Visual inspection apparatus with thickness detection function

By introducing a linkage platform and thickness sensor into the visual inspection equipment, the problem that optical inspection equipment cannot measure the thickness of adhesive is solved, enabling accurate detection of the adhesive thickness on the circuit board and improving the reliability and inspection efficiency of the circuit board.

CN224317005UActive Publication Date: 2026-06-02GUANGZHOU LEICHEN INTELLIGENT EQUIP TECH CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
GUANGZHOU LEICHEN INTELLIGENT EQUIP TECH CO LTD
Filing Date
2025-05-26
Publication Date
2026-06-02

AI Technical Summary

Technical Problem

Existing optical inspection equipment cannot accurately measure the thickness of adhesive coatings, resulting in unstable protective performance of circuit boards and affecting product reliability and lifespan.

Method used

A visual inspection device with thickness detection function was designed. The imaging component and the thickness measurement component are moved in three-dimensional space by a linkage platform. The thickness measurement sensor is used to detect the thickness of the adhesive coating on the circuit board, including laser sensor, spectral confocal sensor or spectroscopic interferometer sensor.

Benefits of technology

It enables precise measurement of the adhesive coating thickness on circuit boards, improving the reliability and testing efficiency of circuit boards, and avoiding safety hazards and maintenance difficulties caused by improper adhesive layer thickness.

✦ Generated by Eureka AI based on patent content.

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Abstract

This application discloses a visual inspection device with thickness detection function, belonging to the technical field of optical inspection equipment. The visual inspection device with thickness detection function includes a linkage platform, an imaging component, a conveying track, a drive module, and a thickness measuring component. The linkage platform includes a stage capable of moving along at least a first direction and a second direction respectively. The conveying track is used to transport the workpiece to be measured. The surface of the workpiece to be measured faces the imaging component. The drive module includes a slide that moves along a third direction and is mounted on the stage of the linkage platform. The thickness measuring component is mounted on the slide, so that the drive module drives the thickness measuring component to move closer to or away from the workpiece to be measured. The first direction, the second direction, and the third direction are perpendicular to each other. The imaging component is mounted on the stage or the slide. This utility model can realize the thickness detection of adhesive coating on circuit boards, improving the reliability of circuit boards.
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Description

Technical Field

[0001] This utility model relates to the technical field of optical inspection equipment, and in particular to a visual inspection device with thickness detection function. Background Technology

[0002] With the diversification of electronic product applications, the reliability design and service life assurance of PCBA (Printed Circuit Board Assembly) boards face more stringent technical requirements. To cope with the environmental stress challenges under complex operating conditions, the industry generally adopts a solution of coating critical circuit areas with a conformal coating. This process forms a physical isolation barrier by applying adhesive, which can effectively achieve composite functions such as moisture protection, dust protection, corrosion protection, and insulation protection.

[0003] Current mainstream AOI (Automated Optical Inspection) systems, based on machine vision technology, can accurately determine the two-dimensional coverage of adhesive coating areas. However, their detection dimensions have inherent limitations—they can only perform two-dimensional planar inspection and cannot obtain three-dimensional parameter information of the adhesive coating layer, thus failing to detect the thickness of the adhesive. This technological limitation directly leads to the risk of uncontrolled two key process parameters: when the adhesive coating is too thin, it will cause safety hazards such as reduced protective performance and the risk of dielectric breakdown leading to insulation failure; while when the adhesive coating is too thick, it will cause systemic risks such as increased thermal resistance, impeded heat dissipation, deterioration of high-frequency signal integrity, and difficulties in repair during rework. Such inaccuracies in process parameters will significantly affect the life cycle and reliability of circuit board products. Utility Model Content

[0004] The purpose of this utility model embodiment is to provide a visual inspection device with thickness detection function, which can realize the thickness detection of adhesive coating on circuit boards and improve the reliability of circuit boards.

[0005] To achieve the above objectives, this application adopts the following technical solution:

[0006] A visual inspection device with thickness detection function includes:

[0007] The linkage platform includes at least a platform capable of moving along a first direction and a second direction respectively;

[0008] Imaging components;

[0009] A transport track is used to transport the workpiece to be measured; the surface of the workpiece to be measured faces the imaging component.

[0010] A drive module, including a slide that moves along a third direction and the platform mounted on the linkage platform;

[0011] The thickness measuring component is directly or indirectly mounted on the slide table so that the drive module drives the thickness measuring component to move closer to or away from the workpiece to be measured.

[0012] The first direction, the second direction, and the third direction are perpendicular to each other; the imaging component is mounted on the stage or the slide.

[0013] Optionally, the drive module further includes a first drive source; the slide includes a first lifting plate; the first lifting plate is connected to the output end of the first drive source;

[0014] and / or

[0015] The drive module further includes a second drive source; the slide includes a second lifting plate; the second lifting plate is connected to the output end of the second drive source.

[0016] When the slide includes the first lifting plate, the first drive source is installed on the platform, and the imaging component and the thickness measuring component are both installed on the first lifting plate, so that the imaging component and the thickness measuring component can move up and down simultaneously.

[0017] When the slide includes the second lifting plate, the second drive source and the imaging component are both mounted on the platform, and the thickness measuring component is mounted on the second lifting plate, so that the thickness measuring component can move up and down relative to the imaging component.

[0018] When the slide includes the first lifting plate and the second lifting plate, the first drive source is installed on the platform, the imaging component and the second drive source are both installed on the first lifting plate, and the thickness measuring component is installed on the second lifting plate, so that the imaging component and the thickness measuring component can move up and down simultaneously, while the thickness measuring component moves up and down relative to the imaging component.

[0019] Optionally, the drive module further includes a first support base;

[0020] When the slide includes the first lifting plate, the thickness measuring component is installed on the first support base, and both the first support base and the imaging component are installed on the first lifting plate. The thickness measuring component extends and moves in the third direction under the drive of the first lifting plate.

[0021] When the slide table includes the second lifting plate, the second drive source is installed on the first support base and the second lifting plate is connected to the thickness measuring component to drive the thickness measuring component to move along the third direction.

[0022] When the slide includes the first lifting plate and the second lifting plate, the second drive source is installed on the first support base, the imaging component and the first support base are both installed on the first lifting plate, the thickness measuring component is installed on the second lifting plate, and the thickness measuring component moves along the third direction under the drive of the first lifting plate and the second lifting plate, so that the imaging component and the thickness measuring component move up and down at the same time, and the thickness measuring component moves up and down relative to the imaging component.

[0023] Optionally, the thickness measuring component includes a base and a thickness sensor. The base is mounted on the second lifting plate, and the thickness sensor is mounted on the base. The thickness of the adhesive coating is detected by the thickness sensor.

[0024] Optionally, the thickness measuring assembly further includes a protective sleeve installed on the base; the thickness sensor is positioned on the protective sleeve away from the workpiece to be measured, to avoid collision between the thickness sensor and other components of the equipment, thereby protecting the thickness sensor.

[0025] Optionally, the thickness sensor can be any one of a laser sensor, a spectral confocal sensor, or a spectroscopic interferometer, to improve the accuracy of detection.

[0026] Optionally, the drive module further includes a fall arrestor; the second drive source is a cylinder, one end of the fall arrestor is connected to the first support base, and the other end of the fall arrestor is connected to the thickness measuring component, so as to prevent the thickness measuring component from falling when the second drive source disappears or the air supply is cut off.

[0027] Optionally, the fall arrestor is a columnar spring. The first support base is provided with a first connector, and the first connector is provided with a first hanging hole. The base of the thickness measuring component is provided with a second connector, and the second connector is provided with a second hanging hole. One end of the fall arrestor passes through the first hanging hole and is connected to the first connector, and the other end of the fall arrestor passes through the second hanging hole and is connected to the second connector, which facilitates the installation of the fall arrestor.

[0028] Optionally, the visual inspection device with thickness detection function further includes a distance sensor; the distance sensor moves along the third direction with the thickness sensor, improving the accuracy and safety of the inspection.

[0029] Optionally, the second drive source includes a drive motor and a lead screw mounted on the first support base and driven by the output end of the drive motor; the second lifting plate is driven by the lead screw, which can precisely control the up and down movement of the thickness measuring component.

[0030] Optionally, the imaging component is located between the stage and the thickness measurement component, increasing the travel of the thickness measurement component and the imaging component, thereby expanding the detection range.

[0031] Optionally, the vision inspection equipment with thickness detection function further includes a frame and an industrial control computer mounted on the frame; the linkage platform is mounted on the frame, and the linkage platform, the imaging component, the drive module, the thickness measurement component and the conveying track are all electrically connected to the industrial control computer;

[0032] The linkage platform, the imaging component, the driving module, and the thickness measuring component are each provided in one or a pair. When a pair is provided, the two thickness measuring components are located on both sides of the workpiece to be measured, so as to realize the simultaneous detection of the upper and lower surfaces of the circuit board.

[0033] The beneficial effects of this application are as follows: The visual inspection device with thickness detection function of this utility model moves the imaging component and the thickness measuring component through the linkage platform. First, the imaging component is used to acquire and detect the image of the circuit board. Then, the thickness measuring component detects the thickness of the adhesive coating on the circuit board. When the thickness measuring component detects the thickness of the adhesive coating, it moves and approaches the circuit board under the drive of the drive module to realize the thickness detection of the adhesive coating on the circuit board, thereby improving the reliability of the circuit board. Attached Figure Description

[0034] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments.

[0035] Figure 1 This is a schematic diagram of a vision inspection device with thickness detection function; the casing is omitted in the diagram.

[0036] Figure 2 This is a schematic diagram of the installation of the first type of drive module;

[0037] Figure 3 This is a schematic diagram showing the assembly of the first support base, drive source, and anti-fall component of the first type of drive module;

[0038] Figure 4 This is a schematic diagram of the installation of the second type of drive module;

[0039] Figure 5 This is a schematic diagram showing the cooperation between the first support base and the drive motor of the second type of drive module.

[0040] Explanation of reference numerals in the attached figures:

[0041] 11. Linkage platform; 12. Imaging component; 13. Thickness measuring component; 14. Drive module; 15. Distance sensor; 16. Frame; 17. Conveyor track; 18. Industrial computer; 21. Foot cup; 22. Fixing plate;

[0042] 110. Platform; 111. First linear module; 112. Second linear module;

[0043] 130. Base; 131. Thickness sensor; 132. Protective sleeve;

[0044] 1401, Slide table; 1402, First support base; 1403, Second drive source; 1404, Anti-fall component; 1405, First connector; 1406, Second connector; 1407, First hanging hole; 1408, Second hanging hole; 1409, Drive motor; 1410, First drive source; 1411, First lifting plate; 1412, Second lifting plate. Detailed Implementation

[0045] To make the technical problems solved by this application, the technical solutions adopted, and the technical effects achieved clearer, the technical solutions of the embodiments of this application are further described in detail below. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0046] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "fixed," "linked," "communicated," "abutting," "clamping," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0047] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0048] In the description herein, it should be understood that the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationships shown in the accompanying drawings, and are used only for ease of description and simplification of operation. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first" and "second" are merely used for distinction in description and have no special meaning.

[0049] In the description of this specification, references to terms such as "an embodiment," "example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0050] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style of the specification is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0051] Unless otherwise stated or defined, the term "and / or" as used in this invention includes any and all combinations of one or more of the associated listed items.

[0052] For ease of description, unless otherwise stated, the terms "front and back" or "first direction" used below are not related to the preceding or following directions. Figure 2 The X-direction itself is consistent with the left and right directions or the second direction mentioned below. Figure 2 Its own Y-direction is consistent, and the up and down directions or third directions mentioned below are consistent with it. Figure 2 They are aligned in the same Z direction.

[0053] In related technologies, as the operating environments of electronic products become increasingly diverse, the requirements for protection processes on PCBA circuit boards have significantly increased. To ensure long-term stable operation, engineers apply special protective adhesives to critical parts of the circuit board. This material effectively isolates moisture, dust, and chemical corrosion while providing necessary insulation protection.

[0054] Currently widely used optical inspection (AOI) equipment can accurately check the location and area of ​​adhesive application. However, these devices have a significant technical limitation—they cannot measure adhesive layer thickness. This deficiency can lead to two types of quality issues: First, if the adhesive layer is too thin, such as below the standard thickness, it may result in reduced moisture resistance and substandard insulation performance. Second, if the adhesive layer is too thick, exceeding a reasonable range, it will not only affect the heat dissipation efficiency of electronic components on the circuit board and interfere with the high-frequency signal transmission of these components, but it will also increase the difficulty of removing the adhesive layer during later repairs.

[0055] Therefore, the industry urgently needs to develop new testing solutions that can simultaneously detect the coverage and thickness of adhesive, which is of great significance for improving the durability and quality stability of electronic products.

[0056] To address the problems in the aforementioned related technologies, this application provides a visual inspection device with thickness detection function. This visual inspection device with thickness detection function has a simple structure. The visual inspection device with thickness detection function drives the imaging component and the thickness measurement component to move through a linkage platform. First, the imaging component is used to acquire and detect images of the circuit board, and then the thickness measurement component detects the thickness of the adhesive coating on the circuit board.

[0057] like Figures 1 to 5 As shown, the visual inspection device with thickness detection function provided in this application is used to detect the thickness of adhesive coating on a circuit board. The visual inspection device with thickness detection function includes a linkage platform 11, an imaging component 12, a transport track 17, a drive module 14, and a thickness measuring component 13. The linkage platform 11 enables the movement of the imaging component 12, the drive module 14, and the thickness measuring component 13 in three-dimensional space. The imaging component 12 is used for image acquisition and inspection of the circuit board. The drive module 14 includes a slide 1401 that moves along a third direction and is mounted on a stage 110 of the linkage platform 11. The thickness measuring component 13 is mounted on the slide 1401 of the drive module 14, and the drive module 14 is used to drive the thickness measuring component 13 to move along a third direction, so that the thickness measuring component 13 approaches or moves away from the circuit board to be measured. The transport track 17 is used to transport the workpiece to be measured. During inspection, the surface to be measured of the workpiece faces the imaging component 12.

[0058] The linkage platform 11 includes at least a stage 110 capable of moving along a first direction and a second direction, respectively. The first direction, the second direction, and the third direction are mutually perpendicular. The first direction, the second direction, and the third direction are all straight lines. For example, the first direction is a horizontal direction (front-back), the second direction is a horizontal direction (left-right), and the third direction is a vertical direction. The stage 110 is the output end of the linkage platform 11 and can move along the horizontal direction (front-back) and the horizontal direction (left-right). The imaging component 12 and the drive module 14 are mounted on the stage 110. The thickness measurement component 13 is mounted on the slide 1401 of the drive module 14, enabling the thickness measurement component 13 to move in three-dimensional space. The imaging component 12 can be mounted on the stage to move in the horizontal plane or mounted on the slide 1401 to move in three-dimensional space.

[0059] The slide 1401 is the output terminal of the drive module 14. It is vertically positioned in the third direction. The slide 1401 is connected to the thickness measuring component 13 to drive the thickness measuring component 13 closer to or further away from the workpiece to be measured. The workpiece to be measured is a circuit board. During measurement, the linkage platform 11 moves the imaging component 12, the drive module 14, and the thickness measuring component 13 above the circuit board. At this time, the imaging component 12 acquires and detects images of the circuit board. The linkage platform 11 adjusts the positions of the imaging component 12, the drive module 14, and the thickness measuring component 13 based on the adhesive layer information acquired by the imaging component 12, so that the thickness measuring component 13 is adjusted to be directly above the adhesive layer whose thickness needs to be measured. Finally, the drive module 14 drives the thickness measuring component 13 to move downwards closer to the adhesive layer, realizing the thickness measurement of the adhesive layer by the thickness measuring component 13.

[0060] In one embodiment, the drive module 14 further includes a first drive source 1410. The slide table 1401 includes a first lifting plate 1411. The first lifting plate 1411 is connected to the output end of the first drive source 1410.

[0061] and / or

[0062] The drive module 14 also includes a second drive source 1403. The slide table 1401 includes a second lifting plate 1412. The second lifting plate 1412 is connected to the output end of the second drive source 1403.

[0063] When the drive module 14 includes a first drive source 1410, a first lifting plate 1411 is provided at the output end of the first drive source 1410. When the drive module 14 includes a second drive source 1403, a second lifting plate 1412 is provided at the output end of the first drive source 1410.

[0064] When the drive module 14 includes only the first drive source 1410, that is, the slide table 1401 includes the first lifting plate 1411, the first drive source 1410 is installed on the stage 110, and the imaging component 12 and the thickness measurement component 13 are both installed on the first lifting plate 1411, so that the imaging component 12 and the thickness measurement component 13 can move simultaneously along a third direction.

[0065] When the drive module 14 includes only the second drive source 1403, that is, the slide 1401 includes the second lifting plate 1412, the second drive source 1403 and the imaging component (12) are both installed on the stage 110, and the thickness measuring component 13 is installed on the second lifting plate 1412, so that the imaging component 12 can move in the horizontal plane, and the thickness measuring component 13 can move relative to the imaging component 12 along a third direction.

[0066] When the drive module 14 includes a first drive source 1410 and a second drive source 1403, that is, the slide 1401 includes a first lifting plate 1411 and a second lifting plate 1412. The imaging component 12 and the thickness measurement component 13 can move together along a third direction under the drive of the first drive source 1410, and the thickness measurement component 13 can also move relative to the imaging component 12 along a third direction.

[0067] In the embodiments of this application, unless otherwise stated, the driving module 14 is described as including both a first driving source 1410 and a second driving source 1403. When the thickness measuring component 13 descends to approach the coating layer to detect the coating thickness, the thickness measuring component 13 moves relative to the imaging component 12 and approaches the circuit board under the drive of the driving module 14. This makes the thickness measuring component 13 applicable to more detection scenarios. When there are tall electronic components on the circuit board that prevent the imaging component 12 from moving together with the thickness measuring component 13 to a suitable detection reference range, the driving module 14 can be used to drive the imaging component 12 to move to the detection reference range alone. This not only improves the detection accuracy but also avoids collisions between the imaging component 12 and the circuit board and the electronic components on the circuit board, preventing damage to the imaging component 12 or the circuit board. Meanwhile, since the imaging component 12 is stationary relative to the thickness measuring component 13 during detection, and the thickness measuring component 13 has its own up-and-down movement, the thickness measuring component 13 can quickly switch when detecting boards of different thicknesses, reducing the movement time of the imaging component 12. The time for the imaging component 12 to take pictures and the time for the thickness measuring component 13 to measure thickness are shorter, thus improving the efficiency of adhesive thickness detection.

[0068] Optionally, the drive module 14 may also include a first support base 1402.

[0069] When the slide table 1401 includes the first lifting plate 1411, the thickness measuring component 13 is installed on the first support base 1402. The first support base 1402 and the imaging component 12 are both installed on the first lifting plate 1411. The thickness measuring component (13) moves along a third direction under the drive of the first lifting plate 1411.

[0070] When the slide table 1401 includes the second lifting plate 1412, the second drive source 1403 is installed on the first support base 1402 and the second lifting plate 1412 is connected to the thickness measuring component 13 to drive the thickness measuring component 13 to move along a third direction.

[0071] When the slide table 1401 includes a first lifting plate 1411 and a second lifting plate 1412, a second drive source 1403 is mounted on a first support base 1402. The imaging component 12 and the first support base 1402 are both mounted on the first lifting plate 1411, and the thickness measuring component 13 is mounted on the second lifting plate 1412. The thickness measuring component moves along a third direction under the influence of the first lifting plate 1411 and the second lifting plate 1412. The first support base 1402 and the imaging component 12 are both mounted on the first lifting plate 1411 so that the first drive source 1410 drives the first support base 1402 and the imaging component 12 to move along the third direction. The second drive source 1403 is mounted on the first support base 1402, and the second lifting plate 1412 is connected to the thickness measuring component 13 to drive the thickness measuring component 13 to move along the third direction. Specifically, the first support 1402 is U-shaped and is installed after the stage 110 to form a receiving space, which serves to accommodate the imaging component 12. The imaging component 12 is installed on the stage 110 and located within the receiving space, which not only protects the imaging component 12 but also reduces the space occupied by the visual inspection equipment with thickness detection function. When the height of the circuit board under test is constant, the second lifting plate 1412 and the thickness measuring component 13 on the second lifting plate 1412 move downward under the drive of the second drive source 1403, so that the thickness measuring component 13 moves into the measurement reference range, and finally the thickness measuring component 13 measures the thickness of the adhesive on the surface of the circuit board.

[0072] Furthermore, the thickness measuring component 13 includes a base 130 and a thickness sensor 131. The base 130 is mounted on the second lifting plate 1412 of the slide table 1401, and the thickness sensor 131 is mounted on the base 130. The thickness sensor 131 is used to measure the thickness of the adhesive coating on the surface of the current board, thereby realizing the detection of the adhesive coating thickness.

[0073] It can be understood that the thickness sensor 131 is one or more of a laser sensor, a spectral confocal sensor, or a spectroscopic interferometer. By using the above sensors, a laser sensor can be implemented, thereby improving the accuracy of detection.

[0074] Laser sensors typically employ triangulation and time-of-flight methods. Triangulation works by striking the adhesive surface with a laser beam, capturing the reflected light with a receiver to form a triangle, and then calculating the distance change to determine the thickness. Time-of-flight methods measure the round-trip time of the laser beam to calculate the adhesive thickness.

[0075] Spectral confocal sensors are divided into white light spectral confocal sensors and colored light spectral confocal sensors. The spectral confocal measurement method uses a special lens to extend the focal halo range of different colors of light, forming a special magnified chromatic aberration. This allows light of a precise wavelength to be focused onto the object being measured, depending on the distance between the object and the lens. By measuring the wavelength of the reflected light, the precise distance between the object and the lens can be obtained.

[0076] The spectroscopic interferometer sensor utilizes the principle of white light interference. When two beams of light (reference light and measurement light) interfere, obvious interference fringes will only appear when the optical path difference is zero. By moving the reference mirror or using spectral analysis, the positions of different interfaces can be determined, thereby obtaining the coating thickness.

[0077] This application utilizes the aforementioned thickness measuring component 13 to measure the adhesive thickness of the workpiece when the thickness measuring sensor moves within the measurement reference range. Laser sensors, spectral confocal sensors, or spectroscopic interferometers are all non-contact automatic measurement sensors. The thickness measuring component 13 can be used to measure the thickness of adhesive applied to one side of a circuit board, or to measure the thickness of adhesive applied to both sides of a circuit board.

[0078] In one embodiment, the thickness measuring assembly 13 further includes a protective sleeve 132 mounted on the base 130. The thickness sensor 131 and the protective sleeve 132 are sequentially arranged along the moving path of the slide table 1401 near the workpiece to be measured, with the thickness sensor 131 positioned away from the workpiece by the protective sleeve 132. To prevent the thickness sensor 131 from colliding with other components of the equipment during operation, the protective sleeve 132 is added to protect the thickness sensor 131. The protective sleeve 132 is located below the thickness sensor 131 and has a thickness measuring channel through which the thickness measuring light from the thickness sensor 131 passes, enabling the detection of the adhesive thickness.

[0079] The second driving source 1403 in this application embodiment has the following two structures.

[0080] The structure of the first type of second drive source 1403 is as follows: the second drive source 1403 is a cylinder. The drive module 14 also includes a fall arrestor 1404. The output end of the second drive source 1403 is connected to the second lifting plate 1412 of the slide table 1401. One end of the fall arrestor 1404 is connected to the first support base 1402, and the other end of the fall arrestor 1404 is connected to the thickness measuring component 13. The fall arrestor 1404 prevents the thickness measuring component 13 from falling when the second drive source 1403 disappears or the air supply is cut off.

[0081] To prevent the second drive source 1403 from falling due to failure of the second drive source 1403 after an unexpected gas outage, this application provides a fall protection device such as a fall arrestor 1404. The fall arrestor 1404 is connected to the first support base 1402 at its upper end and to the thickness measuring component 13 at its lower end, thus providing gas outage protection for the thickness measuring component 13.

[0082] Optionally, the fall protection device includes a first connecting member 1405 and a second connecting member 1406. Specifically, the fall protection member 1404 is a columnar spring. The first connecting member 1405 is provided on the first support base 1402, and the first connecting member 1405 has a first hanging hole 1407. The base 130 of the thickness measuring component 13 is provided with a second connecting member (1406), and the second connecting member 1406 has a second hanging hole 1408. The upper end of the fall protection member 1404 passes through the first hanging hole 1407 and is connected to the first connecting member 1405, and the lower end of the fall protection member 1404 passes through the second hanging hole 1408 and is connected to the second connecting member 1406. This facilitates the installation of the fall protection member 1404. The columnar spring can prevent the thickness sensor 131 from falling when the equipment suddenly stops supplying air or the air pressure is insufficient, reducing the risk of equipment failure, improving the stability of equipment operation, and reducing equipment maintenance costs.

[0083] The second type of second drive source 1403 has the following structure: The second drive source 1403 includes a drive motor 1409 mounted on the first support base 1402 and a lead screw mounted on the first support base 1402 and drivenly connected to the output end of the drive motor 1409. The second lifting plate 1412 of the slide table 1401 is drivenly connected to the lead screw. The lead screw is not shown in the figure. A rod seat is provided on the first support base 1402. Both the drive motor 1409 and the lead screw are mounted on the rod seat. The cooperation between the lead screw and the drive motor 1409 can accurately control the up and down movement of the thickness measuring component 13. When the measurement scenario requires the height of the thickness measuring component 13 to be adjusted according to the different heights of the circuit board, the actual height of the circuit board is first measured by the distance sensor 15 or observed manually. Then, the cooperation between the lead screw of the drive module 14 and the drive motor 1409 drives the thickness measuring component 13 to move up and down to the measurement reference height. Finally, the thickness measuring component 13 measures the thickness of the adhesive on the surface of the circuit board.

[0084] It is understood that in other embodiments, the first drive source 1410 and the second drive source 1403 of the drive module 14 may also be other linear drive modules such as hydraulic cylinders and electric telescopic rods.

[0085] In one embodiment, the vision inspection device with thickness detection function further includes a distance sensor 15. The distance sensor 15 is mounted on the thickness measuring assembly 13 and moves along a third direction with the thickness measuring sensor 131. The distance sensor 15 measures the distance between the distance measuring sensor 131 and the workpiece to be measured. In scenarios where the circuit board has a small range of height adjustment, the distance sensor 15 first measures the height of the circuit board under test, and then drives the thickness measuring assembly 13 to move within the measurement reference range via the drive module 14 to measure the adhesive thickness of the circuit board, improving the accuracy and safety of the inspection.

[0086] In one embodiment, the linkage platform 11 further includes a first linear module 111 and a second linear module 112 mounted on the output end of the first linear module 111. The stage 110 is mounted on the output end of the second linear module 112. The output end of the first linear module 111 slides along a horizontally set first direction, and the output end of the second linear module 112 slides along a horizontally set second direction, thereby enabling the imaging component 12 and the thickness measurement component 13 to move in the horizontal plane. Specifically, in this embodiment, both the first linear module 111 and the second linear module 112 include an electric lead screw assembly and a guide rail assembly. Through the cooperation of the electric lead screw assembly and the guide rail assembly, the stage 110 is linked in the first and second directions.

[0087] In one embodiment, the thickness measuring component 13 and the imaging component 12 are arranged sequentially along a first direction, with the imaging component 12 located between the stage 110 and the thickness measuring component 13. This increases the travel distance of the thickness measuring component 13 and the imaging component 12, resulting in a larger detection range. Specifically, the thickness measuring component 13 and the imaging component 12 are arranged sequentially along a front-back direction, with the imaging component 12 closer to the stage 110 than the thickness measuring component 13. This allows for a greater travel distance when the thickness measuring component 13 and the imaging component 12 slide along a second direction, resulting in a wider range for measuring the adhesive thickness of the circuit board.

[0088] Understandably, the thickness measuring component 13 and the imaging component 12 can also be arranged sequentially along the second direction, so that the thickness measuring component 13 and the imaging component 12 have a larger stroke when sliding along the first direction.

[0089] Optionally, the vision inspection equipment with thickness detection function also includes a frame 16. The linkage platform 11 is mounted on the frame 16 to support the linkage platform 11. Specifically, the frame 16 is used to install and support the linkage platform 11, the imaging component 12 on the linkage platform 11, the drive module 14, the thickness measurement component 13, and other mechanical parts of the equipment, so that the various mechanical parts of the equipment can cooperate precisely to achieve the measurement of the adhesive thickness.

[0090] In one embodiment, the conveyor track 17 is used to convey the circuit board in a second direction. The conveyor track 17 has a conveying channel for conveying the workpiece to be measured. Exemplarily, the conveyor track 17 is a belt conveyor or a sprocket conveyor, and the conveying channel is located on the belt and conveyor chain, enabling the conveying of the circuit board. The conveying channel is positioned on the moving path of the imaging component 12 and the thickness measuring component 13, enabling automatic conveying of the circuit board and detection of the adhesive coating thickness.

[0091] In one embodiment, the linkage platform 11, imaging component 12, driving module 14, and thickness measuring component 13 are either one or a pair. When a pair is provided, the two linkage platforms 11, two imaging components 12, two driving modules 14, and two thickness measuring components 13 correspond one-to-one. The conveying channel is located between the two thickness measuring components 13, enabling simultaneous detection of the upper and lower surfaces of the circuit board. Specifically, when there is one linkage platform 11, imaging component 12, driving module 14, and thickness measuring component 13, the adhesive thickness on one side of the circuit board can be measured, or the adhesive thickness on both sides of the circuit board can be measured sequentially by flipping the circuit board. In this embodiment, there are two linkage platforms 11, imaging component 12, driving module 14, and thickness measuring components 13, enabling simultaneous measurement of the adhesive thickness on both sides of the circuit board. The two thickness measuring components 13 are arranged alternately from top to bottom, and the circuit board is placed between the two thickness measuring components 13, with one side of the circuit board facing upwards and the other side facing downwards, enabling simultaneous measurement of the adhesive thickness on both the upper and lower surfaces of the circuit board.

[0092] Optionally, the vision inspection equipment with thickness detection function also includes an industrial control computer 18 mounted on the frame 16. The linkage platform 11, imaging component 12, drive module 14, thickness measurement component 13, and conveyor track 17 are all electrically connected to the industrial control computer 18. The industrial control computer 18 is used to control and set the parameters of the vision inspection equipment with thickness detection function, so that the vision inspection equipment with thickness detection function can perform measurements according to needs, such as selecting parameters such as single-sided adhesive thickness measurement, double-sided adhesive thickness measurement, measurement speed, and number of measurements. The industrial control computer 18 can monitor the operation of the vision inspection equipment with thickness detection function, and can also control the start and stop of the vision inspection equipment with thickness detection function, thereby improving the safety of the vision inspection equipment with thickness detection function.

[0093] Furthermore, the visual inspection equipment with thickness detection function also includes a housing. The housing is installed on the frame 16 and together with the frame 16 forms a thickness measuring cavity. The housing includes multiple plates, which are arranged around the frame 16 to achieve enclosed enclosure of the frame 16. The housing provides dust protection, safety protection, and appearance display. The linkage platform 11, imaging component 12, drive module 14, and thickness measuring component 13 are all located inside the thickness measuring cavity. The housing has an inlet and an outlet. The inlet is located on the left side of the housing, and the outlet is located on the right side of the housing. The outlet is not shown in the figure. The thickness measuring cavity is connected to the outside through the inlet and outlet. The conveying channel passes through the inlet, the thickness measuring cavity, and the outlet in sequence to realize the conveying of the circuit board.

[0094] Optionally, the rack 16 is equipped with alarm lights. The alarm lights have multiple colors, each corresponding to a different operating condition. For example, a green light indicates normal equipment operation, while a red light indicates equipment malfunction. The alarm lights are electrically connected to the industrial control computer 18, which can provide real-time feedback on the operating status of the linkage platform 11, imaging component 12, drive module 14, and thickness measurement component 13.

[0095] In one embodiment, multiple feet 21 are mounted on the frame 16 to enable height adjustment of the visual inspection device with thickness detection function. This allows the visual inspection device with thickness detection function to adjust its level according to the ground conditions, avoiding the visual inspection device with thickness detection function tilting and affecting the measurement of the adhesive thickness of the circuit board.

[0096] The technical principles of this application have been described above with reference to specific embodiments. These descriptions are merely for explaining the principles of this application and should not be construed as limiting the scope of protection of this application in any way. Based on this explanation, those skilled in the art can readily conceive of other specific embodiments of this application without inventive effort, and these embodiments will all fall within the scope of protection of this application.

Claims

1. A visual inspection device with thickness detection function, characterized in that, include: The linkage platform (11) includes at least a platform (110) that can move along a first direction and a second direction respectively; Imaging component (12); A transport track (17) is used to transport the workpiece to be measured; the surface of the workpiece to be measured faces the imaging component (12); The drive module (14) includes a slide (1401) that moves along a third direction; Thickness measuring component (13) is directly or indirectly mounted on the slide table (1401) so that the drive module (14) drives the thickness measuring component (13) to move closer to or away from the workpiece to be measured; The first direction, the second direction, and the third direction are perpendicular to each other; the imaging component (12) is mounted on the stage (110) or the slide (1401).

2. The visual inspection device with thickness detection function according to claim 1, characterized in that, The drive module (14) further includes a first drive source (1410); the slide (1401) includes a first lifting plate (1411); the first lifting plate (1411) is connected to the output end of the first drive source (1410); and / or The drive module (14) further includes a second drive source (1403); the slide (1401) includes a second lifting plate (1412); the second lifting plate (1412) is connected to the output end of the second drive source (1403); When the slide (1401) includes the first lifting plate (1411), the first driving source (1410) is installed on the stage (110), and the imaging component (12) and the thickness measuring component (13) are both installed on the first lifting plate (1411). When the slide (1401) includes the second lifting plate (1412), the second driving source (1403) and the imaging component (12) are both installed on the stage (110), and the thickness measuring component (13) is installed on the second lifting plate (1412); When the slide (1401) includes the first lifting plate (1411) and the second lifting plate (1412), the first driving source (1410) is installed on the stage (110), the imaging component (12) and the second driving source (1403) are both installed on the first lifting plate (1411), and the thickness measuring component (13) is installed on the second lifting plate (1412).

3. The visual inspection device with thickness detection function according to claim 2, characterized in that, The drive module (14) also includes a first support base (1402); When the slide (1401) includes the first lifting plate (1411), the thickness measuring component (13) is installed on the first support base (1402), the first support base (1402) and the imaging component (12) are both installed on the first lifting plate (1411), and the thickness measuring component (13) moves along the third direction under the drive of the first lifting plate (1411); When the slide (1401) includes the second lifting plate (1412), the second drive source (1403) is installed on the first support base (1402) and the second lifting plate (1412) is connected to the thickness measuring component (13) to drive the thickness measuring component (13) to move along the third direction; When the slide (1401) includes the first lifting plate (1411) and the second lifting plate (1412), the second drive source (1403) is installed on the first support base (1402), the imaging component (12) and the first support base (1402) are both installed on the first lifting plate (1411), the thickness measuring component (13) is installed on the second lifting plate (1412), and the thickness measuring component (13) moves along the third direction under the drive of the first lifting plate (1411) and the second lifting plate (1412).

4. The visual inspection device with thickness detection function according to claim 3, characterized in that, The thickness measuring component includes a base (130) and a thickness sensor (131), the thickness sensor (131) being mounted on the base (130).

5. The visual inspection device with thickness detection function according to claim 4, characterized in that, The thickness measuring component (13) also includes a protective sleeve (132) installed on the base (130); the thickness sensor (131) is located in the direction away from the workpiece to be measured from the protective sleeve (132).

6. The visual inspection device with thickness detection function according to claim 4, characterized in that, The thickness sensor (131) can be any one of a laser sensor, a spectral confocal sensor, or a spectroscopic interferometer.

7. The visual inspection device with thickness detection function according to claim 4, characterized in that, The drive module (14) also includes a fall arrestor (1404); one end of the fall arrestor (1404) is connected to the first support base (1402), and the other end of the fall arrestor (1404) is connected to the thickness measuring component (13).

8. The visual inspection device with thickness detection function according to claim 7, characterized in that, The fall arrestor (1404) is a columnar spring. The first support base (1402) is provided with a first connector (1405). The first connector (1405) is provided with a first hanging hole (1407). The thickness measuring component (13) is provided with a second connector (1406) on its base (130). The second connector (1406) is provided with a second hanging hole (1408). One end of the fall arrestor (1404) passes through the first hanging hole (1407) and is connected to the first connector (1405). The other end of the fall arrestor (1404) passes through the second hanging hole (1408) and is connected to the second connector (1406).

9. The visual inspection device with thickness detection function according to claim 4, characterized in that, It also includes a distance sensor (15); the distance sensor (15) moves along the third direction along with the thickness sensor (131).

10. The visual inspection device with thickness detection function according to claim 3, characterized in that, The second drive source (1403) includes a drive motor (1409), a lead screw mounted on the first support base (1402) and drivenly connected to the output end of the drive motor (1409); the second lifting plate (1412) is drivenly connected to the lead screw.

11. The visual inspection device with thickness detection function according to claim 1, characterized in that, The imaging component (12) is located between the stage (110) and the thickness measurement component (13).

12. The visual inspection device with thickness detection function according to claim 1, characterized in that, It also includes a frame (16) and an industrial computer (18) mounted on the frame (16); the linkage platform (11) is mounted on the frame (16), and the linkage platform (11), the imaging component (12), the drive module (14), the thickness measuring component (13) and the conveying track (17) are all electrically connected to the industrial computer (18); The linkage platform (11), the imaging component (12), the driving module (14) and the thickness measuring component (13) are each provided in one or a pair. When a pair is provided, the two thickness measuring components (13) are located on both sides of the workpiece to be measured.