Chip automatic test sorting system
By designing an automated chip testing and sorting system, the system achieves automation and accuracy in high and low temperature testing, solves the problems of inaccurate test results and low efficiency, reduces costs, and meets national standards.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- XIAN TIANJI XINKE SEMICONDUCTOR EQUIPMENT CO LTD
- Filing Date
- 2025-05-30
- Publication Date
- 2026-05-29
AI Technical Summary
Current high and low temperature testing methods for chips are inaccurate, inefficient, and costly to operate manually, making it difficult to meet national standards.
Design an automated chip testing and sorting system, including an automated feeding module, an automated discharging module, a high and low temperature chamber, a test arm module, and a testing system. The chip testing is performed directly in the high and low temperature chamber through the test arm, achieving automated operation and temperature control.
It improves the reliability and efficiency of test results, reduces test costs, and can accurately sort chips in high and low temperature environments, meeting national standards.
Smart Images
Figure CN224306245U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of integrated circuit testing technology and relates to an automatic chip testing and sorting system. Background Technology
[0002] Chips used in aerospace environments must undergo high-temperature, low-temperature, and room-temperature tests according to national standards to ensure their performance and reliability. These tests assess the chip's performance under different ambient temperatures and predict its lifespan and reliability. Furthermore, high and low temperature testing improves chip manufacturing and production quality, reduces failure rates during actual use, and increases user satisfaction.
[0003] In summary, high and low temperature testing is a crucial quality control step for chips, ensuring their performance and reliability and enhancing product competitiveness. Therefore, high and low temperature testing is essential during chip design, manufacturing, and use to guarantee chip stability and reliability.
[0004] The national standard requires that after thorough heating or cooling in a high or low temperature environment (the time for thorough heating and cooling varies depending on the chip size), various indicators of the chip should be tested. Currently, the three-temperature test is performed manually. The high and low temperature chamber usually has a drawer-type inner cavity. After the chip is placed into this drawer of the high and low temperature chamber, it is heated or cooled according to the national standard requirements, and held at the specified temperature for the specified time. Then, the operator quickly removes a chip and places it on a dedicated test socket connected to the testing system. The testing system automatically determines whether the chip's various indicators are qualified.
[0005] Defects and shortcomings of existing technology:
[0006] 1. Test results cannot guarantee the reliability of the chip. The test temperature generally requires a low temperature of -50℃ and a high temperature of +150℃. After the chip leaves the high and low temperature chamber, it is affected by the ambient temperature, and the temperature changes drastically. The temperature during the test is already too far from the specified temperature, and the process does not meet the national standard requirements. The test system will judge the test as qualified, but there will be problems in actual use.
[0007] 2. Manual testing is costly and inefficient. Utility Model Content
[0008] The purpose of this invention is to overcome the shortcomings of the existing technology and provide an automatic chip testing and sorting system with high testing accuracy and efficiency.
[0009] According to a first aspect of the present invention, an automatic chip testing and sorting system is provided, which includes an automatic feeding module, an automatic discharging module, a high and low temperature chamber, a test arm module, and a testing system;
[0010] The automatic feeding module and the automatic discharging module are respectively located on both sides of the high and low temperature chamber, the testing system is located below the high and low temperature chamber, and the testing arm module is located above the high and low temperature chamber.
[0011] Both the automatic feeding module and the automatic discharging module are equipped with a pallet basket, a first automatic lifting platform, and a pallet module dragging mechanism. The automatic lifting platform is connected to the pallet basket to drive the pallet basket to move up and down. Several pallet modules are placed inside the pallet basket, and the pallet module dragging mechanism can drag the pallet modules to move left and right.
[0012] In one embodiment, a preheating waiting module is provided inside the high and low temperature chamber on the side near the automatic feeding module;
[0013] The preheating waiting module is equipped with an upper tray track, a lower tray track, a second automatic lifting platform, and a tray track opening and closing mechanism. The tray track opening and closing mechanism can adjust the distance between the two tracks of the upper tray track.
[0014] When the target pallet module in the automatic feeding module is conveyed to the upper pallet track, the second automatic lifting platform rises to support the target pallet module, the upper pallet track opens, the second lifting platform descends, the target pallet module falls into the lower pallet track, and the upper pallet track closes to wait for the next pallet module.
[0015] In one embodiment, a tray dragging module is provided between the high and low temperature chamber and the testing system;
[0016] The pallet dragging module can drag the target pallet module from the lower pallet track to the pallet track in the test area of the high and low temperature chamber, and after the test is completed, drag the target pallet module to the side of the high and low temperature chamber near the automatic discharge module.
[0017] In one embodiment, the top of the high and low temperature chamber is provided with a first opening, and the test arm module extends into the high and low temperature chamber through the first opening;
[0018] A suction nozzle is provided at one end of the test arm module near the high and low temperature chamber. The suction nozzle picks up the chip in the target tray module in the test area of the high and low temperature chamber and transfers it to the test system, and picks up the chip after the test is completed and transfers it to the target tray module.
[0019] In one embodiment, the bottom of the high and low temperature chamber is provided with a second opening, and the test seat on the test system extends into the high and low temperature chamber through the second opening.
[0020] In one embodiment, the high and low temperature chamber is provided with a feed door on one side and a discharge door on the other side. The automatic feeding module is connected to the high and low temperature chamber through the feed door, and the automatic discharge module is connected to the high and low temperature chamber through the discharge door.
[0021] The high and low temperature chamber and the test arm module are sealed by a flexible connector.
[0022] In one embodiment, the tray module includes a tray base, on which a material tray, a sorting area, and a test window area are provided. The material tray is used to place chips to be tested, and the sorting area is used to place defective chips.
[0023] In one embodiment, the test window area is located at the center of the tray chassis, the sorting area is located on both sides of the test window area, and the material tray module is located on the other two sides of the test window area.
[0024] In one embodiment, the sorting area includes a high-temperature defective area, a room-temperature defective area, and a low-temperature defective area. The high-temperature defective area is used to place chips that fail the high-temperature test, the room-temperature defective area is used to place chips that fail the room-temperature test, and the low-temperature defective area is used to place chips that fail the low-temperature test.
[0025] In one embodiment, a cylinder is provided at both the feed gate and the discharge gate.
[0026] The implementation of this utility model has the following technical effects:
[0027] In the automatic chip testing and sorting system provided by this utility model embodiment, both the testing arm and the testing system extend directly into the high and low temperature chamber. The testing arm picks up the chip to complete the test inside the high and low temperature chamber, thereby making the test temperature more in line with the requirements and significantly improving the reliability of the test results.
[0028] Furthermore, in the automatic chip testing and sorting system provided by this embodiment, the chip is picked up by the testing arm and placed into the testing socket of the testing system for testing, which can improve testing efficiency and save testing costs.
[0029] Furthermore, the automatic chip testing and sorting system provided in this embodiment of the present invention can provide chip operating data status under high temperature and low temperature environments, and can sort chips according to chip data status to further improve chip testing efficiency. Attached Figure Description
[0030] Figure 1 This is a schematic diagram of the structure of the automatic chip testing and sorting system of this utility model.
[0031] Figure 2 This is a schematic diagram of the tray structure and the preheating waiting module in the chip automatic testing and sorting system of this utility model.
[0032] In the diagram, 1-Automatic feeding module, 2-Preheating waiting module, 3-Test arm module, 4-High and low temperature chamber, 5-Automatic discharge module, 6-Test system, 7-Tray module, 8-Tray dragging module, 9-Air conditioning unit, 21-Upper tray track, 22-Lower tray track, 23-Second automatic lifting platform, 24-Tray track opening and closing mechanism, 71-Tray chassis, 72-Material tray, 73-Sorting area, 74-Test window area. Detailed Implementation
[0033] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. In the following description, when referring to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this invention. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this invention as detailed in the appended claims.
[0034] like Figure 1 As shown, the automatic chip testing and sorting system of this utility model includes an automatic feeding module 1, an automatic discharging module 5, a high and low temperature chamber 4, a testing arm module 3, and a testing system 6. The automatic feeding module 1 and the automatic discharging module 5 are respectively arranged on both sides of the high and low temperature chamber 4, the testing system 6 is arranged below the high and low temperature chamber 4, and the testing arm module 3 is arranged above the high and low temperature chamber 4. Each of the automatic feeding module 1 and the automatic discharging module 5 is provided with a tray basket, a first automatic lifting platform, and a tray module dragging mechanism. The automatic lifting platform is connected to the tray basket to drive the tray basket to move up and down. Several tray modules 7 are placed in the tray basket, and the tray module dragging mechanism can drag the tray modules 7 to move left and right.
[0035] The automatic chip testing and sorting system provided in this embodiment of the invention directly inserts both the test arm module 3 and the test system 6 into the high and low temperature chamber 4. The test arm module 3 picks up the chip, allowing testing to be completed inside the chamber 4. This ensures the test temperature meets requirements, significantly improving the reliability of test results. Furthermore, the automatic chip testing and sorting system provided in this embodiment improves testing efficiency and reduces costs by placing the chip into the test socket of the test system 6. Moreover, the automatic chip testing and sorting system provided in this embodiment can provide chip operating data status under high and low temperature environments and can sort chips based on this data status, further improving chip testing efficiency.
[0036] like Figure 2 As shown, a preheating waiting module 2 is provided on the side of the high and low temperature chamber 4 near the automatic feeding module 1. The preheating waiting module 2 is provided with an upper tray track 21, a lower tray track 22, a second automatic lifting platform 23, and a tray track opening and closing mechanism. The tray track opening and closing mechanism can adjust the distance between the two tracks of the upper tray track 21. When the target tray module 7 in the automatic feeding module 1 is transported to the upper tray track 21, the second automatic lifting platform 23 rises to support the target tray module 7, the upper tray track 21 opens, the second lifting platform descends, the target tray module 7 falls into the lower tray track 22, and the upper tray track 21 closes to wait for the next tray module 7.
[0037] In this embodiment, the preheating waiting module 2 is placed inside the high and low temperature chamber 4 near the automatic feeding module 5, and includes an upper tray track 21, a lower tray track 22, a second automatic lifting platform 23, and a tray track opening and closing mechanism 24, allowing the tray module 7 to move freely within the tray track. Specifically, when the tray module 7 is pulled from the tray basket of the automatic feeding module 1 through the feeding door of the high and low temperature chamber 4 into the upper tray track 21 of the preheating waiting module 2 by the automatic feeding module 1, the second automatic lifting platform 23 rises to the position of the tray module 7 on the upper tray track 21 to support the tray module 7, and the upper tray track 21 opens. The second automatic lifting platform 23 descends, and the tray module 7 falls into the lower tray track 22. The upper tray track 21 closes, waiting for the next tray module 7 to be pulled in. The tray module 7 that falls into the lower tray track 22 is placed for a predetermined time after the high and low temperatures reach the preset temperature. This allows the tray module 7, which is currently being tested, to be quickly transported to the test position by the tray dragging module 8 after the test system 6 has finished testing the tray module 7 currently being tested. This avoids wasting test time due to the test system 6 waiting for the tray module 7 to be dragged, thereby improving test efficiency. Furthermore, in this embodiment of the invention, the testing process is completely automated, replacing the manual operation of opening the high and low temperature chamber drawer, taking out a circuit, closing the drawer, testing a circuit, and then opening the drawer again to take out another circuit. This repeated operation significantly improves test efficiency.
[0038] like Figure 1 As shown, a tray dragging module 8 is provided between the high and low temperature chamber 4 and the test system 6; the tray dragging module 8 can drag the target tray module 7 from the lower tray track 22 to the tray track in the test area of the high and low temperature chamber 4, and after the test, drag the target tray module 7 to the side of the high and low temperature chamber 4 near the automatic discharge module 5.
[0039] In this embodiment of the utility model, the tray dragging module 8 is placed below the high and low temperature chamber 4 to drag the tray module 7 from the lower tray track 22 in the preheating waiting module to the tray track in the test area of the high and low temperature chamber 4. After the test is completed, the tray dragging module 8 is dragged to the side of the tray track in the test area of the high and low temperature chamber 4 near the automatic discharge module 5. Finally, the dragging mechanism of the automatic discharge module 5 drags it into the basket of the discharge module.
[0040] Specifically, the top of the high and low temperature chamber 4 is provided with a first opening, and the test arm module 3 extends into the interior of the high and low temperature chamber 4 through the first opening; a suction nozzle is provided on one end of the test arm module 3 near the high and low temperature chamber 4, and the suction nozzle picks up the chip in the target tray module 7 in the test area of the high and low temperature chamber 4 and transfers it to the test system 6, and picks up the chip after the test is completed and transfers it to the target tray module 7.
[0041] In this embodiment, a first opening is provided at the top of the high and low temperature chamber 4 so that the test arm module 3 can extend into the high and low temperature chamber 4 through the first opening. A suction nozzle is provided at one end of the test arm module 3 near the high and low temperature chamber 4 so that the chips in the tray module 7 can be sucked up in a certain order and placed into the test socket of the test system 6 for testing. After the test is completed, the test arm module 3 places the chips into the designated area of the tray module 7 according to whether the test results are qualified.
[0042] It should be noted that after all the chips on one tray module 7 in this embodiment have been tested and placed according to the test results, the test arm module 3 is lifted, the tray dragging module 8 drags the tray module 7 to the side of the tray track in the test area close to the automatic discharge module 5, the discharge door of the high and low temperature chamber 4 is opened, the lifting platform of the automatic discharge module 5 moves up and down, so that the empty space in the tray basket of the automatic discharge module 5 is aligned with the test track in the test area, the tray module dragging mechanism of the automatic discharge module 5 drags the tray module 7 to the empty space in the basket of the automatic discharge module 5, and the discharge door of the high and low temperature chamber 4 is closed.
[0043] It is understood that the bottom of the high and low temperature chamber 4 is provided with a second opening, and the test seat on the test system 6 extends into the high and low temperature chamber 4 through the second opening.
[0044] like Figure 1 As shown, the high and low temperature chamber 4 has a feed door on one side and a discharge door on the other side. The automatic feeding module 1 is connected to the high and low temperature chamber 4 through the feed door, and the automatic discharge module 5 is connected to the high and low temperature chamber 4 through the discharge door. The high and low temperature chamber 4 and the test arm module 3 are sealed by a flexible connector.
[0045] like Figure 2 As shown, the tray module 7 includes a tray base 71, on which a material tray 72, a sorting area 73 and a test window area 74 are provided. The material tray 72 is used to place the chip to be tested, and the sorting area 73 is used to place the defective chip.
[0046] Preferably, the test window area 74 is located at the center of the tray base 71, the sorting area 73 is located on both sides of the test window area 74, and the material tray 72 is located on the other two sides of the test window area 74.
[0047] In this embodiment, the test window area 74 is set at the center of the tray base 71, the sorting area 73 is set on both sides of the test window area 74, and the material tray 72 is set on the other two sides of the test window area 74, so that the nozzle of the test arm can quickly place the tested chips into the corresponding positions according to the test results.
[0048] More preferably, the sorting area 73 includes a high-temperature defective area, a room-temperature defective area, and a low-temperature defective area. The high-temperature defective area is used to place chips that fail the high-temperature test, the room-temperature defective area is used to place chips that fail the room-temperature test, and the low-temperature defective area is used to place chips that fail the low-temperature test.
[0049] In this embodiment, by setting the sorting area 73 to include a high-temperature failure area, a room-temperature failure area, and a low-temperature failure area, and by setting the high-temperature failure area to place chips that failed the high-temperature test, the room-temperature failure area to place chips that failed the room-temperature test, and the low-temperature failure area to place chips that failed the low-temperature test, when the chips on the entire tray module 7 are tested and the tray module 7 is dragged outside the high and low temperature chamber 4, the staff can quickly pick out the qualified chips, the high-temperature failure chips, the room-temperature failure chips, and the low-temperature failure chips, thereby further improving work efficiency.
[0050] Preferably, a cylinder is provided at both the feed gate and the discharge gate to drive the feed gate and the discharge gate to open or close automatically.
[0051] It is understood that the cold and hot air inside the high and low temperature chamber of the automatic chip testing and sorting system in this embodiment of the present invention are provided by an externally connected air conditioning unit 9.
[0052] The working process of the automated chip testing and sorting system provided in this implementation is as follows:
[0053] The operator loads two trays 72 containing the chips into the tray module 7, opens the door of the automatic feeding module 1, and places the tray module 7 into the empty tray basket within the automatic feeding module 1. The lifting platform of the automatic feeding module 1 moves up and down until the tray module 7 to be loaded is aligned with the upper tray track 21 of the preheating waiting module 2. Then, the feed door of the high and low temperature chamber 4 opens, and the tray module dragging mechanism of the automatic feeding module 1 lifts the tray module 7 from the tray basket of the automatic feeding module through the feed door of the high and low temperature chamber 4 into the upper tray track 21 of the preheating waiting module 2. The material gate is closed; the second automatic lifting platform 23 of the preheating waiting module 2 rises to the position of the tray module 7 on the upper tray track 21. When the tray module 7 is supported, the upper tray track 21 opens, the second automatic lifting platform 23 descends, and the tray module 7 falls into the lower tray track 22. The upper tray track 21 closes, waiting for the next tray module 7 to be dragged in. The tray module 7 that falls into the lower tray track 22 is placed for a specified time after the high and low temperatures reach the specified temperatures. Then it is dragged to the test area by the tray dragging module 8. The test arm module 3 starts to move. The test arm nozzle picks up the chips in the tray module 7 in a certain order and puts them into the test socket of the test system 6 for testing. After the test is completed, the test arm module 3 puts the chips into the designated area of the tray module 7 according to whether the test results are qualified. After all the chips on tray module 7 have been tested and placed according to the test results, test arm module 3 is raised, and tray dragging module 8 drags tray module 7 to the side of the tray track in the test area close to the automatic discharge module 5. The discharge door of high and low temperature chamber 4 is opened, and the lifting platform of automatic discharge module 5 moves up and down to align the empty space in the tray basket of automatic discharge module 5 with the test track in the test area. The tray module dragging mechanism of automatic discharge module 5 drags tray module 7 to the empty space in the basket of automatic discharge module 5, and the discharge door of high and low temperature chamber 4 is closed.
[0054] Other embodiments of the present invention will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of the present invention that follow the general principles of the present invention and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of the present invention are indicated by the following claims.
[0055] It should be understood that this invention is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this invention is limited only by the appended claims.
Claims
1. An automated chip testing and sorting system, characterized in that, The chip automatic testing and sorting system includes an automatic feeding module, an automatic discharging module, a high and low temperature chamber, a test arm module, and a testing system. The automatic feeding module and the automatic discharging module are respectively located on both sides of the high and low temperature chamber, the testing system is located below the high and low temperature chamber, and the testing arm module is located above the high and low temperature chamber. Both the automatic feeding module and the automatic discharging module are equipped with a pallet basket, a first automatic lifting platform, and a pallet module dragging mechanism. The automatic lifting platform is connected to the pallet basket to drive the pallet basket to move up and down. Several pallet modules are placed inside the pallet basket, and the pallet module dragging mechanism can drag the pallet modules to move left and right.
2. The chip automatic testing and sorting system as described in claim 1, characterized in that, A preheating waiting module is provided inside the high and low temperature chamber on the side near the automatic feeding module; The preheating waiting module is equipped with an upper tray track, a lower tray track, a second automatic lifting platform, and a tray track opening and closing mechanism. The tray track opening and closing mechanism can adjust the distance between the two tracks of the upper tray track. When the target pallet module in the automatic feeding module is conveyed to the upper pallet track, the second automatic lifting platform rises to support the target pallet module, the upper pallet track opens, the second automatic lifting platform descends, the target pallet module falls into the lower pallet track, and the upper pallet track closes, waiting for the next pallet module.
3. The chip automatic testing and sorting system as described in claim 2, characterized in that, A tray dragging module is provided between the high and low temperature chamber and the testing system; The pallet dragging module can drag the target pallet module from the lower pallet track to the pallet track in the test area of the high and low temperature chamber, and after the test is completed, drag the target pallet module to the side of the high and low temperature chamber near the automatic discharge module.
4. The chip automatic testing and sorting system as described in claim 3, characterized in that, The top of the high and low temperature chamber is provided with a first opening, and the test arm module extends into the high and low temperature chamber through the first opening; A suction nozzle is provided at one end of the test arm module near the high and low temperature chamber. The suction nozzle picks up the chip in the target tray module in the test area of the high and low temperature chamber and transfers it to the test system, and picks up the chip after the test is completed and transfers it to the target tray module.
5. The chip automatic testing and sorting system as described in claim 3, characterized in that, The bottom of the high and low temperature chamber is provided with a second opening, and the test seat on the test system extends into the high and low temperature chamber through the second opening.
6. The chip automatic testing and sorting system as described in claim 3, characterized in that, The high and low temperature chamber is provided with a feed door on one side and a discharge door on the other side. The automatic feeding module is connected to the high and low temperature chamber through the feed door, and the automatic discharge module is connected to the high and low temperature chamber through the discharge door. The high and low temperature chamber and the test arm module are sealed by a flexible connector.
7. The chip automatic testing and sorting system according to any one of claims 1 to 6, characterized in that, The tray module includes a tray base, on which a material tray, a sorting area, and a test window area are provided. The material tray is used to place the chips to be tested, and the sorting area is used to place the defective chips.
8. The automatic chip testing and sorting system as described in claim 7, characterized in that, The test window area is located at the center of the tray base, the sorting area is located on both sides of the test window area, and the material tray is located on the other two sides of the test window area.
9. The automatic chip testing and sorting system as described in claim 8, characterized in that, The sorting area includes a high-temperature defective area, a room-temperature defective area, and a low-temperature defective area. The high-temperature defective area is used to place chips that fail the high-temperature test, the room-temperature defective area is used to place chips that fail the room-temperature test, and the low-temperature defective area is used to place chips that fail the low-temperature test.
10. The automatic chip testing and sorting system as described in claim 6, characterized in that, Both the feed gate and the discharge gate are equipped with cylinders.