Split laser sensor

Abstract

The application provides a split laser sensor, comprising a circuit board, a laser transmitter, a laser receiver, a light shield, two ends of the light shield being detachably connected with the laser transmitter and the laser receiver respectively, a bottom end of the light shield being detachably connected with the circuit board, the light shield being used for shielding a transmitting head of the laser transmitter and a receiving end of the laser receiver, a detection channel being formed on the light shield and being used for light transmission of the laser transmitter and the laser receiver, the laser transmitter and the laser receiver being connected with the circuit board, and the laser transmitter and the laser receiver being split. The laser sensor is split, the design purpose is to solve the limitation of the integrated laser sensor in some application scenarios, and the laser, the optical element, the driving circuit and other components are designed and installed separately, so that higher flexibility, maintainability and performance optimization are provided.

Description

Technical Field

[0001] This utility model relates to the field of sensor structure technology, specifically to a split-type laser sensor. Background Technology

[0002] An integrated laser sensor is a modular device that integrates a laser, optical components, and driving circuitry, and is widely used in laser processing, medical applications, communications, and measurement. While it offers advantages such as high integration and ease of use, it also has the following drawbacks:

[0003] 1. Difficulty in repair and maintenance: Modular design makes disassembly difficult: Due to its high integration, if a component fails, repair and replacement are difficult, potentially requiring the entire sensor to be replaced, increasing maintenance costs. High level of expertise required: Repair and maintenance require specialized technology and equipment, making it challenging.

[0004] 2. Poor flexibility: Customization is difficult: Integrated laser sensors are typically designed to be standardized, making customization to specific needs difficult and limiting their application range. Upgrades are difficult: Due to their high integration, upgrading or replacing a component is challenging and may require redesigning the entire sensor.

[0005] 3. Size and Weight: Larger Size: Despite its high integration, the integrated laser sensor remains relatively large and heavy due to its multiple components, making it unsuitable for use in portable devices. High Installation Space Requirements: In space-constrained applications, the installation and use of integrated laser sensors may be limited. Summary of the Invention

[0006] The purpose of this invention is to provide a split-type laser sensor to solve the technical problems mentioned in the background section.

[0007] To solve the above-mentioned technical problems, this utility model provides the following technical solution: a split-type laser sensor, comprising: a circuit board, a laser emitter, a laser receiver, and a light shield;

[0008] The two ends of the light shield are detachably connected to the laser emitter and the laser receiver, respectively; the bottom end of the light shield is detachably connected to the circuit board.

[0009] The light shield is used to shield the emitting head of the laser emitter and the receiving end of the laser receiver; a detection channel is formed on the light shield, and the detection channel is used for light transmission between the laser emitter and the laser receiver;

[0010] The laser emitter and the laser receiver are both connected to the circuit board, and the laser emitter and the laser receiver are separately configured.

[0011] Optionally, it also includes a heat dissipation ring, which is sleeved on the outer wall of the laser emitter head for heat dissipation of the laser emitter.

[0012] Optionally, heat dissipation fins are provided on the outer wall of the heat dissipation ring, and the heat dissipation ring is snapped onto the light shield.

[0013] Optionally, the laser emitter may further include an emitter mounting plate;

[0014] The laser emitter's emitting head is connected to the emitter mounting plate, and the emitting head is connected to the circuit board; the emitter mounting plate is snapped into the end of the light shield.

[0015] Optionally, the laser receiver may further include a receiver mounting plate;

[0016] The receiving end of the laser receiver is connected to the receiver fixing plate, and the receiving end is connected to the circuit board; the receiver fixing plate is snapped into the end of the light shield.

[0017] Optionally, a communicating air passage is formed at the location where the heat dissipation ring is engaged with the light shield.

[0018] Optionally, it also includes at least two circuit board pads; the circuit board pads are disposed on the circuit board, the laser emitter is soldered to the circuit board via one of the circuit board pads, and the laser receiver is soldered to the circuit board via the other circuit board pad.

[0019] Optionally, a cover plate is provided on the outside of both the laser emitter and the laser receiver, and the cover plate is snapped into the light shield.

[0020] Optionally, a notch is provided at the location where the cover plate is connected to the light shield, the notch being used to expose the edge of the cover plate.

[0021] This utility model has the following beneficial effects: This application provides a split-type laser sensor, including: a circuit board, a laser emitter, a laser receiver, and a light shield; both ends of the light shield are detachably connected to the laser emitter and the laser receiver, respectively; the bottom end of the light shield is detachably connected to the circuit board; the light shield is used to shield the emitting head of the laser emitter and the receiving end of the laser receiver; a detection channel is formed on the light shield, and the detection channel is used for light transmission between the laser emitter and the laser receiver; both the laser emitter and the laser receiver are connected to the circuit board, and the laser emitter and the laser receiver are separately arranged. This application, by separating the laser sensor, aims to overcome the limitations of integrated laser sensors in certain application scenarios. By designing and installing the laser, optical elements, driving circuit, and other components separately, it provides greater flexibility, maintainability, and performance optimization. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of a split-type laser sensor.

[0023] Figure 2 This is a cross-sectional structural diagram of a split-type laser sensor.

[0024] Figure 3 This is a schematic diagram of another cross-sectional structure of a split-type laser sensor.

[0025] Figure 4 This is a schematic diagram of a partial structure of a split-type laser sensor.

[0026] Figure 5 This is a schematic diagram of the light-shielding device.

[0027] Figure 6 This is a schematic diagram of a light shield equipped with a heat dissipation ring.

[0028] Figure 7 This is a schematic diagram of the heat dissipation ring.

[0029] In the diagram, 1. Circuit board; 2. Light shield; 3. Transmitter head; 4. Receiver end; 5. Detection channel; 6. Heat sink ring; 7. Heat sink fins; 8. Transmitter mounting plate; 9. Receiver mounting plate; 10. Air passage; 11. Cover plate; 12. Notch. Detailed Implementation

[0030] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0031] See Figures 1-7This application provides a split-type laser sensor, including: a circuit board 1, a laser emitter, a laser receiver, and a light shield 2; both ends of the light shield 2 are detachably connected to the laser emitter and the laser receiver, respectively; the bottom end of the light shield 2 is detachably connected to the circuit board 1; the light shield 2 is used to shield the emitting head 3 of the laser emitter and the receiving end 4 of the laser receiver; a detection channel 5 is formed on the light shield 2, and the detection channel 5 is used for light transmission between the laser emitter and the laser receiver; both the laser emitter and the laser receiver are connected to the circuit board 1, and the laser emitter and the laser receiver are separately arranged.

[0032] In this embodiment, the split-type laser sensor provided in this application can be applied to an alarm or detection alarm in a valve well. Specifically, it can be used to detect the content of hazardous gases, such as methane gas. Specifically, after the laser emitter emits a laser beam, the laser receiver receives the laser signal. After the laser beam propagates through gases of different concentrations, the refractive index of the laser beam received by the laser receiver will change. Then, the laser receiver is connected to a spectrometer, and the gas concentration in the current detection channel 5 can be determined using the spectrometer. This technology is a conventional technique in the field, and this application has not made any improvements to it. A spectrometer that can be directly purchased and equipped with a laser sensor can be used.

[0033] In this embodiment, to address the shortcomings of current integrated laser sensors, this application designs the laser emitter and laser receiver in the laser sensor as separate units. Both the laser emitter and the laser receiver are connected to the circuit board 1. Specifically, the laser emitter and the laser receiver are electrically and communicatively connected to the circuit board 1 for signal transmission and power supply. When the laser sensor needs to be turned on, the circuit board 1 sends an activation signal to the laser emitter, which then powers on and sends a laser beam to the laser receiver. After receiving the laser beam, the laser receiver feeds the signal back to the spectrometer through the circuit board 1, so that the spectrometer can analyze the laser beam signal to determine the gas concentration in the current detection channel 5. The split design of the laser emitter and receiver allows for independent replacement and repair of each component, reducing maintenance costs and complexity. Users can select and configure different lasers, optical components, and drive circuits according to specific needs, meeting diverse application requirements. The split design facilitates system upgrades, allowing for the upgrade of individual components without affecting others. Lasers and optical components can be installed separately to adapt to different spatial layouts and installation conditions. The split design allows for selective replacement and upgrades of components, avoiding the need to replace the entire system due to a single component failure, thus reducing long-term operating costs. Multiple systems can share certain high-cost components such as drive circuits and control systems, reducing overall costs. The split design facilitates redundant design, improving system reliability and security. A failure in one component will not directly affect other components, improving overall system reliability. Each component can be tested and verified independently, facilitating research and development and optimization. The split design also enables rapid iteration and improvement, shortening the development cycle.

[0034] In this embodiment, see Figure 5 As shown, through the integrated design of the light shield 2, during the assembly process, after inserting and snapping the laser emitter and laser receiver into the predetermined positions of the light shield 2, the bottom end of the light shield 2 is detached and connected to the circuit board 1. Specifically, mounting holes can be pre-set on the circuit board 1, and pins can be pre-set on the bottom of the light shield 2. Inserting the pins into the mounting holes completes the assembly of the two. Of course, the positions of the pre-set mounting holes on the circuit board 1 need to be planned in advance. After that, the laser emitter and laser receiver are soldered onto the circuit board 1 to complete the assembly of the entire split laser sensor.

[0035] Furthermore, the purpose of setting up the light shield 2 is to reduce the interference of external light sources on the laser emitter and laser receiver, and improve the detection accuracy. In addition, by setting up the light shield 2, the installation stability between the laser emitter and laser receiver and the circuit board 1 can be improved.

[0036] In one specific embodiment, it further includes a heat dissipation ring 6, which is sleeved on the outer wall of the laser emitter head 3 for heat dissipation of the laser emitter.

[0037] In this embodiment, as Figure 6 , Figure 7 As shown, the heat dissipation ring 6 is fitted on the outer wall of the laser emitter head 3 to conduct heat dissipation during the operation of the laser emitter, so as to avoid the laser emitter head 3 from overheating and shortening its service life.

[0038] In one specific implementation, such as Figure 7 As shown, heat dissipation fins 7 are provided on the outer wall of the heat dissipation ring 6, and the heat dissipation ring 6 is snapped onto the light shield 2. Adding heat dissipation fins 7 can further improve the heat dissipation capacity and effect of the heat dissipation ring 6.

[0039] In one specific implementation, such as Figure 3 , Figure 4 As shown, the laser emitter further includes an emitter mounting plate 8; the emitting head 3 of the laser emitter is connected to the emitter mounting plate 8, and the emitting head 3 is connected to the circuit board 1; the emitter mounting plate 8 is snapped into the end of the light shield 2. The laser receiver further includes a receiver mounting plate 9; the receiving end 4 of the laser receiver is connected to the receiver mounting plate 9, and the receiving end 4 is connected to the circuit board 1; the receiver mounting plate 9 is snapped into the end of the light shield 2.

[0040] In this embodiment, as Figure 3 As shown, mounting holes can be provided on the transmitter mounting plate 8, and a pin can be provided at the end of the light shield 2. Inserting the pin into the mounting hole allows for assembly. Similarly, mounting holes can be provided on the receiver mounting plate 9, and a pin can be provided at the end of the light shield 2. Inserting the pin into the mounting hole allows for assembly. The aforementioned design of the transmitter mounting plate 8 and receiver mounting plate 9 can further improve the connection stability between the laser transmitter and laser receiver and the circuit board 1. Furthermore, by having the light shield 2 engage with both the transmitter mounting plate 8 and the receiver mounting plate 9, the installation stability of the laser transmitter and laser receiver can be further improved.

[0041] In one specific embodiment, a communicating air passage 10 is formed at the position where the heat dissipation ring 6 is engaged with the light shield 2, for airflow to pass through.

[0042] In one specific embodiment, it further includes at least two circuit board 1 pads; the circuit board 1 pads are disposed on the circuit board 1, the laser emitter is soldered to the circuit board 1 via one of the circuit board 1 pads, and the laser receiver is soldered to the circuit board 1 via the other circuit board 1 pad.

[0043] In this embodiment, to further improve the connection stability between the laser transmitter and the laser receiver and the circuit board 1, solder pads are reserved on the circuit board 1 for soldering the transmitter mounting plate 8 of the laser transmitter and the receiver mounting plate 9 of the laser receiver, respectively. Of course, before soldering, the transmitter mounting plate 8 and the receiver mounting plate 9 need to be inserted into the corresponding slots on the circuit board 1, and then soldering can be performed.

[0044] In one specific embodiment, a cover plate 11 is provided on the outer side of both the laser emitter and the laser receiver, and the cover plate 11 is snapped into the light shield 2. The purpose of providing the cover plate 11 is to protect the outer surfaces of the laser emitter and the laser receiver from impact damage.

[0045] In this embodiment, to facilitate the installation of the cover plate 11, a buckle can be designed at the outer end of the light shield 2, such as... Figure 5 As shown, the cover plate 11 is provided with a slot that matches the buckle, so that the cover plate 11 can be engaged with the light shield 2.

[0046] In one specific implementation, such as Figure 1 As shown, a notch 12 is provided at the position where the cover plate 11 is connected to the light shield 2. The notch 12 is used to expose the edge of the cover plate 11. The design of the notch 12 facilitates the opening of the cover plate 11 for maintenance, repair, replacement, upgrade and other work on the laser emitter or laser receiver.

[0047] The purpose of this application for a split-type laser sensor is to address the limitations of integrated laser sensors in certain application scenarios. By designing and installing the laser, optical elements, driving circuit, and other components separately, it provides greater flexibility, maintainability, and performance optimization.

[0048] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0049] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A split-type laser sensor, characterized in that, include: Circuit board (1), laser emitter, laser receiver, and light shield (2); The two ends of the light shield (2) are detachably connected to the laser emitter and the laser receiver, respectively; the bottom end of the light shield (2) is detachably connected to the circuit board (1); The light shield (2) is used to shield the emitting head (3) of the laser emitter and the receiving end (4) of the laser receiver; a detection channel (5) is formed on the light shield (2), and the detection channel (5) is used for optical transmission between the laser emitter and the laser receiver; The laser emitter and the laser receiver are both connected to the circuit board (1), and the laser emitter and the laser receiver are separately configured.

2. The split-type laser sensor according to claim 1, characterized in that, Also includes: A heat dissipation ring (6) is sleeved on the outer wall of the laser emitter head (3) for heat dissipation of the laser emitter.

3. The split-type laser sensor according to claim 2, characterized in that, Heat dissipation fins (7) are provided on the outer wall of the heat dissipation ring (6), and the heat dissipation ring (6) is snapped onto the light shield (2).

4. The split-type laser sensor according to claim 1, characterized in that, The laser emitter also includes an emitter mounting plate (8); The laser emitter's emitter head (3) is connected to the emitter fixing plate (8), and the emitter head (3) is connected to the circuit board (1); the emitter fixing plate (8) is engaged with the end of the light shield (2).

5. The split-type laser sensor according to claim 1, characterized in that, The laser receiver also includes a receiver mounting plate (9); The receiving end (4) of the laser receiver is connected to the receiver fixing plate (9), and the receiving end (4) is connected to the circuit board (1); the receiver fixing plate (9) is snapped into the end of the light shield (2).

6. The split-type laser sensor according to claim 2, characterized in that, At the position where the heat dissipation ring (6) is engaged with the light shield (2), a communicating air passage (10) is formed.

7. The split-type laser sensor according to claim 1, characterized in that, It also includes at least two circuit board (1) pads; the circuit board (1) pads are disposed on the circuit board (1), the laser emitter is soldered to the circuit board (1) via one of the circuit board (1) pads, and the laser receiver is soldered to the circuit board (1) via the other circuit board (1) pad.

8. The split-type laser sensor according to claim 1, characterized in that, A cover plate (11) is provided on the outside of both the laser emitter and the laser receiver, and the cover plate (11) is snapped into the light shield (2).

9. The split-type laser sensor according to claim 1, characterized in that, A notch (12) is provided at the position where the cover plate (11) is connected to the light shield (2), and the notch (12) is used to expose the edge of the cover plate (11).

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