Shock-absorbing and dust-proof graphics card fan

Abstract

The utility model discloses a shock attenuation dustproof display card fan, including structure bottom plate, heat dissipation fin, upper cover, and the upper cover and structure bottom plate are detachably installed on both sides of heat dissipation fin through bolt, be equipped with the buffer sponge block for buffering shock attenuation on the structure bottom plate, and the heat dissipation fin is welded with the connecting strip and is set up through -hole and is connected with the upper cover, and the heat dissipation fin is installed heat dissipation fan, and the bottom surface fixed printed circuit board and with heat dissipation fin and copper pipe abutment realizes high -efficient heat dissipation, and the copper pipe runs through heat dissipation fin and extends to both ends, and the upper cover both ends downward extension forms the shroud protection copper pipe end, and the structure bottom plate is connected with printed circuit board through the buffer connecting piece, and the heat dissipation fin arranges multiple heat dissipation gaps to increase air contact area, the utility model discloses can improve heat dissipation efficiency, strengthen shock attenuation performance and effectively prevent dust from entering, is applicable to high -performance display card heat dissipation demand.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for electronic devices, and in particular to a shock-absorbing and dust-proof graphics card fan. Background Technology

[0002] In the field of computer hardware, the graphics card, as a core component, directly affects the overall performance and stability of the device. Graphics cards generate a significant amount of heat under high load, making an efficient cooling system crucial for stable operation. Currently, graphics card cooling systems typically consist of heatsinks, cooling fans, and heat-conducting elements such as copper pipes, achieving rapid heat dissipation by increasing the heat dissipation area and airflow. However, existing graphics card cooling systems still have many shortcomings in practical applications. For example, during operation, the internal structure of the graphics card is easily impacted by high-speed fan operation or external vibrations, leading to loosening or even damage of components, thus affecting its lifespan. Furthermore, dust accumulation significantly reduces cooling efficiency, further exacerbating the risk of overheating. The lack of effective shock absorption and dust prevention designs in current technology makes it difficult for graphics cards to meet user needs in terms of reliability and durability under complex operating environments. Simultaneously, the assembly method of cooling systems is mostly fixed, making disassembly and assembly inconvenient and increasing the difficulty of maintenance and cleaning. Therefore, developing a graphics card fan cooling structure that combines shock absorption, dust prevention, and ease of disassembly and maintenance has become an urgent technical problem to be solved. Utility Model Content

[0003] The purpose of this invention is to provide a shock-absorbing and dust-proof graphics card fan to overcome the shortcomings of the existing technology.

[0004] To achieve the above objectives, this utility model provides the following technical solution:

[0005] A shock-absorbing and dust-proof graphics card fan includes a structural base plate, cushioning foam blocks, a cooling fan, a top cover, a protective shroud, heatsink fins, copper pipes, heat dissipation gaps, and a printed circuit board. The structural base plate is located at the bottom of the graphics card, serving as the base for the entire cooling system. The structural base plate is detachably fixed to one side of the heatsink fins using bolts for stable installation and easy maintenance. Furthermore, the structural base plate is equipped with multiple cushioning foam blocks to absorb vibrations and prevent dust from entering the system. The cushioning foam blocks are fixed to the structural base plate by adhesive or embedding, forming a buffer connection between the structural base plate and the printed circuit board, thereby reducing the impact of vibrations generated during graphics card operation on system stability.

[0006] Specifically, the buffer connector includes a threaded connection to a structural base plate cooling fan. The structural base plate has through holes, allowing the cooling fan to pass through and connect to the buffer foam block. The two ends of the buffer foam block abut against the printed circuit board and the structural base plate respectively, thus forming an elastic support between them. This design not only improves the system's shock resistance but also prevents external dust from entering through the sealing effect of the buffer foam block.

[0007] Furthermore, the cooling fan is mounted above the heatsink fins to accelerate airflow and thus improve heat dissipation efficiency. The cooling fan is securely connected to the heatsink fins via bolts or clips to ensure stability during high-speed operation. The fan blades are optimized to maximize airflow output with low noise, thereby enhancing heat dissipation.

[0008] Specifically, the top cover covers the heat dissipation fins and is bolted to the structural base plate to form a closed heat dissipation system. The two ends of the top cover extend downwards to form a protective shield, designed to protect the ends of the copper pipes from damage caused by the external environment. An appropriate gap is left between the inner wall of the shield and the copper pipes to ensure unobstructed airflow while preventing deformation of the copper pipes due to external forces.

[0009] Furthermore, the heat dissipation fins are composed of multiple closely arranged metal plates to increase the contact area with air, thereby improving heat dissipation efficiency. Multiple heat dissipation gaps are arranged between the heat dissipation fins; these gaps are precisely calculated to ensure smooth airflow and heat removal. The width of the heat dissipation gaps is adjusted according to actual application requirements, typically ranging from 1 mm to 3 mm, to meet the heat dissipation requirements of different scenarios.

[0010] Specifically, the copper pipes penetrate the heatsink fins and extend to both ends to conduct heat. The copper pipes are made of high thermal conductivity pure copper and are fixedly connected to the heatsink fins via a welding process to ensure that heat can be quickly transferred from the graphics card core to the heatsink fins. The two ends of the copper pipes extend into the upper cover shroud, and the shroud's protective function further enhances the safety of the copper pipes.

[0011] Furthermore, the printed circuit board is fixed to the bottom surface of one of the heat sink fins and directly abuts against the heat sink fins and copper pipes to facilitate heat conduction. The printed circuit board is fixed by screws or adhesive, and its surface is coated with thermal grease to reduce thermal resistance and improve heat dissipation efficiency. The layout of the printed circuit board is optimized, with key components concentrated near the heat sink fins to maximize the performance of the heat dissipation system.

[0012] Specifically, the connecting strip is welded to the heat dissipation fins and has through holes for connection to the top cover. The connecting strip is made of high-strength aluminum alloy to ensure it will not deform or break during long-term use. The positions of the through holes on the connecting strip are precisely calculated to ensure a secure and reliable connection between the top cover and the heat dissipation fins.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0014] First, the design of multiple heat dissipation fins and gaps increases the contact area with air, thereby improving heat dissipation efficiency. Second, copper pipes run through the heat dissipation fins and extend to both ends, rapidly conducting heat to the fins and further enhancing heat dissipation capacity. Third, multiple cushioning sponge blocks fixed to the structural base plate absorb vibrations and prevent dust from entering through elastic support, thus improving system stability and dustproof performance. Finally, the protective covers extending downwards from both ends of the top cover protect the ends of the copper pipes, avoiding the risk of external damage.

[0015] In summary, this utility model provides a shock-absorbing and dust-proof graphics card fan. Through reasonable structural design and component combination, it achieves efficient heat dissipation and shock absorption and dust prevention functions, and has broad application prospects. Attached Figure Description

[0016] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0017] Figure 2 This is a schematic diagram of the structure of this utility model ignoring the top cover;

[0018] Figure 3 This is a partial enlarged view of the side of this utility model.

[0019] Attached image annotations:

[0020] 1. Structural base plate; 2. Buffer foam block; 3. Cooling fan; 4. Top cover; 5. Protective cover; 6. Connecting strip; 8. Copper pipe; 9. Heat dissipation gap; 10. Heat dissipation fins; 11. Printed circuit board. Detailed Implementation

[0021] To make the above-mentioned objects, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a full understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.

[0022] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. When the number of elements is referred to as "multiple," it can be any number of two or more. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0024] The present invention will now be described in detail with reference to the embodiments shown in the accompanying drawings:

[0025] like Figure 1 As shown, the overall structure of this utility model includes a structural base plate 1, buffer sponge blocks 2, a cooling fan 3, a top cover 4, a protective cover 5, a connecting strip 6, copper pipes 8, a heat dissipation gap 9, heat dissipation fins 10, and a printed circuit board 11. These components, through reasonable design and assembly, form a complete graphics card cooling system. The structural base plate 1, serving as the foundation of the entire system, is located at the bottom of the graphics card and is detachably fixed to one side of the heat dissipation fins 10 with bolts. This design not only ensures a stable connection between the structural base plate 1 and the heat dissipation fins 10 but also facilitates disassembly and replacement during later maintenance. Multiple buffer sponge blocks 2 are provided on the structural base plate 1. These buffer sponge blocks 2 are fixed to the structural base plate 1 by adhesive or embedding, forming a buffer connection between the structural base plate 1 and the printed circuit board 11. The buffer sponge blocks 2 are made of highly elastic material, with their two ends abutting against the printed circuit board 11 and the structural base plate 1 respectively, thereby absorbing vibration. Furthermore, the buffer sponge blocks 2 also have a certain sealing performance, effectively preventing external dust from entering the system and further improving the dustproof effect.

[0026] To achieve efficient heat dissipation, a cooling fan 3 is installed above the heat dissipation fins 10. The cooling fan 3 is fixedly connected to the heat dissipation fins 10 by bolts or clips, ensuring stability during high-speed operation. The blades of the cooling fan 3 are optimized to maximize airflow output with low noise. When the cooling fan 3 is running, airflow passes through the heat dissipation gaps 9 between the heat dissipation fins 10, carrying away heat and expelling it from the system. The heat dissipation fins 10 are composed of multiple closely arranged metal plates, made of aluminum alloy or pure copper with excellent thermal conductivity to improve heat transfer efficiency. Multiple heat dissipation gaps 9 are arranged between the heat dissipation fins 10, the width of which is adjusted according to actual application requirements, typically between 1 mm and 3 mm. Figure 2 As shown, ignoring the top cover 4, the layout of the heat dissipation fins 10 and their heat dissipation gaps 9 can be clearly seen. This design significantly increases the contact area between the heat dissipation fins 10 and the air, thereby improving heat dissipation efficiency.

[0027] A copper pipe 8 passes through the heat dissipation fins 10 and extends to both ends to conduct heat. The copper pipe 8 is made of pure copper with high thermal conductivity and is fixedly connected to the heat dissipation fins 10 via a welding process. Laser welding technology is used to ensure a strong and reliable connection between the copper pipe 8 and the heat dissipation fins 10, while reducing thermal resistance. Both ends of the copper pipe 8 extend into the protective cover 5 of the upper cover 4. The protective cover 5 is designed to protect the ends of the copper pipe 8 from damage caused by the external environment. An appropriate gap is left between the inner wall of the protective cover 5 and the copper pipe 8 to ensure unobstructed airflow and prevent deformation of the copper pipe 8 due to external forces. Figure 3 As shown, the shape of the protective cover 5 matches the end of the copper tube 8, and can completely cover both ends of the copper tube 8, thereby achieving a protective function.

[0028] The printed circuit board 11 is fixed to the bottom surface of one of the heat sink fins 10 and directly contacts the heat sink fin 10 and copper pipe 8 to facilitate heat conduction. The printed circuit board 11 is fixed by screws or adhesive, and its surface is coated with thermal grease to reduce thermal resistance and improve heat dissipation efficiency. The layout of the printed circuit board 11 is optimized, with key components concentrated near the heat sink fin 10 to maximize the performance of the cooling system. In practical applications, the heat generated by the graphics card core is transferred through the printed circuit board 11 to the heat sink fin 10 and copper pipe 8, and then the cooling fan 3 accelerates airflow to expel the heat from the system, thus achieving efficient heat dissipation.

[0029] The connecting strip 6 is welded to the heat dissipation fins 10 and has through holes for connection to the upper cover 4. The connecting strip 6 is made of high-strength aluminum alloy to ensure it will not deform or break during long-term use. The positions of the through holes on the connecting strip 6 are precisely calculated to ensure a secure and reliable connection between the upper cover 4 and the heat dissipation fins 10. Figure 1 As shown, the top cover 4 covers the heat dissipation fins 10 and is connected to the structural base plate 1 by bolts to form a closed heat dissipation system. The two ends of the top cover 4 extend downward to form a protective cover 5. The design of the protective cover 5 not only protects the ends of the copper pipes 8, but also enhances the sealing of the entire system, further preventing dust from entering the system.

[0030] During actual operation, the heat generated by the graphics card core is first transferred to the heat sink 10 and copper pipe 8 through the printed circuit board 11. The copper pipe 8 quickly conducts the heat to the heat sink 10, and the airflow generated by the cooling fan 3 passes through the heat dissipation gap 9, carrying away the heat and expelling it from the system. During this process, the buffer sponge 2 absorbs the vibrations generated during the graphics card's operation, reducing the impact of vibrations on system stability. Simultaneously, the sealing effect of the buffer sponge 2 prevents the intrusion of external dust, thereby improving the system's dustproof performance. The protective covers 5 at both ends of the top cover 4 protect the ends of the copper pipe 8, avoiding the risk of external damage and further enhancing the system's reliability.

[0031] The technical solution of this utility model increases the contact area with air through the design of multiple heat dissipation fins 10 and heat dissipation gaps 9, thereby improving heat dissipation efficiency. Copper pipes 8 penetrate the heat dissipation fins 10 and extend to both ends, rapidly conducting heat to the heat dissipation fins 10, further enhancing heat dissipation capacity. Multiple buffer sponge blocks 2 fixedly installed on the structural base plate 1 absorb vibration and prevent dust from entering through elastic support, thereby improving the system's stability and dustproof performance. Furthermore, the protective covers 5 formed by the downward extension of both ends of the top cover 4 protect the ends of the copper pipes 8, avoiding the risk of external damage.

[0032] In summary, this utility model, through its reasonable structural design and component combination, achieves efficient heat dissipation, shock absorption, and dust prevention functions, and has broad application prospects. The above embodiments are merely preferred embodiments of this utility model. Those skilled in the art can make appropriate adjustments to the material, size, and installation method of each component according to actual needs, but all such adjustments should be considered within the protection scope of this utility model.

[0033] The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as the combination of these technical features does not contradict each other, it should be considered within the scope of this specification. For those skilled in the art, several modifications and improvements can be made without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A shock-absorbing and dust-proof graphics card fan, characterized in that, The system includes a structural base plate (1), a buffer sponge block (2), a cooling fan (3), a top cover (4), a shield (5), cooling fins (10), copper pipes (8), cooling gaps (9), and a printed circuit board (11). The structural base plate (1) is located at the bottom of the graphics card and is fixed to one side of the cooling fins (10) with bolts. The buffer sponge block (2) is set on the structural base plate (1) and forms a buffer connection with the printed circuit board (11). The cooling fan (3) is installed above the cooling fins (10). The top cover (4) covers the cooling fins (10) and is connected to the structural base plate (1) with bolts. The shield (5) is formed by extending downward from both ends of the top cover (4). The copper pipes (8) pass through the cooling fins (10) and extend to both ends. Multiple cooling gaps (9) are arranged between the cooling fins (10). The printed circuit board (11) is fixed to the bottom surface of the cooling fins (10).

2. The graphics card fan as described in claim 1, characterized in that, The cushioning sponge block (2) is fixed to the structural base plate (1) by adhesive or embedding, and forms an elastic support between the structural base plate (1) and the printed circuit board (11).

3. The graphics card fan as described in claim 2, characterized in that, The two ends of the buffer sponge block (2) abut against the printed circuit board (11) and the structural base plate (1) respectively, and achieve a sealing effect between the two.

4. The graphics card fan as described in claim 1, characterized in that, The cooling fan (3) is fixedly connected to the heat dissipation fins (10) by bolts or clips, and the blade shape is optimized to achieve airflow output under low noise conditions.

5. The graphics card fan as described in claim 1, characterized in that, The heat dissipation fins (10) are composed of multiple closely arranged metal plates, and the width of the heat dissipation gaps (9) is between 1 mm and 3 mm.

6. The graphics card fan as described in claim 1, characterized in that, The copper tube (8) is made of pure copper with high thermal conductivity and is fixedly connected to the heat dissipation fins (10) by welding process.

7. The graphics card fan as described in claim 1, characterized in that, The surface of the printed circuit board (11) is coated with thermal grease and key components are concentrated near the heat sink fins (10).

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