A high-power LED ceramic heat-dissipation substrate

Abstract

The utility model discloses a high -power LED ceramic heat dissipation baseplate, including base, the base upper side is welded with metal conductor, be equipped with LED chip on the metal conductor, be equipped with organic glue between the LED chip and metal conductor, the LED chip outside is coated with fluorescent powder, the fluorescent powder outside is equipped with silica gel, the base upper side and lower side are equipped with first heat dissipation hole and second heat dissipation hole respectively, the second heat dissipation hole is fixedly connected with aluminium pipe in, first heat dissipation hole and second heat dissipation hole are staggered and set up, the aluminium pipe upper end is located between first heat dissipation hole, and with both sides first heat dissipation hole between distance is 0.6mm, the aluminium pipe diameter is 1mm. Through above -mentioned structure, through the first heat dissipation hole and second heat dissipation hole on the base to its heat dissipation, increase its heat conduction effect under the action of aluminium pipe simultaneously, only have organic glue between LED chip and metal conductor, cancel the traditional insulating layer, greatly increased the heat dissipation effect of baseplate.

Description

Technical Field

[0001] This utility model relates to the field of ceramic substrate technology, and in particular to a high-power LED ceramic heat dissipation substrate. Background Technology

[0002] In recent years, white LEDs have developed rapidly. With their advantages of energy saving, environmental friendliness, and long lifespan, they are gradually dominating the lighting market and are hailed as the next-generation light source for the 21st century. The lifespan of an LED is determined by the PN junction temperature of the chip. If the LED junction temperature is too high, it may cause color drift and uneven light output, affecting its light production. The key to solving this problem is to reduce the LED junction temperature, and the key to reducing the junction temperature is to have a good heat sink that can dissipate the heat generated by the LED in a timely manner. Therefore, the heat dissipation problem of LEDs is a major factor limiting their greater success in the market.

[0003] High-power LEDs are the most common type of LED. They have high power, reaching 1W, 2W, or even tens of watts. Therefore, they generate a lot of heat. Currently, the brackets used to package high-power LEDs are generally made by adding metal encapsulation to the LED plastic and then mounting it on an aluminum substrate or ceramic base. In order to improve the heat dissipation and heat transfer effect, heat dissipation is only achieved through the base, which is not effective and cannot meet the heat dissipation requirements of high-power LEDs. Utility Model Content

[0004] The purpose of this invention is to provide a high-power LED ceramic heat dissipation substrate, which solves the problems mentioned above.

[0005] To achieve the above objectives, a high-power LED ceramic heat dissipation substrate is provided, comprising a base, a metal conductor welded to the upper side of the base, an LED chip disposed on the metal conductor, an organic adhesive disposed between the LED chip and the metal conductor, a phosphor coated on the outer side of the LED chip, and a silicone coating on the outer side of the phosphor; a first heat dissipation hole and a second heat dissipation hole are respectively provided on the upper and lower sides of the base, an aluminum tube is fixedly connected in the second heat dissipation hole, the first heat dissipation hole and the second heat dissipation hole are staggered vertically, the upper end of the aluminum tube is located between the first heat dissipation holes, and the distance between the aluminum tube and the first heat dissipation holes on both sides is 0.6 mm, and the diameter of the aluminum tube is 1 mm.

[0006] According to the high-power LED ceramic heat dissipation substrate, the phosphor is far away from the LED chip and does not contact the LED chip.

[0007] According to the high-power LED ceramic heat dissipation substrate, an electromagnetic compatibility lead is welded between the LED chip and the metal conductors on both sides.

[0008] According to the high-power LED ceramic heat dissipation substrate, the base is a glass-ceramic composite material, and the ceramic material is composed of Al or Al2O3, and also includes other materials such as BeO, ferroelectric spinel, ferroelectric perovskite or photoelectric piezoelectric ceramics.

[0009] According to the high-power LED ceramic heat dissipation substrate, the metal conductor is made of copper.

[0010] This utility model has the following beneficial effects:

[0011] 1. Compared with existing technologies, by providing heat dissipation holes and aluminum tubes on the base, and using only organic adhesive between the LED chip and the metal conductor, the traditional insulating layer is eliminated, greatly increasing the heat dissipation effect of the substrate.

[0012] 2. Compared with existing technologies, by applying phosphor to the outside of the LED chip and coating it with the phosphor away from the chip, the luminous efficiency can be increased by about 5%. By reducing power and increasing reflectivity, the heat of the LED chip is reduced. Attached Figure Description

[0013] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0014] Figure 1 This is a structural diagram of a high-power LED ceramic heat dissipation substrate according to the present invention;

[0015] Figure 2 This is a base structure diagram of a high-power LED ceramic heat dissipation substrate according to the present invention;

[0016] Figure 3 This is a diagram showing the internal structure of the base of a high-power LED ceramic heat dissipation substrate according to this utility model.

[0017] Figure 4 This is a cross-sectional view of the base of a high-power LED ceramic heat dissipation substrate according to the present invention.

[0018] Legend:

[0019] 1. Base; 11. First heat dissipation hole; 12. Second heat dissipation hole; 2. Metal conductor; 3. LED chip; 4. Organic adhesive; 5. Phosphor powder; 6. Silicone; 7. Electromagnetic compatibility lead wire; 8. Aluminum tube. Detailed Implementation

[0020] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.

[0021] Reference Figure 1-4 This utility model provides a high-power LED ceramic heat dissipation substrate, which includes a base 1. The base 1 is a glass-ceramic composite material. The ceramic material is composed of Al or Al2O3, and may also include other materials such as BeO, ferroelectric spinel, ferroelectric perovskite, or photoelectric piezoelectric ceramics. By adjusting the composition of the low-temperature co-fired ceramic substrate material, different thermal conductivity and coefficient of thermal expansion can be obtained. The (65%+35%) 3Al2O3·2SiO2 and 2MgO2-Al2O3-5SiO2 systems are similar to the thermal matching of Si materials, thus being close to the coefficient of thermal expansion of the LED chip 3, preventing thermal stress from damaging the chip and ensuring good safety.

[0022] A metal conductor 2 is welded to the upper side of the base 1. The metal conductor 2 is made of copper. An LED chip 3 is placed on the metal conductor 2. Electromagnetic compatibility leads 7 are welded between the LED chip 3 and the metal conductors 2 on both sides. Organic glue 4 is placed between the LED chip 3 and the metal conductor 2. The traditional insulating layer is eliminated, which greatly increases the heat dissipation effect of the substrate 1. The results can be found in the literature "Jae-KwanSim et al. proposed the use of low temperature eutectic ceramic for LED-COB packaging (LTC-CCOB)".

[0023] The LED chip 3 is coated with phosphor 5 on the outside, and silicone 6 is placed on the outside of phosphor 5. The silicone 6 adopts a conical reflector cup, which can effectively reduce the loss of photons at the interface, thereby improving the luminous flux of the light source. The phosphor 5 is far away from the LED chip 3 and does not contact the LED chip 3. Coating it by keeping the phosphor 5 away from the chip can improve its luminous efficiency by about 5%. The results can be found in the literature "Ma Jianshe et al. Simulation and experiment using TracePro software".

[0024] The base 1 has a first heat dissipation hole 11 and a second heat dissipation hole 12 on its upper and lower sides respectively. An aluminum tube 8 is fixedly connected in the second heat dissipation hole 12. The first heat dissipation hole 11 and the second heat dissipation hole 12 are arranged alternately. The upper end of the aluminum tube 8 is located between the first heat dissipation holes 11, and the distance between it and the first heat dissipation holes 11 on both sides is 0.6mm. The diameter of the aluminum tube 8 is 1mm.

[0025] Working principle: During use, heat is dissipated through the first heat dissipation hole 11 and the second heat dissipation hole 12 on the base 1. At the same time, the thermal conductivity is increased by the aluminum tube 8. Meanwhile, only organic glue 4 is provided between the LED chip 3 and the metal conductor 2, eliminating the traditional insulation layer and greatly increasing the heat dissipation effect of the substrate 1.

[0026] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A high-power LED ceramic heat dissipation substrate, characterized in that, Includes a base (1), a metal conductor (2) welded to the upper side of the base (1), an LED chip (3) provided on the metal conductor (2), an organic adhesive (4) provided between the LED chip (3) and the metal conductor (2), a phosphor (5) coated on the outside of the LED chip (3), and a silicone (6) provided on the outside of the phosphor (5). The base (1) is provided with a first heat dissipation hole (11) and a second heat dissipation hole (12) on the upper and lower sides respectively. An aluminum tube (8) is fixedly connected in the second heat dissipation hole (12). The first heat dissipation hole (11) and the second heat dissipation hole (12) are arranged alternately. The upper end of the aluminum tube (8) is located between the first heat dissipation holes (11) and the distance between it and the first heat dissipation holes (11) on both sides is 0.6 mm. The diameter of the aluminum tube (8) is 1 mm.

2. The high-power LED ceramic heat dissipation substrate according to claim 1, characterized in that, The phosphor (5) is far away from the LED chip (3) and does not come into contact with the LED chip (3).

3. The high-power LED ceramic heat dissipation substrate according to claim 2, characterized in that, Electromagnetic compatibility leads (7) are welded between the LED chip (3) and the metal conductors (2) on both sides.

4. The high-power LED ceramic heat dissipation substrate according to claim 3, characterized in that, The base (1) is a glass-ceramic composite material.

5. A high-power LED ceramic heat dissipation substrate according to claim 4, characterized in that, The metal conductor (2) is made of copper.

Images