A label sticking device for chip packaging
Through multiple mechanical structure designs, the label pasting device for chip packaging achieves precise positioning and stable fixation, solving the problem of insufficient flexibility in adjusting the label pasting position, improving pasting accuracy and stability, and adapting to chip packaging of different specifications.
CN224324281UActive Publication Date: 2026-06-05SUZHOU ASEN SEMICON CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUZHOU ASEN SEMICON CO LTD
- Filing Date
- 2025-08-13
- Publication Date
- 2026-06-05
Smart Images
Figure CN224324281U_ABST
Abstract
The utility model relates to chip packaging processing technical field, concretely is a kind of label pasting device for chip packaging, it includes: base, the inner side of top is slidably connected with support plate;Fixed component, including electric push rod, slide rail and positioning block, electric push rod is provided with two and is placed on support plate, slide rail is provided with four and is welded on support plate, positioning block is slidably connected with slide rail;Moving component, including support column, connecting column, support block and locating plate, support column is welded on base, connecting column is slidably connected with support column, support block is slidably connected in connecting column, locating plate is welded with the bottom end of support block, the chip packaging of different specifications can be adapted, ensure that label pasting process is stable and reliable, improve the efficiency and quality of chip packaging label pasting.
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