A heat dissipation system for electronic devices

Abstract

This application discloses a heat dissipation system for electronic devices, comprising: a liquid cooling plate; microchannels disposed within the liquid cooling plate for containing a cooling medium; a circulation mechanism disposed on the liquid cooling plate and communicating with the microchannels to circulate the cooling medium within the microchannels; and a fan disposed on the liquid cooling plate. As the cooling medium flows within the microchannels, it conducts heat while simultaneously carrying it away, achieving "flow transport" of heat. Simultaneously, the microchannels and the liquid cooling plate have a larger contact area, making it easier for heat transferred from the electronic device to the liquid cooling plate to be conducted to the cooling medium. The fan, disposed on the liquid cooling plate, forms active air convection. This application combines the active flow heat dissipation of the microchannels with the active air convection heat dissipation of the fan, ensuring continuous active heat transport and dissipation throughout the process, resulting in a fast response and significantly improved heat dissipation efficiency.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation system technology, and in particular to a heat dissipation system for electronic devices. Background Technology

[0002] With the continuous improvement of electronic product performance, especially its widespread application in fields such as artificial intelligence and high-performance computing, the heat generated by electronic components during operation has increased significantly. Prolonged exposure to high temperatures can not only affect the stable operation of electronic components but also potentially damage them and shorten their lifespan. Therefore, effectively dissipating the heat generated by electronic components during operation and rapidly releasing it through a cooling system is crucial to ensuring the normal operation of electronic products.

[0003] Currently, the commonly used heat dissipation structures in electronic devices (such as laptops) are mainly combinations of "heat pipe + fan" or "vapor chamber + fan". This type of heat dissipation relies on passive heat-conducting elements to conduct heat from the chip and then carries the heat away through the fan, resulting in low heat dissipation efficiency.

[0004] Therefore, existing technologies still need to be improved and developed. Utility Model Content

[0005] The technical problem to be solved by this utility model is to provide a heat dissipation system for electronic devices, which addresses the above-mentioned deficiencies of the prior art and aims to solve the problem of low heat dissipation efficiency caused by passive heat conduction in the prior art.

[0006] The technical solution adopted by this utility model to solve the technical problem is as follows:

[0007] A heat dissipation system for electronic devices, comprising:

[0008] Liquid cooling plate; the liquid cooling plate is provided with microchannels, which are used to contain the cooling medium;

[0009] A circulation mechanism is disposed on the liquid cooling plate and communicates with the microchannel to allow the cooling medium to circulate within the microchannel.

[0010] A fan is mounted on the liquid cooling plate.

[0011] The aforementioned heat dissipation system for electronic devices, wherein the circulation mechanism comprises:

[0012] At least one micropump; the return port and outlet of the micropump are both connected to the microchannel.

[0013] The aforementioned heat dissipation system for electronic devices further includes:

[0014] The finned unit is disposed on the liquid cooling plate and close to the fan.

[0015] The aforementioned heat dissipation system for electronic devices, wherein the fin unit comprises:

[0016] The first mounting plate is detachably connected to the liquid cooling plate;

[0017] The second mounting plate is arranged opposite to the first mounting plate;

[0018] Multiple fins are arranged side by side between the first mounting plate and the second mounting plate, and are respectively connected to the first mounting plate and the second mounting plate.

[0019] The heat dissipation system for electronic devices, wherein the air outlet of the fan faces the finned unit, and the fins are parallel to the air outlet direction of the fan.

[0020] The aforementioned heat dissipation system for electronic devices, wherein the liquid cooling plate comprises:

[0021] Top cover;

[0022] The lower cover is fastened to the upper cover to form a sealed cavity; the microchannel is located between the upper cover and the lower cover.

[0023] The heat dissipation system for electronic devices, wherein the microchannels are etched on the side of the upper cover facing the lower cover.

[0024] The heat dissipation system for electronic devices includes an upper cover with a portion corresponding to the microchannel recessed away from the lower cover to form a recessed portion; the lower cover has a protrusion that contacts the bottom wall of the recessed portion to divide the recessed portion into the microchannel.

[0025] The aforementioned heat dissipation system for electronic devices, wherein the upper cover comprises:

[0026] First structural layer; through holes are etched on the first structural layer according to the shape of the microchannel;

[0027] A second structural layer is disposed on the first structural layer and blocks the through hole from one side.

[0028] The heat dissipation system for electronic devices, wherein the first structural layer includes a PI-CU structural layer and the second structural layer includes a CU structural layer.

[0029] Beneficial effects: The microchannels are used to contain the cooling medium, and the circulation mechanism enables the cooling medium to circulate within the microchannels. As the cooling medium flows within the microchannels, it not only conducts heat but also carries it away simultaneously, continuously removing heat from the electronic device that has migrated to the liquid cooling plate, achieving "flow transport" of heat. Simultaneously, the microchannels and the liquid cooling plate have a larger contact area, making it easier for heat from the electronic device to be conducted to the cooling medium through the liquid cooling plate. Compared to passive heat dissipation in existing technologies, the heat dissipation achieved by the circulation of the cooling medium within the microchannels is more active and faster.

[0030] The fan, mounted on the liquid cooling plate, creates active air convection, significantly improving heat exchange efficiency compared to natural convection. Therefore, this application combines the active flow-type heat dissipation of the microchannels with the active air convection-type heat dissipation of the fan, ensuring continuous active heat transport and dissipation throughout the process, resulting in rapid response and a substantial improvement in heat dissipation efficiency. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the overall assembly structure of the heat dissipation system for electronic devices described in this application;

[0032] Figure 2 This is an exploded structural diagram of the heat dissipation system for electronic devices described in this application;

[0033] Figure 3 This is a schematic diagram of the microchannel structure described in this application;

[0034] Figure 4 This is a schematic diagram showing the distribution of the fan and the finned unit described in this application;

[0035] Figure 5 This is a schematic diagram of the structure of the liquid cooling plate in Embodiment 1 of this application;

[0036] Figure 6 This is a schematic diagram of the structure of the liquid cooling plate in Embodiment 2 of this application;

[0037] Figure 7 This is a schematic diagram of the structure of the liquid cooling plate in Embodiment 3 of this application;

[0038] Figure 8 This is an exploded structural diagram of the liquid cooling plate in Embodiment 3 of this application. Detailed Implementation

[0039] Those skilled in the art will understand that, unless specifically stated otherwise, the singular forms “a,” “an,” “the,” and “the” used herein may also include the plural forms. It should be further understood that the term “comprising” as used in this application means the presence of the stated features, integers, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. It should be understood that when we say an element is “connected” or “coupled” to another element, it can be directly connected or coupled to the other element, or there may be intermediate elements. Furthermore, “connected” or “coupled” as used herein can include wireless connections or wireless coupling. The term “and / or” as used herein includes all or any units and all combinations of one or more associated listed items.

[0040] It will be understood by those skilled in the art that, unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. It should also be understood that terms such as those defined in general dictionaries should be understood to have the same meaning as in the context of the prior art, and should not be interpreted in an idealized or overly formal sense unless specifically defined as herein.

[0041] This utility model provides a heat dissipation system for electronic devices, such as... Figure 1 and Figure 2 As shown, the heat dissipation system for electronic devices includes a liquid cooling plate 1, a circulation mechanism 2, and a fan 3; the liquid cooling plate 1 is provided with microchannels 11 (such as...). Figure 3 As shown, the microchannel 11 is used to contain the cooling medium; the circulation mechanism 2 is disposed on the liquid cooling plate 1 and communicates with the microchannel 11 so that the cooling medium circulates within the microchannel 11; the fan 3 is disposed on the liquid cooling plate 1.

[0042] Specifically, the microchannel 11 is used to contain the cooling medium, and the circulation mechanism 2 enables the cooling medium to circulate within the microchannel 11. When the cooling medium flows within the microchannel 11, it not only conducts heat but also carries away heat while conducting heat, thereby continuously removing heat transferred from the electronic device to the liquid cooling plate 1, achieving "flow transport" of heat. Simultaneously, the microchannel 11 has a larger contact area with the liquid cooling plate 1, making it easier for heat transferred from the electronic device to the liquid cooling plate 1 to be conducted to the cooling medium through the liquid cooling plate 1. Compared to passive heat dissipation in the prior art, the heat dissipation achieved by the circulation of the cooling medium within the microchannel 11 is more active and faster.

[0043] The fan 3 is mounted on the liquid cooling plate 1, forming active air convection, which greatly improves the heat exchange efficiency compared to natural convection. Therefore, this application combines the active flow heat dissipation of the microchannel 11 with the active air convection heat dissipation of the fan 3, so that active heat transfer and dissipation are always carried out during the continuous process, with fast response speed and significantly improved heat dissipation efficiency.

[0044] In one embodiment of this application, the circulation mechanism 2 includes at least one micropump 21 (such as...). Figure 1 and Figure 2 (as shown); the return port and outlet of the micropump 21 are both connected to the microchannel 11.

[0045] In this embodiment, the micropump 21 has a return port and an outlet, both of which are connected to the microchannel 11, thereby forcibly driving the flow of the cooling medium and forming an internal circulation of the cooling medium within the microchannel 11, preventing hot spots and temperature buildup. Under the power of the micropump 21, the cooling medium flows continuously, enabling the flow to transport heat and thus improving heat dissipation efficiency.

[0046] In one embodiment of this invention, two micropumps 21 are connected in parallel. With the two micropumps 21 connected in parallel, they simultaneously supply heat to the cooling system, resulting in a higher flow rate and faster heat transfer. The high flow rate reduces the residence time of the coolant in the microchannel 11, preventing localized overheating. If one micropump 21 fails, the other micropump 21 can still maintain a minimum cooling cycle, preventing the system from overheating and shutting down instantly, thus improving overall system stability and operational safety.

[0047] Meanwhile, since the two micropumps 21 are connected in parallel, the opening and closing of the two micropumps 21 can be controlled independently without affecting the other. Therefore, one or two pumps can be activated as needed: only one pump is activated under low load to save energy and reduce noise; both pumps are activated under high load.

[0048] To make the heat dissipation system suitable for small electronic devices, such as laptops, this embodiment only provides two micropumps 21 on the outer side of the liquid cooling plate 1. This satisfies the above heat dissipation requirements without taking up too much internal space in the electronic device. Furthermore, the micropumps 21 consume power; multiple micropumps 21 operating together will increase the overall system power consumption, and too many may even introduce additional heat sources, offsetting some of the heat dissipation effect.

[0049] The liquid cooling plate 1 is provided with a liquid injection port. After the cooling medium in the microchannel 11 is filled, the liquid injection port needs to be sealed to form a liquid internal circulation space in the liquid cooling plate 1. The micropump 21 is designed at the liquid injection port to reduce the flow resistance of the cooling medium.

[0050] like Figure 1 and Figure 2 As shown, the heat dissipation system for electronic devices also includes a finned unit 4, which is disposed on the liquid cooling plate 1 and close to the fan 3.

[0051] Specifically, in this application, the finned unit 4 is also provided on the outer side of the liquid cooling plate 1. The finned unit 4 is in contact with the liquid cooling plate 1 and receives the heat transferred by the liquid cooling plate 1. The finned unit 4 is used to increase the heat exchange area per unit volume, and the heat exchange with the air is quickly achieved through the finned unit 4, further improving the heat dissipation efficiency. Therefore, by being close to or in contact with the heat dissipation components on the electronic device, the liquid cooling plate 1 allows the heat generated by the heat dissipation components to be transferred to the liquid cooling plate 1. The liquid cooling plate 1 then transfers a portion of the heat to the cooling medium in the microchannel 11, where heat dissipation is achieved through the flow of the cooling medium. The liquid cooling plate 1 also transfers a portion of the heat to the finned unit 4, where heat exchange with the air is achieved through the finned unit 4, thus achieving synchronous heat dissipation.

[0052] When the finned unit 4 relies solely on natural convection, its heat dissipation efficiency is limited, and hot air tends to accumulate around the finned unit 4. Therefore, the finned unit 4 is placed close to the fan 3 and positioned within the air outlet range of the fan 3 to ensure that the airflow can fully penetrate the fins 43 and carry away the heat.

[0053] like Figure 4 As shown, the finned unit 4 includes a first mounting plate 41, a second mounting plate 42, and a plurality of fins 43; the first mounting plate 41 is detachably connected to the liquid cooling plate 1; the second mounting plate 42 is arranged opposite to the first mounting plate 41; the plurality of fins 43 are arranged side by side between the first mounting plate 41 and the second mounting plate 42, and are respectively connected to the first mounting plate 41 and the second mounting plate 42.

[0054] Specifically, the fins 43 are perpendicular to the first mounting plate 41 and the second mounting plate 42 respectively. The first mounting plate 41, the second mounting plate 42 and the liquid cooling plate 1 are all parallel to each other. The first mounting plate 41 and the second mounting plate 42 can install and position the fins 43 so that the spacing between two adjacent fins 43 can be maintained uniformly, which enhances the structural strength of the fin unit 4 and avoids warping and shaking of a single fin 43 after being heated, thereby affecting contact and heat dissipation.

[0055] Multiple fins 43 are spaced apart between the first mounting plate 41 and the second mounting plate 42, thereby forming an airflow channel between adjacent fins 43; the fin unit 4 is located at the air outlet 31 of the fan 3 (e.g., Figure 4 As shown in the figure, the fins 43 and the air outlet 31 of the fan 3 are parallel to each other, so that the air circulation channel can be parallel to the air outlet 31 of the fan 3, so that the airflow blown by the fan 3 can flow along the air circulation channel, penetrate the entire set of fins 43, and guide the airflow to pass through the direction of the air circulation channel. Each fin 43 can participate in heat exchange, reducing dead corners, heat accumulation, and backflow.

[0056] The liquid cooling plate 1 includes an upper cover 101 and a lower cover 102; the lower cover 102 is fastened to the upper cover 101 to form a sealed cavity; the microchannel 11 is located between the upper cover 101 and the lower cover 102.

[0057] Example 1

[0058] like Figure 5 As shown, the microchannels 11 are etched on the side of the upper cover 101 facing the lower cover 102.

[0059] Specifically, the microchannels 11 are etched onto the upper cover 101 using an etching process, thus forming the microchannels 11 on the upper cover 101. The lower cover 102 is used to fasten and shield the microchannels 11 with the upper cover 101, thereby forming a sealed cavity. After the lower cover 102 is fastened to the upper cover 101, they are welded together using a brazing process to form the main body of the liquid cooling plate 1.

[0060] Both the upper cover 101 and the lower cover 102 are made of C5191 tin bronze alloy or JCC-6M-T copper alloy, which has a higher hardness than pure copper and is less prone to deformation due to heat.

[0061] When the depth of the microchannel 11 is too shallow, the amount of cooling medium per unit volume in the microchannel 11 is less, resulting in greater pressure loss, increased burden on the micropump 21, and easy blockage of the microchannel 11 by microparticles or bubbles. When the depth of the microchannel 11 is too deep, the distance between the central flow layer of the cooling medium and the wall of the liquid cooling plate 1 is large, resulting in decreased thermal conductivity and affecting the thinness of the product. Based on this, the depth of the microchannel 11 in this application is in the range of 0.1mm to 0.9mm, which does not affect the overall structural thickness, ensures that the cooling medium can be close to the wall to enhance convective heat transfer, and facilitates the driving of the micropump 21, so that the cooling medium can maintain a high circulation efficiency within the microchannel 11.

[0062] In one embodiment of this example, the thickness of the upper cover 101 is 0.8 mm, and the thickness of the lower cover 102 is 0.2 mm.

[0063] Example 2

[0064] like Figure 6 As shown, the portion of the upper cover 101 corresponding to the microchannel 11 is recessed toward the side opposite to the lower cover 102 to form a recessed portion; the lower cover 102 is provided with a protrusion 200, which contacts the bottom wall of the recessed portion to divide the recessed portion into the microchannel 11.

[0065] Specifically, both the upper cover 101 and the lower cover 102 are made of copper foil with a thickness of 0.1mm to 0.2mm. The upper cover 101 is stamped by a stamping process to form the recessed portion on the upper cover 101 at the position corresponding to the microchannel 11. The lower cover 102 is stamped by a stamping process to form the protrusion 200 on the lower cover 102 at the position corresponding to the recessed portion.

[0066] It should be noted that the protrusion 200 is used to form the sidewall of the microchannel 11; when the upper cover 101 and the lower cover 102 are fastened together, the protrusion 200 is inserted into the recess and contacts the bottom wall of the recess, thereby dividing and forming the microchannel 11 in the recess.

[0067] The upper cover 101 and the lower cover 102 are welded together by high-temperature diffusion welding process, applying 100 kg of pressure at a temperature of 850°C and maintaining the temperature for 3 hours, thereby forming a sealed cavity.

[0068] In one embodiment of this example, the thickness of both the upper cover 101 and the lower cover 102 is 0.2 mm.

[0069] Example 3

[0070] like Figure 7 and Figure 8 As shown, the upper cover 101 includes a first structural layer 1011 and a second structural layer 1012; through holes 100 are etched on the first structural layer 1011 according to the shape of the microchannel 11 (e.g., Figure 8 (as shown); the second structural layer 1012 is disposed on the first structural layer 1011 and blocks the through hole 100 from one side.

[0071] Specifically, the upper cover 101 is formed by combining the first structural layer 1011 and the second structural layer 1012; the first structural layer 1011 is located between the second structural layer 1012 and the lower cover 102. The through-hole 100 is etched into the first structural layer 1011 according to the shape of the microchannel 11. After the second structural layer 1012 is combined with the first structural layer 1011, the second structural layer 1012 can block the through-hole 100 from the side of the first structural layer 1011 away from the lower cover 102, thereby forming the microchannel 11. Finally, the first structural layer 1011 and the lower cover 102 are fastened together to obtain a sealed cavity, ultimately forming the liquid cooling plate 1.

[0072] In one embodiment of this invention, the first structural layer 1011 includes a PI (polyimide)-CU (copper) structural layer, meaning that the first structural layer 1011 is a functional composite laminate structure formed by coating copper onto the surface of a polyimide film. The second structural layer 1012 includes a CU (copper) structural layer; the lower cover 102 adopts a CU-PI structure, with a copper layer as the base material, and a polyimide insulating layer laminated on one side surface. The copper layer provides high thermal conductivity and structural support, while the PI layer provides high heat resistance and excellent electrical insulation properties, used to construct an integrated thermally conductive and insulating structure in a high-power-density electronic module.

[0073] The combination of the first structural layer 1011, the second structural layer 1012, and the lower cover 102 forms a sandwich structure. The second structural layer 1012 provides a heat conduction channel to the heat source above, with the copper layer conducting heat and the PI layer providing electrical insulation to prevent short circuits of the heat source. The second structural layer 1012 provides sufficient thickness for etching the through-hole 100 and combines with the first structural layer 1011 to form the microchannel 11, thereby obtaining the main channel carrier for the flow of the cooling medium liquid. The lower cover 102 serves as a structural sealing surface and also provides electrical insulation protection for the circuits or components below.

[0074] The sandwich structure of the second structural layer 1012, the first structural layer 1011, and the lower cover 102 allows the microchannel 11 to be located in the middle layer, with both upper and lower layers intact. This makes the structure of the liquid cooling plate 1 more stable and less prone to deformation or breakage. The microchannel 11 sandwiched in the middle can also distribute heat flow evenly, facilitating double-sided heat exchange. The copper layers at the top and bottom layers can quickly absorb heat and transfer it to the microchannel 11 in the middle layer, where the cooling medium carries the heat.

[0075] In one embodiment of this example, the thickness of the first structural layer 1011 is 0.6 mm; the thickness of the second structural layer 1012 is 0.2 mm, wherein the thickness of PI is 0.15 mm and the thickness of CU is 0.05 mm; the thickness of the lower cover 102 is 0.2 mm, wherein the thickness of PI is 0.15 mm and the thickness of CU is 0.05 mm.

[0076] The manufacturing method of the heat dissipation system for electronic devices is as follows:

[0077] S100, The microchannels are formed by etching on the upper cover;

[0078] Specifically, based on Embodiment 1, the microchannel 11 is obtained by etching directly on the side of the upper cover 101 facing the lower cover 102; that is, the microchannel 11 is obtained by etching directly on the single-layer structure of the upper cover 101. The thickness of the upper cover 101 is 0.8 mm, the thickness of the lower cover 102 is 0.2 mm, and the microchannel 11 is obtained by etching to a depth of 0.6 mm on the upper cover 101.

[0079] Based on Embodiment 3, the etching of the microchannels 11 on the upper cover 101 specifically includes:

[0080] S101. Etch through holes in the first structural layer according to the shape of the microchannels;

[0081] S102. The second structural layer is welded to one side of the first structural layer, and the second structural layer blocks the through hole to form the microchannel.

[0082] Specifically, the microchannel 11 is formed by a double-layer structure, which has higher manufacturing reliability and stability; the through hole 100 penetrates the first structural layer 1011, and the etching depth of the through hole 100 is controlled to be the thickness of the first structural layer 1011.

[0083] According to the shape and layout path of the microchannel 11, after etching the through hole 100 in the preset area of ​​the first structural layer 1011, the second structural layer 1012 is covered on the first structural layer 1011, so that the first structural layer 1011 and the second structural layer 1012 are closely attached, and the through hole 100 is blocked by the second structural layer 1012, thereby forming the microchannel 11.

[0084] S200. After fastening the lower cover onto the upper cover and blocking the opening of the microchannel, weld the lower cover and the upper cover together to obtain a liquid cooling plate with the microchannel.

[0085] Specifically, after the lower cover 102 is fastened to the upper cover 101 and blocks the opening of the microchannel 11, the upper cover 101 and the lower cover 102 are welded together using a diffusion welding process to form a sealed cavity.

[0086] The first structural layer 1011 and the lower cover 102 are bonded using a low-temperature diffusion welding process. The low-temperature diffusion welding equipment is used to weld the material at a constant temperature of 280°C for 5 hours to form a sealed cavity.

[0087] The microchannels 11 inside the liquid cooling plate 1 are filled with cooling medium using a degassing and filling device. After the cooling medium is filled, the injection port on the liquid cooling plate 1 (which is connected to the microchannels 11) is sealed using a super wave / resistance welding process to form an internal liquid circulation space.

[0088] S300. Install a circulation mechanism and a fan on the outside of the liquid cooling plate, and connect the circulation mechanism to the microchannel.

[0089] Specifically, the micropump 21, the fan 3, and the fin unit 4 are soldered on the outside of the liquid cooling plate 1 using a brazing process. Low-temperature solder paste is used for soldering, and the circulation mechanism 2 is connected to the microchannel 11.

[0090] In summary, this application provides a heat dissipation system for electronic devices, comprising: a liquid cooling plate; microchannels disposed within the liquid cooling plate for containing a cooling medium; a circulation mechanism disposed on the liquid cooling plate and communicating with the microchannels to circulate the cooling medium within the microchannels; and a fan disposed on the liquid cooling plate. The microchannels contain the cooling medium, and the circulation mechanism enables the cooling medium to circulate within the microchannels. As the cooling medium flows within the microchannels, it not only conducts heat but also carries away heat while conducting heat, thereby continuously removing heat transferred from the electronic device to the liquid cooling plate, achieving "flow transport" of heat. Simultaneously, the microchannels and the liquid cooling plate have a larger contact area, making it easier for heat transferred from the electronic device to the liquid cooling plate to be conducted to the cooling medium. Compared to passive heat dissipation in the prior art, the heat dissipation achieved by the circulation of the cooling medium within the microchannels is more active and faster. The fan, mounted on the liquid cooling plate, creates active air convection, significantly improving heat exchange efficiency compared to natural convection. Therefore, this application combines the active flow-type heat dissipation of the microchannels with the active air convection-type heat dissipation of the fan, ensuring continuous active heat transport and dissipation throughout the process, resulting in rapid response and a substantial improvement in heat dissipation efficiency.

[0091] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0092] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0093] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0094] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0095] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0096] Of course, the above description of the embodiments of this utility model is quite detailed, but it should not be construed as a limitation on the scope of protection of this utility model. This utility model may have other various implementations. Based on this implementation, other implementations obtained by those skilled in the art without any creative effort are all within the scope of protection of this utility model. The scope of protection of this utility model is subject to the appended claims.

Claims

1. A heat dissipation system for an electronic device, comprising: It includes: Liquid cooling plate; the liquid cooling plate is provided with microchannels, which are used to contain the cooling medium; A circulation mechanism is disposed on the liquid cooling plate and communicates with the microchannel to allow the cooling medium to circulate within the microchannel. A fan is mounted on the liquid cooling plate.

2. The heat dissipation system for electronic devices according to claim 1, characterized in that, The circulation mechanism includes: At least one micropump; the return port and outlet of the micropump are both connected to the microchannel.

3. The heat dissipation system for electronic devices according to claim 1, characterized in that, It also includes: The finned unit is disposed on the liquid cooling plate and close to the fan.

4. The heat dissipation system for electronic devices according to claim 3, characterized in that, The fin unit includes: The first mounting plate is detachably connected to the liquid cooling plate; The second mounting plate is arranged opposite to the first mounting plate; Multiple fins are arranged side by side between the first mounting plate and the second mounting plate, and are respectively connected to the first mounting plate and the second mounting plate.

5. The heat dissipation system for electronic devices according to claim 4, characterized in that, The fan's air outlet faces the finned unit, and the fins are parallel to the air outlet's airflow direction.

6. The heat dissipation system for electronic devices according to claim 1, characterized in that, The liquid cooling plate includes: Top cover; The lower cover is fastened to the upper cover to form a sealed cavity; the microchannel is located between the upper cover and the lower cover.

7. The heat dissipation system for electronic devices according to claim 6, characterized in that, The microchannels are etched on the side of the upper cover facing the lower cover.

8. The heat dissipation system for electronic devices according to claim 6, characterized in that, The portion of the upper cover corresponding to the microchannel is recessed towards the side opposite to the lower cover to form a recessed portion; the lower cover is provided with a protrusion, which contacts the bottom wall of the recessed portion to divide the recessed portion into the microchannel.

9. The heat dissipation system for electronic devices according to claim 6, characterized in that, The top cover includes: First structural layer; through holes are etched on the first structural layer according to the shape of the microchannel; A second structural layer is disposed on the first structural layer and blocks the through hole from one side.

10. The heat dissipation system for electronic devices according to claim 9, characterized in that, The first structural layer includes a PI-CU structural layer, and the second structural layer includes a CU structural layer.

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