A hollow structure circuit board

CN224319575UActive Publication Date: 2026-06-02FOSHAN SHUNDE JUNDA ELECTRONIC CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
FOSHAN SHUNDE JUNDA ELECTRONIC CO LTD
Filing Date
2025-03-28
Publication Date
2026-06-02

AI Technical Summary

Technical Problem

Existing hollow-structure circuit boards struggle to balance mechanical strength and heat dissipation efficiency, making them prone to microcrack propagation or even breakage under vibration or impact conditions, and their heat dissipation effect is insufficient.

Method used

A hollow structure circuit board was designed, including hollow structures in different areas and composite support structures. It combines a heat storage area and a heat dissipation plate, and uses thermally conductive silicone and electromagnetic shielding materials to improve heat dissipation performance. The mechanical strength is enhanced by the support structure.

Benefits of technology

This technology enhances the mechanical strength of the circuit board while improving heat dissipation efficiency, effectively buffering transient thermal shocks and improving anti-interference performance, thus preventing damage to circuit components.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

This utility model discloses a hollow structure circuit board, belonging to the field of circuit board technology. It includes a circuit board body, the top of which is divided into a first low-heat zone, a second low-heat zone, and a high-heat zone according to the power of the components. A first circular hollow structure is disposed on one side of the second low-heat zone, a second circular hollow structure is disposed at the bottom of the first low-heat zone, a rectangular hollow structure is disposed on one side of the high-heat zone, and a heat dissipation structure is disposed at the bottom of the circuit board body. The first circular hollow structures are distributed on both sides of the second low-heat zone, and an anti-interference layer is disposed within each first circular hollow structure. The second circular hollow structure includes a composite support structure. The effect of setting up the composite support structure, support lines, heat storage zone, and anti-interference layer is to enhance the compressive strength of the circuit board body itself, while the heat storage zone can absorb transient thermal shocks and improve anti-interference performance.
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