A semiconductor thermoelectric material cutting device

Abstract

The utility model discloses a kind of semiconductor thermoelectric material cutting device, including frame, the inside of the frame is provided with hydraulic cylinder, the telescopic end of the hydraulic cylinder is connected with bottom plate, the top of the bottom plate is fixedly connected with fixed column, the top of the fixed column is fixedly connected with clamping mechanism, the inside of the frame is provided with shell, the side of the frame is fixedly connected with scale plate. Through the above structure, some semiconductor thermoelectric materials can be solved when cutting, material loosening or offset may occur, avoid the problem that instability may occur when cutting, and avoid the problem that the quality of material cannot be guaranteed, can solve part of semiconductor thermoelectric materials when cutting, may appear the case that staff needs to measure material length by oneself, avoid the problem that semiconductor thermoelectric material after cutting may need secondary accurate cutting, and avoid the problem of cost increase that appears in secondary cutting.

Description

Technical Field

[0001] This utility model relates to the field of cutting device technology, and in particular to a semiconductor thermoelectric material cutting device. Background Technology

[0002] Semiconductor thermoelectric materials refer to semiconductor materials with a large thermoelectric effect, also known as thermoelectric materials. They can directly convert heat energy into electrical energy or directly generate a cooling effect from electrical energy. In the production process of semiconductor thermoelectric materials, they usually need to be cut. Semiconductor thermoelectric materials come in a variety of shapes and specifications, among which the cylindrical structure is the most common.

[0003] In existing technologies, when cutting some semiconductor thermoelectric materials, the cutting blade moves longitudinally, which may cause the material to loosen or shift. This directly leads to instability during cutting and indirectly results in the inability to guarantee the quality of the material. In existing technologies, some semiconductor thermoelectric materials require high precision during cutting, which may require workers to measure them themselves. This directly leads to the need for a second precision cutting of the semiconductor thermoelectric material after cutting, and indirectly leads to increased costs due to the second cutting. Utility Model Content

[0004] The purpose of this invention is to provide a semiconductor thermoelectric material cutting device that can solve the problem that when cutting some semiconductor thermoelectric materials, the cutting blade moves longitudinally, which may cause the material to loosen or shift. This avoids instability during cutting and ensures the quality of the material. It also solves the problem that some semiconductor thermoelectric materials require high precision, which may require manual measurement by the operator. This avoids the need for secondary precision cutting of the semiconductor thermoelectric material after initial cutting and avoids the increased cost associated with secondary cutting.

[0005] To achieve the above objectives, a semiconductor thermoelectric material cutting device is provided, including a frame, a hydraulic cylinder is disposed inside the frame, and a base plate is connected to the telescopic end of the hydraulic cylinder;

[0006] A fixing column is fixedly connected to the top of the base plate, and a clamping mechanism is fixedly connected to the top of the fixing column. A housing is provided inside the frame, and a scale plate is fixedly connected to the side of the frame.

[0007] According to the semiconductor thermoelectric material cutting device, a knob is provided on the side of the clamping mechanism, a worm gear is fixedly connected below the knob, and a worm wheel is meshed with the side of the worm gear.

[0008] According to the semiconductor thermoelectric material cutting device, the surface of the worm gear is provided with a spiral groove, a first connecting rod is slidably connected to the surface of the spiral groove, a second connecting rod is fixedly connected to the side of the first connecting rod, and an arc-shaped block is fixedly connected to the other end of the second connecting rod.

[0009] According to the semiconductor thermoelectric material cutting device, the side of the second connecting rod is also connected to a sliding groove, and the other end of the worm gear is fixedly connected to a bearing, the outer surface of the bearing being fixedly connected to the inner wall of the clamping mechanism.

[0010] According to the semiconductor thermoelectric material cutting device, a servo motor is installed inside the housing, and a threaded rod is fixedly connected to the output end of the servo motor. A nut is threadedly connected to the outer surface of the threaded rod.

[0011] According to the semiconductor thermoelectric material cutting device, a third connecting rod is fixedly connected below the nut, a frame is fixedly connected below the third connecting rod, and a drive motor is fixedly connected to the side of the frame.

[0012] According to the semiconductor thermoelectric material cutting device, a rotating rod is fixedly connected to the output end of the drive motor, and a cutting blade is fixedly connected to the outer surface of the rotating rod.

[0013] According to the semiconductor thermoelectric material cutting device, a fourth connecting rod is fixedly connected to the side of the nut, a connecting plate is fixedly connected to the other end of the fourth connecting rod, and a pointer is fixedly connected to the top of the connecting plate.

[0014] According to the semiconductor thermoelectric material cutting device, a first limiting groove is provided on the lower part of the housing, and a second limiting groove is provided on the side of the housing.

[0015] This utility model has the following beneficial effects:

[0016] 1. Compared with existing technologies, by setting up a clamping mechanism, knob and arc block, the arc block can clamp and fix the semiconductor thermoelectric material. Under the anti-reverse action of the worm gear, the semiconductor thermoelectric material will not loosen or shift, thus avoiding the instability that may occur during cutting and the problem of material quality not being guaranteed.

[0017] 2. Compared with existing technologies, by setting up structures such as a shell, a scale plate, and a pointer, the pointer can move laterally on the surface of the scale plate, thereby controlling the cutting length. Under the action of the scale plate, the semiconductor thermoelectric material can be precisely cut, thus avoiding the problem that the semiconductor thermoelectric material may need to be precisely cut again after cutting, and avoiding the problem of increased costs caused by secondary cutting. Attached Figure Description

[0018] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0019] Figure 1 This is a three-dimensional structural diagram of a semiconductor thermoelectric material cutting device according to the present invention;

[0020] Figure 2 This is a three-dimensional half-sectional view of the clamping mechanism of a semiconductor thermoelectric material cutting device according to the present invention;

[0021] Figure 3 This is a three-dimensional half-sectional view of the housing of a semiconductor thermoelectric material cutting device according to the present invention;

[0022] Figure 4 This utility model relates to a semiconductor thermoelectric material cutting device. Figure 1 Enlarged view of point A in the middle.

[0023] Legend:

[0024] 1. Frame; 2. Hydraulic cylinder; 3. Base plate; 4. Fixed column; 5. Clamping mechanism; 6. Housing; 7. Scale plate; 8. Knob; 9. Worm gear; 10. Worm wheel; 11. Spiral groove; 12. First connecting rod; 13. Second connecting rod; 14. Arc block; 15. Slide groove; 16. Bearing; 17. Servo motor; 18. Threaded rod; 19. Nut; 20. Third connecting rod; 21. Frame body; 22. Drive motor; 23. Rotating rod; 24. Cutting blade; 25. Fourth connecting rod; 26. Connecting plate; 27. Pointer; 28. First limiting groove; 29. ​​Second limiting groove. Detailed Implementation

[0025] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.

[0026] Reference Figure 1-4This utility model provides a semiconductor thermoelectric material cutting device, which includes a frame 1, a hydraulic cylinder 2 inside the frame 1, and a base plate 3 connected to the telescopic end of the hydraulic cylinder 2.

[0027] A fixing post 4 is fixedly connected to the top of the base plate 3, a clamping mechanism 5 is fixedly connected to the top of the fixing post 4, a housing 6 is provided inside the frame 1, and a scale plate 7 is fixedly connected to the side of the frame 1.

[0028] A knob 8 is provided on the side of the clamping mechanism 5. A worm 9 is fixedly connected to the lower part of the knob 8. A worm wheel 10 is meshed with the side of the worm 9. A spiral groove 11 is opened on the surface of the worm wheel 10. A first connecting rod 12 is slidably connected to the surface of the spiral groove 11. A second connecting rod 13 is fixedly connected to the side of the first connecting rod 12. An arc block 14 is fixedly connected to the other end of the second connecting rod 13. A sliding groove 15 is also connected to the side of the second connecting rod 13. A bearing 16 is fixedly connected to the other end of the worm 9. The outer surface of the bearing 16 is fixedly connected to the inner wall of the clamping mechanism 5.

[0029] A servo motor 17 is installed inside the housing 6. A threaded rod 18 is fixedly connected to the output end of the servo motor 17. A nut 19 is threadedly connected to the outer surface of the threaded rod 18. A third connecting rod 20 is fixedly connected below the nut 19. A frame 21 is fixedly connected below the third connecting rod 20. A drive motor 22 is fixedly connected to the side of the frame 21. A rotating rod 23 is fixedly connected to the output end of the drive motor 22. A cutting blade 24 is fixedly connected to the outer surface of the rotating rod 23. A fourth connecting rod 25 is fixedly connected to the side of the nut 19. A connecting plate 26 is fixedly connected to the other end of the fourth connecting rod 25. A pointer 27 is fixedly connected to the top of the connecting plate 26. A first limiting groove 28 is opened at the bottom of the housing 6. A second limiting groove 29 is opened on the side of the housing 6.

[0030] The above structure, through the clamping mechanism 5 and the knob 8, enables the following when a cylindrical semiconductor thermoelectric material needs to be fixed: the material is first passed through the clamping mechanism 5, and then the knob 8 is rotated, causing the worm gear 9 to rotate. A worm wheel 10 is meshed with the side of the worm gear 9, allowing the worm wheel 10 to rotate. The spiral groove 11 on the side of the worm wheel 10 and the sliding groove 15 on the side of the clamping mechanism 5 limit the movement of the first connecting rod 12, allowing it to slide on the surface of the sliding groove 15. A second connecting rod 13 is fixedly connected to the side of the first connecting rod 12, allowing the second connecting rod 13 to move the arc-shaped block 14. This allows the arc-shaped block 14 to clamp and fix the semiconductor thermoelectric material. Furthermore, the anti-reverse action of the worm wheel 9 and worm gear 10 prevents the semiconductor thermoelectric material from loosening or shifting, thus avoiding instability during cutting and ensuring material quality.

[0031] By setting up the housing 6 and the scale plate 7, when precise cutting of the semiconductor thermoelectric material is required, the servo motor 17 can be started first, so that the servo motor 17 can drive the threaded rod 18 to rotate. Under the action of the first limiting groove 28 opened below the threaded rod 18, the nut 19 can drive the third connecting rod 20 to move laterally. The frame 21 is fixedly connected to the lower part of the third connecting rod 20, so that the frame 21 can drive the cutting blade 24 to move laterally. The fourth connecting rod 25 is fixedly connected to the side of the nut 19, so that the fourth connecting rod 25 can drive the connecting plate 26 to move laterally. The pointer 27 is fixedly connected to the upper part of the connecting plate 26, so that the pointer 27 can move laterally. In addition, the pointer 27 can move laterally on the surface of the scale plate 7, so that the cutting length can be controlled. Under the action of the scale plate 7, the semiconductor thermoelectric material can be precisely cut, thereby avoiding the problem that the semiconductor thermoelectric material may need to be precisely cut again after cutting, and avoiding the cost increase caused by secondary cutting.

[0032] Working Principle: When it is necessary to fix a cylindrical semiconductor thermoelectric material, the material can first be passed through the clamping mechanism 5, and then the knob 8 can be rotated, so that the knob 8 can drive the worm 9 to rotate. The side of the worm 9 is meshed with a worm wheel 10, so that the worm wheel 10 can rotate. Under the limiting effect of the spiral groove 11 opened on the side of the worm wheel 10 and the sliding groove 15 opened on the side of the clamping mechanism 5, the first connecting rod 12 can slide on the surface of the sliding groove 15. The side of the first connecting rod 12 is fixedly connected to the second connecting rod 13, so that the second connecting rod 13 can drive the arc block 14 to move, thereby allowing the arc block 14 to clamp and fix the semiconductor thermoelectric material. Under the anti-reverse action of the worm wheel 9 and worm 10, the semiconductor thermoelectric material will not loosen or shift. When it is necessary to fix the semiconductor thermoelectric material... When performing precise cutting, the servo motor 17 can be started first, so that the servo motor 17 can drive the threaded rod 18 to rotate. Under the action of the first limiting groove 28 opened below the threaded rod 18, the nut 19 can drive the third connecting rod 20 to move laterally. The frame 21 is fixedly connected to the lower part of the third connecting rod 20, so that the frame 21 can drive the cutting blade 24 to move laterally. The fourth connecting rod 25 is fixedly connected to the side of the nut 19, so that the fourth connecting rod 25 can drive the connecting plate 26 to move laterally. The pointer 27 is fixedly connected to the upper part of the connecting plate 26, so that the pointer 27 can move laterally. Thus, the pointer 27 can move laterally on the surface of the scale plate 7, thereby controlling the cutting length. Under the action of the scale plate 7, the semiconductor thermoelectric material can be precisely cut.

[0033] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A semiconductor thermoelectric material cutting device, characterized in that, Includes a frame (1), and a hydraulic cylinder (2) is provided inside the frame (1). The telescopic end of the hydraulic cylinder (2) is connected to a base plate (3). A fixing column (4) is fixedly connected above the base plate (3), and a clamping mechanism (5) is fixedly connected above the fixing column (4). A shell (6) is provided inside the frame (1), and a scale plate (7) is fixedly connected to the side of the frame (1).

2. The semiconductor thermoelectric material cutting device according to claim 1, characterized in that, The clamping mechanism (5) has a knob (8) on its side, and a worm gear (9) is fixedly connected below the knob (8). A worm wheel (10) is meshed with the side of the worm gear (9).

3. The semiconductor thermoelectric material cutting device according to claim 2, characterized in that, The surface of the worm gear (10) is provided with a spiral groove (11), and a first connecting rod (12) is slidably connected to the surface of the spiral groove (11). A second connecting rod (13) is fixedly connected to the side of the first connecting rod (12), and an arc block (14) is fixedly connected to the other end of the second connecting rod (13).

4. The semiconductor thermoelectric material cutting device according to claim 3, characterized in that, The second connecting rod (13) is also connected to a sliding groove (15) on its side. The other end of the worm (9) is fixedly connected to a bearing (16), and the outer surface of the bearing (16) is fixedly connected to the inner wall of the clamping mechanism (5).

5. The semiconductor thermoelectric material cutting device according to claim 1, characterized in that, A servo motor (17) is installed inside the housing (6). A threaded rod (18) is fixedly connected to the output end of the servo motor (17). A nut (19) is threadedly connected to the outer surface of the threaded rod (18).

6. The semiconductor thermoelectric material cutting device according to claim 5, characterized in that, A third connecting rod (20) is fixedly connected below the nut (19), a frame (21) is fixedly connected below the third connecting rod (20), and a drive motor (22) is fixedly connected to the side of the frame (21).

7. The semiconductor thermoelectric material cutting device according to claim 6, characterized in that, The output end of the drive motor (22) is fixedly connected to a rotating rod (23), and a cutting blade (24) is fixedly connected to the outer surface of the rotating rod (23).

8. The semiconductor thermoelectric material cutting device according to claim 5, characterized in that, A fourth connecting rod (25) is fixedly connected to the side of the nut (19), and a connecting plate (26) is fixedly connected to the other end of the fourth connecting rod (25). A pointer (27) is fixedly connected to the top of the connecting plate (26).

9. A semiconductor thermoelectric material cutting device according to claim 1, characterized in that, A first limiting groove (28) is provided on the lower part of the housing (6), and a second limiting groove (29) is provided on the side of the housing (6).

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