Wafer on-off device

Abstract

The utility model provides a kind of wafer feeding and discharging device, including machine table, be equipped with carrier plate storage mechanism and jam storage mechanism on machine table, wafer front face is placed in jam upwards, still be equipped with first wafer manipulator and second wafer manipulator on machine table, first wafer manipulator is docked with jam storage mechanism, second wafer manipulator is docked with carrier plate storage mechanism, still be equipped with transfer carousel on machine table, first wafer manipulator and second wafer manipulator are all docked with transfer carousel;The end of second wafer manipulator is equipped with bernoulli suction component, the end of first wafer manipulator is equipped with support component. By support component is placed on transfer carousel, then bernoulli suction component is in suction transfer carousel on wafer, bernoulli suction component non-contact suction mode can avoid contacting the effective area of wafer front face, by support component can make small structure from bottom support mode and extend into jam, simultaneously avoid the problem that wafer back cannot be suctioned.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment technology, and in particular to a wafer loading and unloading device. Background Technology

[0002] In semiconductor manufacturing processes, such as the LED industry, wafer cleaning is crucial, especially when using plasma cleaning, requiring extra care in wafer placement and protection. Wafers must be placed on specialized cleaning trays during plasma cleaning. Because the front side of the wafer (excluding the invalid areas at the edges) is a highly clean and sensitive area, it must never come into contact with any potentially contaminated objects during the cleaning process. Furthermore, the trays used for plasma cleaning must be free of holes to prevent plasma leakage or other potential damage to the wafer.

[0003] However, in traditional wafer cleaning processes, due to the special structure of the cleaning tray, the back side of the wafer cannot be picked up by automated equipment. This means that wafer loading and unloading operations can only be performed manually. Manual operation is not only inefficient but also prone to errors during wafer turnover, leading to wafer damage or secondary contamination. Utility Model Content

[0004] To address the aforementioned problems, the purpose of this invention is to provide a wafer loading and unloading device.

[0005] This utility model is implemented using the following method: a wafer loading and unloading device includes a machine base, on which a tray storage mechanism and a cassette storage mechanism are provided. A wafer is placed face up in the cassette. The machine base is also equipped with a first wafer robot and a second wafer robot. The first wafer robot is connected to the cassette storage mechanism, and the second wafer robot is connected to the tray storage mechanism. The machine base is also equipped with a transfer turntable, and both the first and second wafer robots are connected to the transfer turntable. The end of the second wafer robot is equipped with a Bernoulli pick-up component, and the end of the first wafer robot is equipped with a holding component. The holding component is used to remove the wafer from the cassette and place it on the transfer turntable, and the Bernoulli pick-up component is used to pick up the wafer from the transfer turntable and place it on the tray.

[0006] Preferably, the first wafer manipulator further includes a multi-axis moving assembly, and the picking assembly includes an R-axis rotating component mounted on the multi-axis moving assembly, the R-axis rotating component being connected to a toothed fork.

[0007] Preferably, the upper surface of the toothed fork is provided with a first groove, and the bottom surface of the first groove is provided with an adsorption groove; the adsorption groove is connected to a vacuum generator; the R-axis rotating component includes a fixed frame and a rotary motor mounted on the fixed frame, and the output shaft of the rotary motor is fixedly connected to the toothed fork.

[0008] Preferably, the Bernoulli suction assembly includes a housing and a Bernoulli suction cup located at the center of the housing. The housing is mounted on the end of the second wafer manipulator. The lower end face of the housing is surrounded by a plurality of arc-shaped blocks at intervals, and the gaps between adjacent arc-shaped blocks form air passages.

[0009] Preferably, the transfer turntable includes a rotating frame, which is driven to rotate by a first motor. The upper surface of the rotating frame is provided with a plurality of supporting parts. The upper surface of the supporting parts is provided with a clearance groove from top to bottom, and has an opening at one end away from the center of the rotating frame to avoid the lifting component.

[0010] Preferably, the upper surface of the support portion is provided with a second support groove that matches the shape and size of the wafer, and the clearance groove is provided from the bottom surface of the second support groove downwards; the second support groove is provided with a plurality of vacuum adsorption holes at a position avoiding the clearance groove, and the vacuum adsorption holes are connected to a vacuum generator.

[0011] Preferably, the disk storage mechanism includes a multi-layer storage rack, which is mounted on the machine base. A disk handling assembly is provided on the machine base between the storage rack and the second wafer robot. The disk handling assembly is used to remove disks from the storage rack or to store disks containing wafers into the storage rack.

[0012] Preferably, the pallet handling assembly includes a lifting platform, which is mounted on the machine base. A translation drive is installed on the lifting platform, and a gripper cylinder is installed on the translation drive for gripping the pallet.

[0013] Preferably, each layer of the storage rack is provided with a removable drawer-type carrier, which is longitudinally divided into multiple layers. Each layer of the carrier is provided with multiple rollers on both sides of the tray inlet / outlet direction. The end of the carrier facing the tray transport assembly is open for pushing in and taking out the tray. Each layer of the storage rack is provided with movable blocking members at both ends of the tray inlet / outlet direction.

[0014] Preferably, the storage rack has a transport trolley connected to the carrier at the end opposite to the tray transport assembly; the trolley has the same number of layers as the storage rack, and each layer has the same height as the corresponding storage rack layer; each layer of the trolley has swingable limiting blocks on both sides, one at the end facing the storage rack and the other at the end opposite to the storage rack; the distance between the limiting blocks at both ends on the same side is equal to the length of the carrier; and a linkage shaft is fixedly connected between the limiting blocks at both ends on the same side.

[0015] The beneficial effects of this utility model are as follows: This utility model provides a wafer loading and unloading device. Compared with the prior art, this utility model has at least the following technical effects: 1. It uses a first wafer manipulator and a second wafer manipulator. The second wafer manipulator is equipped with a Bernoulli pick-up component, and the first wafer manipulator is equipped with a holding component and a transfer turntable. The wafer is placed on the transfer turntable by the holding component, and then the Bernoulli pick-up component picks up the wafer on the transfer turntable. The non-contact pick-up method of the Bernoulli pick-up component can avoid contact with the effective area on the front side of the wafer. The internal space of the chuck is narrow and the Bernoulli pick-up component cannot reach in. However, the holding component can be made smaller and can reach into the chuck from the bottom. At the same time, it avoids the problem of not being able to pick up the back side of the wafer, realizes the automated handling of wafers, avoids the wafer damage and handling stagnation caused by errors in manual handling, and helps to improve the handling efficiency and ensure the stability of the production line cycle. 2. The structure of the toothed fork is designed to easily reach into narrow spaces. It has an R-axis rotating component to drive the toothed fork to rotate, which facilitates the removal of the wafer and its placement on the transfer turntable. 3. The surface of the fork has a groove with a suction groove. The back of the wafer cannot be held in place, but since the wafer is supported on the fork, minimal force is needed to hold it in the groove. The suction groove only requires a small amount of suction, preventing the wafer from falling and being damaged when the fork moves. 4. An arc-shaped stop is arranged around the Bernoulli suction cup on the housing of the Bernoulli pick-up assembly. This stop limits the wafer during pick-up to prevent it from being thrown out and damaged. 5. A transfer turntable is used to position and place the wafer removed from the chuck. This allows the pick-up assembly to place the wafer at a fixed position each time, and the Bernoulli pick-up assembly to pick it up at the same position, reducing the difficulty of positioning during pick-up and placement and improving the accuracy of pick-up and placement. 6. A second groove with a vacuum suction hole is provided on the placement section to provide suction to hold the wafer on the placement section, preventing it from being thrown out when the rotating frame rotates. 7. The storage rack of the tray storage component has multiple layers and is equipped with a tray handling component to realize the retrieval and storage of multiple trays. This avoids the need for manual loading and unloading of trays in real time. The trays only need to be replaced once at certain intervals, which can significantly reduce the workload, improve production efficiency, and ensure the stability of the production cycle. Attached Figure Description

[0016] Figure 1This is a three-dimensional structural diagram of a wafer loading and unloading device according to the present invention.

[0017] Figure 2 This is a schematic diagram showing the docking state of the tray storage mechanism and the transport trolley of this utility model.

[0018] Figure 3 This is a schematic diagram of the connection between the storage rack and the carrier of the disk storage mechanism of this utility model.

[0019] Figure 4 This is another perspective view of the connection between the storage rack and the carrier of the disk storage mechanism of this utility model.

[0020] Figure 5 This is a schematic diagram of the disk transport component of the disk storage mechanism of this utility model.

[0021] Figure 6 This is a schematic diagram of the structure of the first wafer manipulator of this utility model.

[0022] Figure 7 This is a schematic diagram of the structure of the first wafer manipulator of this utility model.

[0023] Figure 8 This is a schematic diagram of the Bernoulli pick-up component of the second wafer manipulator of this utility model.

[0024] Figure 9 This is a schematic diagram of the state of the Bernoulli picking component of the second wafer manipulator of this utility model picking up a wafer.

[0025] Figure 10 This is a schematic diagram of the structure of the transfer turntable of this utility model.

[0026] Figure 11 This is a schematic diagram of the structure of the transport trolley of this utility model.

[0027] Explanation of icon numbers: 1. Machine;

[0028] 2. Disk storage mechanism;

[0029] 21. Storage rack; 211. Blocking element; 212. Cargo tray detection sensor; 213. First limit bar; 214. In / out detection sensor;

[0030] 22. Tray handling assembly; 221. Lifting platform; 222. Translation drive unit; 223. Gripper cylinder; 224. Alignment cylinder; 225. Positioning block;

[0031] 23. Vehicle; 231. Roller; 232. Floor; 233. Side panel; 234. Handle;

[0032] 3. Casing storage mechanism; 31. Storage rack; 32. Wafer entry / exit sensor;

[0033] 4. First wafer robot; 41. Picking assembly; 411. R-axis rotating component; 412. Toothed fork; 413. First tray; 414. Adsorption tray; 42. Multi-axis moving assembly; 43. Laser sensor;

[0034] 5. Second wafer manipulator; 51. Bernoulli suction assembly; 511. Housing; 512. Bernoulli suction cup; 513. Arc stop; 514. First sensor;

[0035] 6. Transfer turntable; 61. Rotating frame; 62. Placement section; 63. Relief groove; 64. Second placement groove; 65. Vacuum adsorption hole; 7. Carrier tray; 71. Clamping block; 8. Wafer; 9. Transport trolley; 91. Limiting block; 92. Linkage shaft; 93. Second limiting bar; 10. Plug. Detailed Implementation

[0036] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0037] Please see Figures 1 to 11A wafer 8 loading and unloading device includes a machine base 1, on which a tray storage mechanism 2 and a cassette storage mechanism 3 are provided. The wafer 8 is placed face up in a cassette 10. The machine base 1 is also provided with a first wafer robot 4 and a second wafer robot 5. The first wafer robot 4 is connected to the cassette storage mechanism 3, and the second wafer robot 5 is connected to the tray storage mechanism 2. The machine base 1 is also provided with a transfer turntable 6, on which both the first wafer robot 4 and the second wafer robot 5 are connected. The end of the second wafer robot 5 is provided with a Bernoulli pick-up component 51, and the end of the first wafer robot 4 is provided with a pick-up component 41. The pick-up component 41 is used to remove the wafer 8 from the cassette 10 and place it on the transfer turntable 6. The Bernoulli pick-up component 51 is used to pick up the wafer 8 from the transfer turntable 6 and place it on a tray 7. The wafer is handled by a first wafer robot 4 and a second wafer robot 5. The second wafer robot 5 is equipped with a Bernoulli pick-up component 51, and the first wafer robot 4 is equipped with a pick-up component 41 and a transfer turntable 6. The wafer is placed on the transfer turntable 6 by the pick-up component 41, and then the Bernoulli pick-up component 51 picks up the wafer 8 on the transfer turntable 6. The Bernoulli pick-up component 51 uses a non-contact pick-up method, which avoids contact with the effective area on the front of the wafer 8. The internal space of the cassette 10 is too small for the Bernoulli pick-up component 51 to reach in, but the pick-up component 41 can be made smaller and can reach into the cassette 10 from the bottom. At the same time, it avoids the problem of not being able to pick up the back of the wafer 8, realizes the automated handling of the wafer 8, avoids the problems of wafer 8 damage and handling stagnation caused by errors in manual handling, and helps to improve handling efficiency and ensure the stability of the production line cycle.

[0038] Please see Figure 1 , Figures 6 to 7 Preferably, the first wafer manipulator 4 further includes a multi-axis moving assembly 42, and the picking assembly 41 includes an R-axis rotating member 411 mounted on the multi-axis moving assembly 42. The R-axis rotating member 411 is connected to a toothed fork 412. A laser sensor 43 aimed at the cartridge storage mechanism 3 is also mounted on the multi-axis moving assembly 42 to determine the position of the wafer 8. The toothed fork 412 has a plate-like structure, which facilitates its insertion into narrow spaces. The R-axis rotating member 411 drives the toothed fork 412 to rotate, which facilitates the removal of the wafer 8 and its placement on the transfer turntable 6. Laser sensor 43 confirms the status of wafer 8 on the cassette 10 (stacked, tilted, presence or absence of wafer 8) by scanning. The wafer 8 suction cup picks up the back of wafer 8 via Y-axis extension and retraction. The wafer 8 is rotated 180° to the turntable by rotating the R-axis (the R-axis is designed with a shaft seal to reduce the risk of breakage during rotation). The X and Z axes move simultaneously. Wafer 8 is then placed on the intermediate turntable 6, and the suction tank 414 breaks the vacuum to return wafer 8 to its waiting position. The multi-axis moving assembly 42 can be an existing XYZ three-axis moving module, a mature and readily available device, and will not be described in detail.

[0039] Please see Figure 1 , Figures 6 to 7 Preferably, the upper surface of the toothed fork 412 is provided with a first support groove 413, and the bottom surface of the first support groove 413 is provided with an adsorption groove 414; the adsorption groove 414 is connected to a vacuum generator; the R-axis rotating component 411 includes a fixed frame and a rotary motor mounted on the fixed frame, and the output shaft of the rotary motor is fixedly connected to the toothed fork 412. The surface of the toothed fork 412 is provided with a support groove, and the adsorption groove 414 is provided in the support groove. The back side of the wafer 8 cannot be adsorbed, but since the wafer 8 is supported on the toothed fork 412, not much force is needed to push the wafer 8 onto the support groove. The adsorption groove 414 only needs to provide a little suction to achieve this, thus preventing the wafer 8 from falling and being damaged when the toothed fork 412 moves.

[0040] Please see Figure 1 , Figures 8 to 9 Preferably, the Bernoulli suction assembly 51 includes a housing 511 and a Bernoulli suction cup 512 disposed at the center of the housing 511. The housing 511 is mounted on the end of the second wafer manipulator 5. Multiple arc-shaped stops 513 are spaced around the lower end face of the housing 511, and the gaps between adjacent arc-shaped stops 513 form air channels. The arc-shaped stops 513 arranged around the Bernoulli suction cup 512 on the housing 511 of the Bernoulli suction assembly 51 serve to radially limit the wafer 8. When suctioning the wafer 8, the stops can limit the wafer 8 to prevent it from being thrown, thus avoiding damage from falling. The arc-shaped stops are designed with a 9° arc, allowing the wafer 8 to smoothly contact the arc-shaped stops 513. The air channel design ensures sufficient wafer 8 suction while reducing airflow pressure, minimizing impact on the stops during the suction process, and preventing the wafer 8 from breaking due to impact on the arc-shaped stops 513.

[0041] Please see Figure 1 , Figures 8 to 9 Preferably, a first sensor 514 is also installed on the housing 511 to detect whether the Bernoulli chuck 512 picks up the wafer 8.

[0042] Please see Figure 1 , Figure 10 Preferably, the transfer turntable 6 includes a rotating frame 61, which is driven to rotate by a first motor. The upper surface of the rotating frame 61 is surrounded by a plurality of support portions 62. Each support portion 62 has a downward-facing clearance groove 63 on its upper surface, and an opening at one end opposite to the center of the rotating frame 61 to avoid obstructing the pick-and-place assembly 41. This allows the toothed fork 412 to extend into and place the wafer 8 onto the support portion 62.

[0043] Please see Figure 1 , Figure 10Preferably, the upper surface of the placement part 62 is provided with a second groove that matches the shape and size of the wafer 8, and the clearance groove 63 is provided downward from the bottom surface of the second groove; the second groove is provided with a plurality of vacuum adsorption holes 65 in a position avoiding the clearance groove 63, and the vacuum adsorption holes 65 are connected to a vacuum generator. The placement part 62 is provided with a second groove, and the vacuum adsorption holes 65 are provided in the second groove, which can provide suction to fix the wafer 8 on the placement part 62, so as to prevent the wafer 8 from being thrown out when the rotating frame 61 rotates.

[0044] Please see Figures 1 to 5 Preferably, the tray storage mechanism 2 includes a multi-layered storage rack 21, which is mounted on the machine base 1. A tray handling assembly 22 is provided on the machine base 1 between the storage rack 21 and the second wafer robot 5. The tray handling assembly 22 is used to remove trays 7 from the storage rack 21 or to store trays 7 containing wafers 8 into the storage rack 21. The storage rack 21 of the tray 7 storage assembly has multiple layers and, in conjunction with the tray handling assembly 22, enables the retrieval and storage of multiple trays 7. This avoids manual loading and unloading of trays 7 in real time; only a complete replacement of the trays 7 is required at regular intervals. This significantly reduces workload, improves production efficiency, and ensures stable production cycles.

[0045] Please see Figures 1 to 5 Preferably, the pallet handling assembly 22 includes a lifting platform 221, which is mounted on the machine base 1. A translation drive 222 is mounted on the lifting platform 221, and a gripper cylinder 223 is mounted on the translation drive 222 for gripping the pallet 7. The translation drive 222 controls the movement of the pallet 7. The lifting platform 221 moves the gripper cylinder 223 to the height of the layer where the pallet needs to be placed or removed. Then, the gripper cylinder 223 moves to the corresponding position via the translation drive 222, gripping the pallet 7 and lifting it from the storage rack 21. This allows for multi-layer storage and retrieval of the pallet 7, serving as a buffer area to avoid manual loading and unloading of the pallet 7 in real time. The lifting platform 221 uses a servo motor + synchronous belt direct drive structure, with four guide pillars and sleeves ensuring lifting and guiding accuracy. A limit plate is installed on the rear side of the tray 7 to ensure consistent backward movement after clamping. A position sensor and a positioning sensor are also located on the rear side to determine whether the tray 7 is in the correct position. Wear of the gripper blocks can also detect slippage of the tray 7, triggering an alarm and preventing misalignment of the wafer 8 due to tray 7 positioning issues. The telescopic mechanism of the lifting platform 221 uses a cylinder + guide rail device, but is not limited to this method; a module can also be used. Alternatively, the lifting platform 221 mechanism can use a servo motor + guide pillar and sleeve device, but is not limited to this method; a lead screw, slide rail, or slider device can also be used as the lifting mechanism. The translation drive component 222 can be a lead screw, slide rail, or slider module, but is not limited to this.

[0046] Please see Figures 1 to 5 Preferably, the lifting platform 221 is provided with guide bearing strips on both sides of the translation drive 222. An alignment cylinder 224 is provided on the outer side of one of the guide bearing strips. The alignment cylinder 224 pushes out towards the other guide bearing strip. The guide bearing strips are L-shaped, and the distance between the two guide bearing strips matches the size of the tray 7. The tray 7 has a clamping block 71 at a position that matches the gripper cylinder 223. The alignment cylinder 224 allows the tray 7 to be aligned to one side. The lifting platform 221 also has a positioning block 225 at the end of the guide bearing strip away from the storage rack 21. After the gripper cylinder 223 is pulled out, the tray 7 presses against the positioning block 225, achieving alignment of the other side of the tray 7. This ensures planar alignment of the tray 7, facilitating accurate placement of the wafer 8 in the placement slot of the tray 7.

[0047] Please see Figures 1 to 5 , Figure 11 Preferably, each layer of the storage rack 21 is provided with a removable drawer-type carrier 23. The carrier 23 is longitudinally divided into multiple layers. Each layer of the carrier 23 has multiple rollers 231 on each side wall in the direction of tray 7 entry and exit. The end of the carrier 23 facing the tray transport assembly 22 is open for pushing in and taking out the tray 7. Each layer of the storage rack 21 has movable blocking members 211 at both ends in the direction of tray 7 entry and exit. By providing carriers 23 that can hold multiple trays 7, and each layer of the storage rack 21 can hold one carrier 23, the operator can quickly load multiple trays 7 at once, improving the loading and unloading efficiency of trays 7, reducing the time interrupted by loading and unloading, and the rollers 231 reduce the friction when trays 7 enter and exit.

[0048] Please see Figures 1 to 2 , Figure 11 Preferably, the storage rack 21, at the end opposite to the tray transport assembly 22, is connected to a transport trolley 9 with a carrier 23. The trolley has the same number of layers as the storage rack 21, and each layer has the same height as the corresponding layer of the storage rack 21. Each layer of the trolley has swingable limiting blocks 91 on both sides, one at the end facing the storage rack 21 and the other at the end opposite to the storage rack 21. Thus, after the tray 7 is externally mounted, the transport trolley 9 can be aligned with the storage rack 21, and the carrier 23 can be directly pushed to load or unload materials, significantly reducing the labor intensity of workers. Furthermore, the swingable limiting blocks 91 allow the transport trolley 9 to swing and block the carrier 23 as it moves, preventing the carrier 23 from being confined within the transport trolley 9 during movement.

[0049] Please see Figures 1 to 2 , Figure 11Preferably, the distance between the limiting blocks 91 at both ends of the same side is equal to the length of the carrier 23; a linkage shaft 92 is fixedly connected between the limiting blocks 91 at both ends of the same side. By swinging the limiting block 91 at the rear of the trolley, the limiting block 91 at the front can be swung, eliminating the need to operate the front and rear limiting blocks 91 separately. This avoids the problem that the limiting block 91 at the front is difficult to reach after the storage rack 21 and the transport trolley 9 are aligned.

[0050] Please see Figures 1 to 5 , Figure 11 Preferably, the carrier 23 consists of a base plate 232 and a side plate 233. The side plate 233 is fixed to the base plate 232, and rollers 231 are mounted on the side plate 233. A limiting plate is provided at the end of the side plate 233 facing away from the tray transport assembly 22. Each layer of the side plate 233 has a detection port, and each detection port is connected to a tray detection sensor 212. The detection sensor is mounted on the storage rack 21 and is used to detect whether there is a tray 7 in that layer, ensuring that the tray transport assembly 22 can accurately pick up the tray 7. A handle 234 is provided at the end of the base plate 232 facing away from the tray transport assembly 22. The handle 234 facilitates pulling the carrier 23 from the storage rack 21 onto the transport trolley 9, or pushing it from the transport trolley 9 onto the storage rack 21. Each layer of the storage rack 21 has a first limiting strip 213 on both sides of the bottom surface in the direction of movement of the carrier 23. The distance between the two first limiting strips 213 on the same layer is equal to the width of the base plate 232. Each layer of the transport trolley 9 has a second limiting strip 93 on both sides of the bottom surface in the direction of movement of the carrier 23. The distance between the two second limiting strips 93 on the same layer is equal to the width of the carrier 23. The first limiting strips 213 and the second limiting strips 93 facilitate the alignment of the storage positions of each layer of the storage rack 21 and the transport trolley 9, allowing the carrier 23 to move in and out smoothly. The two ends of the first limiting strips 213 and the second limiting strips 93 are extended outward.

[0051] Please see Figures 1 to 5 Preferably, an entry / exit detection sensor 214 is provided at the end of the storage rack 21 that interfaces with the tray transport assembly 22 to ensure accurate retrieval of the tray 7. The entry / exit detection sensor 214, the tray detection sensor 212, the first sensor 514, and the wafer entry / exit sensor 32 are all laser-beam type sensors.

[0052] Please see Figure 1 Preferably, the cartridge storage mechanism 3 includes a storage rack 31 with multiple cartridge storage slots. Each slot holds one cartridge 10, and each cartridge storage slot is equipped with a wafer entry / exit sensor 32 to ensure accurate removal of the wafer 8. The cartridges 10 filled with wafers 8 are manually placed into the cartridge storage slots of the storage rack 31.

[0053] The working principle of this utility model is as follows:

[0054] The multi-axis moving component 42 drives the picking component 41 to move into the stopper 10, so that the toothed fork 412 extends into the lower surface of the wafer 8. Then, the suction groove 414 uses negative pressure to hold the wafer 8. The multi-axis moving component 42 moves in the opposite direction to make the toothed fork 412 disengage from the stopper 10. After disengagement, the R-axis rotating component 411 drives the toothed fork 412 to rotate to a position facing the transfer turntable 6. Then, the multi-axis moving component 42 drives it to the placement part 62 of the transfer turntable 6, which is now facing the first wafer robot 4. The toothed fork 412 extends into the clearance groove 63, so that the wafer 8 is placed in the second placement groove 64. After the suction groove 414 breaks the vacuum, the multi-axis moving component 42 drives the toothed fork 412 to withdraw and pick up the next wafer 8. The transfer tray rotates to rotate the placement part 62 where the wafer 8 is placed to a position to dock with the second wafer robot 5. Then, the second wafer manipulator 5 moves the Bernoulli adsorption assembly to the docking position, and the Bernoulli chuck 512 works to pick up the wafer 8, while the circumferential surface of the wafer 8 is limited by the arc-shaped stop block 513; at the same time, the lifting platform 221 of the tray transport assembly 22 works, and the translation drive 222 works to move the gripper cylinder 223 to the position to remove the tray 7 of the corresponding layer. The gripper cylinder 223 clamps the gripping block 71, the blocking member 211 at the front end of the storage rack 21 retracts, and the translation drive 222 moves in the opposite direction to remove the tray 7 of the corresponding layer. The tray 7 detaches until it abuts against the positioning block 225. Then, the alignment cylinder 224 extends to push the tray 7 to the other side. The lifting platform 221 then descends to the normal handling and placement position. The second wafer 8 mechanically drives the Bernoulli suction component to move to the corresponding placement position of the tray 7. The Bernoulli suction cup 512 lowers, and this cycle repeats. After the tray 7 is filled with wafers 8, the alignment cylinder 224 retracts, and the lifting platform 221 and translation drive 222 move in opposite directions to push the tray 7 back into the carrier 23. When all the trays 7 in the carrier 23 are full, the transport trolley 9 is pushed to align with the storage rack 21, and the swing limit block 91 is moved to prevent it from blocking the movement path of the tray 7. The blocking member 211 at the rear end of the storage rack 21 retracts, allowing the handle 234 of the carrier 23 to be grasped and the entire carrier 23 to be pulled out. The process of loading the carrier 23 with empty trays 7 into the storage rack 21 continues in this manner.

[0055] Several points should be noted: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installation", "connection" and "linkage" should be interpreted broadly, and can be mechanical or electrical connection, or internal connection between two components, or direct connection. "Up", "down", "left", "right", etc. are only used to indicate relative positional relationship. When the absolute position of the described object changes, the relative positional relationship may change.

[0056] Secondly: The accompanying drawings of the embodiments disclosed in this utility model only involve the structures involved in the embodiments disclosed in this utility model. Other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of this utility model can be combined with each other.

[0057] Finally, the above description is only a preferred embodiment of the present utility model. The protection scope of the present utility model is not limited to the above embodiments. All technical solutions that fall within the scope of the present utility model are protected by the present utility model.

[0058] It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principles of this utility model should also be considered within the scope of protection of this utility model.

Claims

1. A wafer loading and unloading device, comprising a machine base, wherein the machine base is provided with a tray storage mechanism and a chuck storage mechanism, and a wafer is placed in the chuck with its front side facing up, characterized in that: The machine platform is also equipped with a first wafer robot and a second wafer robot. The first wafer robot is docked with the cartridge storage mechanism, and the second wafer robot is docked with the tray storage mechanism. The machine platform is also equipped with a transfer turntable, and both the first and second wafer robots are docked with the transfer turntable. The end of the second wafer robot is equipped with a Bernoulli pick-up component, and the end of the first wafer robot is equipped with a pick-up component. The pick-up component is used to remove the wafer from the cartridge and place it on the transfer turntable, and the Bernoulli pick-up component is used to pick up the wafer from the transfer turntable and place it on the tray.

2. The wafer loading and unloading device according to claim 1, characterized in that: The first wafer manipulator also includes a multi-axis moving assembly, and the picking assembly includes an R-axis rotating component mounted on the multi-axis moving assembly, the R-axis rotating component being connected to a toothed fork.

3. The wafer loading and unloading device according to claim 2, characterized in that: The upper surface of the toothed fork is provided with a first groove, and the bottom surface of the first groove is provided with an adsorption groove; the adsorption groove is connected to a vacuum generator; the R-axis rotating component includes a fixed frame and a rotary motor mounted on the fixed frame, and the output shaft of the rotary motor is fixedly connected to the toothed fork.

4. The wafer loading and unloading device according to claim 1, characterized in that: The Bernoulli suction assembly includes a housing and a Bernoulli suction cup located at the center of the housing. The housing is mounted on the end of the second wafer manipulator. The lower end face of the housing is surrounded by a plurality of arc-shaped blocks at intervals, and the gaps between adjacent arc-shaped blocks form air channels.

5. A wafer loading and unloading device according to claim 1, characterized in that: The transfer turntable includes a rotating frame, which is driven to rotate by a first motor. The upper surface of the rotating frame is provided with a plurality of supporting parts. The upper surface of the supporting parts is provided with a clearance groove from top to bottom, and has an opening at one end away from the center of the rotating frame to avoid the lifting component.

6. A wafer loading and unloading device according to claim 5, characterized in that: The upper surface of the support section is provided with a second support groove that matches the shape and size of the wafer, and the clearance groove is provided from the bottom surface of the second support groove downwards; the second support groove is provided with a plurality of vacuum adsorption holes in a position that avoids the clearance groove, and the vacuum adsorption holes are connected to a vacuum generator.

7. A wafer loading and unloading device according to claim 1, characterized in that: The disk storage mechanism includes a multi-layer storage rack, which is mounted on the machine platform. A disk handling assembly is provided on the machine platform between the storage rack and the second wafer robot. The disk handling assembly is used to remove disks from the storage rack or to store disks containing wafers into the storage rack.

8. A wafer loading and unloading device according to claim 7, characterized in that: The pallet handling assembly includes a lifting platform, which is mounted on the machine base. A translation drive is installed on the lifting platform, and a gripper cylinder is installed on the translation drive for gripping the pallet.

9. A wafer loading and unloading device according to claim 7, characterized in that: Each layer of the storage rack is equipped with a removable drawer-type carrier. The carrier is longitudinally divided into multiple layers. Each layer of the carrier has multiple rollers on both sides of the tray in the inlet and outlet direction. The end of the carrier facing the tray transport assembly is open for pushing in and taking out the tray. Each layer of the storage rack has movable blocking members at both ends of the tray inlet and outlet direction.

10. A wafer loading and unloading device according to claim 7, characterized in that: The storage rack is connected to a transport trolley of the carrier at one end away from the tray transport assembly; the trolley has the same number of layers as the storage rack, and each layer has the same height as the corresponding storage rack layer; each layer of the trolley has swingable limit blocks on both sides, one at the end facing the storage rack and the other at the end away from the storage rack; the distance between the limit blocks at both ends on the same side is equal to the length of the carrier; a linkage shaft is fixedly connected between the limit blocks at both ends on the same side.

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