Wafer polishing apparatus

Abstract

The utility model discloses a wafer grinding equipment, including several wafer racks, a drive arrangement, a grinding device, a front desk, a rear desk, a shift device and a control unit, wherein each wafer rack is respectively spaced through several positioning holes for positioning wafer, each wafer rack forms respectively for distinguishing each wafer rack's identification mark, the first positioning mark for identifying the configuration center of each positioning hole, the hole position mark for identifying each positioning hole, the utility model can shift multiple wafers in one time, and bind each wafer corresponding first configuration mark, identification mark and hole position mark, become the grinding record of being favorable to tracking each wafer's processing course.

Description

Technical Field

[0001] This utility model relates to a device component used in the wafer grinding process, and more particularly to a wafer grinding device. Background Technology

[0002] The wafer grinding equipment includes several wafer racks, a drive unit, a grinding unit, and a transfer unit. Each wafer rack is spaced apart on the drive unit along a circular path. The drive unit drives each wafer rack to circulate in a planetary manner along the circular path, and each wafer rack rotates around its radial center. Each wafer rack has several positioning holes, and each positioning hole is used to position a wafer. The grinding unit has two grinding discs, and each grinding disc grinds two surfaces of each wafer set on each wafer rack. Each surface is located on two opposite sides of the wafer in the thickness direction. The transfer unit is used to transfer each wafer to the positioning holes and, after the grinding process is completed, transfer each wafer away from the wafer rack.

[0003] The transfer device includes a pick-and-place unit, a processing unit, and a robotic arm. The pick-and-place unit is located at the working end of the robotic arm and includes a vacuum suction cup, a lifting mechanism, and an image capture device. The vacuum suction cup is used to attract and release wafers, the lifting mechanism is used to control the lifting and lowering of the vacuum suction cup, and the image capture device is used to capture images of the positioning holes. The processing unit is mainly composed of electronic circuits with microprocessors, which is used to run an image recognition program. The processing unit recognizes the images captured by the image capture device and controls the vacuum suction cup, the lifting mechanism, and the robotic arm based on the recognition results.

[0004] A vacuum chuck attracts the wafer to be ground, and then the robotic arm moves to move the pick-and-place unit above the pre-set positioning hole of the wafer. The image capture device captures the image of the positioning hole, and the processing unit identifies whether the wafer is vertically aligned with the positioning hole based on the image. The processing unit controls the robotic arm to move according to the deviation value between the wafer and the positioning hole, so that the wafer is aligned with the positioning hole. When the processing unit determines that the wafer is vertically aligned with the positioning hole, it controls the lifting mechanism to move the vacuum chuck to descend. When the wafer enters the positioning hole, the vacuum chuck releases the wafer and places the wafer in the selected positioning hole. The above operation is repeated to place multiple wafers one by one in different positioning holes.

[0005] After the grinding process is completed, the transfer device transfers the multiple ground wafers one by one. When each wafer is transferred away from the wafer holder, the transfer device also needs to perform image recognition and alignment so that the vacuum chuck can accurately align and attract the wafer, and the wafer can be transferred away from the wafer holder and placed in the set position for the next process.

[0006] Between two grinding operations, the grinding equipment requires a long wait for the transfer device to transfer multiple wafers to be ground to each wafer rack, and for multiple ground wafers to be transferred away. The overall efficiency of the wafer grinding equipment in performing the grinding process needs to be improved.

[0007] Each wafer needs to have its processing history recorded separately. The wafer grinding process not only needs to record the grinding time of the wafer, but also the wafer rack and positioning hole where the wafer is positioned. The transfer device cannot identify the wafer rack and positioning hole where each wafer is transferred and positioned, which is not conducive to tracking the processing history of each wafer. Utility Model Content

[0008] The main purpose of this utility model is to provide a wafer grinding device.

[0009] To achieve the aforementioned objectives, the present invention adopts the following technical solution.

[0010] A wafer grinding apparatus includes several wafer racks, a drive unit, a grinding unit, a front stage, a rear stage, a transfer unit, and a control unit. Each wafer rack is spaced apart from the drive unit, and each wafer rack has several positioning holes spaced apart. Each positioning hole is used to position a wafer, and the grinding unit is used to grind each wafer.

[0011] Each wafer rack forms an identification mark, which is used to distinguish and identify each wafer rack. Each wafer rack forms a first positioning mark, which is used to identify the configuration center of each positioning hole. Each wafer rack forms several hole position marks, which are adjacent to each positioning hole and are used to distinguish and identify each positioning hole.

[0012] The front stage, in conjunction with the number and arrangement of the positioning holes of each wafer rack, forms several first configuration structures and several first configuration marks at intervals, which are used to set the wafers to be ground. Each first configuration mark is used to distinguish and identify each first configuration structure. The front stage forms a second positioning mark, which is used to identify the configuration center of each first configuration structure.

[0013] The back stage, in conjunction with the number and arrangement of the positioning holes of each wafer rack, forms several second configuration structures at intervals for setting the polished wafers. The back stage forms a third positioning mark, which is used to identify the configuration center of each second configuration structure.

[0014] The transfer device includes a pick-and-place unit and a robotic arm. The pick-and-place unit is located at the working end of the robotic arm and includes an adjustment module, several lifters, several suction cup modules, and an image capture device. The adjustment module is connected to the robotic arm and has a drive-rotating mounting base. Each lifter is arranged at intervals around the rotation center of the mounting base on the radial outer periphery of the mounting base. Each lifter is connected to a suction cup module, which causes each lifter to move the suction cup module up and down to approach or move away from each wafer. Each suction cup module includes at least one vacuum suction cup for attracting and releasing wafers. The image capture device is connected to the adjustment module and is used to capture images.

[0015] The control unit is mainly composed of electronic circuits, including a programmable controller, a storage medium and a microprocessor. The programmable controller and the storage medium are electrically connected to the microprocessor. The programmable controller is electrically connected to the pick-and-place unit and the robotic arm. The storage medium is a read-and-write memory medium used to store the grinding records of each wafer. The microprocessor is electrically connected to the image capture device.

[0016] The microprocessor runs an image recognition program to recognize the image of the wafer rack captured by the image capture device, and controls the robotic arm and pick-and-place unit through a programmable controller based on the recognition results, thereby placing or removing multiple wafers at once. The microprocessor also binds each wafer and sets the first configuration mark, identification mark and hole mark for each wafer, thus creating multiple grinding records corresponding to each wafer.

[0017] Compared with the prior art, this invention can transfer multiple wafers onto a selected wafer rack at once. After the grinding process is completed, multiple wafers can be removed from the wafer rack at once, improving the overall efficiency of the grinding process. Furthermore, this invention can record the first configuration mark of the first configuration structure set for each wafer, the identification mark of the corresponding wafer rack, and the hole position mark of the corresponding positioning hole. Combined with the identification mark of each wafer, this forms a grinding record, which is beneficial for tracking the processing history of each wafer. Attached Figure Description

[0018] Figure 1 This is a three-dimensional schematic diagram of a portion of the structure of Embodiment 1 of this utility model.

[0019] Figure 2 This is a partial top view of Embodiment 1 of this utility model.

[0020] Figure 3 yes Figure 2 The enlarged view shows a portion of the first positioning mark and hole position mark.

[0021] Figure 4 yes Figure 2 The enlarged view shows a portion of the second positioning mark and the first configuration mark.

[0022] Figure 5 yes Figure 2 The enlarged view shows a portion of the third positioning mark and the second configuration mark.

[0023] Figure 6 This is a partial perspective view of Embodiment 1 of the present invention, showing another perspective of the pick-and-place unit.

[0024] Figure 7 This is a cross-sectional view of the pick-and-place unit of Embodiment 1 of this utility model.

[0025] Figure 8 This is a circuit block diagram of the transfer device according to Embodiment 1 of this utility model.

[0026] Figure 9 This is a flowchart of a method for picking up and placing multiple wafers according to Embodiment 1 of this utility model.

[0027] Figure 10 This is a three-dimensional schematic diagram of placing a wafer onto a wafer rack according to Embodiment 1 of this utility model.

[0028] Figure 11 This is a top view schematic diagram of the adjustment of the wafer alignment and positioning hole state according to Embodiment 1 of this utility model.

[0029] Figure 12 This is a three-dimensional schematic diagram of a portion of the structure of Embodiment 2 of this utility model, showing the robotic arm and the transfer device.

[0030] Figure 13 This is a partially enlarged top view of the wafer rack of Embodiment 3 of this utility model. Detailed Implementation

[0031] The figures illustrate embodiments of the present invention, but these embodiments are for illustrative purposes only and are not limited to this structure in patent applications.

[0032] like Figures 1 to 8As shown, the wafer polishing equipment includes several wafer racks 10, a drive device 20, a polishing device 30, a front stage 40, a rear stage 50, a transfer device 60, and a control unit 70. Each wafer rack 10 is spaced apart from the drive device 20, which drives each wafer rack 10 to circulate. Each wafer rack 10 rotates during circumferential operation. Each wafer rack 10 has several positioning holes 11 spaced apart. In this example, the positioning holes 11 are arranged at equal intervals. Each positioning hole 11 is used to position a wafer 90. The polishing device 30 polishes each wafer 90 positioned on each wafer rack 10. The drive device 20 and the polishing device 30 are well-known to those skilled in the art, and their technical features are not necessarily related to the present invention. Therefore, the specific configuration of the drive device 20 and the polishing device 30 will not be described in detail.

[0033] Each wafer rack 10 forms an identification mark 12, which is used to distinguish and identify each wafer rack 10. Each wafer rack 10 forms a first positioning mark 13, which is used to identify the configuration center of each positioning hole 11. In this example, each first positioning mark 13 is located at the radial center of each wafer rack 10. Each positioning hole 11 is configured around the first positioning mark 13. Each wafer rack 10 forms several hole position marks 14, which are adjacent to each positioning hole 11. Each hole position mark 14 is used to distinguish and identify each positioning hole 11.

[0034] The identification mark 12, the first positioning mark 13, and each hole mark 14 can be selected as numbers, text, graphics, or a combination thereof. Different wafer racks 10 have different identification marks 12. In this example, numbers are selected as identification marks 12. The first positioning mark 13 and the hole mark 14 are selected as holes that penetrate the wafer rack 10, and each hole mark 14 is selected as a hole with a different diameter.

[0035] The front stage 40, in accordance with the number and arrangement of the positioning holes 11 of each wafer rack 10, forms several first configuration structures 41 and several first configuration marks 42, which are used to set the wafers 90 to be ground. Each first configuration mark 42 is used to distinguish and identify each first configuration structure 41. The front stage 40 forms a second positioning mark 43, which is used to identify the configuration center of each first configuration structure 41.

[0036] The rear stage 50, in accordance with the number and arrangement of the positioning holes 11 of each wafer rack 10, forms several second configuration structures 51 at intervals for setting the polished wafers 90. The rear stage 50 forms a third positioning mark 53, which is used to identify the configuration center of each second configuration structure 51.

[0037] The transfer device 60 is used to transfer each wafer 90 between the front stage 40, the wafer rack 10 and the rear stage 50. It includes a pick-and-place unit 61 and a robotic arm 62. The pick-and-place unit 61 is located at the working end 63 of the robotic arm 62. The robotic arm 62 is used to actuate the pick-and-place unit 61 to approach or move away from a selected wafer rack 10.

[0038] The pick-and-place unit 61 includes an adjustment module 64, several lifters 65, several suction cup modules 66, and an image capture device 67. The adjustment module 64 is connected to the robotic arm 62 and has a driven rotating mounting base 642. Each lifter 65 is arranged at intervals around the rotation center of the mounting base 642 on the radial outer periphery of the mounting base 642. Each lifter 65 is connected to each suction cup module 66, so that each lifter 65 actuates each suction cup module 66 to move up and down, approaching or moving away from each wafer 90. Each suction cup module 66 includes three vacuum suction cups 662 for attracting and releasing wafers 90. The number of vacuum suction cups 662 constituting the suction cup module 66 can be increased or decreased as needed, but is limited to one vacuum suction cup 662 per suction cup module 66.

[0039] Image capture unit 67 is connected to adjustment module 64 and is used to capture images of wafer rack 10, front stage 40 and rear stage 50. In this example, a camera lens with a photosensitive element (not shown) is selected as image capture unit 67. Specific examples of photosensitive elements include charge-coupled device (CCD) and complementary metal-oxide-semiconductor (CMOS).

[0040] The control unit 70 is mainly composed of electronic circuits. The control unit 70 can be selectively set at an appropriate position in the wafer polishing equipment. It includes a programmable controller 71, a storage medium 72 and a microprocessor 73. The programmable controller 71 and the storage medium 72 are electrically connected to the microprocessor 73. The programmable controller 71 is electrically connected to the pick-and-place unit 61 and the robotic arm 62. The storage medium 72 is a read-and-write memory medium used to store the polishing records of each wafer 90. The microprocessor 73 is electrically connected to the image capture unit 67.

[0041] The microprocessor 73 runs an image recognition program to recognize the image captured by the image capturer 67, and controls the robotic arm 62 and the pick-and-place unit 61 through the programmable controller 71 based on the recognition results, so as to place multiple wafers 90 to be ground into the selected wafer rack 10 at one time, and remove multiple wafers 90 that have been ground from the selected wafer rack 10 at one time. The microprocessor 73 binds each wafer 90 and sets the first configuration mark 42, identification mark 12 and hole position mark 14 for each wafer 90, thus forming multiple grinding records corresponding to each wafer 90.

[0042] like Figures 9 to 11 As shown, the method for picking up and placing multiple wafers using the aforementioned wafer grinding equipment includes the following steps.

[0043] The pick-and-place unit picks up the wafers: The robotic arm 62 pulls the pick-and-place unit 61 to the space above the front stage 40. Based on the image captured by the image capture device 67 of the front stage 40, the control unit 70 controls the transfer device 60 to calibrate the alignment of each suction cup module 66 with the pre-configured wafers 90 to be ground in each first configuration structure 41. The microprocessor 73 records the first configuration mark 42 corresponding to each wafer 90. Then, the control unit 70 controls each vacuum suction cup 662 of each suction cup module 66 to attract the corresponding wafer 90. The control unit 70 records the first configuration mark 42 corresponding to each wafer 90.

[0044] The alignment process of the transfer device 60 with each suction cup module 66 relative to each wafer 90 mainly involves the transfer device 60 moving so that the center of the pick-and-place unit 61 is aligned with the second positioning mark 43. Then, the control unit 70 controls the adjustment module 64 based on the difference in alignment between each wafer 90 and each suction cup module 66, so that the setting seat 642 rotates or does not rotate, so that each suction cup module 66 is aligned with each wafer 90.

[0045] Alignment of the pick-and-place unit with the wafer rack: The robotic arm 62 moves the pick-and-place unit 61 to the space above the selected wafer rack 10. The image capture unit 67 captures the identification mark 12 of the wafer rack 10. The microprocessor 73 runs an image recognition program to identify and record the wafer rack 10 where each wafer 90 is placed. The image capture unit 67 captures the image of the first positioning mark 13 of the wafer rack 10. The microprocessor 73 identifies the first positioning mark 13 and calculates the axial distance deviation between the pick-and-place unit 61 and the first positioning mark 13. Then, the control unit 70 controls the robotic arm 62 to move or not move to compensate for the distance deviation. The pick-and-place unit 61 and the first positioning mark 13 are aligned vertically. The image capture unit 67 captures the images of each positioning hole 11 of the wafer rack 10. The microprocessor 73 recognizes the images of the shape and corresponding hole position marks 14, calculates the angular deviation value between each positioning hole 11 and each suction cup module 66 with the first positioning mark 13 as the center, and then the control unit 70 controls the adjustment module 64 to rotate or not rotate the setting seat 642 to compensate for the angular deviation value. Each suction cup module 66 is vertically aligned with each positioning hole 11. Accordingly, the control unit 70 can control the transfer device 60 to calibrate the alignment of each suction cup module 66 with each positioning hole 11 based on the image of the wafer frame 10 captured by the image capture device 67. The control unit 70 records the identification mark 12 of the wafer frame 10 and the hole position marks 14 of each positioning hole 11 corresponding to each wafer 90.

[0046] The wafer placement unit places wafers: The control unit 70 controls each suction cup module 66 to release each wafer 90 into each positioning hole 11, thereby placing one wafer 90 in each positioning hole 11 of each wafer holder 10, thereby causing the drive device 20 and the polishing device 30 to run and complete the polishing process of each wafer 90.

[0047] By repeating the aforementioned steps of picking up wafers by the pick-up and placement unit, aligning the pick-up and placement unit with the wafer holder, and placing the wafers by the pick-up and placement unit, the wafers 90 to be polished can be placed in the positioning holes 11 of each wafer holder 10 in a multi-wafer placement manner. Accordingly, the drive device 20 and the polishing device 30 can be operated to complete the polishing process of each wafer 90.

[0048] Wafer alignment by pick-and-place unit: After the grinding process is completed, the robotic arm 62 pulls the pick-and-place unit 61 to move to the space above the selected wafer rack 10. Based on the image of the wafer rack 10 captured by the image capture device, the control unit 70 controls the transfer device 60 to calibrate the alignment of each suction cup module 66 with each wafer 90 that has been ground on each wafer rack 10. The control unit 70 records the identification mark 12 of the wafer rack 10 and the hole position mark 14 of each positioning hole 11 corresponding to each wafer 90.

[0049] The transfer device transfers wafers: each suction cup module 66 attracts each wafer 90, and then each suction cup module 66 drives each wafer 90 to rise away from the wafer rack 10. Then, the robotic arm 62 pulls the pick-and-place unit 61 to move above the rear stage 50. Based on the result of the image captured by the image capture device 67, the control unit 70 controls the transfer device 60 to calibrate the positioning of each suction cup module 66 relative to each second configuration structure 51, and the pick-and-place unit 61 releases each polished wafer 90 to each second configuration structure 51 of the rear stage 50.

[0050] Storing polishing records: The microprocessor 73 binds the identification identifier of each wafer 90, sets the first configuration mark 42, identification mark 12 and hole mark 14 of each wafer 90 accordingly, and forms multiple polishing records corresponding to each wafer 90. The storage medium 72 stores each polishing record.

[0051] The transfer device 60 can transfer multiple wafers 90 arranged on the front stage 40 to the selected wafer rack 10 at one time. After the grinding device 30 completes the grinding process, the transfer device 60 can remove multiple wafers 90 from the wafer rack 10 at one time and transfer them to the rear stage 50. In this way, the time spent on placing and removing wafers 90 is shortened, and the overall efficiency of the wafer grinding equipment in performing the grinding process is improved.

[0052] During the process of placing each wafer 90 on the selected wafer rack 10 and removing each wafer 90 from the wafer rack 10, the transfer device 60 can identify the first configuration structure 41, wafer rack 10 and positioning hole 11 respectively configured for each wafer 90, record the first configuration mark 42 of the first configuration structure 41 set for each wafer 90, the identification mark 12 corresponding to the wafer rack 10 and the hole position mark 14 corresponding to the positioning hole 11, and bind and combine them with the identification identifier of each wafer 90 to form a grinding record stored in the storage medium 72, which is beneficial for tracking the processing process of each wafer 90.

[0053] Furthermore, the rear stage 50 forms several second configuration marks 52, each second configuration mark 52 being used to distinguish and identify each second configuration structure 51.

[0054] In the wafer transfer step of the pick-and-place unit, the control unit 70 records the second configuration mark 52 of each second configuration structure 51 corresponding to each wafer 90, and the microprocessor 73 further binds the second configuration mark 52 for identifying the second configuration structure 51 set on each wafer 90, which becomes a grinding record corresponding to each wafer 90.

[0055] Each suction cup module 66 further includes a positioning frame 664, each vacuum suction cup 662 is respectively set in the positioning frame 664, and each lifting device 65 is mainly composed of a pneumatic cylinder 652. The piston rod 654 of each pneumatic cylinder 652 reciprocates axially in the up and down direction. Each piston rod 654 is connected to the corresponding positioning frame 664, thereby causing each suction cup module 66 to move up and down.

[0056] like Figure 12 As shown, the main difference between Embodiment 2 and Embodiment 1 is that the shape of the robotic arm 62 is different.

[0057] like Figure 13 As shown, the main difference between Embodiment 3 and Embodiment 1 is that each hole position mark 14 represents a hole of a different shape.

Claims

1. A wafer grinding device, characterized in that... It includes several wafer racks, a drive unit, a grinding unit, a front stage, a rear stage, a transfer unit, and a control unit. Each wafer rack is spaced apart from the drive unit, and each wafer rack has several positioning holes spaced apart. Each positioning hole is used to position a wafer. The grinding unit is used to grind each wafer. Each wafer rack forms an identification mark, which is used to distinguish and identify each wafer rack. Each wafer rack forms a first positioning mark, which is used to identify the configuration center of each positioning hole. Each wafer rack forms several hole position marks, which are adjacent to each positioning hole and are used to distinguish and identify each positioning hole. The front stage, in conjunction with the number and arrangement of the positioning holes of each wafer rack, forms several first configuration structures and several first configuration marks at intervals for setting the wafers to be ground. Each first configuration mark is used to distinguish and identify each first configuration structure. The front stage forms a second positioning mark, which is used to identify the configuration center of each first configuration structure. The back stage, in conjunction with the number and arrangement of the positioning holes of each wafer rack, forms several second configuration structures at intervals for setting the polished wafers. The back stage forms a third positioning mark, which is used to identify the configuration center of each second configuration structure. The transfer device includes a pick-and-place unit and a robotic arm. The pick-and-place unit is located at the working end of the robotic arm and includes an adjustment module, several lifters, several suction cup modules, and an image capture device. The adjustment module is connected to the robotic arm and has a rotating mounting base. Each lifter is arranged at intervals around the rotation center of the mounting base on the radial outer periphery of the mounting base. Each lifter is connected to a suction cup module, which causes each lifter to move the suction cup module up and down to approach or move away from each wafer. Each suction cup module includes at least one vacuum suction cup for attracting and releasing wafers. The image capture device is connected to the adjustment module and is used to capture images. The control unit is mainly composed of electronic circuits, including a programmable controller, a storage medium and a microprocessor. The programmable controller and the storage medium are electrically connected to the microprocessor. The programmable controller is electrically connected to the pick-and-place unit and the robotic arm. The storage medium is a read-and-write memory medium used to store the grinding records of each wafer. The microprocessor is electrically connected to the image capture device.

2. The wafer grinding equipment according to claim 1, characterized in that... The rear stage forms several second configuration markers, each of which is used to distinguish and identify the second configuration structure. The microprocessor binds to each wafer and sets a first configuration mark, identification mark, hole mark and second configuration mark for each wafer, which become multiple grinding records corresponding to each wafer.

Images