IGBT automatic cutting and bending system

Abstract

The application provides an IGBT automatic cutting and bending system, which comprises a rack, a guide rail, a feeding device, a leg cutting device, a bending device and a carrying device arranged on the rack, and the guide rail has a waiting station, a leg cutting station and a bending station; the feeding device comprises a feeding mechanism, a guide mechanism and a tilting mechanism, the tilting mechanism is used to drive the box to rotate and move between the feeding position and the tilting position, the feeding mechanism is used to feed the boxes to the feeding position one by one, and the guide mechanism comprises an inclined transition plate, the transition plate has a sliding groove suitable for the sliding of IGBT raw materials, the outlet of the sliding groove is connected with one end of the guide rail, and when the tilting mechanism drives the box to rotate to the tilting position, the IGBT raw materials can be sequentially slid out of the box to the sliding groove under the action of gravity and then fall to the waiting station of the guide rail through the sliding groove. The feeding is realized without the aid of a vibrating mechanism, the IGBT raw materials are not damaged, and the system is safe and reliable; the system has high automation degree and is suitable for large-batch rapid processing.

Description

Technical Field

[0001] This application belongs to the technical field of IGBT processing equipment, and more specifically, relates to an automatic IGBT cutting and bending system. Background Technology

[0002] Insulated-Gate Bipolar Transistors (IGBTs) are semiconductor devices widely used in home appliances, industry, automobiles, and military fields. Before being soldered onto a circuit board, IGBTs require lead shaping, which involves lead trimming and bending. Existing processing equipment for trimming and bending IGBT leads typically uses a vibratory feeder. The IGBT raw material is poured into the vibratory feeder for screening, arranging, and discharge. Then, a conveyor transports the material to a disc-shaped processing platform where the leads are trimmed and bent one by one. In this method, the IGBT leads are prone to entanglement and deformation within the vibratory feeder, affecting the forming quality. Continuous vibration may also damage the internal structure of the IGBT. Furthermore, the overall processing efficiency of this equipment is low and fails to meet processing requirements. Utility Model Content

[0003] The purpose of this application is to provide an IGBT automatic cutting and bending system that can automatically cut and bend the pins.

[0004] To achieve the above objectives, the technical solution adopted in this application is as follows: An automatic IGBT cutting and bending system is provided, including a frame, and a guide rail, a feeding device, a shearing device, a bending device, and a conveying device disposed on the frame. The guide rail has a waiting station, a shearing station, and a bending station. The feeding device includes a feeding mechanism, a guiding mechanism, and a discharging mechanism. The discharging mechanism is used to drive the material box to rotate and move between the feeding position and the discharging position. The feeding mechanism is used to transport the material boxes one by one to the feeding position. The guiding mechanism includes an inclined transition plate, and the transition plate has a shape suitable for IGBTs. The raw material slides through a chute, the outlet of which is connected to one end of the guide rail. When the material unloading mechanism rotates the material box to the unloading position, the IGBT raw material can slide out of the material box into the chute sequentially by its own gravity, and then slide down the chute to the waiting position of the guide rail. The conveying device is used to move the IGBT from the waiting position to the lead-cutting position and from the lead-cutting position to the bending position. The lead-cutting device is used to cut the leads of the IGBT located at the lead-cutting position, and the bending device is used to bend the leads of the IGBT located at the bending position.

[0005] In one embodiment, the feeding mechanism includes a storage bin for stacking and storing multiple boxes, a first power source for conveying the boxes in the storage bin to the loading position, and a drive plate connected to the first power source. The top surface of the drive plate is provided with a slot with a width suitable for the box. The first power source can drive the drive plate to move between a clamping position and the loading position. When the drive plate is in the clamping position, a box at the bottom of the storage bin falls into the slot. When the drive plate is in the loading position, the box moves to the loading position.

[0006] In one embodiment, a support plate is horizontally arranged at one end of the frame away from the guide rail. The unloading mechanism includes a rotating seat, a lifting plate, and a second power source. The rotating seat is rotatably connected to the frame, and the lifting plate is movably disposed on the rotating seat. The output end of the second power source is hinged to one end of the rotating seat. The support plate and the rotating seat form a support platform for placing the material box. The lifting plate is configured such that after the feeding mechanism pushes the material box to the support platform, it descends to press one end of the material box against the rotating seat, and rises to a predetermined position when the empty material box rotates to a horizontal position. The second power source is used to drive the rotating seat to rotate, thereby causing the material box to rotate and move between the loading position and the unloading position.

[0007] In one embodiment, a buffer mechanism is provided at the end of the material pouring mechanism away from the discharge port. The buffer mechanism includes a fixed frame connected and fixed to the material pouring mechanism, a drive cylinder on the fixed frame, and a buffer block at the output end of the drive cylinder. The drive cylinder drives the buffer block to move between a first position and a second position. When the empty material box is rotated to a horizontal state by the material pouring mechanism, the buffer block is located at the first position and is suspended above the empty material box. When the material pouring mechanism drives the material box to rotate, the buffer block is located at the second position and abuts against the top surface of the material box.

[0008] In one embodiment, the discharge end of the feeding mechanism is provided with a discharge sensor that is communicatively connected to the second power source. When the discharge sensor detects that there is IGBT raw material at the discharge port of the material box, it controls the second power source to maintain the current state. When the discharge sensor detects that there is no IGBT raw material at the discharge port of the material box, it controls the second power source to drive the rotating seat to rotate to a horizontal state.

[0009] In one embodiment, the transition plate has an arc-shaped section at one end near the guide rail, so that the IGBT raw material can slide stably down the guide rail through the arc-shaped section.

[0010] In one embodiment, the waiting station has a waiting area near the transition plate and an operating area away from the transition plate. The frame is provided with a pressing mechanism, which includes a third power source and a pressing plate. The third power source drives the pressing plate to press the IGBT raw material located in the waiting area to restrict the IGBT raw material from sliding from the waiting area to the operating area.

[0011] In one embodiment, the guide rail further includes a coding station, and the conveying device is further used to move the IGBT from the bending station to the coding station; the IGBT automatic cutting and bending system further includes a coding mechanism, which includes a bracket disposed on the frame and a nozzle slidably disposed on the bracket, the nozzle being able to slide horizontally back and forth along the bracket to sequentially perform coding processing on each pin of the IGBT located at the coding station.

[0012] In one embodiment, the device further includes a pushing mechanism and a discharging mechanism mounted on the frame. The pushing mechanism is used to push multiple finished IGBTs that have been marked at the marking station into an empty material box at the discharging station. The discharging mechanism has a storage box area and a finished product stacking area. The storage box area is used to stack multiple empty material boxes, and the finished product stacking area is used to stack material boxes containing finished IGBTs.

[0013] In one embodiment, the conveying device includes a fourth power source, a movable seat, a lifting seat, and a mounting plate. The lifting seat is fixed to one side of the movable seat, and one side of the mounting plate is slidably connected to the lifting seat. The mounting plate can move up and down relative to the lifting seat. The bottom surface of the mounting plate has three spaced mounting areas, and each mounting area is provided with the same number of suction nozzles. The fourth power source is connected to the movable seat to drive the movable seat to move back and forth.

[0014] The beneficial effects of the IGBT automatic cutting and bending system provided in this application are as follows: Compared with the prior art, in the IGBT automatic cutting and bending system of this application, when the first power source of the feeding mechanism transports the material box to the loading position, the unloading mechanism rotates the material box to the same angle as the transition plate, so that each IGBT material 1 in the material box can slide out of the material box in sequence under its own gravity and slide down from the transition plate onto the guide rail. The overall structure is simple, and there is no need to use a vibration mechanism to achieve loading, which will not damage the IGBT material 1. It is safe and reliable, and multiple IGBT material 1 can be unloaded at one time. The frame is equipped with a conveying device, which can transport the IGBTs from the previous station to the next station. The whole process is automated and can meet the needs of large-volume rapid processing. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 A perspective view of the IGBT automatic cutting and bending system provided in the embodiments of this application;

[0017] Figure 2 for Figure 1 The image shows a top view of the IGBT automatic cutting and bending system.

[0018] Figure 3 for Figure 1 The diagram shows a partial structural schematic of the IGBT automatic cutting and bending system.

[0019] Figure 4 for Figure 1 The diagram shows the structure of the feeding device in the automatic IGBT cutting and bending system.

[0020] Figure 5 for Figure 1 The diagram shows a partial structural schematic of the IGBT automatic cutting and bending system.

[0021] Figure 6 for Figure 4 A partial structural diagram of the feeding device is shown;

[0022] Figure 7 for Figure 6 A schematic diagram of the feeding device from another angle is shown.

[0023] Figure 8 for Figure 4 A partial structural diagram of the feeding device is shown;

[0024] Figure 9 A schematic diagram of the structure in which the positioning mechanism pushes against the IGBT raw material.

[0025] The following are the labeling elements in the figure:

[0026] 1-IGBT raw material; 10-Frame; 101-Waiting station; 102-Lead shearing station; 103-Bending station; 104-Inkjet printing station; 105-Unloading station; 11-First frame; 12-Second frame; 13-Guide rail; 130-Waiting area; 131-Operating area; 14-Collection box; 15-Material box; 16-Fixing plate; 17-Support plate; 18-Limit block; 19-Fixing block; 20-Discharging mechanism; 21-Rotating seat; 22-Lifting plate; 23-Second power source; 230-Connecting rod; 24-Guide block; 240-Guide groove; 251-Connecting block; 252-Rotating shaft; 253-Supporting component; 254-Connecting frame; 255-Discharge sensor; 26-Buffer mechanism; 260-Fixing frame; 261-Drive cylinder; 262-Buffer block; 30-Guiding mechanism; 31-Transition plate; 310-Crossway; 311-Arc-shaped section; 40-Feeding mechanism; 41-Storage bin; 410-Clamping plate; 411-Stacking trough; 42-First power source; 43-Drive plate; 430-Panel; 431-Slot; 432-Connecting plate; 50-Shearing device; 51-Shearing blade; 52-Scrap bin; 60-Bending device; 61-Roller; 70-Transporting device; 71- Fourth power source; 72-Modible seat; 73-Lifting seat; 74-Mounting plate; 80-Coding mechanism; 81-Bracket; 810-Connecting frame; 82-Nozzle; 83-Pressure material mechanism; 830-Third power source; 831-Pressure plate; 84-Positioning mechanism; 841-Positioning plate; 90-Pushing mechanism; 91-Push block; 92-Discharge mechanism; 920-Storage box area; 921-Finished product stacking area. Detailed Implementation

[0027] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0028] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0029] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0030] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0031] See Figures 1 to 3 The automatic IGBT cutting and bending system provided in this application embodiment will now be described. This automatic IGBT cutting and bending system includes a frame 10, and guide rails 13, a feeding device, a shearing device 50, a bending device 60, and a conveying device 70 disposed on the frame 10. The guide rails 13 are arranged along the length of the frame 10, and have a waiting station 101, a shearing station 102, and a bending station 103. The frame 10 includes a first frame 11 and a second frame 12 connected together. The top surface of the second frame 12 is lower than the top surface of the first frame 11. The guide rails 13 are fixed on the second frame 12. A feeding mechanism 40 and a unloading mechanism 20 are disposed on the first frame 11, and the shearing device 50, the bending device 60, and the conveying device 70 are all disposed on the second frame 12.

[0032] See Figures 4 to 6 The feeding device includes a feeding mechanism 40, a guiding mechanism 30, and a discharging mechanism 20. The discharging mechanism 20 is used to drive the material box 15 to rotate and move between the feeding position and the discharging position. The feeding mechanism 40 is used to transport the material boxes 15 one by one to the feeding position. The guiding mechanism 30 includes an inclined transition plate 31. The transition plate 31 has a chute 310 suitable for the sliding of IGBT raw materials. The outlet of the chute 310 is connected to one end of the guide rail 13. When the discharging mechanism 20 drives the material box 15 to rotate to the discharging position, the IGBT raw materials can slide out of the material box 15 into the chute 310 one by one by their own gravity, and slide down to the waiting station 101 of the guide rail 13.

[0033] See Figures 1 to 3The conveying device 70 is used to move the IGBT from the waiting station 101 to the lead-cutting station 102 and from the lead-cutting station 102 to the bending station 103. The lead-cutting device 50 is used to cut the leads of the IGBT located at the lead-cutting station 102. The bending device 60 is used to bend the leads of the IGBT located at the bending station 103.

[0034] See Figures 4 to 6 The guiding mechanism 30 includes an inclined transition plate 31 with a groove 310 suitable for the sliding of the IGBT raw material 1. The inlet of the groove 310 is connected to the outlet of the pouring mechanism 20, and the outlet of the groove 310 is connected to one end of the guide rail 13. The guiding mechanism 30 also includes a cover plate covering the transition plate 31, so that the guiding mechanism 30 is a plate structure with openings at both ends, making it difficult for the IGBT raw material 1 to escape from the groove 310 after falling into it. The transition plate 31 is inclinedly fixed to one end of the second frame 12 near the first frame 11 by a support frame, and the inclination angle of the transition plate 31 can be set to about 45 degrees. The bottom of both the first frame 11 and the second frame 12 are provided with support frames and casters, which facilitates the movement of the entire frame 10.

[0035] The transition plate 31 has an arc-shaped section 311 at one end near the guide rail 13, which allows the IGBT material 1 to slide stably onto the guide rail 13. If the arc-shaped section 311 is not provided, the connection between the transition plate 31 and the guide rail 13 will not be smooth, and one end of the IGBT material 1 may press against the end of the guide rail 13, thus preventing subsequent IGBT material 1 from flowing smoothly onto the guide rail 13.

[0036] See Figures 6 to 8The feeding mechanism 40 is located beside the unloading mechanism 20. The feeding mechanism 40 includes a storage bin 41, a first power source 42, and a drive plate 43. The storage bin 41 is used to stack and store multiple boxes 15. The first power source 42 is used to transport the boxes 15 in the storage bin 41 to the loading position. The drive plate 43 is connected to the first power source 42. Specifically, the storage bin 41 includes two clamping plates 410 spaced apart on the frame 10. A plurality of stacking grooves 411 suitable for stacking boxes 15 are formed between the two clamping plates 410. The bottom of the stacking grooves 411 may be provided with elastic members. The top surface of the drive plate 43 is provided with a slot 431 with a width suitable for the box 15. The first power source 42 can drive the drive plate 43 to move between the clamping position and the loading position. When the drive plate 43 is in the clamping position, a box 15 at the bottom of the stacking groove 411 falls into the slot 431 of the drive plate 43. When the drive plate 43 is in the loading position, the material box 15 moves to the loading position. Specifically, the drive plate 43 includes two spaced-apart support plates 430 and a connecting plate 432 connected to the bottom surface of the two support plates 430. The connecting plate 432 and the two support plates 430 form an I-shaped structure. The two support plates 430 are respectively slidably engaged with the slide rails on the frame 10 via sliders. The layout direction of the slide rails is parallel to the width direction of the frame 10. The connecting plate 432 is connected to the output end of the first power source 42, so that the first power source 42 drives the two support plates 430 to move back and forth through the connecting plate 432. The top surfaces of the two support plates 430 are respectively provided with slots 431, the depth of which is less than the thickness of the material box 15. The first power source 42 may be, but is not limited to, a cylinder. After the unloading is completed, the empty material box 15 is rotated to the loading position by the unloading mechanism 20, while the feeding mechanism 40 continues to push the material box 15. One end of the two pallets 430 pushes the empty material box 15 out of the loading position, and the empty material box 15 falls into the collection box 14 on one side of the frame 10.

[0037] See Figure 1 , Figure 3 The lead shearing device 50 includes a scrap bin 52 and a vertically movable shearing blade 51. The scrap bin 52 is located adjacent to the guide rail 13. When the IGBT is in the shearing position, one end of each lead abuts against the top of one side of the scrap bin 52. When the shearing blade 51 descends, it cuts off the excess part of the lead, and the cut-off part falls into the scrap bin 52. The bending device 60 includes a fixed frame, a slide, and rollers 61 rotatably mounted on the slide at both ends. The slide is slidably mounted on the fixed frame and can move up and down. When the slide descends, one side of the roller 61 bends the IGBT located in the bending position.

[0038] Compared with the prior art, the IGBT feeding device provided in this application has the following advantages: when the first power source 42 of the feeding mechanism 40 transports the material box 15 to the feeding position, the unloading mechanism 20 rotates the material box 15 to the same angle as the transition plate 31, so that each IGBT material 1 in the material box 15 can slide out of the material box 15 in sequence under its own gravity and slide down from the transition plate 31 onto the guide rail 13. The overall structure is simple, and there is no need to use a vibration mechanism to achieve feeding. It will not damage the IGBT material 1, and it is safe and reliable. Multiple IGBT material 1 can be unloaded at one time. The frame 10 is equipped with a conveying device 70, which can transport the IGBTs from the previous station to the next station. The whole process is automated and can meet the needs of large-volume rapid processing.

[0039] See Figures 4 to 6 Specifically, the first power source 42 transports a material box 15 from the storage bin 41 to the loading position. When the unloading mechanism 20 rotates the material box 15 located at the loading position to a predetermined angle, the material box 15 is located at the unloading position. At this time, one end of the material box 15 is aligned with the entrance of the slide groove 310 of the transition plate 31. The IGBT raw material 1 in the material box 15 slides down from the material box 15 into the slide groove 310 in sequence, and then slides down from the slide groove 310 to the guide rail 13, so that multiple IGBT raw materials 1 are arranged in sequence on the guide rail 13. This completes the entire loading operation of the IGBT, in preparation for the subsequent lead shearing and bending operation.

[0040] See Figures 6 to 8The frame 10 has a horizontally arranged support plate 17 at one end away from the guide rail 13. The material feeding mechanism 20 includes a rotating seat 21, a lifting plate 22, and a second power source 23. The rotating seat 21 is rotatably connected to the frame 10. The frame 10 has a fixed block 19. The bottom surface of the rotating seat 21 has two spaced connecting blocks 251. The two connecting blocks 251 are rotatably mounted with a rotating shaft 252 via bearings. The rotating shaft 252 rotatably passes through the fixed block 19. The lifting plate 22 is movably mounted on the rotating seat 21. The output end of the second power source 23 is hinged to one end of the rotating seat 21. The support plate 17 and the rotating seat 21 form a support platform for placing the material box 15. The feeding position of the material box 15 is on this support platform. The frame 10 has multiple support members 253. When the rotating seat 21 is in a horizontal position, its bottom surface abuts against the top surface of the support member 253. The lifting plate 22 is configured as a feeding mechanism 40 to push the material box 15 to the support platform and then descend to press one end of the material box 15 against the rotating seat 21. When the empty material box 15 rotates to the horizontal position, it rises to a predetermined position. The second power source 23 is used to drive the rotating seat 21 to rotate, thereby causing the material box 15 to rotate and move between the feeding position and the unloading position. That is, the second power source 23 can drive the material box 15 to rotate from the horizontal position to the inclined position, and drive the empty material box 15 to rotate from the inclined position to the horizontal position. The second power source 23 specifically includes a drive cylinder 261 and a connecting rod 230. The drive cylinder 261 is installed inside the frame 10. One end of the connecting rod 230 is connected to the output shaft of the drive cylinder 261, and the other end is hinged to the rotating seat 21. A connecting frame 254 with a U-shaped longitudinal section is installed on the bottom surface of the rotating seat 21. A fixed shaft is provided on the connecting frame 254, and the other end of the connecting rod 230 is rotatably connected to the fixed shaft, thus realizing the hinge between the connecting rod 230 and the rotating seat 21.

[0041] See Figures 4 to 6 and Figure 8 A hollow guide block 24 is provided on the top surface of the rotating base 21 near the transition plate 31. The guide block 24 has a guide groove 240 suitable for the IGBT raw material 1 to slide through. The inlet of the guide groove 240 is connected to one end of the material box 15 located on the support platform. When the rotating base 21 drives the material box 15 to rotate to the unloading position, the outlet of the guide groove 240 is connected to the inlet of the slide 310. That is to say, when the material box 15 is driven to rotate to a predetermined angle by the unloading mechanism 20, the IGBT raw material 1 in the material box 15 first passes through the guide block 24 on the rotating base 21, then slides into the slide 310 of the transition plate 31, and finally slides onto the guide rail 13.

[0042] The discharge end of the material feeding mechanism 20 is equipped with a discharge sensor 255 that is communicatively connected to the second power source 23. When the discharge sensor 255 detects that there is IGBT raw material 1 at the discharge port of the material box 15 on the material feeding mechanism 20, it controls the second power source 23 to maintain the current state. When the discharge sensor 255 detects that there is no IGBT raw material 1 at the discharge port of the material box 15 on the material feeding mechanism 20, it controls the second power source 23 to drive the rotating seat 21 to rotate to a horizontal state. In other words, when the discharge sensor 255 detects material, the material box 15 remains in its original tilted position. If no material is detected, the material box 15 on the discharging mechanism 20 is empty. The discharging mechanism 20 then moves the material box 15 back to the horizontal position, pushing the empty material box 15 out of the discharging station of the discharging mechanism 20. The empty material box 15 falls into the adjacent collection box 14, and the new material box 15 of the feeding mechanism is transported to the discharging station to continue the feeding operation. This cycle continues until all the material boxes 15 in the feeding mechanism are used up, and then multiple new material boxes 15 are stacked in the storage area of ​​the feeding mechanism.

[0043] See Figures 5 to 7 A buffer mechanism 26 is provided at the end of the unloading mechanism 20 away from the discharge port to reduce the swing amplitude of the material box 15. The buffer mechanism 26 includes a fixed frame 260, a drive cylinder 261, and a buffer block 262. The fixed frame 260 is connected and fixed to the unloading mechanism 20, the drive cylinder 261 is mounted on the fixed frame 260, and the buffer block 262 is located at the output end of the drive cylinder 261. The buffer block 262 can be a cylindrical silicone block or an elastic injection molded part. The buffer block 262 forms a buffer section. The drive cylinder 261 can drive the buffer block 262 to move between a first position and a second position. When the empty material box 15 is rotated to a horizontal state by the unloading mechanism 20, the buffer block 262 is located in the first position and is suspended above the empty material box 15. When the unloading mechanism 20 drives the material box 15 to rotate, the buffer block 262 is in the second position, and the buffer block 262 abuts against the top surface of the material box 15. That is, the buffer block 262 can buffer the material box 15 during the process of being driven to rotate into an inclined state. The end of the material box 15 away from the guide rail 13 contacts the buffer block 262 during the swing. The setting of the buffer block 262 can reduce the swing amplitude of the material box 15, so that the material box 15 can reach a stable state more quickly. In other words, when the material box 15 moves from the feeding mechanism 40 to the support platform, there is a gap between the buffer block 262 and the material box 15. Before the material box 15 is driven to tilt by the unloading mechanism 20, the buffer block 262 descends to abut against the material box 15. After the unloading is completed, the empty material box 15 is driven to rotate to a horizontal position by the unloading mechanism 20. At this time, the buffer block 262 rises, and the empty material box 15 is pushed out of the support platform by the drive plate 43.

[0044] See Figure 5 and Figure 9A limiting block 18 is provided at the end of the guide rail 13 away from the transition plate 31 to restrict the IGBT material 1 from continuing to slide forward along the guide rail 13. It can be understood that the guide rail 13 and the limiting block 18 can be integrally set, that is, a boss is provided at one end of the guide rail 13, and the boss forms the limiting block 18.

[0045] See Figure 4 , Figure 5 and Figure 9 The waiting station 101 of the guide rail 13 has a waiting area 130 near the transition plate 31 and an operating area 131 away from the transition plate 31. The length of the operating area 131 is greater than the length of the waiting area 130. The frame 10 is provided with a pressing mechanism 83, which includes a third power source 830 and a pressing plate 831. The third power source 830 drives the pressing plate 831 to press the IGBT raw material 1 located in the waiting area 130 to restrict the IGBT raw material 1 from sliding from the waiting area 130 to the operating area 131. In this embodiment, the operating area 131 can hold 10 IGBT raw materials 1, and the waiting area 130 can hold 5 IGBT raw materials 1. That is, when there are 10 IGBT raw materials 1 in the operating area 131 of the guide rail 13, the third power source 830 drives the pressure plate 831 to press down the 5 IGBT raw materials 1 in the waiting area 130. When the 10 IGBT raw materials 1 in the operating area 131 are moved to the next processing position, the third power source 830 drives the pressure plate 831 to leave the waiting area 130. At this time, the IGBT raw materials 1 in the transition plate 31 push against the 5 IGBT raw materials 1 in the waiting area 130 due to their own gravity, until there are 10 IGBT raw materials 1 in the operating area 131 again, and so on.

[0046] See Figure 5 and Figure 9 The frame 10 is also equipped with a positioning mechanism 84. A fixing plate 16 is provided on the side of the guide rail 13 away from the positioning mechanism 84. The positioning mechanism 84 includes a positioning plate 841 and a drive cylinder for moving the positioning plate 841. The drive cylinder is configured to drive the positioning plate 841 to abut one end of each IGBT material 1 located on the guide rail 13, so that the other end of each IGBT material 1 abuts against the fixing plate 16. That is to say, when multiple IGBT materials 1 slide down from the transition plate 31 and move to the guide rail 13, they may not be neatly arranged on the guide rail 13. The drive cylinder can drive the positioning plate 841 to abut the IGBT materials 1 on the guide rail 13 against the fixing plate 16 on one side of the guide rail 13. In this way, the positioning and alignment of each IGBT material 1 on the guide rail 13 is achieved. When these aligned rows of IGBT materials 1 are moved to the next processing position, all the pins of each IGBT material 1 can be neatly arranged, thereby improving the product yield.

[0047] See Figure 2 , Figure 3The guide rail 13 also has a coding station 104, which is used to carry multiple finished IGBTs that have undergone lead cutting and bending. The conveying device 70 is also used to move the IGBTs from the bending station 103 to the coding station 104. The coding mechanism 80 includes a bracket 81 mounted on the frame 10 and a nozzle 82 slidably mounted on the bracket 81. The nozzle 82 can slide horizontally back and forth along the bracket 81 to sequentially code each pin of the IGBT located at the coding station 104.

[0048] The marking mechanism 80 also includes a drive source and a connecting frame 810. The drive source provides driving force to drive the connecting frame 810 to move linearly back and forth relative to the support 81. The nozzle 82 is fixed to the connecting frame 810 and is located directly above the guide rail 13. The nozzle 82 is configured to sequentially mark the pins of each IGBT finished product located at the marking station 104 when the drive source drives the connecting frame 810 to move.

[0049] In this embodiment, multiple finished IGBT products that have been cut and bent are placed on the guide rail 13. Each IGBT product has three pins, with a portion of the pin bent at a 90-degree angle and located on the side of the guide rail 13, and the other portion of the pin located above the guide rail 13 to form an area for the nozzle 82 to spray. The nozzle 82 can sequentially perform a coding operation on each IGBT product, spraying numbers, patterns, letters, or symbols on each pin of the IGBT product. Different numbers can be sprayed on each pin of the IGBT product; or numbers in a certain pattern can be sprayed, such as spraying the number 0 on the gate pin of the IGBT product, and spraying the number 1 on the collector and emitter pins respectively; when processing another type of IGBT, other numbers can be sprayed on each pin to distinguish different types of IGBTs. The coding mechanism 80 can sequentially code the pins of each IGBT product, which can prevent the use of the wrong model. The coding on the pins facilitates traceability and makes it easier for subsequent visual inspection equipment to check the model of the finished product, avoiding the installation of IGBTs of different models in the product and causing machine explosion, thus improving safety.

[0050] See Figure 2 , Figure 3The conveying device 70 includes a fourth power source 71, a movable seat 72, a lifting seat 73, and a mounting plate 74. The lifting seat 73 is fixed to one side of the movable seat 72, and one side of the mounting plate 74 is slidably connected to the lifting seat 73. The mounting plate 74 can move up and down relative to the lifting seat 73. The bottom surface of the mounting plate 74 has three spaced mounting areas, each with the same number of suction nozzles. The fourth power source 71 is connected to the movable seat 72 to drive the movable seat 72 to move back and forth, so that the three mounting areas of the mounting plate 74 can be aligned with the corresponding workstations. That is, when the fourth power source 71 drives the mounting plate 74 to move to one end, the three mounting areas are aligned with the waiting workstation 101, the shearing workstation 102, and the bending workstation 103, respectively. When the fourth power source 71 drives the mounting plate 74 to move to the other end, the three mounting areas are aligned with the shearing workstation 102, the bending workstation 103, and the coding workstation 104, respectively. When the mounting plate 74 is moved into place, the lifting seat 73 descends to the predetermined height, the suction nozzle picks up the IGBT on the corresponding workstation, and then the lifting seat 73 rises to reset, thus enabling the transport of IGBTs.

[0051] See Figures 1 to 3 The IGBT automatic cutting and bending system also includes a pushing mechanism 90 and a unloading mechanism 92 mounted on the frame 10. The pushing mechanism 90 is used to push multiple IGBT finished products that have been marked on the guide rail 13 into the empty material box 15 of the unloading station 105. The pushing mechanism 90 has a pushing block 91, which pushes the IGBT finished products on the marking station 104 into the empty material box 15 of the unloading station 105. The unloading mechanism 92 has a storage box area 920 and a finished product stacking area 921. The storage box area 920 is used to stack multiple empty material boxes 15, and the finished product stacking area 921 is used to stack the material boxes 15 containing IGBT finished products. The structure and operating principle of the pushing mechanism 90 are similar to those of the feeding mechanism 40. It also drives the empty material box 15 at the bottom of the storage area 920 to the unloading station 105 through the drive plate. The unloading mechanism 92 can be equipped with multiple suction nozzles to adsorb the material box 15. After the empty material box 15 is filled with IGBT finished products, the unloading mechanism 92 adsorbs the material box 15 filled with IGBT finished products and moves it to the finished product stacking area 921.

[0052] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An automatic cutting and bending system for IGBTs, characterized in that: The device includes a frame, and guide rails, a feeding device, a shearing device, a bending device, and a conveying device mounted on the frame. The guide rails have a waiting station, a shearing station, and a bending station. The feeding device includes a feeding mechanism, a guiding mechanism, and a discharging mechanism. The discharging mechanism drives the material boxes to rotate between the feeding position and the discharging position. The feeding mechanism conveys the material boxes one by one to the feeding position. The guiding mechanism includes an inclined transition plate with a groove suitable for the sliding of IGBT raw materials. The outlet of the groove is connected to the... One end of the guide rail is connected, and when the material unloading mechanism drives the material box to rotate to the unloading position, the IGBT material can slide out of the material box into the chute in sequence by its own gravity, and slide down to the waiting station of the guide rail through the chute; the conveying device is used to move the IGBT from the waiting station to the lead-cutting station and from the lead-cutting station to the bending station. The lead-cutting device is used to cut the leads of the IGBT located at the lead-cutting station, and the bending device is used to bend the leads of the IGBT located at the bending station.

2. The IGBT automatic cutting and bending system as described in claim 1, characterized in that: The feeding mechanism includes a storage bin for stacking and storing multiple boxes, a first power source for conveying the boxes in the storage bin to the feeding position, and a drive plate connected to the first power source. The top surface of the drive plate is provided with a slot with a width suitable for the box. The first power source can drive the drive plate to move between a clamping position and the feeding position. When the drive plate is in the clamping position, a box at the bottom of the storage bin falls into the slot. When the drive plate is in the feeding position, the box moves to the feeding position.

3. The IGBT automatic cutting and bending system as described in claim 1, characterized in that: The frame is horizontally equipped with a support plate at one end away from the guide rail. The material discharging mechanism includes a rotating seat, a lifting plate, and a second power source. The rotating seat is rotatably connected to the frame, and the lifting plate is movably mounted on the rotating seat. The output end of the second power source is hinged to one end of the rotating seat. The support plate and the rotating seat form a support platform for placing the material box. The lifting plate is configured such that after the feeding mechanism pushes the material box onto the support platform, it descends to press one end of the material box against the rotating seat, and rises to a predetermined position when the empty material box rotates to a horizontal position. The second power source is used to drive the rotating seat to rotate, thereby causing the material box to rotate and move between the feeding position and the discharging position.

4. The IGBT automatic cutting and bending system as described in claim 3, characterized in that: The feeding mechanism is equipped with a buffer mechanism at one end away from the discharge port. The buffer mechanism includes a fixed frame connected and fixed to the feeding mechanism, a drive cylinder on the fixed frame, and a buffer block at the output end of the drive cylinder. The drive cylinder drives the buffer block to move between a first position and a second position. When the empty material box is rotated to a horizontal state by the feeding mechanism, the buffer block is located in the first position and is suspended above the empty material box. When the feeding mechanism drives the material box to rotate, the buffer block is located in the second position and abuts against the top surface of the material box.

5. The IGBT automatic cutting and bending system as described in claim 3, characterized in that: The discharge end of the feeding mechanism is equipped with a discharge sensor that is communicatively connected to the second power source. When the discharge sensor detects that there is IGBT raw material at the discharge port of the material box, it controls the second power source to maintain the current state. When the discharge sensor detects that there is no IGBT raw material at the discharge port of the material box, it controls the second power source to drive the rotating seat to rotate to a horizontal state.

6. The IGBT automatic cutting and bending system as described in claim 1, characterized in that: The transition plate has an arc-shaped section at one end near the guide rail, so that the IGBT raw material can slide stably down the guide rail through the arc-shaped section.

7. The IGBT automatic cutting and bending system as described in claim 1, characterized in that: The waiting station has a waiting area near the transition plate and an operating area away from the transition plate. The frame is equipped with a pressing mechanism, which includes a third power source and a pressing plate. The third power source drives the pressing plate to press the IGBT raw material located in the waiting area to restrict the IGBT raw material from sliding from the waiting area to the operating area.

8. The IGBT automatic cutting and bending system as described in claim 1, characterized in that: The guide rail also has a coding station, and the conveying device is also used to move the IGBT from the bending station to the coding station; the IGBT automatic cutting and bending system also includes a coding mechanism, which includes a bracket mounted on the frame and a nozzle slidably mounted on the bracket. The nozzle can slide back and forth horizontally along the bracket to sequentially code each pin of the IGBT located at the coding station.

9. The IGBT automatic cutting and bending system as described in claim 8, characterized in that: It also includes a pushing mechanism and a unloading mechanism mounted on the frame. The pushing mechanism is used to push multiple finished IGBTs that have been marked at the marking station into an empty material box at the unloading station. The unloading mechanism has a storage box area and a finished product stacking area. The storage box area is used to stack multiple empty material boxes, and the finished product stacking area is used to stack material boxes containing finished IGBTs.

10. The IGBT automatic cutting and bending system according to any one of claims 1 to 9, characterized in that: The conveying device includes a fourth power source, a movable seat, a lifting seat, and a mounting plate. The lifting seat is fixed to one side of the movable seat, and one side of the mounting plate is slidably connected to the lifting seat. The mounting plate can move up and down relative to the lifting seat. The bottom surface of the mounting plate has three spaced mounting areas, and each mounting area is provided with the same number of suction nozzles. The fourth power source is connected to the movable seat to drive the movable seat to move back and forth.

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