Handle assembly and vehicle
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ILLINOIS TOOL WORKS INC
- Filing Date
- 2024-12-31
- Publication Date
- 2026-06-05
AI Technical Summary
Electric vehicle touch door handles are prone to malfunction or accidental triggering in harsh environments such as rain, leading to functional failure.
By employing stress sensors or optical sensors, the sensor is triggered by the movement or floating structure of the door handle cover instead of deformation, thus realizing the push-type door handle function and sensing minute pressing pressure to trigger the door to unlock or unfold.
Ensuring the normal operation of the door handle in various environments avoids touch malfunctions or accidental triggering, thus improving reliability and user experience.
Smart Images

Figure CN224326141U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the fields of handle components and vehicles. Background Technology
[0002] Electric vehicles use touch-sensitive door handles, which can be activated or unlocked when the handle is touched. Utility Model Content
[0003] According to a first aspect of this application, a handle assembly is provided, characterized in that it includes a door handle cover, a door handle housing, and a sensor module, wherein the door handle cover is movably or deformably disposed outside the door handle housing, and the sensor module is disposed between the door handle cover and the door handle housing and in contact with the door handle cover, such that the sensor module can sense the force applied to the door handle cover and deform accordingly.
[0004] According to a first aspect of this application, the door handle cover is provided with a pressing protrusion on the side facing the sensor module, the pressing protrusion contacting the sensor module, such that when the door handle cover moves relative to the sensor module, the sensor module can sense the force applied to the pressing protrusion and deform accordingly.
[0005] According to a first aspect of this application, the door handle cover is characterized in that it is floatingly disposed on the outside of the door handle housing.
[0006] According to a first aspect of this application, the door handle cover is characterized by: a snap-fit structure on the side of the door handle housing near the door handle shell, and a snap-fit mating structure on the side of the door handle shell facing the door handle cover; the snap-fit structure and the snap-fit mating structure abut against each other to limit the range of movement of the door handle cover relative to the door handle shell; wherein when the door handle cover is not subjected to the pressing force, the door handle cover is floatingly disposed on the door handle shell; and when the door handle cover is subjected to the pressing force, the door handle cover can move relative to the door handle shell.
[0007] According to a first aspect of this application, the door handle cover is characterized in that: one side end of the door handle cover is mounted on the door handle housing via a swing shaft, so that the door handle cover is swingably disposed outside the door handle housing; and the door handle cover is provided with a snap-fit structure relative to the other side end of the one side end, and the door handle housing is provided with a snap-fit mating structure on the side facing the door handle cover, wherein the abutting engagement of the snap-fit structure and the snap-fit mating structure limits the range of movement of the door handle cover relative to the door handle housing; when the door handle cover is not subjected to the pressing force, the door handle cover is floatingly disposed on the door handle housing; when the door handle cover is subjected to the pressing force, the door handle cover can move relative to the door handle housing.
[0008] According to a first aspect of this application, the sensor module comprises a sensor module housing and a sensor chip, the sensor chip being disposed inside the sensor module housing; wherein the sensor module housing is disposed between the door handle cover and the door handle housing, and contacts the door handle cover, such that the sensor module housing can deform under the force applied by the door handle cover.
[0009] According to a first aspect of this application, the sensor chip is a stress sensor and the sensor module further includes an intermediate component; wherein the sensor chip contacts the sensor module housing through the intermediate component, thereby sensing the force on the sensor module housing; or the sensor chip contacts the sensor module housing, thereby sensing the force on the sensor module housing.
[0010] According to a first aspect of this application, the sensor chip is a displacement sensor or an optical sensor; wherein the sensor chip can sense the displacement caused by deformation of the sensor module housing.
[0011] According to a first aspect of this application, the sensor module further includes a circuit board, and the sensor chip is communicatively connected to the circuit board; wherein the circuit board may be sealed at a side end of the sensor module; or the circuit board may be sealed on the side facing the door handle housing.
[0012] According to a second aspect of this application, a vehicle is provided, characterized by including a handle assembly as described in the first aspect of this application. Attached Figure Description
[0013] The features and advantages of this application can be better understood by reading the following detailed description with reference to the accompanying drawings, in which the same reference numerals denote the same parts, wherein:
[0014] Figure 1A This is a schematic diagram of a vehicle having the handle assembly of this application;
[0015] Figure 1B This is a partial schematic diagram of a vehicle door having the handle assembly of this application;
[0016] Figure 2A is a three-dimensional exploded view of the handle assembly of this application;
[0017] Figure 2B is a simplified block diagram of the handle assembly of this application, showing a first embodiment of the sensor in the sensor module;
[0018] Figure 2C This is a simplified block diagram of the handle assembly of this application, illustrating a second embodiment of the sensor in the sensor module;
[0019] Figure 3A This is a simplified block diagram of the handle assembly of this application, illustrating a first embodiment of the sealing structure in the sensor module;
[0020] Figure 3B This is a simplified block diagram of the handle assembly of this application, illustrating a second embodiment of the sealing structure in the sensor module;
[0021] Figure 4A This is a simplified block diagram of the handle assembly of this application, showing the unpressed state of the first embodiment of the pressing structure;
[0022] Figure 4B This is a simplified block diagram of the handle assembly of this application, showing the pressed state of the first embodiment of the pressing structure;
[0023] Figure 5A This is a simplified block diagram of the handle assembly of this application, showing the unpressed state of a second embodiment of the pressing structure;
[0024] Figure 5B This is a simplified block diagram of the handle assembly of this application, showing the pressing state of a second embodiment of the pressing structure;
[0025] Figure 6A This is a simplified block diagram of the handle assembly of this application, showing the unpressed state of a third embodiment of the pressing structure;
[0026] Figure 6B This is a simplified block diagram of the handle assembly of this application, showing the pressing state of a third embodiment of the pressing structure. Detailed Implementation
[0027] It should be understood that although terms indicating direction, such as "front," "rear," "up," "down," "left," "right," etc., are used in this application to describe various example structural parts and elements of this application in a directional or orientational manner, their use herein is merely for illustrative purposes and is determined based on the example orientations shown in the accompanying drawings. Since the embodiments disclosed in this application can be arranged in different orientations, these terms indicating direction are for illustrative purposes only and should not be considered as limiting. In the following drawings, the same components use the same reference numerals.
[0028] Figure 1A-1B The installation environment of the handle component of this application is shown.
[0029] like Figure 1A-1B As shown, the vehicle 100 has a door 101, on which a handle assembly 102 is installed. The handle assembly 102 is installed in a handle cavity 104 on the door 101. When not in use, the handle assembly 102 can retract into the handle cavity 104, thus forming a hidden handle structure. Figure 1A As shown, in the retracted position, the outer side of the handle assembly 102 remains flush with the outer sheet metal of the door 101; as Figure 1B As shown, when the door needs to be opened, the handle assembly 102 is driven from the retracted position to the extended position, thereby allowing the user to pull the handle assembly 102 to open the door.
[0030] Figures 2A-2C show Figure 1A-1B The specific structure of the center handle assembly.
[0031] As shown in Figure 2A, the handle assembly 102 includes a door handle cover 202, a door handle housing 204, and a sensor module 210. The door handle cover 202 is disposed outside the door handle housing 204, and is floatingly mounted on the door handle housing 204, or deformable under pressure when mounted on the door handle housing 204. The door handle housing 204 has a housing cavity 206, in which the sensor module 210 is mounted and positioned between the door handle cover 202 and the door handle housing 204. The sensor module 210 includes an outer housing 211, an inner housing 212, a circuit board 216, and a circuit board connecting harness 232 (see Figures 2B-2C). The outer housing 211 and the inner housing 212 together form a housing cavity 218. The circuit board 216 is disposed in the housing cavity 218 between the outer housing 211 and the inner housing 212. The sensor module 210 also includes a sensor chip 214, which is disposed on the circuit board 216 and communicatively connected to it. In the assembled state, the outer housing 211 contacts the pressing protrusion 222 (see Figures 2B-2C) on the inner side of the door handle cover 202, so that the sensor module 210 can sense the pressing pressure applied to the door handle cover 202 and deform under the pressing pressure.
[0032] As shown in Figures 2B-2C, the door handle cover 202 has an inner side 224 facing the sensor module 210, and a pressing protrusion 222 is provided on the inner side 224. In the assembled state, the pressing protrusion 222 contacts the outer housing 211 of the sensor module, so that when the door handle cover 202 moves relative to the sensor module 210, the outer housing 211 of the sensor module can deform under the pressing pressure on the pressing protrusion 222. The sensor chip 214 is located at the position where the pressing protrusion 222 points downward in Figures 2B-2C, for example, directly opposite the pressing protrusion 222.
[0033] As shown in Figure 2B, the sensor chip 214 can be configured as a stress sensor, which contacts the outer housing 211 of the sensor module. Alternatively, the sensor module 210 may also include an intermediate component 225, through which the sensor chip 214 indirectly contacts the outer housing 211. The intermediate component 225 is made of an elastic material, such as a rubber pad, or other components capable of transmitting stress. The intermediate component 225 is pressed between the sensor chip 214 and the outer housing 211 of the sensor module, thereby ensuring that when the outer housing 211 of the sensor module is pressed, the pressure is transmitted to the sensor chip 214 through the elastic intermediate component 225. Whether the sensor chip 214 contacts the outer housing 211 of the sensor module or contacts the outer housing 211 of the sensor module through the intermediate component 225, the purpose is to enable the sensor chip 214 to sense the force or stress caused by the slight deformation of the outer housing 211 of the sensor module, thereby generating a corresponding pressure trigger signal and transmitting it to the circuit board 216. The circuit board 216 transmits the pressure trigger signal to the control system of the vehicle 100 through the circuit board connection harness 232, thereby controlling the handle to unfold or the door to unlock.
[0034] like Figure 2C As shown, the sensor chip 214 can also be configured as a displacement sensor or an optical sensor. A reflective device 226, such as reflective paper, is provided on the inner side of the outer housing 211 of the sensor module at a position corresponding to the pressing protrusion 222. The sensor chip 214 can emit infrared rays or other light beams towards the reflective device 226. By detecting changes in the displacement of the infrared rays or other light beams, the sensor chip 214 senses the minute deformation generated by the outer housing 211 of the sensor module, thereby generating a corresponding trigger signal. As those skilled in the art know, the sensor chip 214 can also be other types of sensors, as long as they can detect the minute deformation of the outer housing 211 of the sensor module caused by pressure.
[0035] Figures 3A-3B Different sealing structures for the sensor module are shown.
[0036] like Figures 3A-3B As shown, the sensor module 210 has high requirements for waterproof performance. However, due to the type of sensor chip 214 used, the entire sensor module 210 cannot be sealed with traditional potting compound. Therefore, a semi-encapsulated structure is adopted to encapsulate the circuit board 216 inside the sensor module 210. This ensures both the waterproof performance of the sensor module 210 and the ability of the sensor chip 214 to accurately detect the touch force applied by the user to the handle assembly.
[0037] like Figure 3AAs shown, circuit board 216 can be sealed at one of the left and right sides of sensor module 210. A hot melt adhesive partition 306 is provided inside sensor module 210, which divides sensor module 210 into inner and outer sections. Figure 3A (left side) and outside ( Figure 3A (Right side of the image). The circuit board 216 and the circuit board connecting harness 232 pass through the hot melt adhesive partition 306, and the circuit board 216 and the circuit board connecting harness 232 can be sealed on the outside of the hot melt adhesive partition 306 using hot melt adhesive 302.
[0038] like Figure 3B As shown, circuit board 216 can also be sealed on the entire outer surface of sensor module 210. Inside sensor module 210, circuit board mounting partitions 311 and 312 are provided for mounting and positioning circuit board 216. Circuit board mounting partitions 311 and 312 are not limited to... Figure 3B The form shown can also be other structures for mounting and positioning the circuit board 216. Specifically, in this embodiment, the inner housing 212 of the sensor module is... Figure 3B The circuit board 216 has a through-type structure in the vertical direction. After the circuit board 216 is installed and positioned, hot melt adhesive 302 is used to seal the underside of the circuit board 216.
[0039] Figure 4A-6B Three embodiments of the press-fit structure for the handle assembly are shown. Among them, Figures 4A-4B The first embodiment of the press-fit structure is shown; Figures 5A-5B A second embodiment of the press-fit structure is shown; Figures 6A-6B A third embodiment of the press-fit structure is shown.
[0040] like Figures 4A-4B As shown, the door handle cover 202 is fixedly mounted on the door handle housing 204. In the assembled state, the pressing protrusion 222 on the inner side of the door handle cover 202 contacts the outer housing 211 of the sensor module 210. Since the door handle cover 202 has a certain rigidity, when the user presses the door handle cover 202, the pressing force F0 needs to be large enough to deform the door handle cover 202, thereby causing the pressing protrusion 222 to move downward under the deformation, which in turn causes the outer housing 211 of the sensor module to deform accordingly or transmit the pressing force. The sensor chip 214 arranged inside the sensor module 210 can sense the deformation or pressing force, thereby triggering a release unlocking signal.
[0041] like Figures 5A-5BAs shown, the door handle cover 202 is floatingly mounted on the door handle housing 204. In the assembled state, the pressing protrusion 222 on the inner side of the door handle cover 202 contacts the outer housing 211 of the sensor module of the sensor module 210. The inner surface 502 of the door handle cover 202 does not directly contact the outer surface 504 of the door handle housing 204, thus forming a state in which the door handle cover 202 is suspended on the door handle housing 204. The door handle cover 202 has a snap-fit structure 512 on the side near the door handle housing 204, which is formed by bending inward from the side surface 511 of the door handle cover 202 (which may be all side surfaces surrounding the door handle cover 202). The door handle housing 204 has a corresponding snap-fit mating structure 514, which extends outward from the outer surface 504 of the door handle housing 204 and bends laterally (e.g., Figures 5A-5B It is formed by bending upwards and then to the right (as shown in the figure). The snap-fit structure 512 and the snap-fit mating structure 514 abut against each other, thereby limiting the movement range of the door handle cover 202 to the longitudinal direction shown in the figure, and also preventing the door handle cover 202 from detaching from the door handle housing 204. Since the door handle cover 202 can be positioned relative to the door handle housing 204... Figures 5A-5B The door handle cover 202 moves longitudinally, so it does not need to deform when pressed and can transmit the pressing force to the sensor module 210 through longitudinal movement.
[0042] like Figure 5A As shown, when not subjected to pressure, the door handle cover 202 is in a floating state relative to the door handle housing 204 and is located in an upper position. The snap-fit structure 512 and the snap-fit mating structure 514 abut against each other to prevent the door handle cover 202 from detaching from the door handle housing 204. Figure 5B As shown, when the door handle cover 202 is pressed by a pressure F, the door handle cover 202 slightly sinks relative to the door handle housing 204, so that the pressing protrusion 222 transmits the pressing pressure F to the upper surface 522 of the sensor module of the sensor module outer housing 211 of the sensor module 210. Since the sensor module 210 does not have very high structural strength requirements, its sensor module outer housing 211 uses a relatively soft material. Therefore, the softer outer shell material of the upper surface 522 of the sensor module will deform under the action of the pressing pressure F. The sensor chip 214 can detect this deformation and trigger a corresponding signal. In the process of triggering the sensor chip 214, since it is not necessary to deform the rigid door handle cover 202, it is only necessary to move the door handle cover 202 downward and deform the softer sensor module outer housing 211 by pressing the pressing protrusion 222. Therefore, a large pressing pressure F is not required to trigger the sensor chip 214.
[0043] and Figures 5A-5B The embodiments shown are similar, in Figures 6A-6B In the illustrated embodiment, the door handle cover 202 is floatingly mounted on the door handle housing 204. The difference lies in... Figures 6A-6B As shown, the door handle cover 202 adopts a semi-suspended structure. One end of the door handle cover 202 is mounted on the door handle housing 204 via a swing shaft 602, allowing the door handle cover 202 to be swingably positioned outside the door handle housing 204. The other end of the door handle cover 202, relative to the aforementioned end, employs the aforementioned snap-fit structure 512, and a corresponding snap-fit mating structure 514 is provided at the door handle housing 204. The snap-fit structure 512 and the snap-fit mating structure 514 abut against each other, limiting the swing range of the door handle cover 202. When pressed, the end of the door handle cover 202 with the snap-fit structure 512 swings downwards around the swing shaft 602. With this structure, the entire upper surface of the door handle cover 202 can be used as the pressing part, resulting in a large pressing range. Therefore, the sensor chip 214 can be positioned more flexibly on the circuit board 216, and the pressing protrusion 222 is also positioned accordingly based on the sensor chip 214.
[0044] like Figure 6A As shown, when not subjected to pressure, the door handle cover 202 is in a semi-floating state relative to the door handle housing 204 and is located in a swinging, upper position. The snap-fit structure 512 and the snap-fit mating structure 514 abut against each other to prevent the door handle cover 202 from detaching from the door handle housing 204. Figure 6B As shown, when the door handle cover 202 is pressed by a pressure F, the door handle cover 202 swings slightly downward relative to the door handle housing 204. This causes the pressing protrusion 222 to transmit the pressing force F to the upper surface 522 of the sensor module on the outer housing 211 of the sensor module 210, thereby deforming it. This deformation is then detected by the sensor chip 214, triggering a corresponding signal. During the triggering of the sensor chip 214, since it is not necessary to deform the rigid door handle cover 202, but only to swing it downward and deform the softer outer housing 211 of the sensor module by pressing the protrusion 222, a large pressing force F is not required to trigger the sensor chip 214.
[0045] The touch function of capacitive door handles is prone to malfunction or accidental triggering in rainy conditions. Therefore, to ensure the normal functioning of electric vehicles under various usage conditions, especially for door handles exposed on the exterior of the vehicle body, and to prevent touch malfunction or accidental triggering even in rainy or snowy weather, this application adopts a push-type door handle. The corresponding function of the door handle, such as opening or unlocking the door, can be triggered by a small touch force so that the user can open the door.
[0046] The handle assembly of this application can achieve at least the following beneficial technical effects:
[0047] First, the handle assembly of this application is equipped with a stress sensor or an optical sensor, and the sensor is triggered by applying a suitable tactile force to the door handle cover to realize the corresponding function of the handle assembly. This can avoid touch failure or false triggering caused by capacitor failure in harsh environments such as rain.
[0048] Secondly, the door handle cover of the handle assembly of this application is movable or floatingly disposed above the door handle housing. The sensor can be triggered by the displacement of the door handle cover instead of the surface deformation of the door handle cover. Therefore, it is not necessary to apply a large pressing force to the door handle cover to deform it, but only to press it to move it to trigger the sensor.
[0049] The examples of embodiments of this application described above are intended to be illustrative and not restrictive. Various changes may be made without departing from the spirit or scope of this application.
Claims
1. A handle assembly, characterized in that... include: Door handle cover; A door handle housing, wherein the door handle cover is movably or deformably disposed on the outside of the door handle housing; as well as The sensor module includes a sensor module housing and a sensor chip, wherein the sensor chip is disposed inside the sensor module housing; The sensor module housing is disposed between the door handle cover and the door handle housing, and contacts the door handle cover, so that the sensor module housing can deform under the force applied by the door handle cover.
2. The handle assembly as claimed in claim 1, characterized in that: The door handle cover has a pressing protrusion on the side facing the sensor module. The pressing protrusion contacts the sensor module so that when the door handle cover moves relative to the sensor module, the sensor module can sense the force applied to the pressing protrusion and deform accordingly.
3. The handle assembly as claimed in claim 2, characterized in that: The door handle cover is floatingly mounted on the outside of the door handle housing.
4. The handle assembly as claimed in claim 3, characterized in that: The door handle cover has a snap-fit structure on the side near the door handle housing, and the door handle housing has a snap-fit mating structure on the side facing the door handle cover. The snap-fit structure and the snap-fit mating structure abut against each other to limit the range of movement of the door handle cover relative to the door handle housing. When the door handle cover is not subjected to pressing force, the door handle cover is floatingly mounted on the door handle housing; when the door handle cover is subjected to pressing force, the door handle cover can move relative to the door handle housing.
5. The handle assembly as claimed in claim 3, characterized in that: One end of the door handle cover is mounted on the door handle housing via a swing shaft, so that the door handle cover can be swingably positioned outside the door handle housing; and The door handle cover is provided with a snap-fit structure on the other side opposite to the one side end, and the door handle housing is provided with a snap-fit mating structure on the side facing the door handle cover. The movement range of the door handle cover relative to the door handle housing is limited by the abutting cooperation between the snap-fit structure and the snap-fit mating structure. When the door handle cover is not subjected to pressing force, the door handle cover is floatingly mounted on the door handle housing; when the door handle cover is subjected to the pressing force, the door handle cover can move relative to the door handle housing.
6. The handle assembly as claimed in claim 1, characterized in that: The sensor chip is a stress sensor, and the sensor module also includes intermediate components; The sensor chip contacts the sensor module housing through the intermediate component, thereby sensing the force applied to the sensor module housing; or the sensor chip contacts the sensor module housing, thereby sensing the force applied to the sensor module housing.
7. The handle assembly as claimed in claim 1, characterized in that: The sensor chip is a displacement sensor or an optical sensor; The sensor chip can sense the displacement caused by the deformation of the sensor module housing.
8. The handle assembly as claimed in claim 1, characterized in that: The sensor module also includes a circuit board, and the sensor chip is communicatively connected to the circuit board; The circuit board may be sealed on the side of the sensor module; or the circuit board may be sealed on the side facing the door handle housing.
9. A vehicle, characterized in that... Includes the handle assembly as described in any one of claims 1-8.