An electronic component pin polishing machine

Abstract

The utility model discloses an electronic component pin polishing machine relates to electronic component pin processing technical field, including support and polishing bin, the surface fixed connection of support has PLC controller, the surface of polishing bin is provided with support mechanism, the bottom surface fixed connection of support has two vibration components, the surface fixed connection of polishing bin has two vibration motor, through water pump cooperation drainage tube pumps into the polishing bin in polishing liquid, makes the pin to receive the corrosion of polishing liquid, removes surface oxide, realizes chemical polishing, starts through the PLC controller control two vibration motor, drives the polishing bin vibration through two vibration motor, and the spring of polishing bin is connected through the side plate and support plate and will amplify the vibration frequency of polishing bin, makes the pin to be in the active state, and the polishing bin of vibrating will agitate the polishing liquid in the inside and make it and the pin fully contact, and the impurity of active polishing liquid can take away the surface corrosion, solved the polishing effect of current chemical polishing device is poor.

Description

Technical Field

[0001] This utility model relates to the field of electronic component pin processing technology, and in particular to an electronic component pin polishing machine. Background Technology

[0002] In the field of electronic equipment manufacturing, electronic components are the basic building blocks, and their quality directly affects the overall performance and reliability of the equipment. As the key part connecting electronic components to external circuits, the surface condition of the pins is crucial, including polishing the electronic component pins, which requires electronic component pin polishing equipment.

[0003] Currently, most existing electronic component pin polishing devices achieve their effects using the following techniques;

[0004] Mechanical polishing technology relies on physical friction to remove surface defects from leads. Examples include polishing wheel polishing, which uses a high-speed rotating polishing wheel and abrasive to grind the leads; vibratory polishing, which uses vibration to cause friction between the leads and the polishing medium; and tumble polishing, which involves tumbling the leads in a tumbler filled with polishing medium. These techniques are highly efficient, but less effective for complex shapes or tiny leads.

[0005] Chemical polishing technology involves immersing the leads in a chemical polishing solution, where a chemical reaction dissolves the oxide layer and impurities. This method can handle leads with complex shapes and produces a uniform surface. However, the polishing solution is highly corrosive, requires sophisticated equipment, has high wastewater treatment costs, and poses environmental concerns.

[0006] Magnetic polishing technology: This technology uses a magnetic field to drive a magnetic polishing medium, uniformly polishing leads in a non-contact manner. It features intelligent parameter adjustment, making it suitable for complex lead shapes, improving surface quality and performance, and reducing damage caused by traditional polishing methods.

[0007] Chemical mechanical polishing (CMP) technology combines chemical etching and mechanical grinding. It uses the chemical action of polishing fluid to first oxidize the pin surface, and then removes the oxide film through abrasive particles and polishing pads to achieve high-precision planarization polishing. It is commonly used in integrated circuit manufacturing, but the equipment is complex and expensive.

[0008] Currently, existing polishing devices have been found to have at least the following technical problems in actual use;

[0009] Most existing chemical polishing devices place the pins in a container filled with polishing liquid, which then chemically etches the pins. However, most existing chemical polishing devices do not have a mechanism to flip or move the pins. The pins are piled up at the bottom of the container and are in contact with each other. These contact points may not be in contact with the polishing liquid, resulting in incomplete polishing of the pin surface and poor polishing effect. Utility Model Content

[0010] To address the shortcomings of existing technologies, this invention provides an electronic component pin polishing machine, which solves the problem of poor polishing effect of existing chemical polishing devices.

[0011] To achieve the above objectives, this utility model provides the following technical solution:

[0012] An electronic component pin polishing machine includes a support and a polishing chamber. A PLC controller is fixedly connected to the surface of the support, and a support mechanism is provided on the surface of the polishing chamber. Two vibration components are fixedly connected to the bottom surface of the support, and two vibration motors are fixedly connected to the surface of the polishing chamber. The vibration components include an L-shaped plate, six springs are fixedly connected to the side of the L-shaped plate near the polishing chamber, and four springs are fixedly connected to the inner bottom surface of the L-shaped plate. The support mechanism includes a side plate and a support plate.

[0013] Preferably, the surface of the bracket has a round hole, and the polishing chamber is fitted inside the round hole.

[0014] Preferably, a water pump is fixedly connected to the top surface of the bracket, a diversion pipe is fixedly connected to the water inlet of the water pump, a guide pipe is fixedly connected to the water outlet of the water pump, the end of the guide pipe away from the water pump is fixedly connected to the polishing chamber, the guide pipe is flexible and has a certain amount of movement allowance at the top of the bracket.

[0015] Preferably, the top of the polishing chamber is hinged with a cover plate, and a discharge hopper is fixedly connected to the bottom of the polishing chamber via a damping bearing. A solenoid valve is fixedly installed in the middle section of the discharge hopper.

[0016] Preferably, there are two side plates, both of which are fixedly connected to the side wall of the polishing chamber.

[0017] Preferably, there are two support plates, both of which are fixedly connected to the bottom surface of the polishing chamber.

[0018] Preferably, both L-shaped plates are fixedly connected to the bracket, and the two vibration components are symmetrically arranged with the circular hole on the top surface of the bracket as the axis.

[0019] Preferably, the side plate is fixedly connected to the side wall of the L-shaped plate by six springs, and the support plate is fixedly connected to the inner bottom surface of the L-shaped plate by four springs.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] 1. During the chemical polishing process, two vibration motors are started by the PLC controller. The two vibration motors drive the polishing chamber to vibrate. The springs connected to the side plate and support plate of the polishing chamber amplify the vibration frequency of the polishing chamber, so that the pins are in an active state. At the same time, the vibrating polishing chamber will stir the polishing liquid inside, so that it can fully contact the pins. The active polishing liquid can remove the impurities corroded on the surface, which solves the problem of poor polishing effect of existing chemical polishing devices.

[0022] 2. After polishing is completed, the solenoid valve is opened by the PLC controller, so that the pins in the polishing chamber are removed together with the polishing liquid and separated by a strainer. During the unloading process, the polishing chamber vibrates continuously, so that the pins are not easy to stick to the inner wall of the polishing chamber, thus making this application have the effect of convenient unloading. Attached Figure Description

[0023] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the preferred embodiments of this utility model are described in detail below with reference to the accompanying drawings.

[0024] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0025] Figure 2 This is a structural diagram of the polishing chamber and vibration assembly of this utility model;

[0026] Figure 3 This is a structural diagram of the polishing chamber and support mechanism of this utility model;

[0027] Figure 4 This is a structural diagram of the support mechanism and vibration component of this utility model in their separated state.

[0028] Legend: 1. Bracket; 2. Polishing chamber; 3. Vibration motor; 4. Side plate; 5. Water pump; 6. L-shaped plate; 7. Spring; 101. PLC controller; 201. Cover plate; 202. Discharge hopper; 203. Solenoid valve; 401. Support plate; 501. Drainage pipe. Detailed Implementation

[0029] This application provides an electronic component pin polishing machine, which effectively solves the problem of poor polishing effect of existing chemical polishing devices.

[0030] Example

[0031] like Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, the technical solution in this application embodiment effectively solves the technical problem of poor polishing effect of existing chemical polishing devices. The overall idea is as follows:

[0032] To address the problems existing in the prior art, this utility model provides an electronic component pin polishing machine, including a support 1 and a polishing chamber 2. A PLC controller 101 is fixedly connected to the surface of the support 1, and a support mechanism is provided on the surface of the polishing chamber 2. Two vibration components are fixedly connected to the bottom surface of the support 1, and two vibration motors 3 are fixedly connected to the surface of the polishing chamber 2. The vibration components include an L-shaped plate 6, and six springs 7 are fixedly connected to the side of the L-shaped plate 6 near the polishing chamber 2. Four springs 7 are fixedly connected to the inner bottom surface of the L-shaped plate 6. The support mechanism includes a side plate 4 and a support plate 401.

[0033] The surface of the bracket 1 has a round hole, and the polishing chamber 2 is fitted inside the round hole.

[0034] A water pump 5 is fixedly connected to the top surface of the bracket 1. A diversion pipe 501 is fixedly connected to the inlet of the water pump 5. A guide pipe is fixedly connected to the outlet of the water pump 5. The end of the guide pipe away from the water pump 5 is fixedly connected to the polishing chamber 2. The guide pipe is flexible and has a certain amount of movement allowance at the top of the bracket 1.

[0035] The top of the polishing chamber 2 is hinged with a cover plate 201. The bottom of the polishing chamber 2 is fixedly connected with a discharge hopper 202 via a damping bearing. A solenoid valve 203 is fixedly installed in the middle section of the discharge hopper 202.

[0036] There are two side plates 4, and both side plates 4 are fixedly connected to the side wall of the polishing chamber 2.

[0037] There are two support plates 401, and both support plates 401 are fixedly connected to the bottom surface of the polishing chamber 2.

[0038] Both L-shaped plates 6 are fixedly connected to the bracket 1, and the two vibration components are symmetrically arranged with the circular hole on the top surface of the bracket 1 as the axis.

[0039] The side plate 4 is fixedly connected to the side wall of the L-shaped plate 6 by six springs 7, and the support plate 401 is fixedly connected to the inner bottom surface of the L-shaped plate 6 by four springs 7.

[0040] Support bracket 1: Supports the entire device and fixes the PLC controller 101, vibration assembly and water pump 5.

[0041] Polishing chamber 2: The main place for chemical polishing, containing pins and polishing fluid.

[0042] Vibration motor 3: Provides a vibration source to drive the polishing chamber 2 to vibrate, causing the pins to move and promoting the flow of polishing fluid.

[0043] Side plate 4: Connects the polishing chamber 2 to the spring 7 on the L-shaped plate 6, transmitting vibration and amplifying the vibration frequency.

[0044] Water pump 5: Pumps polishing liquid into polishing chamber 2 through drainage pipe 501 and guide pipe.

[0045] L-shaped plate 6: Fixes spring 7, providing a support structure for the vibration assembly.

[0046] Spring 7: Connects the polishing chamber 2 and the L-shaped plate 6 through the side plate 4 and the support plate 401, amplifying the vibration frequency.

[0047] PLC controller 101: controls the start and stop of vibration motor 3 and solenoid valve 203.

[0048] Cover plate 201: Hinged to the top of polishing chamber 2, used for inserting and removing pins without sealing.

[0049] Discharge hopper 202: Fixed to the bottom of polishing chamber 2, used for unloading materials.

[0050] Solenoid valve 203: Installed in the middle section of discharge hopper 202 to control the unloading process.

[0051] Support plate 401: Connects the polishing chamber 2 to the spring 7 on the inner bottom surface of the L-shaped plate 6, transmitting vibration.

[0052] Drainage pipe 501: Connects to the inlet of water pump 5 and is used to introduce polishing liquid.

[0053] Working principle:

[0054] In the first step of this application, the pins are placed inside the polishing chamber 2 by opening the cover plate 201. Then, the polishing chamber 2 is covered by the cover plate 201 (no sealing is required). Subsequently, polishing liquid is pumped into the polishing chamber 2 by the water pump 5 and the drainage pipe 501, so that the pins are corroded by the polishing liquid, removing surface oxides and achieving chemical polishing. During the chemical polishing process, the PLC controller 101 controls the two vibration motors 3 to start. The two vibration motors 3 drive the polishing chamber 2 to vibrate. The spring 7 connected to the side plate 4 and the support plate 401 of the polishing chamber 2 amplifies the vibration frequency of the polishing chamber 2, so that the pins are in an active state. At the same time, the vibrating polishing chamber 2 will agitate the polishing liquid inside, so that it can fully contact the pins. The active polishing liquid can remove the impurities corroded from the surface.

[0055] The second step is to open the solenoid valve 203 by controlling the PLC controller 101 after polishing, so that the pins in the polishing chamber 2 are removed together with the polishing liquid and separated by a strainer. During the unloading process, the polishing chamber 2 vibrates continuously, so that the pins are not easy to adhere to the inner wall of the polishing chamber 2, thus making the present application have the effect of convenient unloading.

[0056] Finally, it should be noted that the above embodiments are merely examples for clearly illustrating the present invention and are not intended to limit the implementation. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations. However, obvious variations or modifications derived therefrom are still within the protection scope of this invention.

Claims

1. An electronic component pin polishing machine, comprising a support (1) and a polishing chamber (2), wherein a PLC controller (101) is fixedly connected to the surface of the support (1), characterized in that, The surface of the polishing chamber (2) is provided with a support mechanism, and the bottom surface of the bracket (1) is fixedly connected with two vibration components, and the surface of the polishing chamber (2) is fixedly connected with two vibration motors (3). The vibration assembly includes an L-shaped plate (6), on which six springs (7) are fixedly connected, and on the inner bottom surface of the L-shaped plate (6) near the polishing chamber (2), four springs (7) are fixedly connected. The support mechanism includes a side plate (4) and a support plate (401).

2. The electronic component pin polishing machine as described in claim 1, characterized in that: The support (1) has a circular hole on its surface, and the polishing chamber (2) is fitted inside the circular hole.

3. The electronic component pin polishing machine as described in claim 2, characterized in that: A water pump (5) is fixedly connected to the top surface of the bracket (1). A diversion pipe (501) is fixedly connected to the inlet of the water pump (5). A guide pipe is fixedly connected to the outlet of the water pump (5). The end of the guide pipe away from the water pump (5) is fixedly connected to the polishing chamber (2).

4. The electronic component pin polishing machine as described in claim 3, characterized in that: The polishing chamber (2) is hinged to a cover plate (201) at the top, and a discharge hopper (202) is fixedly connected to the bottom of the polishing chamber (2). A solenoid valve (203) is fixedly installed in the middle section of the discharge hopper (202).

5. The electronic component pin polishing machine as described in claim 4, characterized in that: There are two side plates (4), and both side plates (4) are fixedly connected to the side wall of the polishing chamber (2).

6. The electronic component pin polishing machine as described in claim 5, characterized in that: There are two support plates (401), and both support plates (401) are fixedly connected to the bottom surface of the polishing chamber (2).

7. The electronic component pin polishing machine as described in claim 6, characterized in that: Both L-shaped plates (6) are fixedly connected to the bracket (1), and the two vibration components are symmetrically arranged with the circular hole on the top surface of the bracket (1) as the axis.

8. The electronic component pin polishing machine as described in claim 7, characterized in that: The side plate (4) is fixedly connected to the side wall of the L-shaped plate (6) by six springs (7), and the support plate (401) is fixedly connected to the inner bottom surface of the L-shaped plate (6) by four springs (7).

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