A PCB inspection device based on false point defect detection
By introducing an electric telescopic rod and a replaceable rack into the PCB repair device, the problem of the existing device's inability to adjust the striking force has been solved, enabling flexible repair of different solder joints, expanding the scope of application and improving efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIANGSU TOP INTELLIGENT EQUIP CO LTD
- Filing Date
- 2025-07-21
- Publication Date
- 2026-06-02
AI Technical Summary
Existing PCB repair equipment cannot flexibly adjust the tapping force when repairing solder joints with different solder joint strengths, thus limiting its application range.
A PCB repair device based on false spot defect detection was designed. The device uses an electric telescopic rod to drive a rack to slide, which in turn drives the transmission gear and drive shaft to rotate. This causes a small rubber hammer to swing and strike the solder joints. The striking frequency can be adjusted by changing the drive rack with different tooth interval settings. The device is combined with a magnetic guide post and a telescopic cylinder to fix the circuit board, making it adaptable to different circuit board sizes and strengths.
This allows for flexible adjustment of the striking force based on the strength of the solder joints, expanding the device's application range, preventing damage to the circuit board, and improving work efficiency.
Smart Images

Figure CN224317574U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of PCB repair technology, specifically a PCB repair device based on false spot defect detection. Background Technology
[0002] PCB, or Printed Circuit Board, is an important electronic component. It serves as the support for electronic components and the carrier for their electrical interconnection. Because it is manufactured using electronic printing technology, it is called a "printed" circuit board. To ensure the quality of PCB boards, the solder joints need to be inspected, which requires solder joint inspection equipment.
[0003] An existing Chinese patent (publication number: CN218526522U) relates to a PCB board solder joint inspection device, which can quickly locate the inspection position and reduce the probability of inconvenience and low work efficiency in the inspection of existing inspection devices. It includes a mounting plate on which the inspection device is installed; it also includes two sets of fixing plates, two sets of clamping blocks, a rotating handle, a forward and reverse tapping screw, and mounting blocks. The two sets of fixing plates are respectively installed on the left and right sides of the top of the mounting plate. A first rotating hole is provided through the lower side of the left fixing plate at the top of the mounting plate. The forward and reverse tapping screw rotates through the first rotating hole and is rotatably connected to the lower left side of the right fixing plate at the top of the mounting plate. The rotating handle is installed on the left end of the forward and reverse tapping screw. A first slider is provided at the bottom of each of the two sets of clamping blocks. A first sliding groove and a second sliding groove are provided on the front and rear sides of the top of the mounting plate, respectively.
[0004] During use, the aforementioned repair device uses a small hammer to tap circuit boards with substandard solder joints, causing the weak solder joints to fall off. However, in actual use, since the solder joint strength varies in different circuit boards, the tapping force needs to be adjusted according to the type of circuit board. If only one tapping force can be maintained, the scope of application of the device will be limited.
[0005] To address this issue, we designed a PCB repair device based on false spot defect detection. Utility Model Content
[0006] The purpose of this invention is to provide a PCB repair device based on false spot defect detection to solve the problems mentioned in the background art.
[0007] To solve the above-mentioned technical problems, this utility model provides a PCB repair device based on false spot defect detection, including a mounting base, a connecting frame connected to the top of the mounting base, a drive shaft rotatably connected inside the connecting frame, a small rubber hammer connected to the drive shaft, a transmission gear rotatably connected to one side of the connecting frame, the transmission gear being coaxially arranged with the drive shaft, a drive rack slidably connected to the top of the mounting base, an electric telescopic rod for driving the drive rack to slide on the top of the mounting base, and a disassembly and assembly component for fixing the drive rack on one side of the electric telescopic rod.
[0008] Furthermore, the assembly and disassembly assembly includes a mounting frame connected to the telescopic end of the electric telescopic rod, one end of the drive rack is connected to the mounting rod, a limiting post for limiting the mounting rod is inserted into the mounting frame, a force plate is connected to the top of the limiting post, a return spring is sleeved on the limiting post, one end of the return spring is connected to the mounting frame, and the other end is connected to the force plate.
[0009] Furthermore, a magnetic guide post is slidably connected to the top of the mounting base, and the other end of the magnetic guide post is attracted to the bottom of the drive rack.
[0010] Furthermore, a telescopic cylinder is connected to the top of the mounting base, and a fixing frame for fixing the circuit board is connected to the telescopic end of the telescopic cylinder.
[0011] Furthermore, a telescopic cylinder is connected to the top of the mounting base, and a fixing frame for fixing the circuit board is connected to the telescopic end of the telescopic cylinder.
[0012] Furthermore, an anti-slip sleeve is connected to the end of the fixing plate away from the compression spring, and anti-slip particles are integrally formed on the anti-slip sleeve.
[0013] Compared with the prior art, the beneficial effects of this utility model are as follows: the electric telescopic rod on the mounting base drives the drive rack to slide, the drive rack meshes with the transmission gear, and drives the coaxial drive shaft to rotate, thereby causing the small rubber hammer to swing and strike the solder joints of the PCB board. Because the teeth on the drive rack are set to be intermittent, the transmission gear can be driven to rotate intermittently, pulling the force plate upward, causing the limit post to overcome the elastic force of the return spring and be pulled out from the mounting rod, thus removing the drive rack. During installation, the mounting rod of the drive rack is inserted into the mounting frame, the force plate is released, and the return spring pushes the limit post into the mounting rod to complete the fixation. The above settings allow the drive rack to be replaced, making it convenient to control the striking frequency and expanding the application range of the device. Attached Figure Description
[0014] Figure 1 This is a three-dimensional structural diagram of the overall external structure of this utility model;
[0015] Figure 2This is a side view of the present invention;
[0016] Figure 3 This utility model Figure 1 Enlarged view of point A in the middle;
[0017] Figure 4 This utility model Figure 2 Enlarged view of point B in the middle.
[0018] In the diagram: 1. Mounting base; 2. Connecting frame; 3. Drive shaft; 4. Small rubber hammer; 5. Transmission gear; 6. Drive rack; 7. Electric telescopic rod; 8. Mounting frame; 9. Limiting post; 10. Force plate; 11. Return spring; 12. Fixing frame; 13. Compression spring; 14. Fixing plate; 15. Magnetic guide post; 16. Telescopic cylinder. Detailed Implementation
[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0020] Please see Figure 1-4 This utility model provides a technical solution: a PCB repair device based on false spot defect detection, including a mounting base 1, a connecting frame 2 connected to the top of the mounting base 1, a drive shaft 3 rotatably connected inside the connecting frame 2, a small rubber hammer 4 connected to the drive shaft 3, a transmission gear 5 rotatably connected to one side of the connecting frame 2, the transmission gear 5 being coaxially arranged with the drive shaft 3, a drive rack 6 slidably connected to the top of the mounting base 1, an electric telescopic rod 7 for driving the drive rack 6 to slide on the top of the mounting base 1, and a disassembly and assembly component for fixing the drive rack 6 on one side of the electric telescopic rod 7.
[0021] It should be noted that the teeth on the drive rack 6 are intermittently set to drive the transmission gear 5 to rotate intermittently.
[0022] In practice, the electric telescopic rod 7 on the mounting base 1 drives the drive rack 6 to slide. The drive rack 6 meshes with the transmission gear 5, driving the coaxial drive shaft 3 to rotate. This causes the small rubber hammer 4 to swing and strike the PCB board solder joints. Because the teeth on the drive rack 6 are set at intervals, the transmission gear 5 can rotate intermittently. By disassembling and replacing different drive racks 6, the frequency of the intermittent rotation of the transmission gear 5 can be easily adjusted. For solder joints with low solder strength, the striking force of the small rubber hammer 4 can be reduced to avoid excessive striking and damage to the circuit board. For solder joints with high solder strength, the telescopic speed can be increased to enhance the striking force, ensuring that weak solder joints are shaken off, effectively expanding the application range of the device.
[0023] See Figure 1-4 The assembly includes a mounting frame 8 connected to the telescopic end of the electric telescopic rod 7, a mounting rod connected to one end of the drive rack 6, a limiting post 9 for limiting the mounting rod inserted into the mounting frame 8, a force plate 10 connected to the top of the limiting post 9, a return spring 11 sleeved on the limiting post 9, one end of the return spring 11 connected to the mounting frame 8, and the other end connected to the force plate 10.
[0024] In practice, pulling the force plate 10 upwards causes the limiting post 9 to overcome the elastic force of the return spring 11 and be pulled out of the mounting rod, thus disassembling the drive rack 6. During installation, the mounting rod of the drive rack 6 is inserted into the mounting frame 8, the force plate 10 is released, and the return spring 11 pushes the limiting post 9 into the mounting rod to complete the fixation. The drive rack 6 can be replaced through the above settings, making it convenient to control the striking frequency.
[0025] See Figure 1-4 A magnetic guide post 15 is slidably connected to the top of the mounting base 1, and the other end of the magnetic guide post 15 is attracted to the bottom of the drive rack 6.
[0026] In practice, the magnetic guide post 15 is attracted to the bottom of the drive rack 6, providing a stable guiding effect during the sliding process of the drive rack 6, ensuring that the drive rack 6 slides smoothly along a straight line.
[0027] See Figure 1-4 The top of the mounting base 1 is connected to a telescopic cylinder 16, and the telescopic end of the telescopic cylinder 16 is connected to a fixing frame 12 for fixing the circuit board.
[0028] In practice, the telescopic cylinder 16 pushes the fixed frame 12 to move, fixing the circuit board in a suitable position so that the solder joints are within the striking range of the small rubber mallet 4. The position of the fixed frame 12 can be adjusted by the telescopic cylinder 16 to meet the fixing requirements of circuit boards of different sizes.
[0029] See Figure 1-4 Multiple compression springs 13 are connected inside the fixed frame 12, and the other end of the compression spring 13 is connected to the fixed plate 14.
[0030] In practice, when fixing the circuit board, the compression spring 13 is in a compressed state, and the fixing plate 14 applies elastic pressure to the circuit board, firmly fixing the circuit board within the fixing frame 12. The elasticity of the compression spring 13 can adapt to the fixing of circuit boards of different thicknesses, avoiding damage to the circuit board.
[0031] See Figure 1-4 The end of the fixing plate 14 away from the compression spring 13 is connected to an anti-slip sleeve, and anti-slip particles are integrally formed on the anti-slip sleeve.
[0032] In practice, the anti-slip sleeve on the fixing plate 14 and the anti-slip particles on its surface increase the friction with the surface of the circuit board, preventing the circuit board from sliding within the fixing frame 12 when the compression spring 13 applies pressure to fix the circuit board.
[0033] Working principle: The electric telescopic rod 7 on the mounting base 1 drives the drive rack 6 to slide. The drive rack 6 meshes with the transmission gear 5, which drives the coaxial drive shaft 3 to rotate, thereby causing the small rubber hammer 4 to swing and strike the PCB board solder joints. Since the teeth on the drive rack 6 are set to be intermittent, the transmission gear 5 can be driven to rotate intermittently.
[0034] Pulling the force plate 10 upwards causes the limiting post 9 to overcome the elastic force of the return spring 11 and be pulled out of the mounting rod, thus removing the drive rack 6. During installation, insert the mounting rod of the drive rack 6 into the mounting frame 8, release the force plate 10, and the return spring 11 pushes the limiting post 9 into the mounting rod to complete the fixation. The drive rack 6 can be replaced through the above settings, which facilitates the control of the tapping frequency. By disassembling and replacing different drive racks 6, it is convenient to adjust the frequency of the intermittent rotation of the transmission gear 5. For solder joints with low welding strength, the tapping force of the small rubber hammer 4 can be reduced to avoid excessive tapping and damage to the circuit board. For solder joints with high welding strength, the extension and retraction speed can be increased to enhance the tapping force, ensuring that weak solder joints are shaken off, effectively expanding the application range of the device.
[0035] When fixing the circuit board, the compression spring 13 is in a compressed state, and the fixing plate 14 applies elastic pressure to the circuit board, firmly fixing the circuit board within the fixing frame 12. The elasticity of the compression spring 13 can adapt to the fixing of circuit boards of different thicknesses, avoiding damage to the circuit board.
Claims
1. A PCB repair device based on false spot defect detection, comprising a mounting base (1), characterized in that, The top of the mounting base (1) is connected to a connecting frame (2), and a drive shaft (3) is rotatably connected inside the connecting frame (2). A small rubber hammer (4) is connected to the drive shaft (3). A transmission gear (5) is rotatably connected to one side of the connecting frame (2). The transmission gear (5) is coaxially arranged with the drive shaft (3). A drive rack (6) is slidably connected to the top of the mounting base (1). An electric telescopic rod (7) for driving the drive rack (6) to slide is provided on the top of the mounting base (1). A disassembly and assembly assembly for fixing the drive rack (6) is provided on one side of the electric telescopic rod (7).
2. The PCB repair device based on false spot defect detection as described in claim 1, characterized in that: The assembly and disassembly assembly includes a mounting frame (8) connected to the telescopic end of the electric telescopic rod (7), one end of the drive rack (6) is connected to the mounting rod, a limiting post (9) for limiting the mounting rod is inserted into the mounting frame (8), a force plate (10) is connected to the top of the limiting post (9), and a return spring (11) is sleeved on the limiting post (9). One end of the return spring (11) is connected to the mounting frame (8), and the other end is connected to the force plate (10).
3. The PCB repair device based on false spot defect detection as described in claim 2, characterized in that: A magnetic guide post (15) is slidably connected to the top of the mounting base (1), and the other end of the magnetic guide post (15) is attracted to the bottom of the drive rack (6).
4. The PCB repair device based on false spot defect detection as described in claim 3, characterized in that: The top of the mounting base (1) is connected to a telescopic cylinder (16), and the telescopic end of the telescopic cylinder (16) is connected to a fixing frame (12) for fixing the circuit board.
5. The PCB repair device based on false spot defect detection as described in claim 4, characterized in that: Multiple compression springs (13) are connected inside the fixed frame (12), and the other end of the compression springs (13) is connected to a fixed plate (14).
6. The PCB repair device based on false spot defect detection as described in claim 5, characterized in that: The end of the fixing plate (14) away from the compression spring (13) is connected to an anti-slip sleeve, and the anti-slip sleeve is integrally formed with anti-slip particles.