A connector mold cooling structure with a heat-conductive copper layer

Abstract

The utility model belongs to mould technical field, specifically disclose a kind of connector mould cooling structure with heat conduction copper layer. The utility model includes mould body, the side of mould body is equipped with upper die holder, the side of mould body is equipped with lower die cavity, the side of mould body is equipped with cooling group, cooling component includes heat conduction copper layer and cooling nozzle, heat conduction copper layer and cooling nozzle carry out double cooling to connector mould, through multiple cooling nozzle, mould surface can be cooled all-round, dead angle-free, effectively avoid the problem that mould surface temperature difference is too large due to local cooling insufficient, simultaneously, cooling nozzle can be linked with upper die holder during mould opening and closing process, automatically approach or away from mould surface, both guarantee cooling efficiency, avoid interference with mould, ensure that production flow is smooth, reduce equipment failure risk, to further improve production efficiency and product yield, reduce production cost.

Description

Technical Field

[0001] This application relates to the field of mold technology, and more specifically, to a connector mold cooling structure with a thermally conductive copper layer. Background Technology

[0002] A wire harness connector mold is a specialized tool used to manufacture wire harness connectors. It typically consists of multiple components and is made by processing materials such as plastics into connector housings with specific shapes and sizes through processes such as injection molding. It also provides accurate positioning and mounting structures for internal components such as metal terminals, ensuring that the wire harness connector can achieve reliable electrical connection and mechanical fixation. It is widely used in many fields such as automotive, electronics, and electrical appliances, and is one of the key basic components for ensuring the stable operation of wire harness systems.

[0003] A search revealed that patent CN209502592U discloses a charging connector mold with stable cooling function, specifically relating to the field of charging connector molds. The mold includes an upper mold with a lower mold at its bottom. Both the upper and lower molds have cavities inside, and a heat-conducting plate is provided on the outer side of each cavity. Multiple heat-conducting rods are fixedly mounted on the bottom of the heat-conducting plate, and a cooling block is fixedly mounted on the bottom of each heat-conducting rod. The heat-conducting plate, heat-conducting rods, and cooling blocks are all made of copper. A water channel is provided inside the cooling block, with an inlet at one end and an outlet at the other. Water pipes are provided on the outer sides of both the inlet and outlet. This invention uses a guide column to drive a second movable rod, a second rack, a gear, a first rack, and a first movable rod to move and pull out a movable plate, opening the water pipes. Cooling is achieved through the heat-conducting plate, heat-conducting rods, and cooling blocks, resulting in stable cooling performance and improved molding quality.

[0004] The aforementioned patent uses water cooling to cool the cooling block, which in turn cools the heat-conducting plate through a heat-conducting rod. This method, when used for a long time, will result in a high water temperature and multiple heat transfers, ultimately leading to poor cooling performance. Furthermore, relying solely on water cooling can easily cause uneven cooling, build up scale that clogs water channels, accelerate equipment corrosion and aging, increase energy consumption, and affect equipment performance and lifespan. Utility Model Content

[0005] To address the aforementioned issues, this application provides a connector mold cooling structure with a thermally conductive copper layer.

[0006] The connector mold cooling structure with a thermally conductive copper layer provided in this application adopts the following technical solution:

[0007] A connector mold cooling structure with a thermally conductive copper layer includes a mold body, an upper mold base on one side of the mold body, a lower mold cavity on one side of the mold body, and a cooling component on one side of the mold body.

[0008] The cooling assembly includes a thermally conductive copper layer and cooling nozzles, which provide dual cooling for the connector mold.

[0009] Furthermore, a thermally conductive copper layer is disposed on the inner wall of the lower mold cavity, and a flow cavity is formed inside the thermally conductive copper layer. The number of flow cavities is set to multiple, and the multiple flow cavities are parallel to each other and interconnected.

[0010] Furthermore, an air inlet pipe is provided on one side of the thermally conductive copper layer, and an air outlet pipe is provided on the other side of the thermally conductive copper layer. Both the air inlet pipe and the air outlet pipe are connected to one side of the corresponding flow cavity, and an air pump is connected to one side of the air inlet pipe.

[0011] The above technical solutions can improve heat dissipation efficiency.

[0012] Furthermore, a cylinder is provided on the top of the mold body, and a connecting plate is connected to the output end of the cylinder. The upper mold base is located at the bottom of the connecting plate.

[0013] Furthermore, connecting rods are rotatably connected to both ends of the connecting plate, and two limiting grooves are opened on one side of the mold body. Moving frames are slidably connected inside the two limiting grooves, and connecting seats are provided at both ends of each moving frame.

[0014] Furthermore, the bottom end of each connecting rod is rotatably connected to the corresponding connecting seat, and the number of cooling nozzles is set to multiple.

[0015] Furthermore, each cooling nozzle is respectively set on the top of the corresponding movable frame, each cooling nozzle is connected to the corresponding movable frame, and each movable frame is provided with a connecting pipe on one side, each connecting pipe being connected to the corresponding movable frame.

[0016] Furthermore, a button is provided on one side of the mold body, and multiple cooling nozzles and an air pump are electrically connected to the button.

[0017] The above technical solutions can ensure cooling efficiency.

[0018] In summary, this application includes at least one of the following beneficial technical effects:

[0019] (1) This utility model can quickly gather and conduct a large amount of heat generated by the mold during the molding process through the heat-conducting copper layer, avoiding local overheating. The cooling gas circulating in the flow cavity can fully contact the heat-conducting copper layer to achieve efficient heat exchange and quickly remove the heat. Compared with the traditional single cooling method, this internal cooling structure greatly improves the heat dissipation efficiency, effectively shortens the mold cooling cycle, and improves production efficiency. At the same time, through multiple parallel and interconnected flow cavities, the cooling gas can be evenly distributed on the inner wall of the lower mold cavity, ensuring the uniformity of cooling in all parts of the mold, reducing defects such as deformation and shrinkage of connector products caused by uneven cooling, improving product quality, and also reducing thermal fatigue damage caused by the mold being in a high-temperature state for a long time, thus extending the service life of the mold.

[0020] (2) This utility model can cool the mold surface in all directions without dead angles through multiple cooling nozzles, effectively avoiding the problem of excessive temperature difference on the mold surface caused by insufficient local cooling. At the same time, during the mold opening and closing process, the cooling nozzles can move in conjunction with the upper mold base and automatically approach or move away from the mold surface, which can ensure cooling efficiency and avoid interference with the mold, ensure smooth production process, reduce equipment failure risk, and thus improve production efficiency and product yield, and reduce production costs. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0022] Figure 2 This is a bottom view of the overall structure of this utility model;

[0023] Figure 3 This is a schematic diagram of the overall structure of the lower mold cavity of this utility model;

[0024] Figure 4 This is a schematic diagram of the overall structure of the thermally conductive copper layer of this utility model;

[0025] Figure 5 This is a schematic diagram of the internal structure of the thermally conductive copper layer of this utility model;

[0026] Figure 6 This is a schematic diagram of the overall structure of the mobile frame of this utility model after it has been moved.

[0027] Explanation of reference numerals in the attached drawings: 1. Mold body; 2. Upper mold base; 3. Lower mold cavity; 4. Cylinder; 5. Connecting plate; 6. Thermally conductive copper layer; 7. Flow cavity; 8. Air inlet pipe; 9. Air outlet pipe; 10. Air pump; 11. Button; 12. Connecting rod; 13. Limiting groove; 14. Moving frame; 15. Cooling nozzle; 16. Connecting seat; 17. Connecting pipe. Detailed Implementation

[0028] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0029] Reference Figures 1-6 A connector mold cooling structure with a thermally conductive copper layer includes a mold body 1, an upper mold base 2 on one side of the mold body 1, a lower mold cavity 3 on one side of the mold body 1, and a cooling component on one side of the mold body 1.

[0030] The cooling assembly includes a thermally conductive copper layer 6 and a cooling nozzle 15, which provide dual cooling for the connector mold.

[0031] Reference Figures 3-5 A thermally conductive copper layer 6 is disposed on the inner wall of the lower mold cavity 3. A flow cavity 7 is provided inside the thermally conductive copper layer 6. The number of flow cavities 7 is set to multiple, and the multiple flow cavities 7 are parallel to each other and interconnected. An air inlet pipe 8 is provided on one side of the thermally conductive copper layer 6, and an air outlet pipe 9 is provided on one side of the thermally conductive copper layer 6. Both the air inlet pipe 8 and the air outlet pipe 9 are connected to one side of the corresponding flow cavity 7. An air pump 10 is connected to one side of the air inlet pipe 8.

[0032] By setting up the thermally conductive copper layer 6 and the flow cavity 7, the connector mold can be internally cooled. The specific cooling method is as follows: First, the air pump 10 is started, and external gas is forced into the flow cavity 7 inside the thermally conductive copper layer 6 through the air inlet pipe 8. Since multiple parallel and interconnected flow cavities 7 are distributed throughout the inner wall of the lower mold cavity 3, the gas can fully contact the thermally conductive copper layer 6 when flowing in the flow cavity 7, and quickly remove the mold heat conducted by the copper layer. At the same time, an air extraction device (the air extraction device is existing technology and is not shown in the figure) is connected to one end of the air outlet pipe 9. The air extraction device works continuously, forming a negative pressure in the air outlet pipe 9 and the flow cavity 7, which enables the high-temperature gas that has absorbed heat to be quickly discharged through the air outlet pipe 9. Through the cooperation of the air inlet pipe 8 and the air pump 10, and the synergistic effect of the air outlet pipe 9 and the air extraction device, the cooling gas forms a stable circulating cooling path in the flow cavity 7, continuously cooling the mold internally. This effectively ensures the rapid renewal of the cooling gas inside the mold, further improving the cooling efficiency and ensuring that the mold is always in a suitable temperature state during the production process.

[0033] The thermally conductive copper layer 6 can quickly concentrate and conduct the large amount of heat generated by the mold during the molding process, avoiding local overheating. The cooling gas circulating in the flow cavity 7 can fully contact the thermally conductive copper layer 6 to achieve efficient heat exchange and quickly remove heat. Compared with the traditional single cooling method, this internal cooling structure greatly improves heat dissipation efficiency, effectively shortens the mold cooling cycle, and improves production efficiency. At the same time, through multiple parallel and interconnected flow cavities 7, the cooling gas can be evenly distributed on the inner wall of the lower mold cavity 3, ensuring uniform cooling of all parts of the mold, reducing defects such as deformation and shrinkage of connector products caused by uneven cooling, improving product quality, and also reducing thermal fatigue damage caused by the mold being in a high-temperature state for a long time, extending the service life of the mold.

[0034] Reference Figures 1-3 and Figure 6 The top of the mold body 1 is provided with a cylinder 4, and the output end of the cylinder 4 is connected to a connecting plate 5. The upper mold base 2 is set at the bottom of the connecting plate 5. Both ends of the connecting plate 5 are rotatably connected with connecting rods 12. Two limiting grooves 13 are opened on one side of the mold body 1. The interior of the two limiting grooves 13 is slidably connected with a moving frame 14. Both ends of each moving frame 14 are provided with connecting seats 16. The bottom end of each connecting rod 12 is rotatably connected to the corresponding connecting seat 16. The number of cooling nozzles 15 is set to multiple. The bottom end of each connecting rod 12 is rotatably connected to the corresponding connecting seat 16. The number of cooling nozzles 15 is set to multiple.

[0035] Multiple cooling nozzles 15 can cool the mold surface. Specifically, when the mold needs cooling after injection molding, the cylinder 4 drives the output end to move the connecting plate 5 and the upper mold base 2 upward. One end of the connecting rod 12, which is rotatably connected to the connecting plate 5, rotates. The connecting rod 12 will drive the moving frame 14 to slide upward along the limiting groove 13, so that the connecting seat 16 drives the multiple cooling nozzles 15 to quickly approach the mold surface. At this time, since one end of the connecting pipe 17 is connected to a conveying device (the conveying device is existing technology and is not shown in the figure), and the moving frame 14 has an internal cavity. Both the connecting pipe 17 and the cooling nozzle 15 are connected to the corresponding moving frame 14. In this way, the cooling medium is transported to the interior of the moving frame 14 through the corresponding connecting pipe 17 via the conveying device, and finally delivered to each cooling nozzle 15. It evenly covers the mold surface in the form of atomization or spraying, and quickly removes heat. When the cylinder 4 drives the upper mold base 2 to move down to perform mold closing and other operations, the connecting rod 12 pushes the moving frame 14 to slide down and reset along the limiting groove 13. The cooling nozzle 15 moves away from the mold surface at the same time to avoid interfering with the normal working process of the mold, and at the same time leaves sufficient space for the next injection molding and mold closing.

[0036] Multiple cooling nozzles 15 can provide all-round, dead-angle cooling to the mold surface, effectively avoiding the problem of excessive temperature difference on the mold surface caused by insufficient local cooling. At the same time, during the mold opening and closing process, the cooling nozzles 15 can move in conjunction with the upper mold base 2, automatically approaching or moving away from the mold surface, ensuring cooling efficiency while avoiding interference with the mold, ensuring smooth production process, reducing equipment failure risk, thereby improving production efficiency and product yield, and reducing production costs.

[0037] Reference Figure 2 A button 11 is provided on one side of the mold body 1, and multiple cooling nozzles 15 and air pump 10 are electrically connected to the button 11.

[0038] When the upper mold base 2 moves upward, it triggers the button 11 located on one side of the mold body 1. This simultaneously activates multiple cooling nozzles 15 and air pump 10 to perform cooling work. This ensures that the internal gas circulation and surface spraying dual cooling are activated simultaneously as soon as the mold is demolded, accurately matching the production rhythm, avoiding delays caused by manual operation, greatly improving the timeliness and efficiency of cooling, and effectively improving the product molding quality and production stability.

[0039] The thermally conductive copper layer 6 and the flow cavity 7 of the overall cooling assembly achieve efficient and uniform cooling inside the mold, avoiding local overheating. Multiple cooling nozzles 15 automatically move in tandem with the upper mold base 2 to precisely cover the mold surface. At the same time, the dual cooling is activated simultaneously by the button 11, which improves cooling efficiency and uniformity, shortens the production cycle, reduces product defects, extends mold life, effectively reduces production costs and improves product yield.

[0040] Working principle: During the injection molding stage, the upper mold base 2 and the lower mold cavity 3 close to complete the injection and pressure holding. When the injection is completed and cooling is required, the cylinder 4 is started. Its output end drives the connecting plate 5 and the upper mold base 2 to move upward. The upward movement of the upper mold base 2 drives the connecting rod 12, which is rotatably connected to the connecting plate 5, to rotate. The connecting rod 12 pulls the moving frame 14 to slide upward along the limiting groove 13, so that the connecting seat 16 drives multiple cooling nozzles 15 to approach the mold surface.

[0041] At the same time, after the upper mold base 2 moves up, it will trigger the button 11 on one side of the mold body 1. The button 11 will start the air pump 10 and multiple cooling nozzles 15 through electrical connection. The air pump 10 will press external gas into the flow cavity 7 inside the heat-conducting copper layer 6 through the air inlet pipe 8. Multiple parallel and interconnected flow cavities 7 are distributed throughout the inner wall of the lower mold cavity 3. The gas flows in the cavity and makes full contact with the heat-conducting copper layer 6, taking away the heat inside the mold. The air extraction device at one end of the air outlet pipe 9 will continuously extract air to form a negative pressure, so that the high-temperature gas after absorbing heat will be discharged quickly, thus achieving internal cooling of the mold.

[0042] Next, the conveying device delivers the cooling medium through the cavity of the connecting pipe 17 and the moving frame 14 to the cooling nozzle 15, so as to cool the mold surface in the form of atomization or spray.

[0043] After cooling is complete, cylinder 4 drives the upper mold base 2 to move down and close the mold, connecting rod 12 pushes the moving frame 14 to reset, and cooling nozzle 15 moves away from the mold, waiting for the next injection cycle.

[0044] The above are all preferred embodiments of this application and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A connector mold cooling structure with a thermally conductive copper layer, comprising a mold body (1), characterized in that, The mold body (1) has an upper mold base (2) on one side, a lower mold cavity (3) on one side, and a cooling assembly on one side. The cooling assembly includes a thermally conductive copper layer (6) and a cooling nozzle (15), which provide dual cooling for the connector mold.

2. The connector mold cooling structure with a thermally conductive copper layer according to claim 1, characterized in that: The thermally conductive copper layer (6) is disposed on the inner wall of the lower mold cavity (3). A flow cavity (7) is provided inside the thermally conductive copper layer (6). The number of flow cavities (7) is set to multiple, the multiple flow cavities (7) are parallel to each other, and the multiple flow cavities (7) are interconnected.

3. The connector mold cooling structure with a thermally conductive copper layer according to claim 1, characterized in that: An air inlet pipe (8) is provided on one side of the thermally conductive copper layer (6), and an air outlet pipe (9) is provided on one side of the thermally conductive copper layer (6). Both the air inlet pipe (8) and the air outlet pipe (9) are connected to one side of the corresponding flow cavity (7). An air pump (10) is connected to one side of the air inlet pipe (8).

4. The connector mold cooling structure with a thermally conductive copper layer according to claim 1, characterized in that: The top of the mold body (1) is provided with a cylinder (4), the output end of the cylinder (4) is connected to a connecting plate (5), and the upper mold base (2) is located at the bottom of the connecting plate (5).

5. The connector mold cooling structure with a thermally conductive copper layer according to claim 4, characterized in that: The connecting plate (5) has connecting rods (12) rotatably connected to both ends on both sides. The mold body (1) has two limiting grooves (13) on one side. The two limiting grooves (13) are slidably connected to the inside of the moving frame (14). Each moving frame (14) has a connecting seat (16) at both ends.

6. The connector mold cooling structure with a thermally conductive copper layer according to claim 5, characterized in that: The bottom end of each of the connecting rods (12) is rotatably connected to the corresponding connecting seat (16), and the number of cooling nozzles (15) is set to multiple.

7. The connector mold cooling structure with a thermally conductive copper layer according to claim 6, characterized in that: Each of the cooling nozzles (15) is respectively disposed on the top of the corresponding movable frame (14), and each of the cooling nozzles (15) is connected to the corresponding movable frame (14). Each of the movable frames (14) has a connecting pipe (17) on one side, and each of the connecting pipes (17) is connected to the corresponding movable frame (14).

8. The connector mold cooling structure with a thermally conductive copper layer according to claim 7, characterized in that: A button (11) is provided on one side of the mold body (1), and the multiple cooling nozzles (15) and air pump (10) are electrically connected to the button (11).

Images