Chain type impurity suction machine and dust removal device thereof

Abstract

The application relates to a chain-type gettering machine table and a dust removal device thereof. The dust removal device comprises an air suction mechanism, a first filter, a return air pipe and an air knife. The air suction mechanism is used for sucking the gas in the high-temperature propulsion area of the chain-type gettering machine table. The first filter is connected with the air suction mechanism, and is used for dust removal treatment of the gas sucked by the air suction mechanism. The air knife is connected with the first filter through the return air pipe, and is arranged in the high-temperature propulsion area. The air knife has an air outlet part, and is used for blowing the dust-removed gas to the rollers and / or silicon wafers in the high-temperature propulsion area through the air outlet part. Not only can the dust particles in the high-temperature propulsion area be effectively removed, and the cleanliness of most areas in the high-temperature propulsion area be improved, but also the uniformity of the silicon wafers after gettering and the appearance of the unloaded wafers can be improved, and the yield can be improved.

Description

Technical Field

[0001] This application relates to the field of photovoltaic technology, and in particular to a chain-type vacuum cleaner and its dust removal device. Background Technology

[0002] In the silicon wafer manufacturing process, a gettering process is required before texturing and cleaning. In this process, a getter source is first coated onto the silicon wafer surface, and then the wafer with the getter source coating is placed in a high-temperature advance zone for high-temperature gettering. In the high-temperature advance zone, a doped diffusion layer is formed on the silicon wafer surface. Due to the difference in solubility of impurities in the silicon wafer and the diffusion layer, more metal ions, such as Cr and Fe, are adsorbed in the diffusion layer. In subsequent processes, such as the texturing and cleaning process, the diffusion layer is removed, along with the harmful ions concentrated in it.

[0003] In related technologies, the gettering process for silicon wafers is completed on a chain-type getter. During operation, silicon wafers coated with a getter source enter the high-temperature feed zone of the chain-type getter for high-temperature gettering. However, the phosphorus paste on the silicon wafer surface accumulates over time during the drying process in the high-temperature feed zone, forming dust. This dust causes granular white spots to appear on the surface of the unloaded silicon wafers, affecting the cleanliness of the wafer surface and the cleanroom environment. It also leads to poor uniformity of sheet resistance within the silicon wafer after gettering, resulting in reduced product quality. Utility Model Content

[0004] Therefore, it is necessary to overcome the shortcomings of the existing technology and provide a chain-type vacuum cleaner and its dust removal device, which can effectively remove dust from the surface of silicon wafers, thereby improving product quality and cleanliness.

[0005] A dust removal device for a chain-type vacuum cleaner, the dust removal device comprising:

[0006] A ventilation mechanism is used to draw gas from the high-temperature propulsion zone of the chain-type vacuum cleaner.

[0007] A first filter is connected to the exhaust mechanism and is used to remove dust from the gas drawn in by the exhaust mechanism.

[0008] Return air duct; and

[0009] An air knife is connected to the first filter via the return air duct. The air knife is disposed in the high-temperature propulsion zone and has an air outlet. The air knife is used to blow air through the air outlet toward the rollers and / or silicon wafers in the high-temperature propulsion zone to blow the dust-removed gas toward the rollers and / or silicon wafers.

[0010] In one embodiment, multiple exhaust mechanisms are provided, and each of the multiple exhaust mechanisms is connected to the return air duct.

[0011] In one embodiment, there are multiple first filters, each of which is connected to a corresponding exhaust mechanism, and all of the first filters are connected to the return air duct.

[0012] In one embodiment, the exhaust mechanism is a Roots blower, a centrifugal blower, an axial flow blower, or a cross-flow blower.

[0013] In one embodiment, the dust removal device further includes an air compressor, which is connected in series on the return air duct.

[0014] In one embodiment, the air compressor is provided with a second filter for filtering the gas.

[0015] In one embodiment, the air knife is rotatably mounted on the frame of the high-temperature propulsion zone on the side opposite to the air outlet.

[0016] In one embodiment, the dust removal device further includes a power mechanism, which is mounted on the frame and connected to the air knife. The power mechanism is used to drive the air knife to rotate in order to adjust the air outlet angle of the air outlet.

[0017] In one embodiment, both the outer and inner walls of the air blade are provided with a high-temperature resistant protective coating; the outer wall of the exhaust mechanism is provided with a high-temperature resistant protective coating.

[0018] A chain-type vacuum cleaner includes the aforementioned dust removal device. The chain-type vacuum cleaner has a high-temperature propulsion zone, an exhaust mechanism is disposed in the high-temperature propulsion zone, an air knife is disposed in the high-temperature propulsion zone, and the air outlet of the air knife faces the rollers and / or silicon wafers in the high-temperature propulsion zone.

[0019] The aforementioned chain-type getter and its dust removal device, during operation, draw in gas from the high-temperature feed zone using an exhaust mechanism. The gas is then filtered through a first filter to remove dust. An air knife then blows the dust-free gas onto the rollers and / or silicon wafers, cleaning away dust particles adhering to their surfaces. The purged air is then drawn away by the exhaust mechanism and circulated repeatedly. Thus, it not only effectively removes dust particles from the high-temperature feed zone, improving the cleanliness of most areas within the zone, but also improves the uniformity of the silicon wafers after gettering and the appearance of the finished product, thereby increasing yield. Attached Figure Description

[0020] Figure 1This is a structural diagram of a chain suction machine according to an embodiment of this application.

[0021] Figure 2 This is a diagram showing the working state of the exhaust mechanism in a dust removal device according to an embodiment of this application.

[0022] Figure 3 This is a diagram showing another working state of the exhaust mechanism in a dust removal device according to an embodiment of this application.

[0023] Figure 4 This is another working state diagram of the exhaust mechanism in a dust removal device according to an embodiment of this application.

[0024] Figure 5 This is a structural diagram of an air knife in a dust removal device according to an embodiment of this application.

[0025] 10. Exhaust mechanism; 11. Inlet; 12. Exhaust port; 20. First filter; 30. Return air duct; 40. Air knife; 41. Air outlet; 50. High-temperature propulsion zone; 60. Roller; 70. Silicon wafer; 80. Branch pipe; 90. Air compressor. Detailed Implementation

[0026] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0027] See Figure 1 and Figure 5 , Figure 1 A structural diagram of a chain suction machine according to an embodiment of this application is shown. Figure 5 A structural diagram of the air knife 40 in a dust removal device according to an embodiment of this application is shown. An embodiment of this application provides a dust removal device for a chain-type vacuum cleaner, comprising: an exhaust mechanism 10, a first filter 20, a return air duct 30, and an air knife 40. The exhaust mechanism 10 is used to draw gas from the high-temperature propulsion zone 50 of the chain-type vacuum cleaner. The first filter 20 is connected to the exhaust mechanism 10 and is used to remove dust from the gas drawn in by the exhaust mechanism 10. The air knife 40 is connected to the first filter 20 via the return air duct 30 and has an air outlet 41. The air knife 40 is used to blow air from the high-temperature propulsion zone 50 towards the rollers 60 and / or silicon wafers 70 of the high-temperature propulsion zone 50 through the air outlet 41, thereby blowing the dust-removed gas onto the rollers 60 and / or silicon wafers 70.

[0028] The dust removal device of the aforementioned chain-type getter operates as follows: During operation, the exhaust mechanism 10 draws in gas from the high-temperature feed zone 50, passes it through the first filter 20 for dust removal, and then the air knife 40 blows the dust-removed gas onto the rollers 60 and / or silicon wafers 70, cleaning away dust particles adhering to their surfaces. The cleaned air is then drawn away by the exhaust mechanism 10 and circulated repeatedly. Thus, this system not only effectively removes dust particles from the high-temperature feed zone 50, improving the cleanliness of most areas within it, but also improves the uniformity of the silicon wafers after gettering and the appearance of the finished product, thereby increasing yield.

[0029] Please see Figure 1 In one embodiment, multiple exhaust mechanisms 10 are configured, each connected to a return air duct 30. Thus, the multiple exhaust mechanisms 10 can perform suction treatment on multiple different locations within the high-temperature propulsion zone 50, thereby drawing gas from these locations into the return air duct 30. This effectively removes dust particles from the high-temperature propulsion zone 50 and improves the cleanliness of most areas within the zone.

[0030] The number of exhaust mechanisms 10 includes, but is not limited to, two, three, four, or more. Optionally, multiple exhaust mechanisms 10 are located directly above the silicon wafer 70 and are arranged sequentially at intervals, for example, along the transport direction of the silicon wafer 70. In this way, the gas in the area above the silicon wafer 70 can be drawn into the return air duct 30 by the exhaust mechanisms, effectively improving the air quality above the silicon wafer 70.

[0031] Of course, as an optional option, the ventilation mechanism 10 can be set to one.

[0032] In one embodiment, multiple first filters 20 are provided, and each of the multiple first filters 20 is connected to a corresponding exhaust mechanism 10. All the first filters 20 are connected to the return air duct 30. In this way, the gas drawn in by each exhaust mechanism 10 enters the corresponding first filter 20, and after being filtered by the corresponding first filter 20, the gas is collected and transported to the return air duct 30, and then blown to the roller 60 and silicon wafer 70 through the return air duct 30 and the air knife 40.

[0033] Specifically, the dust removal device also includes multiple branch pipes 80. Each branch pipe 80 is connected to a corresponding exhaust mechanism 10. Multiple first filters 20 are respectively installed on each branch pipe 80.

[0034] The exhaust system 10 includes, but is not limited to, Roots blowers, centrifugal blowers, axial flow blowers, or cross-flow blowers. Roots blowers utilize the spatial changes between two or three Roots rotors to transport gas. Centrifugal blowers use rotating impellers to generate centrifugal force to draw in gas and accelerate its discharge. Axial flow blowers use rotating airfoil blades to accelerate gas flow. Cross-flow blowers use rotating axial flow blades to accelerate gas flow.

[0035] In this embodiment, the exhaust mechanism 10 preferably uses a Roots blower. Please refer to [link / reference]. Figures 2 to 4 , Figures 2 to 4 The diagrams show three different operating states of the Roots blower. The Roots blower is a positive displacement blower. The inlet is separated by the meshing of a pair of rotors, which are driven by a pair of synchronous gears and move in opposite directions, pushing the inhaled gas from the inlet 11 to the outlet 12 without internal compression. Upon reaching the outlet 12, the gas is pressurized by the backflow of high-pressure gas on the exhaust side, thus completing the gas transport. The Roots blower has small rotor clearances, low wear, and no friction, requiring no lubrication. The discharged gas is free of oil contaminants, thus improving cleanliness.

[0036] Optionally, the first filter 20 may be, for example, a filter element, and is located at the exhaust port 12 of the exhaust mechanism 10. The first filter 20 serves to coarsely filter particulate dust, preparing it for subsequent compressed air.

[0037] Please refer to the following: Figure 1 In one embodiment, the dust removal device further includes an air compressor 90. The air compressor 90 is connected in series on the return air duct 30. Thus, under the action of the air compressor 90, the gas in the return air duct 30 can be pressurized, and the pressurized gas is blown through the air knife 40 to the roller 60 and / or silicon wafer 70, which can improve the cleaning effect on dust particles on the surface of the roller 60 and / or silicon wafer 70.

[0038] In one embodiment, the air compressor 90 is equipped with a second filter for filtering the gas. Thus, in addition to the initial filtration by the first filter 20, the gas is further filtered by the second filter, effectively improving the cleanliness of the gas. The gas discharged from the air compressor 90 is fresh air, thereby improving the uniformity of the silicon wafer 70 after gettering and the appearance of the finished product, thus increasing the yield.

[0039] Specifically, the second filter may include, but is not limited to, being installed at the air inlet, air outlet, or any location through which the internal airflow passes of the air compressor 90, as long as it can filter the gas.

[0040] In one embodiment, the air knife 40 is rotatably mounted on the frame of the high-temperature propulsion zone 50 on the side opposite to the air outlet 41.

[0041] Specifically, the air knife 40 has a rotating bearing on the side opposite to the air outlet 41, which is used to mount the air knife 40 onto the frame of the high-temperature propulsion zone 50. This allows the air knife 40 to be flexibly rotated and its angle adjusted on the frame of the high-temperature propulsion zone 50 according to actual needs. This enables the air outlet 41 of the air knife 40 to swing up and down to adjust its position, allowing clean gas to be blown to multiple different positions within the high-temperature propulsion zone 50, thereby improving the cleaning effect on the roller 60 and / or the silicon wafer 70.

[0042] In one embodiment, the dust removal device further includes a power mechanism (not shown in the drawings). The power mechanism is mounted on a frame and connected to the air knife 40. The power mechanism drives the air knife 40 to rotate, thereby adjusting the air outlet angle of the air outlet 41. In this way, the power mechanism drives the air knife 40 to rotate, achieving rotational adjustment of the air knife 40's angle, eliminating the need for manual adjustment, resulting in a high degree of automation and convenient, flexible use.

[0043] Optionally, the power mechanism in this embodiment includes, but is not limited to, various forms of power structures such as cylinders, hydraulic cylinders, or motor screws, as long as they can drive the air knife 40 to rotate and adjust the angle.

[0044] In some embodiments, the length direction of the air outlet 41 of the air knife 40 is parallel to the axial direction of the roller 60. This configuration allows the air knife 40 to be cleaned by the clean gas discharged from the air knife 40 when the roller 60 drives it, facilitating the cleaning of all areas on the silicon wafer 70 by the clean gas discharged from the air knife 40.

[0045] For example, the length of the air outlet 41 is greater than or equal to the width of the silicon wafer 70. The projection of the air outlet 41 onto the silicon wafer 70 extends from one side of the silicon wafer 70 to the other side. In this way, the air outlet 41 can blow clean gas to various positions along the width direction of the silicon wafer 70, resulting in a better cleaning effect.

[0046] Of course, as an alternative, the length of the air outlet 41 can also be less than the width of the silicon wafer 70. The specific length can be flexibly adjusted and set according to actual needs, and no limitation is made here.

[0047] In one embodiment, both the outer and inner walls of the air knife 40 are provided with a high-temperature resistant protective coating. Furthermore, the outer wall of the exhaust mechanism 10 is also provided with a high-temperature resistant protective coating. Thus, the protective coating possesses high-temperature resistance properties, protecting the air knife 40 and the exhaust mechanism 10 from overheating damage and extending their service life.

[0048] The protective coating includes, but is not limited to, polysilazane. Polysilazane possesses excellent corrosion resistance, oxidation resistance, radiation resistance, and high-temperature resistance, and is widely used in aerospace, semiconductor, photovoltaic cells, high-temperature coatings, ceramic materials, and resin materials.

[0049] It should be noted that the high temperature in this embodiment is adjusted and set according to the actual process requirements of the high temperature propulsion zone 50, and is not limited here.

[0050] In this embodiment, the exhaust mechanism 10 draws air from the high-temperature propulsion zone 50, filters it through the first filter 20, and then enters the return air duct 30. It then enters the air compressor 90, which pressurizes the gas, while the second filter performs secondary filtration. The gas after secondary filtration and pressurization is clean and free of impurities, and the compressed air is introduced into the air knife 40. By adjusting the rotating bearing externally, the air outlet 41 of the air knife 40 blows the roller 60 and / or silicon wafer 70 of the high-temperature propulsion zone 50 at a preset angle, effectively removing dust particles generated in the high-temperature propulsion zone 50 due to daily production and improving the situation of dust adhering to the silicon wafer 70 during feeding.

[0051] In some embodiments, this application also provides a chain-type vacuum cleaner, which includes the dust removal device of any of the above embodiments. The chain-type vacuum cleaner is provided with a high-temperature propulsion zone 50. An exhaust mechanism 10 is disposed in the high-temperature propulsion zone 50, and an air knife 40 is disposed in the high-temperature propulsion zone 50. The air outlet 41 of the air knife 40 faces the roller 60 and / or silicon wafer 70 of the high-temperature propulsion zone 50.

[0052] In operation, the aforementioned chain-type getter draws gas from the high-temperature feed zone 50 using the exhaust mechanism 10. The gas is then filtered for dust by the first filter 20, and subsequently blown by the air knife 40 onto the rollers 60 and / or silicon wafers 70, removing dust particles adhering to their surfaces. The purged air is then drawn back by the exhaust mechanism 10 in a continuous cycle. This effectively removes dust particles from the high-temperature feed zone 50, improving the cleanliness of most areas within it, and also improves the uniformity and appearance of the silicon wafers after gettering, thus increasing yield.

[0053] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0054] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0055] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0056] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0057] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0058] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0059] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A dust removal device for a chain-type vacuum cleaner, characterized in that, The dust removal device includes: A ventilation mechanism (10) is used to draw gas from the high-temperature propulsion zone (50) of the chain-type vacuum cleaner. The first filter (20) is connected to the exhaust mechanism (10) and is used to remove dust from the gas drawn in by the exhaust mechanism (10). Return air duct (30); and An air knife (40) is connected to the first filter (20) through the return air pipe (30). The air knife (40) has an air outlet (41). The air knife (40) is used to blow air from the air outlet (41) onto the roller (60) and / or the silicon wafer (70) of the high-temperature propulsion zone (50) in the high-temperature propulsion zone (50) so as to blow the dust-removed gas onto the roller (60) and / or the silicon wafer (70).

2. The dust removal device according to claim 1, characterized in that, The exhaust mechanism (10) is configured as a plurality of such exhaust mechanisms (10), and all such exhaust mechanisms (10) are connected to the return air duct (30).

3. The dust removal device according to claim 2, characterized in that, The first filter (20) is configured as multiple, and the multiple first filters (20) are connected one-to-one with the multiple exhaust mechanisms (10). All the first filters (20) are connected to the return air duct (30).

4. The dust removal device according to claim 1, characterized in that, The exhaust mechanism (10) is a Roots blower, a centrifugal blower, an axial flow blower, or a cross-flow blower.

5. The dust removal device according to claim 1, characterized in that, The dust removal device also includes an air compressor (90), which is connected in series on the return air duct (30).

6. The dust removal device according to claim 5, characterized in that, The air compressor (90) is provided with a second filter for filtering the gas.

7. The dust removal device according to claim 1, characterized in that, The air knife (40) is located on the side opposite to the air outlet (41) and is rotatably mounted on the frame of the high-temperature propulsion zone (50).

8. The dust removal device according to claim 7, characterized in that, The dust removal device also includes a power mechanism, which is mounted on the frame and connected to the air knife (40). The power mechanism is used to drive the air knife (40) to rotate in order to adjust the air outlet angle of the air outlet (41).

9. The dust removal device according to any one of claims 1 to 8, characterized in that, The outer and inner walls of the air knife (40) are provided with a high-temperature resistant protective coating; the outer wall of the exhaust mechanism (10) is provided with a high-temperature resistant protective coating.

10. A chain-type vacuum cleaner, characterized in that, The chain-type vacuum cleaner includes a dust removal device as described in any one of claims 1 to 9. The chain-type vacuum cleaner is provided with a high-temperature propulsion zone (50), the exhaust mechanism (10) is disposed in the high-temperature propulsion zone (50), the air knife (40) is disposed in the high-temperature propulsion zone (50), and the air outlet (41) of the air knife (40) faces the roller (60) and / or silicon wafer (70) of the high-temperature propulsion zone (50).

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