A welding wire and silicon wafer welding fixing structure

Abstract

The utility model discloses a welding fixed structure of welding wire and silicon wafer, including welding seat top board, welding seat middle layer board and welding seat bottom plate, the middle part of welding seat bottom plate is provided with welding seat installation cavity position, and welding seat middle layer board is located in welding seat installation cavity position, and the top of welding seat middle layer board is covered with welding seat top board, and the both sides of welding seat top board all are fixed with the down pressure strip, and the down pressure strip moves along left and right direction and has the upper pressure strip, and all are provided with welding wire clamping block on the down pressure strip and the upper pressure strip, and the outside of welding seat top board is provided with the pressure strip limiting block, and the pressure strip limiting block moves along the front and back direction, and the outer end of pressure strip limiting block is formed with the limiting bench, and a plurality of thimble shafts are distributed on welding seat middle layer board, and thimble shaft extends upwards after passing through welding seat top board.

Description

Technical Field

[0001] This utility model relates to the technical field of silicon wafer string bonding, and in particular to a welding and fixing structure for welding wire and silicon wafer. Background Technology

[0002] Photovoltaic silicon wafers are the core and most valuable component of a solar power generation system. Their function is to convert solar energy into electrical energy, which is then stored in batteries or used directly as a power source. In BC cells (back-contact cells, which can be combined with various circuits), the welding wire needs to be positioned precisely and aligned with the solder points on the silicon wafer for heat welding. Conventional modules or conveyor tracks cannot accurately position the welding wire, and the welding wire at the bottom is not in close contact with the silicon wafer during the heat welding process, affecting the quality of the heat weld. Utility Model Content

[0003] One objective of this invention is to provide a welding and fixing structure for welding wire and silicon wafer, which accurately positions several cut sections of welding wire and lifts them to the lower surface of the silicon wafer, thereby improving the quality of hot welding.

[0004] To achieve this objective, the present invention adopts the following technical solution:

[0005] A welding and fixing structure for welding wire and silicon wafer includes a welding base top plate, a welding base middle plate, and a welding base bottom plate. A welding base mounting cavity is provided in the middle of the welding base bottom plate. The welding base middle plate is located within the welding base mounting cavity. The welding base top plate covers the middle plate. Lower pressure strips are fixed on both sides of the welding base top plate. Upper pressure strips move along the left-right direction on the lower pressure strips. Welding wire clamping blocks are provided on both the lower and upper pressure strips. Pressure strip limiting blocks are provided on the outer side of the welding base top plate. The pressure strip limiting blocks move along the front-back direction, and a limiting platform is formed at the outer end of the pressure strip limiting blocks. A plurality of ejector pin shafts are distributed on the welding base middle plate, and the ejector pin shafts extend upwards after passing through the welding base top plate.

[0006] As a preferred technical solution, welding wire clamping cylinders are fixed around the perimeter of the welding base plate, and a pressure bar swing member is hinged to the outer end of the welding base top plate. The driving end of the welding wire clamping cylinder abuts against one end of the pressure bar swing member. A spring top sleeve is fixed on the welding base top plate, and the spring top sleeve is in elastic contact with the other end of the pressure bar swing member. The pressure bar swing member presses against the outside of the upper pressure bar.

[0007] As a preferred technical solution, a suction cup is installed in the middle of the top plate of the welding seat.

[0008] As a preferred technical solution, the middle layer plate of the welding seat is provided with a middle layer support column, and a support column limiting block is installed at the lower end of the middle layer support column. A magnet is provided inside the support column limiting block.

[0009] As a preferred technical solution, a magnet connecting shaft is installed inside the middle layer support column of the welding base. The lower end of the magnet connecting shaft is connected to the magnet by a screw, and a spring is installed at the upper end of the magnet connecting shaft. The spring is located inside the middle layer support column of the welding base.

[0010] As a preferred technical solution, the upper surface of the middle layer plate of the welding seat is provided with a fixing wire groove, a pin fixing wire is placed in the fixing wire groove, a pin sleeve is fitted on the lower end of the pin shaft, a pin protrusion ring is arranged around the pin sleeve, and the pin fixing wire is engaged with the lower end of the pin protrusion ring.

[0011] The beneficial effects of this utility model are as follows: It provides a welding and fixing structure for welding wire and silicon wafer. This welding and fixing structure is used to clamp and position the cut welding wire, and with the help of the ejector pin, it pushes the welding wire to the welding point position of the silicon wafer above, which facilitates hot welding processing from top to bottom. Attached Figure Description

[0012] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments.

[0013] Figure 1 This is a schematic diagram of the first overall structure (without welding wire) of a welding and fixing structure for welding wire and silicon wafer as described in the embodiment.

[0014] Figure 2 This is a schematic diagram of the second integral structure (with welding wire) of a welding and fixing structure for welding wire and silicon wafer as described in the embodiment.

[0015] Figure 3 This is an exploded view of a welding and fixing structure for welding wire and silicon wafer as described in the embodiment.

[0016] Figure 4 This is a structural diagram of the combination of the top plate and the middle plate of the welding socket as described in the embodiment.

[0017] Figure 5 This is a structural diagram of the combination of the middle layer plate and the bottom plate of the welding socket as described in the embodiment.

[0018] Figure 6 This is a first cross-sectional view of a welding and fixing structure for a welding wire and a silicon wafer as described in the embodiment.

[0019] Figure 7 This is a second cross-sectional view of a welding and fixing structure for a welding wire and a silicon wafer as described in the embodiment.

[0020] Figure 8 This is an exploded view of the middle layer plate of the welding socket described in the embodiment.

[0021] Figures 1 to 8 middle:

[0022] 1. Welding seat top plate; 2. Welding seat middle plate; 3. Welding seat bottom plate; 4. Welding seat mounting cavity; 5. Lower pressure bar; 6. Upper pressure bar; 7. Welding wire clamping block; 8. Pressure bar limiting block; 9. Limiting platform; 10. Ejector pin shaft; 11. Welding wire clamping cylinder; 12. Pressure bar swing piece; 13. Spring top sleeve seat; 14. Suction cup; 15. Welding seat middle layer support column; 16. Support column limiting block; 17. Magnet; 18. Magnet connecting shaft; 19. Spring; 20. Ejector pin fixing screw; 21. Ejector pin sleeve; 22. Ejector pin protrusion ring; 23. Welding wire. Detailed Implementation

[0023] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0024] like Figures 1 to 8 As shown in this embodiment, a welding and fixing structure for welding wire and silicon wafer includes a welding base top plate 1, a welding base middle plate 2, and a welding base bottom plate 3. A welding base mounting cavity 4 is provided in the middle of the welding base bottom plate 3. The welding base middle plate 2 is located in the welding base mounting cavity 4. The welding base top plate 1 covers the welding base middle plate 2. Lower pressure strips 5 are fixed on both sides of the welding base top plate 1. An upper pressure strip 6 moves along the left and right direction on the lower pressure strip 5. Welding wire clamping blocks 7 are provided on both the lower pressure strip 5 and the upper pressure strip 6. A pressure strip limiting block 8 is provided on the outer side of the welding base top plate 1. The pressure strip limiting block 8 moves along the front and back direction. A limiting platform 9 is formed at the outer end of the pressure strip limiting block 8. A plurality of ejector pin shafts 10 are distributed on the welding base middle plate 2. The ejector pin shafts 10 pass through the welding base top plate 1 and extend upward.

[0025] The shortened welding wire 23 is placed on the top plate 1 of the welding seat. The upper pressure bar 6 moves the welding wire clamping block 7 on both sides to hold the welding wire 23 on the fixed lower pressure bar 5. The pressure bar limiting block 8 moves inward in the front-back direction, and the limiting platform 9 holds the end of the welding wire 23 against it and positions it inward. The ejector pin shaft 10 on the middle plate 2 of the welding seat rises and holds the welding wire 23 against the solder joint position of the silicon wafer, waiting for hot soldering.

[0026] Welding wire clamping cylinders 11 are fixed around the base plate 3 of the welding seat. A pressure bar swing piece 12 is hinged to the outer end of the top plate 1 of the welding seat. The driving end of the welding wire clamping cylinder 11 is pressed against one end of the pressure bar swing piece 12. A spring top sleeve 13 is fixed on the top plate 1 of the welding seat. The spring top sleeve 13 is in elastic contact with the other end of the pressure bar swing piece 12. The pressure bar swing piece 12 is pressed against the outside of the upper pressure bar 6.

[0027] The wire clamping cylinder 11 controls the drive end to rise, which moves the pressure bar swing piece 12 inward, so that the pressure bar swing piece 12 applies pressure to the side of the upper pressure bar 6, causing the upper pressure bar 6 to move on the lower pressure bar 5. The two wire clamping blocks 7 can clamp the wire 23. When it is necessary to open the wire clamping blocks 7, the wire clamping cylinder 11 retracts, and under the action of the spring top sleeve seat 13, the pressure bar swing piece 12 is pulled back to its original position.

[0028] A suction cup 14 is installed in the middle of the top plate 1 of the solder pad, which can adsorb and fix the silicon wafer.

[0029] A middle layer support column 15 is provided on the middle layer plate 2 of the welding seat. A support column limiting block 16 is installed at the lower end of the middle layer support column 15. A magnet 17 is provided inside the support column limiting block 16. A magnet connecting shaft 18 is installed inside the middle layer support column 15. The lower end of the magnet connecting shaft 18 is connected to the magnet 17 by screws. A spring 19 is installed at the upper end of the magnet connecting shaft 18. The spring 19 is located inside the middle layer support column 15 of the welding seat.

[0030] The entire fixed structure can be magnetically attached to the welding module by the magnet 17 below the support column limiting block 16, making it easy to adjust the position. Moreover, the spring 19 on the magnet connecting shaft 18 can ensure that there will be no hard collision during the magnetic attachment process, thus extending the service life.

[0031] The upper surface of the middle layer plate 2 of the welding seat is provided with a fixing wire groove, and a pin fixing wire 20 is placed in the fixing wire groove. A pin sleeve 21 is fitted on the lower end of the pin shaft 10. A pin protrusion ring 22 is arranged around the pin sleeve 21. The pin fixing wire 20 is engaged with the lower end of the pin protrusion ring 22.

[0032] Under the action of the ejector pin fixing wire 20, the ejector pin sleeve 21 is clamped on the middle layer plate 2 of the welding seat, which helps the ejector pin shaft 10 to elastically press the welding wire 23 against the silicon wafer.

[0033] It should be stated that the above-described specific embodiments are merely preferred embodiments of this utility model and the technical principles applied thereto. Within the scope of the technology disclosed in this utility model, any variations or substitutions that are easily conceived by those skilled in the art should be covered within the protection scope of this utility model.

Claims

1. A welding and fixing structure for welding wire and silicon wafer, characterized in that, The welding base includes a top plate, a middle plate, and a bottom plate. A welding base mounting cavity is located in the center of the bottom plate. The middle plate is situated within the mounting cavity. The top plate covers the middle plate. Lower pressure strips are fixed to both sides of the top plate. An upper pressure strip moves along the left-right direction on each lower pressure strip. Wire clamps are mounted on both the lower and upper pressure strips. A pressure strip limiting block is located on the outer side of the top plate and moves along the front-back direction. A limiting platform is formed at the outer end of the limiting block. Several ejector pin shafts are distributed on the middle plate, passing through the top plate and extending upwards.

2. The welding and fixing structure for welding wire and silicon wafer according to claim 1, characterized in that, Welding wire clamping cylinders are fixed around the base plate of the welding seat. A pressure bar swing piece is hinged to the outer end of the top plate of the welding seat. The driving end of the welding wire clamping cylinder is pressed against one end of the pressure bar swing piece. A spring top sleeve is fixed on the top plate of the welding seat. The spring top sleeve is in elastic contact with the other end of the pressure bar swing piece. The pressure bar swing piece is pressed against the outside of the upper pressure bar.

3. The welding and fixing structure for welding wire and silicon wafer according to claim 1, characterized in that, A suction cup is installed in the middle of the top plate of the welding seat.

4. The welding and fixing structure for welding wire and silicon wafer according to claim 1, characterized in that, The middle layer plate of the welding seat is provided with a middle layer support column, and a support column limiting block is installed at the lower end of the middle layer support column. A magnet is provided inside the support column limiting block.

5. The welding and fixing structure for welding wire and silicon wafer according to claim 4, characterized in that, A magnet connecting shaft is installed inside the middle layer support column of the welding base. The lower end of the magnet connecting shaft is connected to the magnet by a screw, and a spring is installed at the upper end of the magnet connecting shaft. The spring is located inside the middle layer support column of the welding base.

6. The welding and fixing structure for welding wire and silicon wafer according to claim 4, characterized in that, The upper surface of the middle layer plate of the welding seat is provided with a fixing wire groove, and a pin fixing wire is placed in the fixing wire groove. A pin sleeve is fitted on the lower end of the pin shaft, and a pin protrusion ring is arranged around the pin sleeve. The pin fixing wire is engaged with the lower end of the pin protrusion ring.

Images