Packaging structure and electronic devices

Abstract

This application discloses a packaging structure and an electronic device. The packaging structure includes a substrate and a MEMS chip. The substrate has opposing first and second surfaces, with first and second acoustic holes respectively disposed on the first and second surfaces. An airflow channel connecting the first and second acoustic holes is disposed inside the substrate. The projection of the airflow channel onto the first surface extends beyond the outer edge of the first acoustic hole, and / or the projection of the airflow channel onto the second surface extends beyond the outer edge of the second acoustic hole. The MEMS chip is disposed on the first surface of the substrate, and the diaphragm of the MEMS chip is opposite to the first acoustic hole.

Description

Technical Field

[0001] This application belongs to the field of microphone technology, specifically relating to a packaging structure and electronic device. Background Technology

[0002] In some microphone products, MEMS chips can pick up external sound signals through the sound holes on the substrate. However, in strong airflow environments, the airflow passes directly through the sound holes to the diaphragm of the MEMS chip, which can easily cause diaphragm damage and reduce the product's lifespan. Utility Model Content

[0003] This application aims to provide a packaging structure and electronic device that at least solves one of the problems of the prior art.

[0004] According to a first aspect of this application, a packaging structure is provided, comprising:

[0005] A substrate having a first surface and a second surface opposite to each other, the first surface and the second surface being respectively provided with a first sound hole and a second sound hole that are staggered from each other, and an airflow channel communicating with the first sound hole and the second sound hole being provided inside the substrate;

[0006] Wherein, the projection of the airflow channel on the first surface extends beyond the outer edge of the first acoustic hole, and / or the projection of the airflow channel on the second surface extends beyond the outer edge of the second acoustic hole;

[0007] The MEMS chip is disposed on the first surface of the substrate, and the diaphragm of the MEMS chip is opposite to the first acoustic hole.

[0008] Optionally, the size of the first acoustic hole and / or the second acoustic hole near the end of the first surface is larger than the size near the end of the second surface.

[0009] Optionally, the projection of the airflow channel onto the first surface or the second surface extends at least partially to the edge near the substrate.

[0010] Optionally, the diameter of the first acoustic hole and / or the second acoustic hole is 0.2 mm to 0.6 mm.

[0011] Optionally, the projections of the first acoustic hole and the second acoustic hole onto the first surface or the second surface do not overlap completely.

[0012] Optionally, the substrate has a conductive area, and the first acoustic hole, the second acoustic hole, and the airflow channel all avoid the conductive area.

[0013] Optionally, the system further includes a housing disposed on the substrate and forming a receiving cavity between the housing and the first surface, wherein the MEMS chip is located within the receiving cavity.

[0014] Optionally, it also includes an ASIC chip disposed on the first surface and located within the receiving cavity, and electrically connected to the MEMS chip.

[0015] Optionally, the airflow channel and the projection of the ASIC chip onto the first surface do not overlap at all.

[0016] According to a second aspect of this application, an electronic device is provided, comprising: the packaging structure described in the first aspect.

[0017] In the embodiments of this application, by staggering the first and second sound holes, a strong airflow can pass through the second sound hole, the airflow channel and the first sound hole in sequence, and then reach the diaphragm of the MEMS chip. This reduces the airflow intensity and lowers the risk of diaphragm breakage. When applied to microphone products, this can improve the service life of the device.

[0018] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0019] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0020] Figure 1 This is a schematic diagram of the packaging structure according to an embodiment of this application;

[0021] Figure 2 yes Figure 1 Top view of the middle substrate.

[0022] Figure label:

[0023] 1. Substrate; 11. First acoustic hole; 12. Airflow channel; 13. Second acoustic hole; 2. MEMS chip; 3. ASIC chip; 4. Housing. Detailed Implementation

[0024] Embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments in this application are within the scope of protection of this application.

[0025] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0026] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0027] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0028] like Figures 1 to 2 As shown, according to a first aspect of this application, a packaging structure is provided, including: a substrate 1 and a MEMS chip 2. The substrate 1 has a first surface and a second surface opposite to each other. The first surface and the second surface are respectively provided with a first acoustic hole 11 and a second acoustic hole 13 that are staggered from each other. An airflow channel 12 communicating with the first acoustic hole 11 and the second acoustic hole 13 is provided inside the substrate 1. The projection of the airflow channel 12 on the first surface extends beyond the outer edge of the first acoustic hole 11, and / or the projection of the airflow channel 12 on the second surface extends beyond the outer edge of the second acoustic hole 13. The MEMS chip 2 is disposed on the first surface of the substrate 1, and the diaphragm of the MEMS chip 2 is opposite to the first acoustic hole 11.

[0029] Specifically, in this embodiment, the substrate 1 of the provided packaging structure is provided with a first sound hole 11 and a second sound hole 13 that are staggered from each other, so that when this structure is applied to a microphone product, the airflow can enter the airflow channel 12 from the second sound hole 13, and then enter the first sound hole 11 through the airflow channel 12, and then reach the diaphragm of the MEMS chip 2.

[0030] In practical applications, this airflow guidance method allows strong airflow to be directly blocked by a portion of the substrate 1 when it enters the second acoustic hole 13, reducing the airflow intensity. Furthermore, since the outer edge of the airflow channel 12 extends beyond the outer edge of the first acoustic hole 11 and / or the second acoustic hole 13, the strong airflow can continue to diffuse outwards through the airflow channel 12 after being blocked, further reducing the airflow intensity and the amount of airflow entering. The first acoustic hole 11 is connected to the second acoustic hole 13 through the airflow channel 12 and is opposite to the diaphragm of the MEMS chip 2, allowing the airflow to continue entering the first acoustic hole 11 after diffusing in the airflow channel 12, and then reaching the diaphragm to realize the microphone function.

[0031] In the above embodiments, the projections of the first acoustic hole 11 and the second acoustic hole 13 on the first or second surface of the substrate 1 are offset from each other. They can be completely offset or partially offset, both of which can achieve the purpose of reducing the airflow intensity, and no limitation is imposed here. The projection of the airflow channel 12 on the first or second surface extends beyond the outer edge of the first acoustic hole 11 or the outer edge of the second acoustic hole 13, respectively. The projections of the first acoustic hole 11 and the second acoustic hole 13 can fall completely within the projection of the airflow channel 12, or they can fall partially within the projection of the airflow channel 12. Both of these can achieve the purpose of diffusing the airflow, so no limitation is imposed here either.

[0032] The packaging structure provided in this application allows strong airflow to reach the diaphragm after being diffused by the airflow channel 12 and weakened by the blocking strength of the substrate 1, reducing the risk of diaphragm rupture, achieving anti-blowing effect, and improving the service life of the packaging structure. Furthermore, when this packaging structure is applied to a microphone, the side of the diaphragm facing the first surface forms the microphone's front cavity. The arrangement of the airflow channel 12 further increases the space of the front cavity, lowering the microphone's low-frequency cutoff frequency and enhancing the ability to capture low-frequency sound signals (such as ambient noise and low-frequency components in the voice fundamental frequency). In addition, increasing the front cavity also makes the MEMS chip 2 more sensitive to temperature, improving its applicability in scenarios where temperature requirements and anti-blowing resistance are necessary.

[0033] Optionally, such as Figures 1 to 2 As shown, the size of the first sound hole 11 and / or the second sound hole 13 near the first surface is larger than the size near the second surface.

[0034] Specifically, in this embodiment, the size of the first acoustic hole 11 at the end near the first surface is larger than the size at the end near the second surface, as shown in the reference. Figure 1Specifically, the first acoustic hole 11 has a structure that is wider at the top and narrower at the bottom. This structure guides the airflow to diffuse towards the periphery of the first acoustic hole 11, further reducing the airflow rate and intensity entering the MEMS chip 2. Similarly, the second acoustic hole 13 and the first acoustic hole 11 can both be configured as a structure that is wider at the top and narrower at the bottom, or only the first acoustic hole 11 or the second acoustic hole 13 can be configured as a structure that is wider at the top and narrower at the bottom; there is no limitation on this. Preferably, configuring both the first acoustic hole 11 and the second acoustic hole 13 as a structure that is wider at the top and narrower at the bottom can improve the anti-blowing effect.

[0035] Optionally, such as Figures 1 to 2 As shown, the projection of the airflow channel 12 on the first or second surface extends at least partially to the edge of the substrate 1.

[0036] Specifically, in this embodiment, the projection of the airflow channel 12 onto the first surface extends at least partially to the edge near the substrate 1, thereby maximizing the volume of the airflow channel 12. This allows for a further increase in the front cavity space when the packaging structure is applied to a microphone, thereby improving the microphone's acoustic performance and environmental adaptability. Since the first and second surfaces are typically of the same area, the projection positions of the airflow channel 12 onto the first and second surfaces are generally consistent.

[0037] In practical applications, conductive structures or electronic components are provided on the first surface or inside of the substrate 1. The airflow channel 12 can be selected to extend to the edge of the substrate 1 on the side with fewer electronic components. The shape of the airflow channel 12 can be circular, square, etc., and is designed according to actual needs without limitation.

[0038] Optionally, such as Figures 1 to 2 As shown, the diameter of the first sound hole 11 and / or the second sound hole 13 is 0.2 mm to 0.6 mm.

[0039] Specifically, in practical applications, the diameters of the first sound hole 11 and the second sound hole 13 should not be too large or too small. If they are too large, the anti-blowing effect will be insignificant, and if they are too small, the airflow will be affected. Setting them to 0.2mm to 0.6mm, such as 0.3mm, 0.4mm, 0.5mm, etc., can balance the acoustic effect of the microphone and the anti-blowing effect.

[0040] Optionally, such as Figure 2 As shown, the projections of the first sound hole 11 and the second sound hole 13 on the first surface or the second surface do not overlap at all.

[0041] Specifically, in this embodiment, the projections of the first acoustic hole 11 and the second acoustic hole 13 on the first surface or the second surface do not overlap at all, that is, the first acoustic hole 11 and the second acoustic hole 13 are completely staggered. This design allows the strong airflow to be completely blocked by the substrate 1 after entering the airflow channel 12 from the second acoustic hole 13, and to quickly diffuse within the airflow channel 12, which greatly improves the effect of reducing the airflow intensity.

[0042] In addition, the projections of the first sound hole 11 and the second sound hole 13 on the first surface can be designed so that their projections fall completely within the projection of the airflow channel 12 on the first surface, and the edges of the projections of the first sound hole 11 and the second sound hole 13 are respectively a certain distance from the edge of the projection of the airflow channel 12, which can ensure that the airflow channel 12 is large enough, further increasing the path of airflow from the second sound hole 13 to the first sound hole 11, greatly reducing the amount of airflow entering, and thus ensuring the anti-blowing effect of the encapsulation structure from two aspects.

[0043] Optionally, the substrate 1 has a conductive area, and the first acoustic hole 11, the second acoustic hole 13 and the airflow channel 12 all avoid the conductive area.

[0044] Specifically, in practical applications, substrate 1 can be designed as a multi-layer structure. Different structural designs have different components or conductive structures. The areas with conductive structures are usually conductive areas, while other parts are usually insulating areas made of non-conductive materials. The first acoustic hole 11, the second acoustic hole 13, and the airflow channel 12 are placed within the insulating area to avoid the conductive areas and prevent the conductive structures from being exposed on the inner walls of these structures, thereby improving the safety and reliability of the entire packaging structure.

[0045] Optionally, such as Figure 1 As shown, the packaging structure also includes a housing 4, which is disposed on the substrate 1 and forms a receiving cavity between the housing 4 and the first surface, and the MEMS chip 2 is located in the receiving cavity.

[0046] Specifically, in this embodiment, the housing 4 and the diaphragm of the MEMS chip 2 on the side away from the first surface can form the rear cavity of the microphone, and the housing 4 can protect the components located in the cavity, so that it can be used as an integral structure in electronic devices, improving the integrity of the packaging structure and the ease of assembly.

[0047] Optionally, such as Figure 1 As shown, the packaging structure also includes an ASIC chip 3, which is disposed on the first surface and located in the receiving cavity, and is electrically connected to the MEMS chip 2.

[0048] Specifically, in this embodiment, an ASIC chip 3 can also be disposed in the receiving cavity to meet the usage requirements of the microphone. The airflow channel 12 and the projection of the ASIC chip 3 on the first surface are completely non-overlapping, ensuring that the airflow channel 12 can avoid the assembly area of ​​the ASIC chip 3 in the design. This area contains many conductive structures, and the airflow channel 12's avoidance of the ASIC chip 3 makes the packaging structure safer and more reliable.

[0049] According to a second aspect of this application, an electronic device is provided, comprising: the packaging structure of the first aspect.

[0050] Specifically, in this embodiment, the provided electronic device includes the packaging structure provided in the first aspect, which enables the electronic device to have good anti-blowing effect when implementing the microphone function, thereby extending the service life of the electronic device.

[0051] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0052] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A package structure, characterized by, include: A substrate having a first surface and a second surface opposite to each other, the first surface and the second surface being respectively provided with a first sound hole and a second sound hole that are staggered from each other, and an airflow channel communicating with the first sound hole and the second sound hole being provided inside the substrate; Wherein, the projection of the airflow channel on the first surface extends beyond the outer edge of the first acoustic hole, and / or the projection of the airflow channel on the second surface extends beyond the outer edge of the second acoustic hole; The MEMS chip is disposed on the first surface of the substrate, and the diaphragm of the MEMS chip is opposite to the first acoustic hole.

2. The package structure of claim 1, wherein, The size of the first acoustic aperture and / or the second acoustic aperture at the end near the first surface is larger than the size at the end near the second surface.

3. The package structure of claim 1, wherein, The projection of the airflow channel onto the first surface or the second surface extends at least partially to the edge near the substrate.

4. The package structure of claim 1, wherein, The diameter of the first acoustic hole and / or the second acoustic hole is 0.2 mm to 0.6 mm.

5. The package structure of claim 1, wherein, The projections of the first acoustic hole and the second acoustic hole onto the first surface or the second surface do not overlap at all.

6. The package structure of claim 1, wherein, The substrate has a conductive area, and the first acoustic hole, the second acoustic hole, and the airflow channel all avoid the conductive area.

7. The package structure of claim 1, wherein, It also includes a housing disposed on the substrate and forming a receiving cavity between the housing and the first surface, wherein the MEMS chip is located within the receiving cavity.

8. The package structure of claim 7, wherein, It also includes an ASIC chip, which is disposed on the first surface and located within the receiving cavity, and is electrically connected to the MEMS chip.

9. The package structure of claim 8, wherein, The airflow channel and the projection of the ASIC chip onto the first surface do not overlap at all.

10. An electronic device, comprising: include: The packaging structure according to any one of claims 1-9.

Images