Double-CCD simultaneous shooting and double-head simultaneous pasting structure
By employing a structural design that combines simultaneous dual-CCD imaging and dual-head bonding, along with a multi-axis moving mechanism and a negative pressure adsorption platform, the problem of low efficiency and insufficient precision in existing bonding structures is solved. This achieves efficient and precise bonding of reinforcing sheets, adapting to the bonding needs of different products.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN BANGZHENG PRECISION MACHINERY CO LTD
- Filing Date
- 2025-04-07
- Publication Date
- 2026-05-26
AI Technical Summary
Existing bonding structures have low bonding efficiency, making it difficult to meet the growing production demands, and their insufficient precision leads to a high product defect rate.
It adopts a structure design that allows for simultaneous imaging with dual CCDs and simultaneous bonding with dual heads. Combined with a multi-axis moving mechanism and a negative pressure adsorption platform, it achieves precise positioning and angle adjustment. The upper and lower CCD cameras work together and a multi-color ring aperture assists in recognition to ensure accurate bonding of the reinforcing sheet.
It significantly improves bonding efficiency, meets the needs of large-scale production, reduces product defect rate, adapts to bonding products of different sizes and shapes, and enhances the stability and continuity of the equipment.
Smart Images

Figure CN224290489U_ABST