Earphone ear pad structure and earphone

By introducing clamping connectors and multiple layers of sound insulation material into the earcup structure, the problem of sound leakage in headphones has been solved, achieving better noise reduction and sound cancellation effects as well as wearing comfort.

CN224319488UActive Publication Date: 2026-06-02DONGGUAN SHENGYANG ELECTRONIC CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
DONGGUAN SHENGYANG ELECTRONIC CO LTD
Filing Date
2025-05-22
Publication Date
2026-06-02

AI Technical Summary

Technical Problem

The existing earcup structure of headphones is prone to sound leakage, resulting in poor noise reduction and sound cancellation effects.

Method used

Clamping connectors are used to connect the support, sound-absorbing and sound-insulating components. The clamping connectors increase the assembly base surface between the sound-insulating component and the support, and combined with the internal sound absorption of the sound-absorbing component and the external sound insulation of the sound-insulating component, the assembly stability and sound insulation effect are improved.

Benefits of technology

It effectively avoids sound leakage, improves sound insulation and noise reduction, and enhances wearing comfort.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model belongs to earphone technical field, concretely relates to earphone ear cap structure and earphone, wherein, earphone ear cap structure includes support piece, clamping connecting piece, sound absorbing part and sound insulation part, the sound insulation part sets up in the outer surface of sound absorbing part, one side end of sound insulation part sets up in the inside of clamping connecting piece, and clamping connecting piece is connected between sound absorbing part and support piece, the utility model discloses can improve assembly stability, avoids the phenomenon of using separation and causes the leakage of sound, further can improve sound insulation and sound elimination effect.
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Description

Technical Field

[0001] This utility model belongs to the field of headphone technology, and in particular relates to an ear cover structure for headphones and headphones. Background Technology

[0002] With the rapid development of electronic technology, in addition to meeting various needs in people's lives, it has also gradually moved towards people's entertainment life. Driven by modern people's pursuit of convenience and popular culture, electronic products with sound and light effects have formed a new trend. The emergence of headphones not only makes various electronic products more mobile, but also creates a private space for users to be undisturbed by others or not disturb others. Moreover, headphones are widely used in various electronic devices with sound output, becoming an indispensable tool in life.

[0003] However, most headphones currently use earcups that are prone to sound leakage, resulting in poor noise reduction and sound cancellation. Utility Model Content

[0004] The purpose of this utility model is to provide an earphone cover structure that addresses the shortcomings of existing technologies and solves the technical problem of poor noise reduction and sound cancellation effects in existing technologies.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] An earphone cover structure includes a support member, a clamping connector, a sound-absorbing member, and a sound-insulating member; the sound-insulating member is disposed on the outer surface of the sound-absorbing member; one end of the sound-insulating member is disposed inside the clamping connector; and the clamping connector is connected between the sound-absorbing member and the support member.

[0007] Preferably, the clamping connector includes a first clamping block and a second clamping block; the side surface of the first clamping block away from the second clamping block is connected to the sound-absorbing member; the side surface of the second clamping block away from the first clamping block is connected to the support member; the side surface of the first clamping block near the second clamping block and the side surface of the second clamping block near the first clamping block are respectively connected to the two sides of the sound-insulating member.

[0008] Preferably, the thickness h of the sound insulation component satisfies: 0.1mm≤h≤1.5mm.

[0009] Preferably, the sound-absorbing component is made of sponge or linen; and / or, the sound-insulating component is made of soft rubber.

[0010] Preferably, the Shore hardness of the sound insulation component is in the range of 5A to 90A.

[0011] Preferably, the sound insulation component is covered and connected to the outer surface of the sound absorption component away from the support component;

[0012] And / or, the sound insulation element covers at least a portion of the structure of the outer surface of the sound absorption element near the support.

[0013] Preferably, the earphone cover structure further includes an outer protective member; the outer protective member covers and is disposed on the outer surface of the sound-insulating member away from the sound-absorbing member; and the outer protective member is connected to the support member.

[0014] Preferably, the outer protective component includes a protective film and a protective cloth stacked sequentially from the inside to the outside; and the protective cloth is connected to the support member; the protective film is connected to the outer surface of the sound insulation component away from the sound absorption component.

[0015] Preferably, the protective film is a TPU film or a PU film;

[0016] And / or, the protective fabric may be knitted fabric or needle-punched geotextile.

[0017] This utility model also discloses an earphone, including the aforementioned ear cover structure.

[0018] The beneficial effects of this utility model are as follows: This technical solution uses a clamping connector to clamp and assemble the connecting end of the covered sound insulation component, which increases the assembly base surface between the clamping connector, the sound insulation component, and the support component, thereby improving the assembly stability of the sound insulation component and avoiding separation during use that could cause sound leakage; thus, it can improve the sound insulation and noise reduction effect; and through the internal sound absorption of the sound-absorbing component and the external sound insulation of the sound insulation component, it can further improve the sound insulation and noise reduction effect and improve the comfort of wearing and using it. Attached Figure Description

[0019] The following will refer to the appendix. Figures 1-4 This section describes the features, advantages, and technical effects of exemplary embodiments of the present invention.

[0020] Figure 1 This is a cross-sectional view of an earphone cover structure according to an embodiment of the present invention;

[0021] Figure 2 This is an exploded view of an earphone cover structure according to an embodiment of the present invention;

[0022] Figure 3 This is a partially enlarged view of the ear cup structure of an embodiment of the present invention;

[0023] Figure 4 This is a partially enlarged view of the earcup structure of an embodiment of the present invention.

[0024] In the diagram: 1-Support component; 2-Outer protective component; 21-Protective cloth; 22-Protective film; 3-Clamping connector; 31-First clamping block; 32-Second clamping block; 4-Sound absorbing component; 5-Sound insulation component; 6-Sealing cotton. Detailed Implementation

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0026] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0027] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0028] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or multiple situations existing alone. In addition, the character " / " in this document generally indicates that the related objects before and after are in an "or" relationship.

[0029] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0030] The following is in conjunction with the appendix Figures 1-4 The present invention will be described in further detail, but this is not intended to limit the scope of the present invention.

[0031] like Figure 1 and 2 As shown, in one embodiment of this utility model, the earphone cover structure includes a support member 1, a clamping connector 3, a sound-absorbing member 4, and a sound-insulating member 5; the sound-insulating member 5 is disposed on the outer surface of the sound-absorbing member 4; one side end of the sound-insulating member 5 is disposed inside the clamping connector 3; and the clamping connector 3 is connected between the sound-absorbing member 4 and the support member 1.

[0032] The technical solution of this utility model uses a clamping connector to clamp and assemble the connecting end of the covered sound insulation component. This increases the assembly base surface between the clamping connector, the sound insulation component, and the support component, thereby improving the assembly stability of the sound insulation component and preventing separation during use that could cause sound leakage. This, in turn, improves the sound insulation and noise reduction effect. Furthermore, through the internal sound absorption of the sound-absorbing component and the external sound insulation of the sound insulation component, the sound insulation and noise reduction effect is further improved, enhancing the comfort of wearing and using the device.

[0033] Specifically, in some embodiments, the sound-absorbing component 4 is made of sponge or linen; preferably memory foam; and the sound-absorbing component 4 is annular with an elliptical cross-section, reducing overall weight while ensuring sound absorption. This structure absorbs ambient noise through its annular shape, improving the sound insulation and noise reduction effect of the earcup structure, thereby enhancing wearing comfort.

[0034] Specifically, in some embodiments, the Shore hardness of the sound insulation component 5 ranges from 5A to 90A. In some embodiments, the sound insulation component 5 is made of a soft rubber material; furthermore, the Shore hardness of this soft rubber material can be 5A, 10A, 15A, 20A, 25A, 30A, 35A, 40A, 45A, 50A, 55A, 60A, 65A, 70A, 75A, 80A, 85A, 90A, or any two of the aforementioned values. By controlling the Shore hardness of the soft rubber material within the above range, user comfort can be improved, and the sound insulation effect can be effectively enhanced.

[0035] Specifically, in some embodiments, the support member 1 is a hollow structure made of plastic; the soft material is selected from silicone, gel, TPU (thermoplastic polyurethane elastomer rubber), TPE (thermoplastic elastomer material), TPR (thermoplastic soft rubber), PVC (polyvinyl chloride), and rubber. In the prior art, most ear cup structures are only filled with sponge. Due to the large number of pores inside the sponge, the noise reduction effect of such ear cups 100 is not ideal. However, in this technical solution, by setting a layer of soft material with a Shore hardness between 5A and 50A on the outer surface of the sponge, the noise reduction effect of the ear cup structure can be effectively improved.

[0036] Specifically, in some implementations, such as Figure 1 and 2 As shown, the sound insulation component 5 is attached to the outer surface of the sound absorption component 4 away from the support component 1; and / or, the sound insulation component 5 is attached to at least a portion of the outer surface of the sound absorption component 4 near the support component 1. This structure, through its relatively large coverage, can improve the stability of the assembly between the sound insulation component 5 and the sound absorption component 4, and ensure sound insulation and noise reduction effects.

[0037] Specifically, in some implementations, such as Figure 2 and 4 As shown, the thickness h of the sound insulation component 5 satisfies: 0.1mm ≤ h ≤ 1.5mm. That is, the thickness of the soft rubber material can be 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1.0mm, 1.1mm, 1.2mm, 1.3mm, 1.4mm, 1.5mm, or any two of the aforementioned values, preferably 1mm. This structure, by using a soft rubber material of appropriate thickness, can effectively reduce the thickness of the ear cup structure while ensuring its sound insulation and noise reduction effect.

[0038] Specifically, in some implementations, such as Figure 1 , 2 As shown in Figure 3, the clamping connector 3 includes a first clamping block 31 and a second clamping block 32; the first clamping block 31 and the second clamping block 32 are arranged side by side; and the surface of the first clamping block 31 away from the second clamping block 32 is connected to the sound-absorbing component 4; the surface of the second clamping block 32 away from the first clamping block 31 is connected to the support component 1; the surface of the first clamping block 31 near the second clamping block 32 and the surface of the second clamping block 32 near the first clamping block 31 are respectively connected to the two sides of the sound-insulating component 5. Both the first clamping block 31 and the second clamping block 32 are made of PET (polyterephthalic acid plastic); the first clamping block 31 is bonded to the sound-absorbing component 4; the second clamping block 32 is bonded to the support component 1; and the sound-insulating component 5 is bonded to both the first clamping block 31 and the second clamping block 32. The structure increases the assembly coverage area between the sound insulation component 5 and the first clamp 31 and the second clamp 32 on the upper and lower sides, respectively, thereby effectively reducing the assembly gap and improving its sound insulation and noise reduction effect.

[0039] Specifically, in some implementations, such as Figure 1 and 2 As shown, the earcup structure for headphones also includes an outer protective member 2; the outer protective member 2 covers and is disposed on the outer surface of the sound-insulating member 5 away from the sound-absorbing member 4; and the outer protective member 2 is connected to the support member 1. Wherein, as Figure 1 , 3As shown in Figure 4, the outer protective component 2 includes a protective film 22 and a protective cloth 21 stacked sequentially from the inside out; the protective cloth 21 is connected to the support component 1; and the protective film 22 is connected to the outer surface of the sound insulation component 5 away from the sound absorption component 4. Further, the protective film 22 is selected as a TPU (thermoplastic polyurethane elastomer rubber) film or a PU (polyurethane) film; the protective cloth 21 is selected as a knitted fabric or a needle-punched geotextile. This structure can improve user comfort; and it is relatively simple to manufacture, facilitating production. Further still, such as... Figure 3 As shown, a sealing cotton 6 is provided between the protective cloth 21 and the support member 1.

[0040] This utility model also proposes an earphone, which includes an earcup structure. The specific structure of the earcup structure is as described in the above embodiments. Since this earphone adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, and will not be described in detail here. The earphone can be a noise-canceling earphone, a gaming earphone, a wireless earphone, a wired earphone, an over-ear earphone, or an ear-hook earphone, etc.

[0041] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style of the specification is merely for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0042] Based on the disclosure and teachings of the above specification, those skilled in the art can make changes and modifications to the above embodiments. Therefore, this utility model is not limited to the specific embodiments described above, and any obvious improvements, substitutions, or modifications made by those skilled in the art based on this utility model are within the protection scope of this utility model. Furthermore, although some specific terms are used in this specification, these terms are only for convenience of explanation and do not constitute any limitation on this utility model.

Claims

1. An earcup structure for headphones, characterized in that: It includes a support member, a clamping connector, a sound-absorbing member, and a sound-insulating member; the sound-insulating member is disposed on the outer surface of the sound-absorbing member; one end of the sound-insulating member is disposed inside the clamping connector; and the clamping connector is connected between the sound-absorbing member and the support member.

2. The earcup structure for headphones according to claim 1, characterized in that: The clamping connector includes a first clamping block and a second clamping block; the side surface of the first clamping block away from the second clamping block is connected to the sound-absorbing component; the side surface of the second clamping block away from the first clamping block is connected to the support component; the side surface of the first clamping block near the second clamping block and the side surface of the second clamping block near the first clamping block are respectively connected to the two sides of the sound-insulating component.

3. The earcup structure for headphones according to claim 1, characterized in that: The thickness h of the sound insulation component satisfies: 0.1mm≤h≤1.5mm.

4. The earcup structure for headphones according to claim 1, characterized in that: The sound-absorbing component is made of sponge or linen; and / or, the sound-insulating component is made of soft rubber.

5. The earphone cover structure according to claim 1 or 4, characterized in that: The sound insulation component has a Shore hardness range of 5A to 90A.

6. The earphone cover structure according to claim 1 or 4, characterized in that: The sound insulation component is covered and connected to the outer surface of the sound absorption component away from the support component; And / or, the sound insulation element covers at least a portion of the structure of the outer surface of the sound absorption element near the support.

7. The earcup structure for headphones according to claim 1, characterized in that: The earphone cover structure also includes an outer protective component; the outer protective component covers and is disposed on the outer surface of the sound-insulating component away from the sound-absorbing component; and the outer protective component is connected to the support component.

8. The earcup structure for headphones according to claim 7, characterized in that: The outer protective component includes a protective film and a protective cloth stacked sequentially from the inside to the outside; and the protective cloth is connected to the support member; the protective film is connected to the outer surface of the sound insulation component away from the sound absorption component.

9. The earcup structure for headphones according to claim 8, characterized in that: The protective film is selected from TPU film or PU film; And / or, the protective fabric may be knitted fabric or needle-punched geotextile.

10. An earphone, characterized in that: Includes the ear cup structure for headphones as described in any one of claims 1 to 9.