Heat conduction type computer room cooling device

Abstract

This utility model discloses a heat-conducting computer room heat dissipation device, belonging to the technical field of heat dissipation devices. Its key technical features include a movable frame, a water tank connected to the top of the movable frame, a refrigeration structure connected to the top of the water tank, a circulating pump installed on the top of the water tank, a cooling pipe movably connected to the top of the circulating pump, a cooling mechanism on the surface of the cooling pipe, a support rod on the top of the movable frame, and a fan structure on the top of the support rod. The cooling mechanism includes a heat exchange plate, a heat-conducting block, and a metal clip. This invention solves the problem that most existing heat-conducting computer room heat dissipation devices are fixed installations, and when equipment in the computer room suddenly overheats, there is often a lack of flexibly deployable heat dissipation equipment, making it difficult to promptly and specifically cool down localized overheated areas. This can easily lead to equipment shutdown due to high temperature triggering protection mechanisms, or even irreversible hardware damage.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation device technology, and in particular to a heat-conducting computer room heat dissipation device. Background Technology

[0002] Computer rooms typically house a large number of electronic devices that generate a significant amount of heat during operation. To maintain a stable temperature within the computer room, ensure the normal operation of the equipment, and effectively address the heat dissipation demands generated by the high-density operation of the equipment, it is necessary to install heat dissipation devices in the computer room.

[0003] In existing technologies, computer rooms primarily rely on the operation of equipment such as air conditioners for heat dissipation. The indoor units of these air conditioners are fixedly installed in specific locations within the computer room, blowing out cool air to achieve even cooling. However, since most of these cooling devices are fixedly installed, when a localized equipment in the computer room experiences a sudden overheating failure, it is difficult to quickly and effectively cool the overheated area. This can easily lead to equipment shutting down due to high temperatures triggering protection mechanisms, or even causing irreversible hardware damage. Utility Model Content

[0004] The purpose of this invention is to provide a heat-conducting computer room cooling device that can solve the problem of inconvenience in timely and targeted rapid cooling of local overheated areas.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a heat-conducting computer room heat dissipation device, including a movable frame, a water tank connected to the top of the movable frame, a refrigeration structure connected to the top of the water tank, a circulation pump installed on the top of the water tank, a cooling pipe movably connected to the top of the circulation pump, a cooling mechanism installed on the surface of the cooling pipe, a support rod installed on the top of the movable frame, and a fan structure installed on the top of the support rod;

[0006] The cooling mechanism includes a heat exchange plate, a heat-conducting block, and a metal clip. The rear side of the metal clip is connected to the front side of the heat-conducting block, the rear side of the heat-conducting block is connected to the front side of the heat exchange plate, and the inner wall of the metal clip is engaged with the surface of the cooling pipe.

[0007] Preferably, the bottom of the cooling pipe is movably connected to the top of the refrigeration structure, and the inner wall of the metal block is provided with a slot for use with the cooling pipe.

[0008] Preferably, a fixing block is connected to the top of the movable frame, and a sliding rod is connected to the inner wall of the fixing block.

[0009] Preferably, a slider is slidably connected to the surface of the slide rod, and the bottom of the slider is connected to the bottom of the support rod.

[0010] Preferably, the inner wall of the slider is threaded with a knob, and the rear side of the knob is in close contact with the front side of the slider.

[0011] Preferably, the inner wall of the slider is provided with a sliding hole for use with the sliding rod, and the inner wall of the slider is provided with a threaded hole for use with the knob.

[0012] Preferably, an adjustment frame is connected to the surface of the support rod, and a damping rotation assembly is fixedly connected to the inner wall of the adjustment frame. The damping rotation assembly is connected to the fan structure on the side closest to the fan structure.

[0013] Preferably, the bottom of the mobile frame is connected to casters, and the top of the mobile frame is connected to a handle assembly.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] 1. This application sets up a cooling mechanism. During use, the position of the metal clips and the heat-conducting blocks are fixed, and the position of the heat exchange plate and the heat-conducting blocks is fixed. When the equipment in the heat-conducting machine room suddenly overheats, the heat exchange plate is attached to the heat-generating area, and then the circulating pump at the top of the water tank outputs the cooling medium, which facilitates the circulation of the cooling medium through the cooling pipes. This allows the metal clips on the surface of the cooling pipes to perform rapid heat exchange, which facilitates the stable cooling of the heat exchange plate.

[0016] 2. This application enables the thermally conductive computer room heat dissipation device to be easily moved by setting up a mobile frame, support rod and fan structure. It can quickly respond to the overheating needs of equipment in different areas of the computer room and provide timely heat dissipation support. The fan structure provides air cooling assistance. The two heat dissipation methods work together to greatly improve heat dissipation efficiency, effectively reduce equipment temperature, ensure stable operation of computer room equipment and facilitate user use. Attached Figure Description

[0017] Figure 1 This is an overall structural diagram of the heat-conducting computer room heat dissipation device of this utility model;

[0018] Figure 2 This is a structural diagram of the water tank of this utility model;

[0019] Figure 3 This is a structural diagram of the cooling mechanism of this utility model;

[0020] Figure 4 This is a structural diagram of the slider of this utility model;

[0021] Figure 5 This is a structural diagram of the fan structure of this utility model.

[0022] In the diagram, 1. Moving frame; 2. Cooling mechanism; 201. Heat exchange plate; 202. Heat conduction block; 203. Metal clip; 3. Water tank; 4. Refrigeration structure; 5. Circulating pump; 6. Cooling pipe; 7. Support rod; 8. Fan structure; 9. Slot; 10. Fixing block; 11. Slide rod; 12. Slider; 13. Knob; 14. Sliding hole; 15. Threaded hole; 16. Adjusting frame; 17. Damped rotation assembly; 18. Caster wheel; 19. Handle assembly. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Please see Figure 1-5 The present invention provides the following technical solution:

[0025] A heat-conducting computer room heat dissipation device includes a mobile frame 1, a water tank 3 connected to the top of the mobile frame 1, a cooling structure 4 connected to the top of the water tank 3, a circulation pump 5 installed on the top of the water tank 3, a cooling pipe 6 movably connected to the top of the circulation pump 5, a cooling mechanism 2 installed on the surface of the cooling pipe 6, a support rod 7 installed on the top of the mobile frame 1, and a fan structure 8 installed on the top of the support rod 7.

[0026] The cooling mechanism 2 includes a heat exchange plate 201, a heat conduction block 202, and a metal clip 203. The rear side of the metal clip 203 is connected to the front side of the heat conduction block 202, the rear side of the heat conduction block 202 is connected to the front side of the heat exchange plate 201, and the inner wall of the metal clip 203 is engaged with the surface of the cooling pipe 6.

[0027] In this embodiment: By setting up a cooling mechanism 2, the position of the metal clip 203 and the heat-conducting block 202 are fixed during use, and the position of the heat exchange plate 201 and the heat-conducting block 202 are also fixed. When the equipment in the heat-conducting computer room suddenly overheats, the heat exchange plate 201 is attached to the heat-generating area, and then the circulating pump 5 at the top of the water tank 3 outputs the cooling medium, which flows through the cooling pipe 6. This allows the metal clip 203 on the surface of the cooling pipe 6 to perform rapid heat exchange, facilitating the stable cooling of the heat exchange plate 201. By setting up a movable frame 1, a support rod 7, and a fan structure 8, the heat-conducting computer room heat dissipation device has convenient mobility, which can quickly respond to the overheating needs of equipment in different areas of the computer room and provide timely heat dissipation support. The fan structure 8 provides air cooling assistance. The two heat dissipation methods work together to greatly improve heat dissipation efficiency, effectively reduce equipment temperature, ensure stable operation of computer room equipment, and facilitate user operation.

[0028] Specifically, such as Figure 2 , Figure 3 As shown, the bottom of the cooling pipe 6 is movably connected to the top of the refrigeration structure 4, and the inner wall of the metal block 203 is provided with a slot 9 for use with the cooling pipe 6.

[0029] Specifically, such as Figure 4 As shown, a fixed block 10 is connected to the top of the movable frame 1, and a sliding rod 11 is connected to the inner wall of the fixed block 10.

[0030] Specifically, such as Figure 4 As shown, a slider 12 is slidably connected to the surface of the slider 11, and the bottom of the slider 12 is connected to the bottom of the support rod 7.

[0031] In this embodiment: the slot 9 opened on the inner wall of the metal block 203 facilitates the installation of the cooling pipe 6 through the slot 9 on the inner wall of the metal block 203, which facilitates the subsequent stable installation of the cooling pipe 6. The connection between the cooling pipe 6 and the refrigeration structure 4 ensures continuous circulation of the cooling medium, forming a closed-loop heat dissipation structure, ensuring that the cooling mechanism 2 always obtains a low-temperature cold source. By setting the fixing block 10, the sliding rod 11 and the slider 12, the fixing block 10 is fixed to the position of the sliding rod 11, and the slider 12 is fixed to the position of the support rod 7, which facilitates the subsequent sliding of the slider 12 on the surface of the sliding rod 11 by the support rod 7. This allows for flexible adjustment of the fixed position of the fan structure 8, making it suitable for the heat dissipation needs of equipment in different locations and enhancing the flexibility of the device.

[0032] Specifically, such as Figure 4 As shown, a knob 13 is threadedly connected to the inner wall of slider 12, and the rear side of knob 13 is in close contact with the front side of slider 11.

[0033] Specifically, such as Figure 4As shown, the inner wall of the slider 12 has a sliding hole 14 that works with the slider rod 11, and the inner wall of the slider 12 has a threaded hole 15 that works with the knob 13.

[0034] In this embodiment: By setting a knob 13, the slider 12 can be rotated on its inner wall during use, which helps to restrict the position of the slider 12 and prevents the fan structure 8 from shifting randomly during use, thus ensuring the stability of the fan structure 8 during operation. The sliding hole 14 on the inner wall of the slider 12 allows the slider 12 to slide on the surface of the slide rod 11 through the sliding hole 14. The threaded hole 15 on the inner wall of the slider 12 allows the knob 13 to rotate on its inner wall through the threaded hole 15, which helps to restrict the position of the slider 12 and makes it convenient for the user to use.

[0035] Specifically, such as Figure 5 As shown, an adjustment frame 16 is connected to the surface of the support rod 7, and a damping rotation assembly 17 is fixedly connected to the inner wall of the adjustment frame 16. The damping rotation assembly 17 is connected to the fan structure 8 on the side closest to the fan structure 8.

[0036] Specifically, such as Figure 1 As shown, the bottom of the mobile frame 1 is connected to casters 18, and the top of the mobile frame 1 is connected to a handle assembly 19.

[0037] In this embodiment: by setting the adjustment frame 16 and the damping rotation component 17, the damping rotation component 17 at the top of the support rod 7 allows the fan structure 8 to be freely adjusted at multiple angles. Users can flexibly adjust the airflow direction according to the heat generation area of ​​the equipment to achieve precise air cooling coverage. The universal wheels 18 at the bottom of the mobile frame 1, together with the handle component 19 at the top, make the mobile frame 1 portable. A single person can easily push the mobile frame 1 to any position in the computer room. Moreover, the universal wheels 18 are flexible in turning, adapting to narrow passages and complex layouts, and improving the emergency heat dissipation response speed.

[0038] Working Principle: During the use of the mobile frame 1, a cooling mechanism 2 is installed. During use, the metal clips 203 and heat-conducting blocks 202 are fixed in place, as are the heat exchange plates 201 and heat-conducting blocks 202. When equipment in the heat-conducting computer room suddenly overheats, the heat exchange plates 201 are attached to the heat-generating area. Then, the circulating pump 5 at the top of the water tank 3 outputs cooling medium, allowing it to circulate through the cooling pipes 6. This enables rapid heat exchange on the metal clips 203 on the surface of the cooling pipes 6, facilitating stable cooling of the heat exchange plates 201. The mobile frame 1, support rod 7, and fan structure 8 provide convenient mobility for the heat-conducting computer room cooling device, allowing for rapid response to overheating needs in different areas of the computer room and timely cooling support. The fan structure 8 provides auxiliary air cooling. The two cooling methods work together to significantly improve cooling efficiency, effectively reduce equipment temperature, ensure stable operation of computer room equipment, and facilitate user operation.

[0039] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A heat-conducting computer room cooling device, comprising a movable frame, characterized in that: The top of the mobile frame is connected to a water tank, the top of the water tank is connected to a refrigeration structure, the top of the water tank is equipped with a circulation pump, the top of the circulation pump is movably connected to a cooling pipe, the surface of the cooling pipe is equipped with a cooling mechanism, the top of the mobile frame is equipped with a support rod, and the top of the support rod is equipped with a fan structure. The cooling mechanism includes a heat exchange plate, a heat-conducting block, and a metal clip. The rear side of the metal clip is connected to the front side of the heat-conducting block, the rear side of the heat-conducting block is connected to the front side of the heat exchange plate, and the inner wall of the metal clip is engaged with the surface of the cooling pipe.

2. The heat-conducting computer room cooling device according to claim 1, characterized in that: The bottom of the cooling pipe is movably connected to the top of the refrigeration structure, and the inner wall of the metal block is provided with a slot that mates with the cooling pipe.

3. The heat-conducting computer room cooling device according to claim 1, characterized in that: The top of the movable frame is connected to a fixed block, and the inner wall of the fixed block is connected to a sliding rod.

4. The heat-conducting computer room cooling device according to claim 3, characterized in that: A slider is slidably connected to the surface of the slide rod, and the bottom of the slider is connected to the bottom of the support rod.

5. The heat-conducting computer room cooling device according to claim 4, characterized in that: The inner wall of the slider is threaded with a knob, and the rear side of the knob is in close contact with the front side of the slider.

6. The heat-conducting computer room cooling device according to claim 5, characterized in that: The inner wall of the slider has a sliding hole for use with the slide rod, and the inner wall of the slider has a threaded hole for use with the knob.

7. The heat-conducting computer room cooling device according to claim 1, characterized in that: An adjustment frame is connected to the surface of the support rod, and a damping rotation assembly is fixedly connected to the inner wall of the adjustment frame. The damping rotation assembly is connected to the fan structure on the side closest to the fan structure.

8. The heat-conducting computer room cooling device according to claim 1, characterized in that: The bottom of the mobile frame is connected to casters, and the top of the mobile frame is connected to a handle assembly.

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