Microphone and electronic device

Abstract

The application provides a microphone and an electronic device. The microphone comprises a shell and a flexible circuit board, the flexible circuit board comprises a connecting part and a bending part, the connecting part is connected with the shell, and an inner cavity is formed between the connecting part and the shell; the bending part is located outside the inner cavity, and the bending part comprises a solder pad. The application can improve the stability and convenience of the microphone.

Description

Technical Field

[0001] This utility model relates to the field of microphone technology, and more specifically, to a microphone and electronic device. Background Technology

[0002] In existing technologies, the PCB (Printed Circuit Board) in a microphone is typically used to support electronic components and make electrical connections. However, existing PCBs are made of rigid materials, which are prone to slight deformation when subjected to external forces. The stress generated by this slight deformation is easily transmitted to the electronic components mounted on the PCB, resulting in poor microphone stability. Furthermore, the rigid material of the PCB cannot be bent, leading to complex electrical connection circuits and significantly reducing the ease of use of the microphone.

[0003] Therefore, a new technical solution is needed to solve the above-mentioned technical problems. Utility Model Content

[0004] One objective of this invention is to provide a new technical solution for a microphone and electronic device.

[0005] According to a first aspect of the present invention, a microphone is provided, wherein the microphone comprises:

[0006] case;

[0007] A flexible circuit board includes a connecting portion and a bending portion. The connecting portion is connected to a housing, and an inner cavity is formed between the connecting portion and the housing. The bending portion is located outside the inner cavity and includes a solder pad.

[0008] Optionally, it also includes a first adhesive member, through which the bent portion is connected to the housing.

[0009] Optionally, it further includes a support plate, which is connected to the side of the connecting portion away from the housing, and the hardness of the support plate is greater than the hardness of the connecting portion.

[0010] Optionally, it also includes a second adhesive member, through which the support plate is connected to the side of the connecting portion away from the housing.

[0011] Optionally, the Shore A hardness of the second adhesive is less than 90 degrees.

[0012] Optionally, the support plate is a stainless steel plate or a PCB.

[0013] Optionally, the connecting part includes a first vent hole, which can connect the inner chamber to the outside.

[0014] The microphone also includes a MEMS chip, which is disposed on the connection portion and positioned relative to the first vent.

[0015] Optionally, the support plate includes a second vent hole, which communicates with the first vent hole.

[0016] Optionally, it also includes an ASIC chip, a first gold wire, and a second gold wire. The ASIC chip is disposed on the connection portion. The ASIC chip is electrically connected to the MEMS chip through the first gold wire, and the ASIC chip is electrically connected to the pad through the second gold wire.

[0017] According to a second aspect of the present invention, an electronic device is provided, comprising a microphone as described in any of the first aspects.

[0018] The microphone in this embodiment uses a flexible circuit board to support the electronic components, effectively preventing stress caused by micro-deformation from being transmitted to the electronic components and resulting in poor microphone stability. Furthermore, the bending portion of the flexible circuit board simplifies the microphone's electrical connections, thereby significantly improving its ease of use.

[0019] Other features and advantages of the present invention will become clear from the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings. Attached Figure Description

[0020] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the present invention and, together with their description, serve to explain the principles of the present invention.

[0021] Figure 1 This is a schematic diagram of the microphone structure in one embodiment of the present invention.

[0022] Explanation of reference numerals in the attached figures:

[0023] 1. Shell;

[0024] 2. Flexible circuit board; 201. Connecting part; 2011. First vent hole; 202. Bending part; 2021. Solder pad;

[0025] 3. Inner chamber; 301. First chamber; 302. Second chamber;

[0026] 4. First adhesive component;

[0027] 5. Support plate; 501. Second vent;

[0028] 6. Second adhesive component;

[0029] 7. MEMS chips;

[0030] 8. ASIC chip;

[0031] 9. The first gold thread;

[0032] 10. Second gold line;

[0033] 11. Solder paste. Detailed Implementation

[0034] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present invention.

[0035] The embodiments of this application will now be described in detail, examples of which are illustrated in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0036] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0037] According to one embodiment of this application, a microphone is provided, see [link to relevant documentation]. Figure 1 As shown, the microphone includes a housing 1 and a flexible circuit board 2. The flexible circuit board 2 includes a connecting portion 201 and a bending portion 202. The connecting portion 201 is connected to the housing 1, and an inner cavity 3 is formed between the connecting portion 201 and the housing 1. The bending portion 202 is located outside the inner cavity 3, and the bending portion 202 includes a solder pad 2021.

[0038] Specifically, the microphone described in this embodiment includes a housing 1 and a flexible circuit board 2. The housing 1 can be covered with solder paste 11 on the flexible circuit board 2 to form the inner cavity 3. Electronic components such as MEMS (Micro Electro Mechanical Systems) chips, ASIC (Application Specific Integrated Circuit) chips, integrated circuits, connectors, and processors can be fixedly disposed in the inner cavity 3. Multiple electronic components are interconnected to form the circuit of the microphone.

[0039] The flexible circuit board 2 includes a connecting portion 201 and a bending portion 202, with the connecting portion 201 and the bending portion 202 forming an integral structure. The connecting portion 201 connects to the housing 1 to form the inner cavity 3, and the connecting portion 201 supports the various electronic components within the inner cavity 3. The bending portion 202 is located outside the inner cavity 3 and includes pads 2021 for electrical connection with external devices.

[0040] Therefore, by using a flexible circuit board 2, this application ensures that when the flexible circuit board 2 is subjected to an external impact, the flexible connecting part 201 can directly absorb the external force without causing micro-deformation. This effectively avoids the stress generated by micro-deformation being transmitted to electronic components, which could lead to poor microphone stability. Furthermore, when external devices such as USB (Universal Serial Bus) interface devices, Bluetooth devices, and USB sound cards are located outside the housing 1, the flexible circuit board 2 is flexible, and the bending part 202 is located outside the inner cavity 3. Therefore, the microphone of this application can be directly fixed to the position where the microphone needs to be fixed according to the actual application requirements. This effectively simplifies the electrical connection circuit of the microphone and further improves the ease of use of the microphone.

[0041] Furthermore, the housing 1 described in this application embodiment can be a metal housing, a plastic housing, a rubber housing, a wooden housing, a glass housing, a carbon fiber housing, or a composite material housing, etc. Those skilled in the art can choose according to actual needs, and this application does not impose specific limitations here.

[0042] In one embodiment, the microphone further includes a first adhesive 4, through which the bent portion 202 is connected to the housing 1.

[0043] Specifically, in this embodiment of the application, the first adhesive 4 includes at least one of epoxy resin adhesive, structural adhesive, instant adhesive, anaerobic adhesive, silicone adhesive, polyurethane adhesive, pressure-sensitive adhesive, and hot melt adhesive, so that the bending part 202 can be installed in a suitable position according to the actual application requirements of the microphone, thereby further improving the applicability of the microphone.

[0044] In this application, the first adhesive component 4 can be divided into hard adhesive and soft adhesive depending on the actual application of the microphone. For example, the hard adhesive can be used in scenarios where a high degree of fixation is required to further improve the reliability of the microphone circuit connection; while the soft adhesive can be used in scenarios where stress is more sensitive to further improve the stability of the microphone in use.

[0045] It should be noted that the "hard adhesive" mentioned in this application refers to adhesives with a Shore D hardness of less than 90 degrees, such as epoxy resin adhesives, structural adhesives, instant adhesives, or anaerobic adhesives. The "soft adhesive" refers to adhesives with a Shore A hardness of less than 90 degrees, such as silicone adhesives, polyurethane adhesives, pressure-sensitive adhesives, or hot melt adhesives.

[0046] In one embodiment, the microphone further includes a support plate 5, which is connected to the side of the connecting portion 201 away from the housing 1, and the rigidity of the support plate 5 is greater than that of the connecting portion 201.

[0047] Specifically, such as Figure 1 As shown, in this embodiment of the application, by setting the hardness of the support plate 5 to be greater than that of the connecting part 201, the support plate 5 can support the connecting part 201, thereby effectively avoiding the problem that the microphone's anti-interference performance is poor due to the weak structural strength of the flexible circuit board 2, and further improving the stability of the microphone.

[0048] The support plate 5 can be made of rigid material, such as metal plate, plastic plate, wood plate, glass plate, ceramic plate or composite material plate, as long as it can enhance the structural strength of the flexible circuit board 2.

[0049] In addition, such as Figure 1 As shown, in order to ensure the supporting effect of the support plate 5 on the flexible circuit board 2, it is preferable that the volume of the support plate 5 is larger than the volume of the connecting part 201.

[0050] In one embodiment, the microphone further includes a second adhesive member 6, through which the support plate 5 is connected to the side of the connecting portion 201 opposite to the housing 1.

[0051] Specifically, such as Figure 1 As shown, in this embodiment of the application, the second adhesive 6 is a soft adhesive, such as silicone adhesive, polyurethane adhesive, pressure-sensitive adhesive, or hot melt adhesive, so that the support plate 5 can be fixed to the side of the connecting part 201 away from the housing 1 by the second adhesive 6, thereby effectively avoiding the stress generated by the hard adhesive being transmitted to the electronic components, which would result in poor microphone stability.

[0052] In one embodiment, the Shore A hardness of the second adhesive 6 is less than 90 degrees.

[0053] Specifically, in this embodiment of the application, by setting the Shore A hardness of the second adhesive 6 to be less than 90 degrees, a soft connection can be formed between the support plate 5 and the connecting part 201. This further avoids the situation where stress caused by excessive glue hardness is transmitted to electronic components, resulting in poor microphone stability, and effectively improves the stability and reliability of the microphone.

[0054] In one embodiment, the support plate 5 is a stainless steel plate or a PCB.

[0055] Specifically, since stainless steel plates have high durability and corrosion resistance, this embodiment of the application effectively enhances the structural strength of the flexible circuit board 2 by setting the support plate 5 to stainless steel plate.

[0056] Furthermore, since the PCB is a rigid material and has various additional connection circuits, this embodiment of the application effectively enhances the structural strength of the flexible circuit board 2 by setting the support plate 5 as a PCB, and also further broadens the applicability of the microphone and improves the performance of the microphone.

[0057] In one embodiment, the connection portion 201 includes a first vent 2011, which connects the inner chamber 3 to the outside; the microphone also includes a MEMS chip 7, which is disposed on the connection portion 201 and is disposed relative to the first vent 2011.

[0058] Specifically, such as Figure 1 As shown in the embodiment of this application, the inner chamber 3 includes a first vent 2011 communicating with the outside. The first vent 2011 is disposed on the connecting portion 201 and passes through the connecting portion 201. The microphone also includes a MEMS chip 7, which is disposed on the connecting portion 201 and on the side of the first vent 2011 near the inner chamber 3, thereby dividing the inner chamber 3 into a first chamber 301 and a second chamber 302. The first chamber 301 is provided with electronic components, and the second chamber 302 communicates with the first vent 2011. The MEMS chip 7 can be fixed to the flexible circuit board 2 by means of solder connection, conductive adhesive connection, and gold-tin solder connection, so that the microphone can directly utilize the flexible circuit board 2 to arrange and support the MEMS chip 7, thereby effectively ensuring the stability of the microphone.

[0059] Therefore, when the microphone is in use, outside air can enter the second chamber 302 through the first vent 2011. The MEMS chip 7 can convert the physical signals carried by the air into electrical signals and send them to the electronic components in the first chamber 301 for processing, thereby effectively ensuring the performance of the microphone.

[0060] In addition, the first vent 2011 of this application may also be provided with a waterproof membrane and a dustproof net. The waterproof membrane is used to separate the first chamber from the outside world to effectively prevent external liquids from entering the first chamber 301 and affecting the performance of the MEMS chip 7. The dustproof net is provided on the side of the waterproof membrane away from the first chamber 301. The dustproof net can realize the foreign object protection function of the microphone to effectively prevent external solid impurities from damaging the waterproof membrane.

[0061] In one embodiment, the support plate 5 includes a second vent 501, which communicates with the first vent 2011.

[0062] Specifically, such as Figure 1 As shown, after the support plate 5 is connected to the connecting part 201, the second vent 501 on the support plate 5 corresponds to the first vent 2011 on the connecting part 201, so that outside air can enter the first chamber 301 through the second vent 501 and the first vent 2011 in sequence, thereby effectively ensuring the performance of the microphone.

[0063] Among them, such as Figure 1 As shown, in order to further enhance the microphone's pressure resistance, reduce the microphone's acoustic noise, and improve the microphone's signal-to-noise ratio, it is preferable that the diameter of the second vent 501 is smaller than the diameter of the first vent 2011.

[0064] In one embodiment, the microphone further includes an ASIC chip 8, a first gold wire 9, and a second gold wire 10. The ASIC chip 8 is disposed on the connection portion 201. The ASIC chip 8 is electrically connected to the MEMS chip 7 via the first gold wire 9, and the ASIC chip 8 is electrically connected to the pad 2021 via the second gold wire 10.

[0065] Specifically, such as Figure 1 As shown, the ASIC chip 8 described in this embodiment can be fixed to the flexible circuit board 2 by means of solder connection, conductive glue connection, and gold solder pad connection, so that the microphone can directly use the flexible circuit board 2 to arrange and support the ASIC chip 8, thereby effectively ensuring the stability of the microphone.

[0066] The microphone also includes a first gold wire 9 and a second gold wire 10. The ASIC chip 8 is electrically connected to the MEMS chip 7 through the first gold wire 9, and the ASIC chip 8 is electrically connected to the pad 2021 through the second gold wire 10, thereby effectively improving the integration of the microphone.

[0067] Among them, such as Figure 1 As shown, in order to further simplify the electrical connection circuit of the microphone and avoid external impurities from affecting the electrical connection between the ASIC chip 8 and the pad 2021, it is preferable to place the second gold wire 10 in the bending portion 202 so that the bending portion 202 can serve as a guide and protective component for the second gold wire 10.

[0068] According to another embodiment of this application, an electronic device is provided, the electronic device including the microphone described in the embodiments of this application.

[0069] Specifically, the electronic device described in this application embodiment can be any one of a mobile phone, tablet computer, personal digital assistant, television, smart wearable product, virtual reality terminal device, augmented reality terminal device, rechargeable small household appliances (such as soy milk maker, robot vacuum cleaner), drone, radar, aerospace equipment, and vehicle-mounted equipment. The microphone can be directly fixed to the above-mentioned electronic device, or the microphone can be detachably installed on the above-mentioned electronic device.

[0070] The above embodiments mainly describe the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. For the sake of brevity, they will not be elaborated here.

[0071] Although specific embodiments of the present invention have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of the present invention. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A microphone, characterized in that, include: Shell (1); A flexible circuit board (2) includes a connecting portion (201) and a bending portion (202). The connecting portion (201) is connected to the housing (1), and an inner cavity (3) is formed between the connecting portion (201) and the housing (1). The connecting portion (201) includes a first vent (2011), which enables the inner cavity (3) to communicate with the outside. The bending portion (202) is located outside the inner cavity (3) and includes a pad (2021). A support plate (5) is connected to the connecting part (201) on the side away from the housing (1); the support plate (5) includes a second vent (501), which communicates with the first vent (2011), and the diameter of the second vent (501) is smaller than the diameter of the first vent (2011).

2. The microphone according to claim 1, characterized in that, It also includes a first adhesive (4), through which the bent portion (202) is connected to the housing (1).

3. The microphone according to claim 2, characterized in that, The hardness of the support plate (5) is greater than that of the connecting part (201).

4. The microphone according to claim 3, characterized in that, It also includes a second adhesive (6), through which the support plate (5) is connected to the side of the connecting part (201) away from the housing (1).

5. The microphone according to claim 4, characterized in that, The Shore A hardness of the second adhesive (6) is less than 90 degrees.

6. The microphone according to claim 3, characterized in that, The support plate (5) is a stainless steel plate or a PCB.

7. The microphone according to claim 3, characterized in that, The microphone also includes a MEMS chip (7), which is disposed on the connection portion (201) and is disposed relative to the first vent (2011).

8. The microphone according to claim 7, characterized in that, It also includes an ASIC chip (8), a first gold wire (9) and a second gold wire (10). The ASIC chip (8) is disposed on the connection part (201). The ASIC chip (8) is electrically connected to the MEMS chip (7) through the first gold wire (9). The ASIC chip (8) is electrically connected to the pad (2021) through the second gold wire (10).

9. An electronic device, characterized in that, Includes the microphone as described in any one of claims 1-8.

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