A semiconductor module packaging device

Abstract

This utility model relates to the field of semiconductor packaging technology and discloses a semiconductor module packaging device, including a base. A first motor is fixedly mounted on the upper part of the base, and a rotating shaft is fixedly connected to the output end of the first motor. The end of the rotating shaft away from the first motor extends out of the base and is fixedly connected to a turntable. Multiple lower molds are fixedly mounted on the upper part of the turntable. L-shaped mounting grooves are formed on both sides of the multiple lower molds, and locking blocks are rotatably mounted inside the multiple L-shaped mounting grooves. A vertical plate is fixedly mounted on the rear side of the upper part of the base, and a sliding groove is formed in the center of the front end of the vertical plate. In this utility model, the device can quickly disassemble and assemble the upper mold, facilitating the removal of packaged semiconductor modules or the placement of unpackaged semiconductor modules into the lower molds for packaging. It can also adjust the position of the packaging gun relative to the injection tube, preventing epoxy resin from spilling outside the upper and lower molds, thus achieving better automatic and continuous packaging and improving the packaging effect.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, and in particular to a semiconductor module packaging device. Background Technology

[0002] Semiconductor packaging is the process of protecting integrated circuit chips so that they can be used on circuit boards and isolated from the external environment. The main purpose of packaging is to protect the chip from physical damage and chemical corrosion, while providing necessary electrical connections. Packaging also helps with heat dissipation, ensuring that the chip maintains an appropriate temperature during operation. The packaging gun delivers epoxy resin into the mold and encapsulates the semiconductor. Epoxy resin is a high-molecular polymer with characteristics such as high strength, high hardness, good toughness, and heat resistance.

[0003] Most existing semiconductor module packaging devices typically connect the upper and lower molds with bolts, making quick assembly and disassembly impossible. This makes it inconvenient for workers to remove packaged semiconductor modules or place unpackaged semiconductor modules into the lower mold for packaging. Furthermore, the position of the packaging gun is fixed and its height cannot be adjusted, which can easily cause epoxy resin to spill outside the upper and lower molds, resulting in unnecessary waste.

[0004] Therefore, those skilled in the art have provided a semiconductor module packaging device to solve the problems mentioned in the background art. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies by proposing a semiconductor module packaging device. This device can quickly disassemble and assemble the upper mold, facilitating the removal of packaged semiconductor modules or the placement of unpackaged semiconductor modules into the lower mold for packaging. It can also adjust the position of the packaging gun relative to the injection tube to prevent epoxy resin from spilling outside the upper and lower molds, thereby achieving better automatic and continuous packaging and improving the packaging effect.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a semiconductor module packaging device, including a base, a first motor fixedly disposed at the upper end of the base, a rotating shaft fixedly connected to the output end of the first motor, the end of the rotating shaft away from the first motor extending out of the base and fixedly connected to a turntable, a plurality of lower molds fixedly disposed at the upper end of the turntable, L-shaped mounting grooves being opened on both sides of the plurality of lower molds, and a locking block being rotatably disposed inside the plurality of L-shaped mounting grooves;

[0007] A vertical plate is fixedly installed on the upper rear side of the base. A sliding groove is opened in the middle of the front end of the vertical plate. A lead screw is rotatably installed inside the sliding groove. A slider is threaded on the outer wall of the lead screw. A driven gear is fixedly installed at the upper end of the lead screw. A second motor is fixedly installed on one side inside the vertical plate. A driving gear is fixedly connected to the output end of the second motor. A mounting plate is fixedly connected to the front end of the slider. A sealing gun is fixedly installed in the middle of the front end of the mounting plate.

[0008] Furthermore, a fixing rod is fixedly installed on one side inside the multiple L-shaped mounting slots, and an L-shaped block is sleeved on the outer wall of the multiple fixing rods with one side extending out of the lower mold. The lower end of the multiple L-shaped blocks is placed on the upper end of one side of the clamping block.

[0009] The above technical solution involves pressing the L-shaped blocks on both sides of the lower mold, which, in conjunction with the fixing rod, causes the locking block to rotate.

[0010] Furthermore, a spring is fixedly installed at the lower end of the interior of the plurality of L-shaped mounting slots and the upper end is fixedly connected to the lower end of the locking block. A connecting block is placed at the upper end of the interior of the plurality of L-shaped mounting slots. A locking slot is opened on one side of the plurality of connecting blocks and a locking block is locked inside.

[0011] The above technical solution uses an L-shaped block to drive the card block to rotate, causing the card block to disengage from the card slot, which allows for quick assembly and disassembly of the upper mold.

[0012] Furthermore, each of the multiple connecting blocks is fixedly connected to an upper mold in pairs, a semiconductor module is placed inside the lower end of the multiple lower molds, and an injection tube is fixedly installed in the multiple upper molds;

[0013] Through the above technical solution, the epoxy resin output from the encapsulation gun enters between the upper and lower molds through the injection tube, thereby encapsulating the semiconductor module.

[0014] Furthermore, the slider slides within the groove, which limits its movement.

[0015] The above technical solution allows the slider to slide inside the groove, thereby achieving the limiting function.

[0016] Furthermore, the driving gear and the driven gear are meshed together;

[0017] The above technical solution uses a second motor to drive the driving gear, which in turn drives the driven gear.

[0018] Furthermore, an epoxy resin pump is fixedly installed on the upper end of the mounting plate and located at the rear end of the encapsulation gun. The output end of the epoxy resin pump is fixedly connected to a connecting pipe, and the end away from the epoxy resin pump is fixedly connected to the upper end of the encapsulation gun. The input end of the epoxy resin pump is fixedly connected to a material conveying pipe.

[0019] Through the above technical solution, the epoxy resin pump delivers epoxy resin into the connecting pipe, then into the encapsulation gun, and then performs injection molding encapsulation on the semiconductor modules inside the upper and lower molds.

[0020] Furthermore, a control panel is fixedly installed on one side of the front end of the base;

[0021] The above technical solution allows for the installation of a control panel to facilitate the operation of the device.

[0022] This utility model has the following beneficial effects:

[0023] 1. The semiconductor module packaging device proposed in this utility model can drive the card block to rotate by pressing the L-shaped blocks on both sides of the lower mold, and under the action of the spring, the card block is disengaged from the card slot on the connecting block. This allows for quick assembly and disassembly of the upper mold, making it convenient for workers to place semiconductor modules inside the lower mold for epoxy resin encapsulation. It also makes it easy to remove the encapsulated semiconductor modules, thus improving its convenience.

[0024] 2. The semiconductor module packaging device proposed in this utility model uses a motor to drive the drive gear to rotate, which in turn drives the driven gear to rotate, causing the lead screw to rotate, which in turn drives the packaging gun to move up and down. This allows for adjustment of the position of the packaging gun from the injection tube, preventing epoxy resin from spilling outside the upper and lower molds and avoiding unnecessary waste. At the same time, with the cooperation of the turntable and the lead screw, it can better achieve continuous packaging of each semiconductor, fully encapsulating the semiconductor and improving its packaging effect. Attached Figure Description

[0025] Figure 1 This is an isometric view of a semiconductor module packaging device proposed in this utility model;

[0026] Figure 2 This is a partial side sectional view of a semiconductor module packaging device proposed in this utility model;

[0027] Figure 3 This is a frontal sectional view of the upper and lower molds of a semiconductor module packaging device proposed in this utility model;

[0028] Figure 4 for Figure 3 Enlarged view of point A in the middle;

[0029] Figure 5 for Figure 2 Enlarged view of point B in the middle.

[0030] Legend:

[0031] 1. Base; 2. First motor; 3. Rotating shaft; 4. Turntable; 5. Lower mold; 6. L-shaped mounting groove; 7. Clamping block; 8. Spring; 9. Fixing rod; 10. L-shaped block; 11. Connecting block; 12. Slot; 13. Upper mold; 14. Semiconductor module; 15. Injection tube; 16. Vertical plate; 17. Slide groove; 18. Lead screw; 19. Slider; 20. Driven gear; 21. Second motor; 22. Drive gear; 23. Mounting plate; 24. Sealing gun; 25. Epoxy resin pump; 26. Connecting pipe; 27. Material conveying pipe; 28. Control panel. Detailed Implementation

[0032] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of specific embodiments. Obviously, the described specific embodiments are only a part of the specific embodiments of the present invention, and not all of them. Based on the specific embodiments of the present invention, all other specific embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0033] One specific embodiment of this utility model is provided:

[0034] Reference Figure 1-4 A semiconductor module packaging device includes a base 1. A first motor 2 is fixedly mounted on the upper part of the base 1. A rotating shaft 3 is fixedly connected to the output end of the first motor 2. The end of the rotating shaft 3 away from the first motor 2 extends out of the base 1 and is fixedly connected to a turntable 4. A plurality of lower molds 5 are fixedly mounted on the upper part of the turntable 4. L-shaped mounting grooves 6 are formed on both sides of the plurality of lower molds 5. A locking block 7 is rotatably mounted inside the plurality of L-shaped mounting grooves 6. A fixing rod 9 is fixedly mounted on one side inside the plurality of L-shaped mounting grooves 6. L-shaped blocks 10 are sleeved on the outer wall of the plurality of fixing rods 9, with one side extending out of the lower molds 5. The lower ends of the plurality of L-shaped blocks 10 are placed on the upper side of one side of the locking block 7. By pressing the L-shaped blocks 10 on both sides of the lower molds 5, and with the cooperation of the fixing rod 9, the locking block 7 is moved. When block 7 rotates, springs 8 are fixedly installed at the lower end of multiple L-shaped mounting slots 6 and fixedly connected to the lower end of the locking block 7 at the upper end. Connecting blocks 11 are placed at the upper end of multiple L-shaped mounting slots 6. The locking slots 12 are opened on one side of multiple connecting blocks 11 and locking blocks 7 are locked inside. The locking blocks 7 are rotated by L-shaped block 10, so that the locking blocks 7 are disengaged from the locking slots 12, which can quickly realize the disassembly and assembly of the upper mold 13. The upper mold 13 is fixedly connected to each other at the upper end of multiple connecting blocks 11. Semiconductor modules 14 are placed at the lower end of multiple lower molds 5. Injection tubes 15 are fixedly installed in multiple upper molds 13. Epoxy resin output from the encapsulation gun 24 enters between the upper mold 13 and the lower mold 5 through the injection tube 15, thereby encapsulating the semiconductor module 14.

[0035] Reference Figure 1 , 25. A vertical plate 16 is fixedly installed on the rear side of the upper end of the base 1. A groove 17 is opened in the middle of the front end of the vertical plate 16. A lead screw 18 is rotatably installed inside the groove 17. A slider 19 is threaded on the outer wall of the lead screw 18. A driven gear 20 is fixedly installed at the upper end of the lead screw 18. A second motor 21 is fixedly installed on one side inside the vertical plate 16. A driving gear 22 is fixedly connected to the output end of the second motor 21. A mounting plate 23 is fixedly connected to the front end of the slider 19. A sealing gun 24 is fixedly installed in the middle of the front end of the mounting plate 23. The slider 19 slides within the groove 17 to achieve a limited position. The driving gear 22 and the driven gear 20 are meshed and connected. The second motor 21 drives the drive gear 22, which in turn drives the driven gear 20. An epoxy resin pump 25 is fixedly installed on the upper end of the mounting plate 23 and is located at the rear end of the encapsulation gun 24. The output end of the epoxy resin pump 25 is fixedly connected to the connecting pipe 26, and the end away from the epoxy resin pump 25 is fixedly connected to the upper end of the encapsulation gun 24. The input end of the epoxy resin pump 25 is fixedly connected to the material delivery pipe 27. The epoxy resin pump 25 delivers epoxy resin into the connecting pipe 26 and then into the encapsulation gun 24. Then, it performs injection molding encapsulation on the semiconductor module 14 inside the upper mold 13 and the lower mold 5. A control panel 28 is fixedly installed on one side of the front end of the base 1. The control panel 28 facilitates the control of the device's operation.

[0036] Working principle: When this semiconductor module packaging device is in use, the first motor 2 drives the rotating shaft 3 to rotate, thereby driving the turntable 4 to rotate. The semiconductor modules 14 between the upper mold 13 and the lower mold 5 at the upper end of the turntable 4 are packaged sequentially. By pressing the L-shaped blocks 10 on both sides of the lower mold 5, the locking blocks 7 are rotated. Under the action of the spring 8, the locking blocks 7 disengage from the slots 12 on the connecting block 11, allowing for quick assembly and disassembly of the upper mold 13. After the injected epoxy resin solidifies, the packaged semiconductor modules 14 can be easily removed, or the unpackaged semiconductor modules 14 can be removed. The semiconductor module 14 is encapsulated inside the lower mold 5. The second motor 21 drives the drive gear 22 to rotate, which in turn drives the driven gear 20 to rotate, causing the lead screw 18 to rotate. This, in turn, drives the encapsulation gun 24 to move up and down, thereby adjusting the position of the encapsulation gun 24 from the injection tube 15. Then, the epoxy resin is delivered to the material delivery tube 27 by the epoxy resin pump 25, and then delivered to the encapsulation gun 24. Finally, the epoxy resin is delivered to the space between the upper mold 13 and the lower mold 5 through the injection tube 15, thereby encapsulating the semiconductor module 14 and fully encapsulating it to improve its practicality.

[0037] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing specific embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A semiconductor module packaging device, comprising a base (1), characterized in that: The upper part of the base (1) is fixedly provided with a first motor (2), the output end of the first motor (2) is fixedly connected with a rotating shaft (3), the end of the rotating shaft (3) away from the first motor (2) extends out of the base (1) and is fixedly connected with a turntable (4), the upper part of the turntable (4) is fixedly provided with multiple lower molds (5), the multiple lower molds (5) are provided with L-shaped mounting grooves (6) on both sides, and the multiple L-shaped mounting grooves (6) are rotatably provided with a locking block (7) inside; A vertical plate (16) is fixedly installed on the rear side of the upper end of the base (1). A sliding groove (17) is opened in the middle of the front end of the vertical plate (16). A lead screw (18) is rotatably installed inside the sliding groove (17). A slider (19) is threaded on the outer wall of the lead screw (18). A driven gear (20) is fixedly installed at the upper end of the lead screw (18). A second motor (21) is fixedly installed on one side inside the vertical plate (16). A driving gear (22) is fixedly connected to the output end of the second motor (21). A mounting plate (23) is fixedly connected to the front end of the slider (19). A sealing gun (24) is fixedly installed in the middle of the front end of the mounting plate (23).

2. The semiconductor module packaging device according to claim 1, characterized in that: A fixing rod (9) is fixedly installed on one side inside the multiple L-shaped mounting grooves (6). An L-shaped block (10) is sleeved on the outer wall of the multiple fixing rods (9) and one side extends out of the lower mold (5). The lower end of the multiple L-shaped blocks (10) is placed on the upper side of the card block (7).

3. The semiconductor module packaging device according to claim 1, characterized in that: A spring (8) is fixedly installed at the lower end of the interior of the multiple L-shaped mounting slots (6) and the upper end is fixedly connected to the lower end of the locking block (7). A connecting block (11) is placed at the upper end of the interior of the multiple L-shaped mounting slots (6). A locking groove (12) is opened on one side of the multiple connecting blocks (11) and a locking block (7) is locked inside.

4. A semiconductor module packaging device according to claim 3, characterized in that: The upper ends of the multiple connecting blocks (11) are fixedly connected to each other with an upper mold (13), and the lower ends of the multiple lower molds (5) are filled with semiconductor modules (14). The multiple upper molds (13) are fixedly provided with injection tubes (15).

5. A semiconductor module packaging device according to claim 1, characterized in that: The slider (19) slides within the groove (17) in a limited position.

6. A semiconductor module packaging device according to claim 1, characterized in that: The driving gear (22) and the driven gear (20) are meshed together.

7. A semiconductor module packaging device according to claim 1, characterized in that: An epoxy resin pump (25) is fixedly installed on the upper end of the mounting plate (23) and located at the rear end of the encapsulation gun (24). The output end of the epoxy resin pump (25) is fixedly connected to a connecting pipe (26), and the end away from the epoxy resin pump (25) is fixedly connected to the upper end of the encapsulation gun (24). The input end of the epoxy resin pump (25) is fixedly connected to a material conveying pipe (27).

8. A semiconductor module packaging device according to claim 1, characterized in that: A control panel (28) is fixedly installed on one side of the front end of the base (1).

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