Transesophageal ultrasound probe and ultrasound equipment

Abstract

This application relates to the field of medical device technology, specifically to the structure of a transesophageal ultrasound probe. Because the negative conductive layer of the acoustic probe is located on the side of the conductive matching layer closest to the acoustic lens, the negative conductive layer achieves conductivity with the piezoelectric array element through the conductive matching layer, without affecting the conductivity of both the negative conductive layer and the piezoelectric array element. When cutting the piezoelectric layer, the negative conductive layer does not need to be cut, resulting in better integrity of the negative conductive layer, less brittleness, and higher connection reliability. This improves upon the problem of poor connection reliability in current transesophageal ultrasound probes where the negative conductive layer needs to be cut because it is attached to the piezoelectric array element.

Description

Technical Field

[0001] This application relates to the field of medical device technology, specifically to the structure of a transesophageal ultrasound probe. Background Technology

[0002] An ultrasound probe is an important component of ultrasound equipment (such as ultrasound diagnostic imaging equipment). An ultrasound probe includes an ultrasound transducer, which is responsible for transmitting ultrasound information. It can convert excitation electrical pulse signals into ultrasound signals to enter human soft tissues, and it can also convert ultrasound echo signals reflected by tissues into electrical signals. After back-end processing, the signals are displayed in the form of images for doctors to analyze and diagnose.

[0003] Transesophageal ultrasound (TEE) is a device that can be inserted into the body cavity to perform ultrasound examination of a patient's heart condition. Area array TEE transducers are characterized by a large number of piezoelectric elements and small size. The electrodes used to extract electrical signals are usually attached to the piezoelectric elements, which need to be cut during manufacturing. The cut electrodes are fragile and have low connection strength, resulting in poor reliability. Utility Model Content

[0004] This application provides a transesophageal ultrasound probe to improve the poor connection reliability caused by the need to cut the electrodes of current transesophageal ultrasound probes.

[0005] In addition, the purpose of this application is to provide an ultrasound device using the above-mentioned transesophageal ultrasound probe.

[0006] In a first aspect, some embodiments provide a transesophageal ultrasound probe, comprising:

[0007] A sound head assembly, the sound head assembly including a sound head for emitting and receiving ultrasonic signals;

[0008] An insertion tube for insertion into the human body via the esophagus;

[0009] and a handle assembly, wherein the insertion tube is connected between the sound head assembly and the handle assembly for operating the insertion tube and the sound head assembly via the handle assembly;

[0010] The sound head includes:

[0011] Acoustic lens;

[0012] A piezoelectric layer comprising piezoelectric array elements arranged in a planar array;

[0013] A conductive matching layer is located between the piezoelectric layer and the acoustic lens;

[0014] And a negative conductive layer, which is located between the conductive matching layer and the acoustic lens, and the negative conductive layer is connected to each of the piezoelectric array elements through the conductive matching layer;

[0015] The conductive matching layer includes an acoustic matching substrate and a conductive structure located in the acoustic matching substrate. The negative conductive layer is connected to the piezoelectric array element through the conductive structure.

[0016] In a further embodiment, the conductive structure includes a conductive element embedded in the acoustic matching substrate, the conductive element connecting the negative conductive layer to the piezoelectric array element.

[0017] In a further embodiment, the acoustic matching substrate includes acoustic matching substrate blocks arranged in an array, and the conductive element is embedded in the acoustic matching substrate blocks.

[0018] In one embodiment, the transesophageal ultrasound probe includes:

[0019] A sound head assembly, the sound head assembly including a sound head for emitting and receiving ultrasonic signals;

[0020] An insertion tube for insertion into the human body via the esophagus;

[0021] and a handle assembly, wherein the insertion tube is connected between the sound head assembly and the handle assembly for operating the insertion tube and the sound head assembly via the handle assembly;

[0022] The sound head includes:

[0023] Acoustic lens;

[0024] A piezoelectric layer comprising piezoelectric array elements arranged in a planar array;

[0025] A conductive matching layer is located between the piezoelectric layer and the acoustic lens;

[0026] And a negative conductive layer, which is located between the conductive matching layer and the acoustic lens, and the negative conductive layer is connected to each of the piezoelectric array elements through the conductive matching layer.

[0027] In another embodiment, the conductive matching layer is integrally formed from a conductive material.

[0028] In a further embodiment, the negative conductive layer is a conductive metal layer fixed on at least one of the acoustic lens and the conductive matching layer.

[0029] In a further embodiment, at least one of the acoustic lens and the conductive matching layer is bonded and fixed to the negative conductive layer, or the negative conductive layer is a conductive plating layer plated on at least one of the acoustic lens and the conductive matching layer.

[0030] In a further embodiment, the negative conductive layer is electroplated or bonded to the conductive matching layer. The conductive matching layer includes acoustic matching blocks arranged in an array. At least a portion of the gaps between adjacent acoustic matching blocks is filled with a matching layer filler, and a portion of the negative conductive layer is plated onto the matching layer filler.

[0031] In a further embodiment, the negative conductive layer is electroplated or bonded to the acoustic lens, and the conductive matching layer includes acoustic matching blocks arranged in an array, with acoustic matching seams formed between adjacent acoustic matching blocks and piezoelectric element seams formed between adjacent piezoelectric elements, the acoustic matching seams and the piezoelectric element seams being interconnected.

[0032] In a further embodiment, the insertion tube includes a bending deformation section, and the handle assembly is kinetically connected to the bending deformation section so that the bending deformation section can be bent by operating the handle assembly to change the position of the sound head assembly.

[0033] In a second aspect, one embodiment provides an ultrasound device, including an ultrasound host and a transesophageal ultrasound probe as described in any embodiment of the first aspect.

[0034] According to the transesophageal ultrasound probe of the above embodiment, since the negative conductive layer of the acoustic head is located on the side of the conductive matching layer closer to the acoustic lens, the negative conductive layer achieves conductivity with the piezoelectric element through the conductive matching layer, without affecting the conductivity function of the negative conductive layer and the piezoelectric element. When cutting the piezoelectric layer, the negative conductive layer does not need to be cut, resulting in better integrity of the negative conductive layer, less brittleness, and higher connection reliability. This improves upon the problem of poor connection reliability in current transesophageal ultrasound probes where the negative conductive layer needs to be cut because it is attached to the piezoelectric element. Attached Figure Description

[0035] Figure 1 This is a schematic diagram of the structure of an ultrasonic probe in one embodiment;

[0036] Figure 2 This is a schematic diagram of the structure of the sound head in one embodiment;

[0037] Figure 3 An exploded view of the sound head in one embodiment;

[0038] Figure 4 This is a schematic diagram illustrating the manufacturing process of a sound head in one embodiment;

[0039] Figure 5 This is a schematic diagram of the area array arrangement of piezoelectric array elements in one embodiment;

[0040] Figure 6 This is a partial structural diagram of the sound head in one embodiment.

[0041] List of feature names corresponding to the reference numerals in the figure: 100, Sound head assembly; 1, Sound head; 11, Acoustic lens; 12, Piezoelectric layer; 121, Piezoelectric element; 122, Piezoelectric element slot; 13, Conductive matching layer; 130, Acoustic matching block; 131, Acoustic matching substrate; 1311, Acoustic matching substrate block; 132, Conductive structure; 133, Conductive component; 134, Matching layer filler; 135, Acoustic matching slot; 14, Negative conductive layer; 15, Positive conductive layer; 16, Backing layer; 2, Sound head shell; 200, Insertion tube; 201, Bending deformation section; 300, Handle assembly; 31, Handle shell; 32, Control mechanism; 400, Chip.

[0042] Explanation of reference numerals in parentheses in the accompanying drawings: The feature referred to by the reference numerals in parentheses in the accompanying drawings is the feature represented by both the number inside the parentheses and the number outside the parentheses. Detailed Implementation

[0043] The present application will now be described in further detail with reference to the accompanying drawings and specific embodiments. Similar elements in different embodiments are referred to by related similar element reference numerals. In the following embodiments, many details are described to facilitate a better understanding of the present application. However, those skilled in the art will readily recognize that some features may be omitted in different situations, or may be replaced by other elements, materials, or methods. In some cases, certain operations related to the present application are not shown or described in the specification. This is to avoid obscuring the core parts of the present application with excessive description. For those skilled in the art, detailed description of these related operations is not necessary; they can fully understand the related operations based on the description in the specification and general technical knowledge in the art.

[0044] Furthermore, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various embodiments. At the same time, the steps or actions in the method description can be rearranged or adjusted in a manner obvious to those skilled in the art. Therefore, the various orders in the specification and drawings are only for the clear description of a particular embodiment and do not imply a necessary order, unless otherwise stated that a particular order must be followed.

[0045] In the description herein, it should be understood that the terms “center,” “longitudinal,” “lateral,” “length,” “width,” “thickness,” “upper,” “lower,” “front,” “rear,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” “outer,” “clockwise,” “counterclockwise,” “axial,” “radial,” and “circumferential” indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0046] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature.

[0047] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection, an abutment, or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0048] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0049] The embodiments described in the detailed implementation can be combined in any suitable manner without contradiction. For example, different implementation methods can be formed by combining different embodiments. In order to avoid unnecessary repetition, the various possible combinations of the embodiments will not be described separately.

[0050] To address the issues of poor connection reliability and shielding effectiveness caused by the need to cut the negative electrode in current transesophageal ultrasound probes, this application provides a transesophageal ultrasound probe in which the negative electrode conductive layer is disposed between the acoustic lens and the acoustic matching layer, and the acoustic matching layer is made conductive, thus connecting the negative electrode conductive layer and the piezoelectric layer. In this way, when the piezoelectric layer is cut, the negative electrode conductive layer does not need to be cut, resulting in better connection reliability and shielding performance of the negative electrode conductive layer.

[0051] The transesophageal ultrasound probe of this application is described in detail below with reference to the accompanying drawings.

[0052] In some embodiments, please refer to Figures 1 to 6 The transesophageal ultrasound probe includes a head assembly 100, an insertion tube 200 for insertion into the human body via the esophagus, and a handle assembly 300. The head assembly 100 includes a head 1 for emitting and receiving ultrasound signals. The insertion tube 200 is connected between the head assembly 100 and the handle assembly 300 for operating the insertion tube 200 and the head assembly 100 via the handle assembly 300.

[0053] The acoustic head 1 includes an acoustic lens 11, a piezoelectric layer 12, a conductive matching layer 13, and a negative conductive layer 14, wherein the acoustic lens 11 can converge and narrow the emitted sound beam.

[0054] The piezoelectric layer 12 includes piezoelectric elements 121 arranged in a planar array, and a conductive matching layer 13 is located between the piezoelectric layer 12 and the acoustic lens 11. The piezoelectric elements 121 of the piezoelectric layer 12 are used for the mutual conversion of mechanical energy and electrical energy. When an alternating voltage is applied, the piezoelectric elements 121 of the piezoelectric layer 12 vibrate, thereby generating ultrasonic waves. When receiving ultrasonic waves, the piezoelectric elements 121 convert the mechanical vibration into an electrical signal, and information about the detection location is obtained by analyzing the electrical signal of the piezoelectric elements 121.

[0055] The conductive matching layer 13 is used to reduce the acoustic impedance difference between the ultrasound probe and human skin, thereby facilitating the entry of ultrasound waves into the human body. In this application, the negative conductive layer 14 is located between the conductive matching layer 13 and the acoustic lens 11, and the negative conductive layer 14 is connected to each piezoelectric element 121 through the conductive matching layer 13.

[0056] Because the negative conductive layer 14 is separated from the piezoelectric element 121 by the conductive matching layer 13, and conduction with the piezoelectric element 121 is achieved through the conductive matching layer 13, the negative conductive layer 14 does not need to be cut when the piezoelectric layer 12 is cut. This results in better integrity of the negative conductive layer 14, making it less prone to breakage and improving connection reliability. This addresses the problem of poor connection reliability in current transesophageal ultrasound probes where the negative conductive layer 14 needs to be cut because it is attached to the piezoelectric element 121. Furthermore, since the negative conductive layer 14 does not need to be cut, its continuity is better, which is more conducive to improving its shielding performance.

[0057] It should be noted that the array arrangement described in this application is an array arrangement in two different directions. For example, please refer to... Figure 5 The piezoelectric array element 121 arranged in a surface array refers to the piezoelectric array element 121 arranged in two different directions.

[0058] In some embodiments, the sound head assembly 100 includes not only the sound head 1 but also a sound head mounting structure, which includes a sound head mounting bracket and is used to mount the sound head 1. For some embodiments, please refer to... Figure 1 The head mount structure also includes a head housing 2. In some embodiments, the handle assembly 300 includes a handle housing 31 and a control mechanism 32 for controlling the head assembly 100.

[0059] Regarding the structure of the conductive matching layer 13, please refer to some embodiments. Figure 2 and Figure 3 The conductive matching layer 13 includes an acoustic matching substrate 131 and a conductive structure 132 disposed within the acoustic matching substrate 131. The negative conductive layer 14 is connected to the piezoelectric element 121 through the conductive structure 132. The conductive structure 132 is disposed within the acoustic matching substrate 131, allowing the conductive structure 132 and the acoustic matching substrate 131 to be made of different materials to meet their respective performance requirements. In some other embodiments, the conductive matching layer 13 can also be integrally molded from a conductive material, such as by integrally molding the conductive matching layer 13 with conductive adhesive.

[0060] In some embodiments, please refer to Figure 2 and Figure 3 The conductive structure 132 includes a conductive element 133 embedded in the acoustic matching substrate 131. The conductive element 133 conducts electricity between the negative conductive layer 14 and the piezoelectric array element 121. The conductive element 133, embedded in the acoustic matching substrate 131, is less prone to loosening, resulting in better reliability. Regarding the molding method of the conductive element 133 and the acoustic matching substrate 131, in one embodiment, the acoustic matching substrate 131 is injection molded around the conductive element 133; in another embodiment, after molding, the acoustic matching substrate 131 has pre-drilled mounting holes, and the conductive element 133 is interference-fitted into these holes.

[0061] In some embodiments, please refer to Figure 2 and Figure 3 The acoustic matching substrate 131 includes acoustic matching substrate blocks 1311 arranged in an array, and conductive elements 133 are embedded in the acoustic matching substrate blocks 1311. Specifically, in some embodiments, please refer to... Figure 2 and Figure 3The number of acoustic matching substrate blocks 1311 is the same as the number of piezoelectric array elements 121, and they correspond one-to-one. Acoustic matching seams 135 are formed between the area arrayed acoustic matching substrate blocks 1311, which improves the acoustic performance of the ultrasonic probe. In some other embodiments, the conductive matching layer 13 may not be cut, and the conductive matching layer 13 may be a monolithic structure.

[0062] Regarding the molding method of the acoustic matching substrate block 1311, please refer to one embodiment. Figure 2 and Figure 3 After the acoustic matching substrate 131 and the piezoelectric layer 12 are arranged in layers, the acoustic matching substrate 131 is cut into the piezoelectric layer 12. The acoustic matching substrate 131 is divided into acoustic matching substrate blocks 1311 arranged in an array, and the piezoelectric layer 12 is divided into piezoelectric array elements 121 arranged in an array.

[0063] Regarding the structure of the negative electrode conductive layer 14, please refer to one embodiment. Figures 2 to 4 The negative conductive layer 14 is a conductive metal layer fixed to at least one of the acoustic lens 11 and the conductive matching layer 13. The conductive metal layer has better conductivity and better shielding performance. Specifically, in one embodiment, please refer to... Figures 2 to 4 One side of the negative conductive layer 14 is fixed to the conductive matching layer 13, and the other side is fixed to the acoustic lens 11. In some other embodiments, the negative conductive layer 14 may also be fixed to one of the acoustic lens 11 and the conductive matching layer 13.

[0064] Regarding the specific fixing method, in one embodiment, the negative electrode conductive layer 14 can be fixed by adhesive bonding, or it can be clamped and fixed by the conductive matching layer 13 and the acoustic lens 11.

[0065] In one embodiment, please refer to Figures 2 to 4 At least one of the acoustic lens 11 and the conductive matching layer 13 is bonded and fixed to the negative conductive layer 14. Specifically, in some embodiments, please refer to... Figure 2 The negative conductive layer 14 is bonded to the conductive matching layer 13. The conductive matching layer 13 includes acoustic matching blocks 130 arranged in an array. At least a portion of the gaps between adjacent acoustic matching blocks 130 is filled with a matching layer filler. A portion of the negative conductive layer 14 is plated on the matching layer filler. Each acoustic matching block 130 includes an acoustic matching substrate block 1311 and a conductive element 133. The matching layer filler improves the connection reliability between the negative conductive layer 14 and the conductive matching layer 13. After the conductive matching layer 13 is bonded to the matching layer filler, the portion of the conductive matching layer 13 between adjacent acoustic matching blocks 130 is supported and less susceptible to damage.

[0066] Of course, in some other embodiments, the negative conductive layer 14 can also be bonded to the acoustic lens 11, and in some other embodiments, the acoustic lens 11 and the conductive matching layer 13 are simultaneously bonded and fixed to the negative conductive layer 14.

[0067] In addition to adhesive bonding, in some embodiments not shown, the negative conductive layer 14 is a conductive plating layer plated on at least one of the acoustic lens 11 and the conductive matching layer 13. The conductive plating layer is connected to at least one of the acoustic lens 11 and the conductive matching layer 13 by electroplating, which provides better connection reliability.

[0068] In some embodiments, please refer to Figure 6 The negative conductive layer 14 is electroplated on the conductive matching layer 13. The conductive matching layer 13 includes acoustic matching blocks 130 arranged in an array. At least a portion of the gaps between adjacent acoustic matching blocks 130 is filled with matching layer filler 134, and a portion of the negative conductive layer 14 is plated on the matching layer filler 134. The acoustic matching substrate block 1311 and the conductive element 133 constitute the acoustic matching block 130. The matching layer filler ensures the continuity of the negative conductive layer 14.

[0069] In another embodiment, the negative conductive layer 14 is electroplated onto the acoustic lens 11. In this case, the gap between adjacent acoustic matching blocks 130 can be filled or left unfilled with the matching layer filler 134 as needed. When the matching layer filler 134 is not filled, an acoustic matching gap 135 is formed between adjacent acoustic matching blocks 130, and a piezoelectric element gap 122 is formed between adjacent piezoelectric elements 121. The acoustic matching gap 135 and the piezoelectric element gap 122 are interconnected.

[0070] Since the transesophageal ultrasound probe needs to pass through the esophagus to enter the human body, in order to facilitate changing the position of the sound head 1 within the human body cavity, in one embodiment, please refer to... Figure 1 The insertion tube 200 includes a bending and deforming section 201. A handle assembly 300 is drivenly connected to the bending and deforming section 201, allowing the handle assembly 300 to operate the bending and deforming section 201 to bend and change the position of the sound head assembly 100. In one embodiment, the bending and deforming section 201 includes a snake-bone tube (not shown in the figure), with a protective layer on the outside. A traction line (not shown in the figure) is connected inside the snake-bone tube, with the other end of the traction line extending to the handle assembly 300. The handle assembly 300 is drivenly connected to the bending and deforming section 201 via the traction line, allowing the handle assembly 300 to pull the traction line to bend the snake-bone tube in a set direction.

[0071] In one embodiment, please refer to Figures 2 to 4 The sound head 1 also includes a positive conductive layer 15 and a backing layer 16. The positive conductive layer 15 includes a flexible circuit board with circuitry for supplying power to the piezoelectric elements.

[0072] The manufacturing steps of the acoustic lens 1 are roughly as follows: the backing layer 16, the positive conductive layer 15, the wafer 400 and the conductive matching layer 13 are combined, the conductive matching layer 13 and the wafer 400 are cut to form a two-dimensional array, the negative conductive layer 14 is then bonded or electroplated, and then the acoustic lens 11 is installed.

[0073] In summary, compared to the conventional method of first attaching the negative conductive layer 14 to the piezoelectric layer 12, the negative conductive layer 14 of this application is moved between the conductive matching layer 13 and the acoustic lens 11, avoiding damage to the negative conductive layer 14 caused by cutting the piezoelectric layer 12, improving the stability of electrical signal transmission, and enhancing connection reliability. Furthermore, in some embodiments, while the negative conductive layer 14 is being moved upwards, the conductive matching layer 13 and the piezoelectric layer 12 can be cut, which is beneficial for improving the acoustic performance of the transesophageal ultrasound probe.

[0074] In one embodiment of an ultrasound device, the ultrasound device includes an ultrasound host and a transesophageal ultrasound probe as described in any of the above embodiments, and further details will not be repeated.

[0075] The above examples illustrate this application only to aid understanding and are not intended to limit its scope. Those skilled in the art to which this application pertains can make various simple deductions, modifications, or substitutions based on the ideas presented.

Claims

1. A transesophageal ultrasound probe, characterized in that, include: A sound head assembly, the sound head assembly including a sound head for emitting and receiving ultrasonic signals; An insertion tube for insertion into the human body via the esophagus; and a handle assembly, wherein the insertion tube is connected between the sound head assembly and the handle assembly for operating the insertion tube and the sound head assembly via the handle assembly; The sound head includes: Acoustic lens; A piezoelectric layer comprising piezoelectric array elements arranged in a planar array; A conductive matching layer is located between the piezoelectric layer and the acoustic lens; And a negative conductive layer, which is located between the conductive matching layer and the acoustic lens, and the negative conductive layer is connected to each of the piezoelectric array elements through the conductive matching layer; The conductive matching layer includes an acoustic matching substrate and a conductive structure located in the acoustic matching substrate. The negative conductive layer is connected to the piezoelectric array element through the conductive structure.

2. The transesophageal ultrasound probe as described in claim 1, characterized in that, The conductive structure includes a conductive element embedded in the acoustic matching substrate, the conductive element connecting the negative conductive layer and the piezoelectric array element.

3. The transesophageal ultrasound probe as described in claim 2, characterized in that, The acoustic matching substrate includes acoustic matching substrate blocks arranged in an array, and the conductive element is embedded in the acoustic matching substrate blocks.

4. A transesophageal ultrasound probe, characterized in that, include: A sound head assembly, the sound head assembly including a sound head for emitting and receiving ultrasonic signals; An insertion tube for insertion into the human body via the esophagus; and a handle assembly, wherein the insertion tube is connected between the sound head assembly and the handle assembly for operating the insertion tube and the sound head assembly via the handle assembly; The sound head includes: Acoustic lens; A piezoelectric layer comprising piezoelectric array elements arranged in a planar array; A conductive matching layer is located between the piezoelectric layer and the acoustic lens; And a negative conductive layer, which is located between the conductive matching layer and the acoustic lens, and the negative conductive layer is connected to each of the piezoelectric array elements through the conductive matching layer.

5. The transesophageal ultrasound probe as described in claim 4, characterized in that, The conductive matching layer is integrally formed from conductive material.

6. The transesophageal ultrasound probe according to any one of claims 1-5, characterized in that, The negative conductive layer is a conductive metal layer fixed on at least one of the acoustic lens and the conductive matching layer.

7. The transesophageal ultrasound probe as described in claim 6, characterized in that, At least one of the acoustic lens and the conductive matching layer is bonded and fixed to the negative conductive layer, or the negative conductive layer is a conductive plating layer plated on at least one of the acoustic lens and the conductive matching layer.

8. The transesophageal ultrasound probe as described in claim 6, characterized in that, The negative conductive layer is electroplated or bonded to the conductive matching layer. The conductive matching layer includes acoustic matching blocks arranged in an array. At least a portion of the gaps between adjacent acoustic matching blocks is filled with a matching layer filler. A portion of the negative conductive layer is plated onto the matching layer filler.

9. The transesophageal ultrasound probe as described in claim 6, characterized in that, The negative conductive layer is electroplated or bonded to the acoustic lens. The conductive matching layer includes acoustic matching blocks arranged in an array. Acoustic matching gaps are formed between adjacent acoustic matching blocks and piezoelectric element gaps are formed between adjacent piezoelectric elements. The acoustic matching gaps and piezoelectric element gaps are interconnected.

10. The transesophageal ultrasound probe according to any one of claims 1-5, characterized in that, The insertion tube includes a bending and deforming section, and the handle assembly is kinetically connected to the bending and deforming section so that the bending and deforming section can be bent and deformed by operating the handle assembly to change the position of the sound head assembly.

11. An ultrasonic device, characterized in that, It includes an ultrasound host and a transesophageal ultrasound probe as described in any one of claims 1-10.

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