A spring sheet structure, an actuator and a camera module
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- XIAMEN YOUCHENGFENG TECHNOLOGY CO LTD
- Filing Date
- 2025-06-16
- Publication Date
- 2026-05-29
Smart Images
Figure CN224305843U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the technical field of electronic devices, and in particular to a spring structure, an actuator, and a camera module. Background Technology
[0002] Actuators, commonly used in image capturing devices, can be used to move optical elements such that the optical elements at least partially cover the aperture of the image capturing device. The optical element can be a shutter, which reduces the total amount of light passing through the aperture of the image capturing device, allowing the shutter to be fully open, partially open, and / or fully closed. The optical element can also be a filter, which blocks certain wavelengths of light from passing through the aperture of the image capturing device. The optical element can also be a lens assembly, and so on.
[0003] For example, when taking photos or videos, in order to achieve focus of the camera module, it is necessary to use coils, magnets and springs to work together to form an actuator. The actuator drives the lens assembly to move up and down along the Z-axis to focus, or drives the lens assembly to move or shift along the X-axis and Y-axis to stabilize the image.
[0004] Existing camera modules also incorporate TMR (tunnel magnetoresistance effect) sensors or Hall sensors in conjunction with magnets to detect lens position movement and achieve closed-loop operation. However, placing Hall sensors, TMR sensors, and magnets inside the camera module is costly and takes up a lot of space, which is not conducive to the miniaturization of the camera module. In addition, magnets can also cause magnetic interference, which can affect the magnetic induction of the actuator coil.
[0005] Therefore, to eliminate the need for detection components such as Hall sensors and TMR sensors, some camera modules apply the principle of strain gauges to springs. By coating the spring with a sensing material, the voltage change of the corresponding strain gauge is detected by the deformation of the spring's suspension wire, and the displacement of the lens assembly can be calculated, thus achieving the same closed-loop purpose. However, due to the small size and thinness of the spring's suspension wire, coating the sensing material on it often results in uneven material coating, easily leading to uneven thickness at different locations on the spring's suspension wire. When the lens assembly needs to achieve image stabilization through multi-axis offset, the corresponding spring's suspension wire also needs a complex shape design. Once the mechanical properties of the spring's suspension wire change due to uneven coating of the sensing material, it will affect the normal displacement of the lens assembly and the realization of image stabilization functions. Utility Model Content
[0006] The purpose of this invention is to provide a spring structure, actuator, and camera module that can solve the above problems and has the advantages of reducing product size and having a stable and reliable structure.
[0007] To achieve the above objectives, the solution of this utility model is:
[0008] A spring sheet structure includes a movable part, a fixed part, and a spring sheet suspension wire. The spring sheet structure has a multi-layer structure, which includes a spring sheet body layer, an insulating layer, and a conductive layer, with the insulating layer located between the spring sheet body layer and the conductive layer.
[0009] The insulating layer is formed on the spring body layer by vapor deposition or sputtering, while the conductive layer is formed on the insulating layer by vapor deposition or sputtering.
[0010] The spring structure is formed into a movable part, a fixed part, and a spring suspension wire through secondary processing.
[0011] Furthermore, the insulating layer is made of aluminum oxide or aluminum oxide.
[0012] Furthermore, the conductive layer is made of copper.
[0013] Furthermore, the spring structure is formed by etching to create a movable part, a fixed part, and a spring suspension wire.
[0014] Furthermore, the spring structure is formed into a movable part, a fixed part, and a spring suspension wire through stamping and laser processes.
[0015] This utility model also provides an actuator, including the aforementioned spring structure.
[0016] This utility model also provides a camera module, including the aforementioned spring-loaded structure.
[0017] By adopting the above technical solution, the conductive layer can be connected to an external circuit. When the lens assembly and movable parts shift, causing the spring suspension wire to deform, the current and voltage within the conductive layer change synchronously. Based on the corresponding electrical signal changes, the displacement of the lens assembly can be calculated, thus replacing the functions of existing Hall effect sensors, TMR sensors, and magnets. This reduces product size and enables closed-loop functionality of the camera module. Furthermore, through semiconductor manufacturing processes, insulating and conductive layers can be automatically formed using vapor deposition or sputtering. This allows for precise control of layer thickness, ensuring uniform and controllable thickness of the spring structure, especially the spring suspension wire, without affecting its deformation and reset mechanical properties. This avoids impacting the displacement of the lens assembly and effectively guarantees the normal focusing and image stabilization functions of the camera module. Attached Figure Description
[0018] Figure 1 This is a partial structural schematic diagram of an embodiment of the present utility model;
[0019] Figure 2 This is a schematic diagram of the layer structure of an embodiment of the present invention.
[0020] Labeling: 1. Spring structure, 11. Movable part, 12. Fixed part, 13. Spring suspension wire, 101. Spring body layer, 102. Insulating layer, 103. Conductive layer, 2. Lens assembly, 3. Base. Detailed Implementation
[0021] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0022] like Figure 1 and Figure 2 As shown, a spring structure 1 in this embodiment includes a movable part 11, a fixed part 12, and a spring suspension wire 13; it is mainly used in a camera module to provide elastic force for the displacement and resetting of the lens assembly 2. Typically, the movable part 11 is connected and fixed to the lens assembly 2, the fixed part 12 is connected and fixed to the camera module base 3, and the spring suspension wire 13 is connected between the movable part 11 and the fixed part 12 to provide corresponding elastic force.
[0023] The spring structure 1 described in this embodiment has a multi-layer structure, which includes a spring body layer 101, an insulating layer 102, and a conductive layer 103. The insulating layer 102 is located between the spring body layer 101 and the conductive layer 103. Typically, the spring body layer 101 is made of a flexible metal or other material and can have a conductive function. The insulating layer 102 is used to insulate the conductive layer 103 and the spring body layer 101. The conductive layer 103 can be connected to an external circuit. When the lens assembly 2 and the movable part 11 are displaced, causing the spring suspension wire 13 to deform, the current and voltage in the conductive layer 103 can change synchronously. The displacement of the lens assembly 2 can be calculated based on the corresponding electrical signal changes, thereby replacing the functions of existing Hall sensors or TMR sensors and magnets, reducing the product size and enabling the closed-loop function of the camera module.
[0024] The insulating layer 102 can be formed on the spring body layer 101 by vapor deposition or sputtering, while the conductive layer 103 can be formed on the insulating layer 102 by vapor deposition or sputtering. Thus, through semiconductor manufacturing processes, the insulating layer 102 and the conductive layer 103 can be formed by vapor deposition or sputtering, thereby precisely controlling the thickness of the layers to ensure that the overall thickness of the spring structure 1, especially the spring suspension wire 13, is uniform and controllable, without affecting its deformation and reset mechanical properties, avoiding affecting the displacement of the lens assembly 2, and effectively ensuring the normal focusing and image stabilization functions of the camera module.
[0025] Meanwhile, the spring structure 1 can be formed by etching to create the movable part 11, the fixed part 12, and the spring suspension wire 13. This process is convenient and allows for the creation of the desired structure.
[0026] Of course, the spring structure 1 can also be formed by stamping and laser processes to form the movable part 11, the fixed part 12 and the spring suspension wire 13. The basic structure is first stamped and then the spring suspension wire 13 is laser cut out.
[0027] In this embodiment, the insulating layer 102 is made of aluminum oxide or aluminum oxide, which can have good insulation effect. The conductive layer 103 can be made of copper.
[0028] This embodiment also provides an actuator, including the aforementioned spring structure 1, which, in conjunction with corresponding optical elements, can constitute an image capture device.
[0029] This embodiment also provides a camera module, including the aforementioned spring structure 1.
[0030] The above description is merely a preferred embodiment of this utility model. The protection scope of this utility model is not limited to the above embodiments. All technical solutions falling within the scope of this utility model's concept are protected by this utility model. It should be noted that for those skilled in the art, equivalent changes and modifications without departing from the principle of this utility model should still fall within the protection scope of this utility model.
[0031] In the description of the embodiments of this application, it should be understood that the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the product of this application is usually placed in when in use, or the orientation or positional relationship that is commonly understood by those skilled in the art. It is only for the convenience of describing this application and simplifying the description, and is not intended to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this application.
[0032] Furthermore, the terms "first," "second," and "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "a plurality of" and "several" mean two or more, unless otherwise explicitly specified.
[0033] In the description of the embodiments of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows for mutual communication; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0034] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0035] The foregoing disclosure provides many different implementations or examples for carrying out different structures of this application. To simplify the disclosure, specific examples of components and arrangements are described above. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.
[0036] Furthermore, this application provides examples of various specific processes and materials, but those skilled in the art will recognize the application of other processes and / or the use of other materials.
Claims
1. A spring-loaded structure, comprising a movable part, a fixed part, and a spring-loaded suspension wire, characterized in that: The spring structure has a multi-layer structure, which includes a spring body layer, an insulating layer and a conductive layer, with the insulating layer located between the spring body layer and the conductive layer. The insulating layer is formed on the spring body layer by vapor deposition or sputtering, while the conductive layer is formed on the insulating layer by vapor deposition or sputtering. The spring structure is formed into a movable part, a fixed part, and a spring suspension wire through secondary processing.
2. The spring clip structure according to claim 1, characterized in that: The insulating layer is made of aluminum oxide or aluminum oxide.
3. The spring clip structure according to claim 1, characterized in that: The conductive layer is made of copper.
4. The spring clip structure according to claim 1, characterized in that: The spring structure is formed by etching to create a movable part, a fixed part, and a spring suspension wire.
5. The spring clip structure according to claim 1, characterized in that: The spring structure is formed by stamping and laser processes to create the movable part, the fixed part, and the spring suspension wire.
6. An actuator, characterized in that: Includes the spring structure as described in any one of claims 1-5.
7. A camera module, characterized in that: Includes the spring structure as described in any one of claims 1-5.