0050] In one embodiment, combined with Figure 4As shown, the filter assembly includes a filter capacitor 17 and a filter resistor-capacitor 18; the cathode of the photodetector 16 is electrically connected to the filter capacitor 17 via gold wire bonding, the filter capacitor 17 is electrically connected to the filter resistor-capacitor 18 via gold wire bonding, and the filter resistor-capacitor 18 is electrically connected to the circuit board 3 via gold wire bonding.

[0051] In this embodiment, the photodetector 16 includes a photodetector chip. The second direction is the sequential arrangement of the transimpedance amplifier 15, the photodetector 16, the filter capacitor 17, and the filter resistor-capacitor 18, while the first and second directions are opposite.

[0052] Among them, the photodetector 16 can be an APD (Avalanche Photodiode) chip.

[0053] In addition, combined Figure 4 As shown, the circuit board 3 is also provided with an exposed copper grounding area 411. The exposed copper grounding area 411 of the circuit board 3 is provided with a wire bonding pad 401 and multiple grounding positioning holes 421. Multiple photoelectric components in the photoelectric conversion component 2 are mounted in the exposed copper grounding area 411 of the circuit board 3 by conductive silver paste.

[0054] In one embodiment, the fiber spacing of the fiber array component 12 in the optical receiving component is the same as the mounting spacing of the photodetector 16 and the channel spacing of the signal input pad of the transimpedance amplifier 15.

[0055] In this embodiment, the optical receiving component includes a plurality of optical components arranged sequentially along a first direction, and the photoelectric conversion component includes a plurality of photoelectric components arranged sequentially along a second direction. Since the first and second directions are opposite, this embodiment can minimize the volume of the optical receiving component and the photoelectric conversion component, thereby ensuring a compact optical receiver structure.

[0056] In one embodiment, such as Figure 5 As shown, the optical receiver includes a first optical module receiver 10 and a second optical module receiver 20 arranged in parallel, and the optical input component 4 is connected to the first optical module receiver 10 and the second optical module receiver 20 respectively via optical fiber.

[0057] In this embodiment, the optical receiver further includes a digital signal processor (DSP) chip 5. The DSP chip 5, the first optical module receiver 10, and the second optical module receiver 20 are all mounted on the circuit board 3, and are arranged in parallel on the circuit board 3. The optical input component 4 is used to split the long-distance optical signal and transmit the split optical signals to the first optical module receiver 10 and the second optical module receiver 20 respectively through multiple optical fibers. For example, eight long-distance optical signals can be split into two sets of four optical signals, and four optical signals can be transmitted to the first optical module receiver 10 through four optical fibers, and the other four optical signals can be transmitted to the second optical module receiver 20 through another four optical fibers. Thus, the eight parallel transmission optical receiving channels included in the parallel-arranged first optical module receiver 10 and second optical module receiver 20 can effectively achieve long-distance and parallel transmission of multiple optical signals.

[0058] For example, such as Figure 6 As shown, Figure 6 The diagram below illustrates the structure of a light receiving component in another embodiment. The first optical module receiver 10 includes a first metal structure 11, a first light receiving component, a first photoelectric conversion component, a second metal structure 21, a second light receiving component, and a second photoelectric conversion component. The first light receiving component includes a plurality of first optical components arranged sequentially along a first direction, and the first photoelectric conversion component includes a plurality of first photoelectric components arranged sequentially along a second direction; the first and second directions are opposite. The second light receiving component includes a plurality of second optical components arranged sequentially along the first direction, and the second photoelectric conversion component includes a plurality of second photoelectric components arranged sequentially along the second direction; the first and second directions are opposite.

[0059] The system comprises multiple first optical components, including a first fiber optic array assembly 12, four first optical lenses 13, and a first optical prism 14 arranged sequentially. The first fiber optic array assembly 12, the four second optical lenses 13, and the first optical prism 14 are fixed to a first metal structural component 11 using UV-curable adhesive. The fiber optic array assembly 12 is used to receive multiple optical signals via multiple first optical fibers 31. The system also comprises multiple second optical components, including a second fiber optic array assembly 22, four second optical lenses 23, and a second optical prism 24 arranged sequentially. The second fiber optic array assembly 22, the four second optical lenses 23, and the second optical prism 24 are fixed to a second metal structural component 21 using UV-curable adhesive. The fiber optic array assembly 22 is used to receive multiple optical signals via multiple second optical fibers 32. The incident and exit surfaces of the four first optical lenses 13, the first optical prism 14, the four second optical lenses 23, and the second optical prism 24 are all coated with anti-reflective films. The light-emitting surfaces of both the first fiber optic array assembly 12 and the second fiber optic array assembly 22 are designed with an 8° angle.

[0060] For example, such as Figure 7 As shown, Figure 7 The diagram below illustrates the structure of a photoelectric conversion component in another embodiment. Multiple first photoelectric components include a first transimpedance amplifier 15, four first photodetectors 16, and a first filter component arranged sequentially. The first transimpedance amplifier 15 is electrically connected to the circuit board 3 via gold wire bonding. The anodes of the four first photodetectors 16 are electrically connected to the first transimpedance amplifier 15 via gold wire bonding, and the cathodes of the four first photodetectors 16 are electrically connected to the first filter component. The first filter component includes four first filter capacitors 17 and four first filter resistors / capacitors 18. The cathodes of the four first photodetectors 16 are electrically connected to the four first filter capacitors 17 via gold wire bonding, the four first filter capacitors 17 are electrically connected to the four first filter resistors / capacitors 18 via gold wire bonding, and the four first filter resistors / capacitors 18 are electrically connected to the four first wire bonding pads 401 in the circuit board 3 via gold wire bonding.

[0061] Among them, combined Figure 7As shown, the multiple second optoelectronic components include a second transimpedance amplifier 25, four second photodetectors 26, and a second filter assembly arranged sequentially. The second transimpedance amplifier 25 is electrically connected to the circuit board 3 via gold wire bonding. The anodes of the four second photodetectors 26 are electrically connected to the second transimpedance amplifier 25 via gold wire bonding, and the cathodes of the four second photodetectors 26 are electrically connected to the second filter assembly. The second filter assembly includes four second filter capacitors 27 and four second filter resistors / capacitors 28. The cathodes of the four second photodetectors 26 are electrically connected to the four second filter capacitors 27 via gold wire bonding, the four second filter capacitors 27 are electrically connected to the four second filter resistors / capacitors 28 via gold wire bonding, and the four second filter resistors / capacitors 28 are electrically connected to the four second wire bonding pads 402 in the circuit board 3 via gold wire bonding.

[0062] It should be noted that the chips in the first transimpedance amplifier 15 and the second transimpedance amplifier 25 both support multi-channel signal input. The fiber spacing of the first fiber array assembly 12 is the same as the mounting spacing of the chips in the four first photodetectors 16 of the first group, and the channel spacing of the signal input pads of the chips in the first transimpedance amplifier 15, with the channel spacing of the signal input pads of the chips in the first transimpedance amplifier 15 serving as the preferred reference distance. Similarly, the fiber spacing of the second fiber array assembly 22 is the same as the mounting spacing of the chips in the four second photodetectors 26 of the second group, and the channel spacing of the signal input pads of the chips in the second transimpedance amplifier 25, with the channel spacing of the signal input pads of the chips in the second transimpedance amplifier 25 serving as the preferred reference distance.

[0063] In one embodiment, combined with Figure 7As shown, circuit board 3 also has a first exposed copper grounding area 411 and a second exposed copper grounding area 412. The first exposed copper grounding area 411 of circuit board 3 has four gold-plated first wire bonding pads 401 and four first grounding positioning holes 421. Each optoelectronic component in the optoelectronic conversion assembly of the first optical module receiver is mounted in the first exposed copper grounding area 411 of circuit board 3 using conductive silver paste. The second exposed copper grounding area 412 of circuit board 3 has four gold-plated second wire bonding pads 402 and four second grounding positioning holes 422. Each optoelectronic component in the optoelectronic conversion assembly of the second optical module receiver is mounted in the second exposed copper grounding area 412 of circuit board 3 using conductive silver paste. The first wire bonding pads 401 are used for gold wire bonding electrical connection with the first optical module receiver, and the second wire bonding pads 402 are used for gold wire bonding electrical connection with the second optical module receiver. The four positioning pins on the first metal structural component 11 are installed corresponding to the four first grounding positioning holes 421 and fixed with conductive silver paste; the four positioning pins on the second metal structural component 21 are installed corresponding to the four second grounding positioning holes 422 and fixed with conductive silver paste. In addition, the first exposed copper grounding area 411 and the second exposed copper grounding area 412 on the circuit board 3 are both gold-plated, so gold wire bonding can be achieved on the exposed copper surface of the circuit board 3.

[0064] Based on this, the optical input component 4 inputs an optical signal to the first fiber array component 12 through the first group of four first optical fibers 31, and then transmits the optical signal through the first fiber array component 12 to the four first optical lenses 13 of the first group. The optical signal is then focused into the first optical prism 14 by the four first optical lenses 13 of the first group, and then converted into the four first photodetectors 16 of the first group by the first optical prism 14. The optical signal is then photoelectrically converted into an initial electrical signal by the four first photodetectors 16 of the first group. The initial electrical signal can then be amplified by the first transimpedance amplifier 15 to obtain the amplified initial electrical signal. The amplified initial electrical signal can then be processed by the first filter component to obtain the electrical signal corresponding to the optical signal.

[0065] The optical input component 4 inputs an optical signal to the second fiber array component 22 through the four second optical fibers 32 of the second group, and then transmits the optical signal through the second fiber array component 22 to the four second optical lenses 23 of the second group. The optical signal is then focused into the second optical prism 24 by the four second optical lenses 23 of the second group, and then converted into the four second photodetectors 26 of the second group by the second optical prism 24. The optical signal is then converted into an initial electrical signal by the four second photodetectors 26 of the second group. The initial electrical signal is then amplified by the second transimpedance amplifier 25 to obtain the amplified initial electrical signal. The amplified initial electrical signal is then processed by the second filter component to obtain the electrical signal corresponding to the optical signal.

[0066] It should be noted that the configuration of the four parallel optical signals shown in the above embodiments is only an example. That is, the embodiments of this application can also configure three, six, or eight parallel channels to transmit optical signals. Of course, the embodiments of this application do not limit the number of parallel optical paths. Furthermore, the embodiments of this application are not limited to single-wavelength 100G optical transmission; they are also applicable to single-wavelength 200G optical transmission. That is, the embodiments of this application do not limit the optical transmission method.

[0067] In this embodiment, the optical receiver includes a first optical module receiver and a second optical module receiver. The optical receiver also includes an optical input component, which is connected to both the first and second optical module receivers via optical fibers. Thus, long-distance transmission of optical signals can be effectively achieved using the first and second optical module receivers.

[0068] Based on the above embodiments, this application proposes an eight-channel optical module receiver device (i.e., the above-mentioned optical receiver) for long-distance transmission, which is applicable to COB packaged optical modules (i.e., optical signal transmission devices). It aims to improve the reception efficiency and signal quality of optical signals for long-distance transmission, thereby improving the performance and reliability of the high-speed optical module transmission system and meeting the requirements of 400G / 800G / 1.6T optical transmission systems.

[0069] Specifically, firstly, the aforementioned optical receiver employs two parallel optical module receivers to simultaneously receive eight high-speed optical signals. It utilizes two sets of parallel photodetectors and a corresponding filter circuit layout, significantly improving the receiver's sensitivity and efficiency, thus achieving the necessary performance for long-distance transmission. Secondly, the specially designed metal structure supports the entire coupled optical path while grounding both the metal structure and the circuit board. This forms a "Faraday cage," enclosing the photoelectric conversion components and the bonding wires used for electrical connections between them. With two optical module receivers, this creates two "Faraday cages," effectively resisting and reducing external electromagnetic interference, significantly improving the signal quality of the optical signal, reducing the bit error rate, enhancing the performance and reliability of the high-speed optical module transmission system, and improving the performance of the optical module receiver. Thirdly, the optical receiver in this embodiment has a compact design with eight parallel optical receiving channels, solving the packaging problem of high-speed, multi-channel, long-distance optical receiving devices. This achieves the requirement of multi-channel high-speed parallel long-distance transmission within the limits of existing packaging space.

[0070] In one embodiment, such as Figure 8 As shown, an optical signal transmission device is provided, which includes: an optical transmitter 81 and an optical receiver 82 as described in any of the above embodiments; the optical transmitter 81 and another optical receiver 92 in another optical signal transmission device are connected by an optical fiber, and the optical receiver 82 and another optical transmitter 91 in the other optical signal transmission device are connected by an optical fiber, and both the optical signal transmission device and the other optical signal transmission device are used for long-distance transmission of optical signals.

[0071] The optical signal transmission device and the other optical signal transmission device are two optical modules located at two different locations in the long-distance transmission node. The optical transmitter and optical receiver of these two optical modules are connected via optical fiber. Both optical signal transmission devices are used for long-distance optical signal transmission. Specifically, the optical transmitter 81 in the optical signal transmission device outputs at least one optical signal to another optical receiver 92 in the other optical signal transmission device. The other optical receiver 92 performs photoelectric conversion on the received at least one optical signal to generate an electrical signal corresponding to that optical signal. The other optical transmitter 91 in the other optical signal transmission device outputs at least one optical signal to the optical receiver 82 in the optical signal transmission device. The optical receiver 82 performs photoelectric conversion on the received at least one optical signal to generate an electrical signal corresponding to that optical signal.

[0072] In the aforementioned optical signal transmission device, since the optical receiver can form a closed space with a portion of the circuit board through the metal structural component, and the photoelectric conversion component is set in the closed space on the circuit board, and both the metal structural component and the circuit board are grounded, a "Faraday cage" can be formed. The "Faraday cage" can effectively resist external electromagnetic interference, thereby improving the receiving performance of the optical module receiver. Furthermore, when the optical input component inputs long-distance, multi-channel optical signals to the optical module receiver, the optical module receiver can receive long-distance, multi-channel optical signals with high speed and anti-interference capability. Therefore, the optical receiver in this embodiment can significantly improve the signal quality of the received optical signal when receiving multi-channel optical signals transmitted over long distances.

[0073] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this application.

[0074] The above embodiments are merely illustrative of several implementation methods of this application, and their descriptions are relatively specific and detailed. However, they should not be construed as limiting the scope of this application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. An optical receiver, characterized in that, The optical receiver includes: a circuit board, at least one optical module receiver, and a multi-channel optical input component; The optical module receiver includes a metal structural component, an optical receiving component, and a photoelectric conversion component. The metal structural component is fixed to one side of the circuit board and forms a closed space with a portion of one side of the circuit board. The photoelectric conversion component is disposed within the closed space on the circuit board. The optical receiving component is disposed on the surface of the metal structural component facing away from the circuit board. Both the metal structural component and the circuit board are grounded. The optical input component is connected to the optical module receiver via an optical fiber.

2. The optical receiver according to claim 1, characterized in that, The circuit board includes multiple grounding positioning holes, and the metal structural component includes multiple positioning pins. The metal structural component is fixed by inserting the multiple positioning pins into the multiple grounding positioning holes.

3. The optical receiver according to claim 1, characterized in that, The light receiving component includes a plurality of optical components arranged sequentially along a first direction; the photoelectric conversion component includes a plurality of photoelectric components arranged sequentially along a second direction; the first direction and the second direction are opposite directions.

4. The optical receiver according to claim 3, characterized in that, The plurality of optical components include a fiber array assembly, an optical lens, and an optical prism arranged in sequence; the fiber array assembly, the optical lens, and the optical prism are fixed to the metal structure by UV-curing adhesive.

5. The optical receiver according to claim 3, characterized in that, The plurality of optoelectronic components include a transimpedance amplifier, a photodetector, and a filter assembly arranged sequentially. The transimpedance amplifier is electrically connected to the circuit board via gold wire bonding. The anode of the photodetector is electrically connected to the transimpedance amplifier via gold wire bonding. The cathode of the photodetector is electrically connected to the filter assembly.

6. The optical receiver according to claim 5, characterized in that, The filtering component includes a filter capacitor and a filter resistor-capacitor; The cathode of the photodetector is electrically connected to the filter capacitor via gold wire bonding, the filter capacitor is electrically connected to the filter resistor and capacitor via gold wire bonding, and the filter resistor and capacitor are electrically connected to the circuit board via gold wire bonding.

7. The optical receiver according to claim 5, characterized in that, The fiber spacing of the fiber array component in the optical receiving component is the same as the mounting spacing of the photodetector and the channel spacing of the signal input pad of the transimpedance amplifier.

8. The optical receiver according to claim 1, characterized in that, The optical receiver includes a first optical module receiver and a second optical module receiver arranged in parallel, and the optical input component is connected to the first optical module receiver and the second optical module receiver respectively via optical fiber.

9. The optical receiver according to claim 8, characterized in that, The photoelectric conversion component in the first optical module receiver is mounted on the first exposed copper grounding area of ​​the circuit board using conductive silver paste, and the photoelectric conversion component in the second optical module receiver is mounted on the second exposed copper grounding area of ​​the circuit board using conductive silver paste.

10. An optical signal transmission device, characterized in that, The optical signal transmission device includes: an optical transmitter and an optical receiver as described in any one of claims 1-9; the optical transmitter and another optical receiver in the other optical signal transmission device are connected by an optical fiber, and the optical receiver and another optical transmitter in the other optical signal transmission device are connected by an optical fiber; both the optical signal transmission device and the other optical signal transmission device are used for long-distance optical signal transmission.

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