A MOSFET bend pin forming device

Abstract

The utility model relates to the technical field of bent leg forming, disclose a kind of MOSFET bent leg forming device, including base and support frame, the inner wall of base is provided with clamping mechanism, another side of base upper end is provided with moving mechanism, the clamping mechanism includes two clamping blocks, the middle part of base upper end is equipped with first sliding slot, the front end of first sliding slot inner wall is rotatably connected with two-way threaded rod, the outer wall of two-way threaded rod is equipped with second threaded sleeve at both ends, two the upper end of second threaded sleeve is fixedly connected with first sliding block, two the upper end of first sliding block is fixedly connected with clamping block lower end.The utility model in, MOSFET body is placed in base upper end, starts first servo motor, drives two-way threaded rod rotation, makes first threaded sleeve, first sliding block and clamping block move, preliminarily clamps MOSFET, starts electric telescopic rod and drives pressing plate to descend, carries out secondary clamping, ensure stable and prevent MOSFET displacement or fall off in operation.

Description

Technical Field

[0001] This utility model relates to the field of bending lead forming technology, and in particular to a MOSFET bending lead forming device. Background Technology

[0002] MOSFET is an abbreviation for Metal-Oxide-Semiconductor Field-Effect Transistor, a semiconductor device widely used in electronic and power equipment. A MOSFET lead bending forming device is a specially designed mechanical device used to shape the leads of a MOSFET. Its main function is to bend the leads of the MOSFET into a specific shape to meet the needs of subsequent soldering or assembly.

[0003] Traditional MOSFET bending forming devices are usually of fixed size, which makes it inconvenient to clamp different types of MOSFETs. Furthermore, manual bending is difficult to control the bending force and angle, which can easily lead to excessive bending of the pins or incorrect bending angle.

[0004] Therefore, those skilled in the art have provided a MOSFET bending lead forming apparatus to solve the problems mentioned in the background art. Utility Model Content

[0005] The purpose of this utility model is to address the shortcomings of existing technologies by proposing a MOSFET bending forming device. The MOSFET body is placed on the upper end of the base. The first servo motor is started, which drives the bidirectional threaded rod to rotate. The first threaded sleeve, the first sliding block, and the clamping block move to initially clamp the MOSFET. The electric telescopic rod is started to drive the pressure plate to descend for secondary clamping, ensuring a stable fixation and preventing the MOSFET from shifting or falling off during operation. It can also adapt to MOSFETs of different sizes, improving the versatility of the equipment.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A MOSFET lead bending forming device includes a base and a support frame. The inner wall of the base is provided with a clamping mechanism, and the other side of the upper end of the base is provided with a moving mechanism. The clamping mechanism includes two clamping blocks. A first sliding groove is formed in the middle of the upper end of the base. A bidirectional threaded rod is rotatably connected to the front end of the inner wall of the first sliding groove. The two ends of the outer wall of the bidirectional threaded rod are fitted with second threaded sleeves. The upper ends of the two second threaded sleeves are fixedly connected with first sliding blocks. The upper ends of the two first sliding blocks are fixedly connected to the lower ends of the clamping blocks. A first servo motor is fixedly connected to the rear end of the inner wall of the first sliding groove. An electric telescopic rod is fixedly connected to the middle of the lower end of the support frame. A pressure plate is fixedly connected to the output end of the electric telescopic rod.

[0008] The above technical solution involves placing the MOSFET body on the top of the base, then starting the first servo motor via an external controller to rotate the bidirectional threaded rod. The second threaded sleeve moves accordingly, causing the first sliding block and clamping block to move and initially clamp the MOSFET body. The electric telescopic rod is then activated to lower the pressure plate and clamp the MOSFET body a second time, providing a stable fixation effect and preventing the MOSFET from shifting or falling off during operation. This solution can also accommodate MOSFETs of different sizes and specifications, improving the versatility of the equipment.

[0009] Furthermore, a fixing block is fixedly connected to one side of the upper end of the base, and mounting blocks are fixedly connected to both ends of one side of the upper end of the base. A second sliding groove is opened at one end of each mounting block near the center of the base. A threaded rod is rotatably connected to the top surface of the second sliding groove at the rear end. A second threaded sleeve is fitted on the outer wall of the threaded rod. A sliding rod is rotatably connected to the inner wall of the second sliding groove at the front end. A sliding ring is slidably connected to the outer wall of the sliding rod. A second sliding block is fixedly connected to one end of the second threaded sleeve and the sliding ring near the center of the base. A pressure plate is fixedly connected to adjacent second sliding blocks. A second servo motor is fixedly connected to the bottom surface of the second sliding groove at the rear end.

[0010] By using the above technical solution, the MOSFET pins are placed on the top of the fixed block. Then, the second servo motor is started by an external controller, which drives the threaded rod to rotate. The threaded sleeve and slip ring move accordingly, which in turn moves the second sliding block and pressure plate to bend the MOSFET pins. This avoids damage to the MOSFET pins or chips due to excessive bending or incorrect bending angle, shortens the bending time, and improves production efficiency.

[0011] Furthermore, the lower end of the support frame is fixedly connected to the middle of the upper end of the base;

[0012] The above technical solution makes the center of gravity of the entire device more stable, reducing swaying or instability caused by center of gravity shift.

[0013] Furthermore, the output end of the first servo motor is fixedly connected to the rear end of the bidirectional threaded rod;

[0014] The above technical solution directly reduces intermediate transmission links, lowers energy loss and mechanical wear during transmission, and improves transmission efficiency.

[0015] Furthermore, both of the first sliding blocks slide along the inner wall of the first groove;

[0016] The above technical solution avoids deviation or shaking during the movement, thus providing reliable guidance and positioning functions for the first sliding block and its connected clamping block.

[0017] Furthermore, the output end of the second servo motor is fixedly connected to the lower end of the threaded rod, and both second sliding blocks slide on the inner wall of the second groove;

[0018] Through the above technical solution, the cooperation between the threaded rod and the second sliding block can convert rotational motion into linear motion, thereby achieving precise displacement control.

[0019] Furthermore, both of the second sliding blocks slide along the inner wall of the second groove;

[0020] With the above technical solution, the second sliding block slides on the inner wall of the second groove, which can ensure the stability and smoothness of the movement process.

[0021] Furthermore, a MOSFET body is provided on the upper end of the base;

[0022] The above technical solutions facilitate operation and observation, and optimize space utilization.

[0023] This utility model has the following beneficial effects:

[0024] 1. This utility model proposes a MOSFET bending forming device. The MOSFET body is placed on the upper end of the base. Then, the first servo motor is started by the external controller, which drives the bidirectional threaded rod to rotate. The second threaded sleeve moves accordingly, which drives the first sliding block and the clamping block to move to initially clamp the MOSFET body. The electric telescopic rod is started to drive the pressure plate to descend and clamp the MOSFET body for a second time, providing a stable fixing effect and preventing the MOSFET from shifting or falling off during operation. At the same time, it can adapt to MOSFETs of different sizes and specifications, improve the versatility of the equipment, improve operating efficiency, and reduce labor costs.

[0025] 2. The MOSFET bending forming device proposed in this utility model places the MOSFET pins on the upper end of the fixed block, and then starts the second servo motor through the external controller to drive the threaded rod to rotate. The threaded sleeve and slip ring move accordingly, driving the second sliding block and pressure plate to move, and bending the MOSFET pins. This can avoid damage to the MOSFET pins or chips due to excessive bending or incorrect bending angle, shorten the bending time, and improve production efficiency. Attached Figure Description

[0026] Figure 1 This is an isometric view of a MOSFET lead bending forming device proposed in this utility model;

[0027] Figure 2 This is a schematic diagram of the structure of a MOSFET lead bending forming device proposed in this utility model;

[0028] Figure 3 This is a partial exploded view of a MOSFET lead bending forming device proposed in this utility model;

[0029] Figure 4 This is a partial structural diagram of a MOSFET lead bending forming device proposed in this utility model;

[0030] Figure 5 This is a partial view of a MOSFET bending lead forming device proposed in this utility model.

[0031] Legend:

[0032] 1. Clamping mechanism; 101. First slide groove; 102. Bidirectional threaded rod; 103. First threaded sleeve; 104. First sliding block; 105. Clamping block; 106. First servo motor; 107. Electric telescopic rod; 108. Pressure plate;

[0033] 2. Moving mechanism; 201. Fixed block; 202. Mounting block; 203. Second slide groove; 204. Threaded rod; 205. Second threaded sleeve; 206. Slide rod; 207. Slip ring; 208. Second sliding block; 209. Pressure block; 210. Second servo motor;

[0034] 3. Base; 4. Support frame; 5. MOSFET body. Detailed Implementation

[0035] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of specific embodiments. Obviously, the described specific embodiments are only a part of the specific embodiments of the present invention, and not all of them. Based on the specific embodiments of the present invention, all other specific embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0036] Reference Figure 1 , Figure 2 and Figure 3 The present invention provides a specific embodiment of a MOSFET bending forming device, comprising a base 3 and a support frame 4. A clamping mechanism 1 is provided on the inner wall of the base 3, and a moving mechanism 2 is provided on the other side of the upper end of the base 3. The clamping mechanism 1 includes two clamping blocks 105. A first sliding groove 101 is provided in the middle of the upper end of the base 3. A bidirectional threaded rod 102 is rotatably connected to the front end of the inner wall of the first sliding groove 101. A first threaded sleeve 103 is sleeved on both ends of the outer wall of the bidirectional threaded rod 102. A first sliding block 104 is fixedly connected to the upper end of each of the two first threaded sleeves 103. The upper ends of the two first sliding blocks 104 are fixedly connected to the lower end of the clamping block 105. A first servo motor 106 is fixedly connected to the rear end of the inner wall of the first sliding groove 101. An electric telescopic rod 107 is fixedly connected to the middle of the lower end of the support frame 4. A pressure plate 108 is fixedly connected to the output end of the electric telescopic rod 107.

[0037] The MOSFET body 5 is placed on the upper end of the base 3. Then, the first servo motor 106 is started by the external controller, which drives the bidirectional threaded rod 102 to rotate. The first threaded sleeve 103 moves accordingly, which drives the first sliding block 104 and the clamping block 105 to move and initially clamp the MOSFET body 5. The electric telescopic rod 107 is started to drive the pressure plate 108 to descend and clamp the MOSFET body 5 for a second time, providing a stable fixing effect and preventing the MOSFET from shifting or falling off during operation. At the same time, it can adapt to MOSFETs of different sizes and specifications, improving the versatility of the equipment.

[0038] Reference Figure 3 , Figure 4 and Figure 5A fixing block 201 is fixedly connected to one side of the upper end of the base 3. Mounting blocks 202 are fixedly connected to both ends of one side of the upper end of the base 3. A second sliding groove 203 is provided at one end of each mounting block 202 near the center of the base 3. A threaded rod 204 is rotatably connected to the top surface of the rear end of the second sliding groove 203. A second threaded sleeve 205 is fitted onto the outer wall of the threaded rod 204. A sliding rod 206 is rotatably connected to the inner wall of the front end of the second sliding groove 203. A sliding ring 207 is slidably connected to the outer wall of the sliding rod 206. A second sliding block 208 is fixedly connected to the end of the second threaded sleeve 205 and the sliding ring 207 near the center of the base 3. Adjacent second sliding blocks 208... The pressure plate 108 is fixedly connected to the 8. The second servo motor 210 is fixedly connected to the bottom surface of the second slide groove 203 at the rear end. The MOSFET pin is placed on the upper end of the fixed block 201. Then, the second servo motor 210 is started by the external controller, which drives the threaded rod 204 to rotate. The threaded sleeve and slip ring 207 move accordingly, which drives the second sliding block 208 and the pressure plate 108 to move. The MOSFET is bent, which can avoid damage to the MOSFET pin or chip due to excessive bending or incorrect bending angle, shorten the bending time, and improve production efficiency. The lower end of the support frame 4 is fixedly connected to the middle of the upper end of the base 3.

[0039] This makes the center of gravity of the entire device more stable, reducing swaying or instability caused by center of gravity shift. The output end of the first servo motor 106 is fixedly connected to the rear end of the bidirectional threaded rod 102. The direct connection reduces intermediate transmission links, reduces energy loss and mechanical wear during transmission, and improves transmission efficiency. Both first sliding blocks 104 slide on the inner wall of the first slide groove 101, avoiding offset or swaying during movement, thus providing reliable guidance and positioning functions for the first sliding block 104 and its connected clamping block 105. The output end of the second servo motor 210 is fixedly connected to the lower end of the threaded rod 204. Both second sliding blocks 208 slide on the inner wall of the second slide groove 203. The cooperation between the threaded rod 204 and the second sliding blocks 208 can convert rotational motion into linear motion, realizing precise displacement control. The sliding of the two second sliding blocks 208 on the inner wall of the second slide groove 203 ensures the stability and smoothness of movement. The upper end of the base 3 is equipped with a MOSFET body 5, which facilitates operation and observation and optimizes space utilization.

[0040] Working principle: The MOSFET body 5 is placed on the upper end of the base 3. Then, the first servo motor 106 is started by the external controller, which drives the bidirectional threaded rod 102 to rotate. The first threaded sleeve 103 moves accordingly, which drives the first sliding block 104 and the clamping block 105 to move and initially clamp the MOSFET body 5. The electric telescopic rod 107 is started to drive the pressure plate 108 to descend and clamp the MOSFET body 5 for a second time, providing a stable fixing effect and preventing the MOSFET from shifting or falling off during operation. At the same time, it can adapt to MOSFETs of different sizes and specifications, improving the versatility of the equipment. At this time, the MOSFET pins are placed on the upper end of the fixing block 201. Then, the second servo motor 210 is started by the external controller, which drives the threaded rod 204 to rotate. The second threaded sleeve 205 and the slip ring 207 move accordingly, which drives the second sliding block 208 and the pressure block 209 to move and bend the MOSFET pins. This can avoid damage to the MOSFET pins or chip due to excessive bending or incorrect bending angle, improve operating efficiency, and reduce labor costs.

[0041] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing specific embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A MOSFET lead bending forming device, comprising a base (3) and a support frame (4), characterized in that: The base (3) is provided with a clamping mechanism (1) on its inner wall, and a moving mechanism (2) is provided on the other side of the upper end of the base (3); The clamping mechanism (1) includes two clamping blocks (105). A first sliding groove (101) is provided in the middle of the upper end of the base (3). A bidirectional threaded rod (102) is rotatably connected to the front end of the inner wall of the first sliding groove (101). A first threaded sleeve (103) is sleeved on both ends of the outer wall of the bidirectional threaded rod (102). A first sliding block (104) is fixedly connected to the upper end of each of the two first threaded sleeves (103). The upper ends of the two first sliding blocks (104) are fixedly connected to the lower end of the clamping block (105). A first servo motor (106) is fixedly connected to the rear end of the inner wall of the first sliding groove (101). An electric telescopic rod (107) is fixedly connected to the middle of the lower end of the support frame (4). A pressure plate (108) is fixedly connected to the output end of the electric telescopic rod (107).

2. The MOSFET lead bending forming apparatus according to claim 1, characterized in that: A fixing block (201) is fixedly connected to one side of the upper end of the base (3). Mounting blocks (202) are fixedly connected to both ends of one side of the upper end of the base (3). A second sliding groove (203) is opened at one end of each mounting block (202) near the center of the base (3). A threaded rod (204) is rotatably connected to the top surface of the second sliding groove (203) at the rear end. A second threaded sleeve (205) is fitted on the outer wall of the threaded rod (204). A sliding rod (206) is rotatably connected to the inner wall of the second sliding groove (203) at the front end. A sliding ring (207) is slidably connected to the outer wall of the sliding rod (206). A second sliding block (208) is fixedly connected to one end of the second threaded sleeve (205) and the sliding ring (207) near the center of the base (3). A pressure block (209) is fixedly connected to the adjacent second sliding blocks (208). A second servo motor (210) is fixedly connected to the bottom surface of the second sliding groove (203) at the rear end.

3. The MOSFET lead bending forming apparatus according to claim 1, characterized in that: The lower end of the support frame (4) is fixedly connected to the middle part of the upper end of the base (3).

4. The MOSFET lead bending forming apparatus according to claim 1, characterized in that: The output end of the first servo motor (106) is fixedly connected to the rear end of the bidirectional threaded rod (102).

5. The MOSFET lead bending forming apparatus according to claim 1, characterized in that: Both of the first sliding blocks (104) slide on the inner wall of the first groove (101).

6. The MOSFET lead bending forming apparatus according to claim 2, characterized in that: The output end of the second servo motor (210) is fixedly connected to the lower end of the threaded rod (204).

7. The MOSFET lead bending forming apparatus according to claim 2, characterized in that: Both of the second sliding blocks (208) slide on the inner wall of the second groove (203).

8. The MOSFET lead bending forming apparatus according to claim 1, characterized in that: The base (3) has a MOSFET body (5) on its upper end.

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