A chip collecting device

Abstract

The utility model relates to a kind of chip collection devices, including chip collection box, vacuum generator and three-stage pipeline system, vacuum generator has upper interface, negative pressure interface and lower interface, upper interface is connected external gas source by gas supply pipeline, negative pressure interface is connected by negative pressure pipeline punch cutter bar chip removal passage, lower interface is connected chip collection box by chip removal pipeline, when gas source is supplied to the upper interface of vacuum generator, waste chip is sequentially directed and discharged into chip collection box by chip removal passage, negative pressure pipeline, vacuum generator, chip removal pipeline.The utility model prolongs the chip removal path, effectively solves the sharp and piercing noise problem generated in traditional scheme due to the high speed of waste chip flow, direct impact chip collection box.

Description

Technical Field

[0001] This utility model relates to the field of leather processing technology, and in particular to a chip collection device. Background Technology

[0002] Currently, most CNC cutting systems in the footwear industry, which rely on vibrating blades to cut materials, utilize cutting heads with CNC feed capabilities to cut specified patterns onto the material. As the industry has evolved, some advanced products now include marking and punching functions, eliminating the need for separate marking and punching equipment. However, these products have relatively simple structures, with different functional modules simply arranged horizontally during assembly, resulting in larger dimensions. While this structure is superior to traditional die-cutting solutions in the flexible material cutting industry, simplifying the process, it faces limitations due to insufficient understanding and technological constraints.

[0003] Patent CN202110404287.4 discloses a machining method for a CNC multi-functional integrated tool holder. The method includes a lifting assembly, a mounting base, a steering shaft assembly, a pneumatic tool holder, a confluence assembly, a leveling assembly, a punching assembly, and a chip collection assembly. The lower end of the lifting assembly is connected to the mounting base. The steering shaft assembly, confluence assembly, leveling assembly, and punching assembly are all mounted on the mounting base. The pneumatic tool holder is sleeved on the steering shaft assembly. The chip collection assembly is connected to the punching assembly via an air pipe. This invention can perform cutting, marking, and punching operations. The chip collection channel and chip collection assembly collect and clean the waste material from the punching process, preventing waste from scattering into the working area.

[0004] In the aforementioned patent, the short-path design of the vacuum generator directly connecting to the chip collection box results in high industrial noise generated by the high-pressure airflow directly impacting the box. Based on this problem, the structure of the chip collection device needs to be improved. Utility Model Content

[0005] The purpose of this invention is to overcome the shortcomings and deficiencies of the existing technology and to provide a chip collection device.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a chip collection device, comprising a chip collection box, a vacuum generator, and a three-stage pipeline system. The vacuum generator has an upper interface, a negative pressure interface, and a lower interface. The upper interface is connected to an external air source via an air supply pipeline. The negative pressure interface is connected to the chip removal channel of the punch rod via a negative pressure pipeline. The lower interface is connected to the chip collection box via a chip removal pipeline. When the air source supplies air to the upper interface of the vacuum generator, the waste chips are sequentially discharged into the chip collection box via the chip removal channel, the negative pressure pipeline, the vacuum generator, and the chip removal pipeline.

[0007] As a preferred embodiment of this utility model, the vacuum generator includes an upper cover and a base. The lower end of the upper cover is integrally formed or fixedly connected to a Laval nozzle, which is connected to an upper interface. The base is provided with a receiving cavity extending coaxially with the Laval nozzle and a horizontally arranged negative pressure cavity. The axis of the negative pressure cavity intersects the receiving cavity perpendicularly. The Laval nozzle extends into the receiving cavity, and the negative pressure interface is coaxially connected to the negative pressure cavity.

[0008] As a preferred embodiment of this utility model, the Laval nozzle protrudes from the lower end face of the upper cover, and the Laval nozzle is inserted into the inlet of the receiving cavity.

[0009] As a preferred embodiment of this utility model, the vacuum generator is symmetrically arranged with two working units, each unit including: an independent upper interface and a Laval nozzle; an independent negative pressure interface and a negative pressure chamber; and an independent lower interface; wherein the two negative pressure interfaces are respectively connected to the chip removal channels of different punch rods.

[0010] As a preferred technical solution of this utility model, the chip collection box includes: a chip collection base with a guide rail at the bottom; and a chip collection drawer with sliding plates on both sides that match the guide rail, which are installed in the chip collection base by sliding fit.

[0011] Compared with existing technologies, the advantages of this invention are: it abandons the traditional solution of "direct connection or short path connection of the vacuum generator lower interface to the chip collection box" and creatively introduces an extended chip discharge pipeline. This pipeline forms an effective buffer channel between the vacuum generator lower interface and the chip collection box inlet. When the high-speed discharged waste chip flow passes through this extended pipeline: the path is extended, and kinetic energy is dissipated: the waste chip collides and rubs against the pipe wall multiple times, and its kinetic energy is effectively dissipated, and the flow velocity is significantly reduced; direct high-speed impact is avoided: when the waste chip finally enters the chip collection box, its velocity has been significantly reduced, which greatly weakens the high-speed, high-frequency, hard "slapping" effect of the waste chip flow on the inner wall of the chip collection box (especially the bottom). While maintaining efficient waste chip collection capacity, it specifically and effectively solves the problem of sharp and ear-piercing noise caused by the high-speed and direct impact of the waste chip flow on the chip collection box in traditional solutions. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the chip collection device of this utility model installed on the tool holder assembly;

[0013] Figure 2 This is a schematic diagram of the chip collection device of this utility model installed on the tool holder assembly;

[0014] Figure 3 This is a schematic diagram of the vacuum generator in this utility model;

[0015] Figure 4This is a schematic diagram of the structure of the vacuum generator cover in this utility model;

[0016] Figure 5 This is a schematic diagram of the structure of the vacuum generator base in this utility model;

[0017] Figure 6 This is a cross-sectional view of the vacuum generator in this utility model.

[0018] Reference numerals in the attached diagram: 1. Chip collection box; 2. Vacuum generator; 3. Upper interface; 4. Negative pressure interface; 5. Lower interface; 6. Negative pressure pipeline; 7. Chip discharge pipeline; 8. Top cover; 9. Base; 10. Laval nozzle; 11. Receiving chamber; 12. Negative pressure chamber; 13. Chip collection base; 14. Slide rail; 15. Chip collection drawer; 16. Slide plate. Detailed Implementation

[0019] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0020] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," and "connected," etc., should be interpreted broadly. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0021] like Figure 1-6 The chip collection device shown includes a chip collection box 1, a vacuum generator 2, and a three-stage pipeline system. The vacuum generator 2 has an upper interface 3, a negative pressure interface 4, and a lower interface 5. The upper interface 3 is connected to an external air source through an air supply pipeline. The negative pressure interface 4 is connected to the chip removal channel of the punch rod through a negative pressure pipeline 6. The lower interface 5 is connected to the chip collection box 1 through a chip removal pipeline 7. When the air source supplies air to the upper interface 3 of the vacuum generator 2, the waste chips are sequentially discharged into the chip collection box 1 through the chip removal channel, the negative pressure pipeline 6, the vacuum generator 2, and the chip removal pipeline 7. This application does not involve any improvement to the air source control principle of the vacuum generator 2. Regarding when to control the air source entry and the control of the air source flow rate, this is prior art and therefore not specifically described. In this application, the chip collection device moves with the tool holder assembly, and the tool holder assembly is controlled by a moving unit (this is prior art and not specifically described in this application), which can receive waste chips in real time.

[0022] This application abandons the traditional scheme of "direct connection or short path connection between the lower interface 5 of the vacuum generator 2 and the chip collection box 1", and creatively introduces an extended chip discharge pipe 7. This pipe forms an effective buffer channel between the lower interface 5 of the vacuum generator 2 and the inlet of the chip collection box 1. When the high-speed discharged waste chip flow passes through this extended pipe: the path is extended, and kinetic energy is dissipated: the waste chip collides and rubs against the pipe wall multiple times, and its kinetic energy is effectively dissipated, and the flow velocity is significantly reduced; direct high-speed impact is avoided: when the waste chip finally enters the chip collection box 1, its velocity has been significantly reduced, which greatly weakens the high-speed, high-frequency, hard "slapping" effect of the waste chip flow on the inner wall (especially the bottom) of the chip collection box 1. While maintaining the efficient waste chip collection capacity, it specifically and effectively solves the problem of sharp and piercing noise caused by the high-speed and direct impact of the waste chip flow on the chip collection box 1 in the traditional scheme.

[0023] The vacuum generator 2 includes an upper cover 8 and a base 9. The lower end of the upper cover 8 is integrally formed or fixedly connected to a Laval nozzle 10, which communicates with the upper interface 3. The base 9 is provided with a receiving cavity 11 and a negative pressure cavity 12 that extend coaxially with the Laval nozzle 10. The axis of the negative pressure cavity 12 intersects the receiving cavity 11 perpendicularly. The Laval nozzle 10 extends into the receiving cavity 11, and the negative pressure interface 4 communicates coaxially with the negative pressure cavity 12. In this embodiment, the Laval nozzle 10 protrudes from the lower end face of the upper cover 8, and the Laval nozzle 10 is inserted into the inlet of the receiving cavity.

[0024] The vacuum generator 2 adopts a split design with a top cover 8 and a base 9. The Laval nozzle 10 (fixed to the top cover 8) is inserted into the receiving chamber 11 of the base 9 to ensure precise alignment and smooth airflow. The structure of the negative pressure chamber 12 intersecting the receiving chamber 11 perpendicularly optimizes the negative pressure generation area, enabling the negative pressure interface 4 to more efficiently suck up waste. This structural design improves the generator's pneumatic efficiency and operational stability.

[0025] The vacuum generator 2 is symmetrically arranged with two working units. Each unit includes: an independent upper interface 3 and a Laval nozzle 10; an independent negative pressure interface 4 and a negative pressure chamber 12; and an independent lower interface 5. The two negative pressure interfaces 4 are respectively connected to the chip removal channels of different punch rods.

[0026] The chip collection box 1 includes: a chip collection base 13 with a slide rail 14 with a guide groove at the bottom; and a chip collection drawer 15 with sliding plates 16 on both sides that match the guide groove, which are installed in the chip collection base 13 by sliding fit.

[0027] The system employs a modular design with a fixed chip collection base 13 and a sliding chip collection drawer 15. Slide plates 16 are located on both sides of the drawer, matching the guide rails 14 at the bottom of the base. To clean up the chips, simply pull the chip collection drawer 15 smoothly out of the chip collection base 13 along the rails 14, empty the chips, and push it back in. This design eliminates the need for complete disassembly, making maintenance extremely simple and quick, effectively reducing equipment downtime, and conforming to ergonomic principles.

[0028] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples of this utility model and are not intended to limit it. Various changes and modifications can be made to this utility model without departing from its spirit and scope. All such changes and modifications fall within the scope of protection of this utility model as defined by the appended claims and their equivalents.

Claims

1. A chip collection device, comprising a chip collection box (1), a vacuum generator (2), and a three-stage pipeline system, characterized in that: The vacuum generator (2) has an upper interface (3), a negative pressure interface (4) and a lower interface (5). The upper interface (3) is connected to an external air source through an air supply pipeline. The negative pressure interface (4) is connected to the chip removal channel of the punch rod through a negative pressure pipeline (6). The lower interface (5) is connected to the chip collection box (1) through a chip removal pipeline (7). When the air source supplies air to the upper interface (3) of the vacuum generator (2), the waste chips are sequentially discharged into the chip collection box (1) through the chip removal channel, the negative pressure pipeline (6), the vacuum generator (2), and the chip removal pipeline (7).

2. The chip collecting device according to claim 1, characterized in that: The vacuum generator (2) includes an upper cover (8) and a base (9). The lower end of the upper cover (8) is integrally formed or fixedly connected to a Laval nozzle (10), which is connected to the upper interface (3). The base (9) is provided with a receiving cavity (11) and a negative pressure cavity (12) extending coaxially with the Laval nozzle (10). The axis of the negative pressure cavity (12) intersects perpendicularly with the receiving cavity (11). The Laval nozzle (10) extends into the receiving cavity (11), and the negative pressure interface (4) is coaxially connected with the negative pressure cavity (12).

3. The chip collecting device according to claim 2, characterized in that: The Laval nozzle (10) protrudes from the lower end face of the upper cover (8), and the Laval nozzle (10) is inserted into the inlet of the receiving cavity.

4. The chip collecting device according to claim 2, characterized in that: The vacuum generator (2) is symmetrically arranged with two working units. Each unit includes: an independent upper interface (3) and a Laval nozzle (10); an independent negative pressure interface (4) and a negative pressure chamber (12); and an independent lower interface (5). The two negative pressure interfaces (4) are respectively connected to the chip removal channels of different punch rods.

5. The chip collecting device according to claim 1, characterized in that: The chip collection box (1) includes: a chip collection base (13): a slide rail (14) with a guide groove at the bottom; and a chip collection drawer (15): sliding plates (16) on both sides that match the guide groove, which are installed in the chip collection base (13) by sliding fit.

Images