A redundant design control unit connection structure

Abstract

The utility model discloses a kind of redundancy design control unit connecting structure, including main controller ADCU, spare controller RCU, temperature sensor NTC, power MOS tube, main power supply, spare power supply, first relay, second relay, first crystal oscillator and second crystal oscillator;The PWM1 pin of main controller ADCU is connected with the G pin of power MOS tube MOS1, the AIN0 pin of main controller ADCU is connected to the ADC0 pin of temperature sensor NTC, the DOUT1 pin of main controller ADCU is connected to the CTRL1 pin of first relay RELAY1;The XTAL1_IN and XTAL1_OUT pin of main controller ADCU are connected first crystal oscillator XTAL1;The DOUT2 pin of spare controller RCU is connected with the CTRL2 pin of second relay RELAY2;The XTAL2_IN and XTAL2_OUT pin of spare controller RCU are connected to second crystal oscillator XTAL2, the ADC0 pin of temperature sensor NTC is connected to the AIN0 pin of main controller ADCU.The utility model effectively solves the problem of high-power consumption element overheating and single-point failure, suitable for high reliability scene such as industrial control, automotive electronics.

Description

Technical Field

[0001] This utility model relates to the field of controller technology, specifically to a redundant design control unit connection structure. Background Technology

[0002] Traditional PCB designs may suffer from signal interference issues, such as electromagnetic interference (EMI) or crosstalk. This could be due to excessively long traces, poor layout, or inadequate grounding. Additionally, impedance mismatch during high-speed signal processing can cause reflections, affecting signal quality. Power distribution is also a concern. Poor power plane design can lead to voltage drops or noise, impacting processor stability. Especially when processor power consumption is high, excessive resistance in the power path can cause insufficient power supply. Thermal management is another issue. Processors generate significant heat under high loads; inadequate cooling design, such as insufficient heatsinks or ventilation holes, can lead to overheating, affecting performance or lifespan.

[0003] For example, the design of the application with application number "202322001469.4" is prone to the problem of missing heat dissipation path and high power consumption components (such as power MOSFETs) not being far away from temperature-sensitive devices (such as crystal oscillators). This can easily lead to the power module having poor heat dissipation, with the junction temperature of the MOSFET reaching 150°C and the lifespan shortened to 1 / 10 of the design value.

[0004] Therefore, a redundant design control unit connection structure is needed to address this problem. Utility Model Content

[0005] The purpose of this invention is to provide a redundant control unit connection structure. Through architecture-level redundancy design, this invention effectively solves the problems of overheating of high-power components and single point of failure, and is suitable for high-reliability scenarios such as industrial control and automotive electronics.

[0006] This utility model is implemented as follows:

[0007] A redundant control unit connection structure includes a main controller (ADCU), a backup controller (RCU), a temperature sensor (NTC), a power MOSFET, a main power supply, a backup power supply, a first relay, a second relay, a first crystal oscillator, and a second crystal oscillator. The main controller (ADCU) is responsible for the core control logic. Its PWM1 pin is connected to the G pin of the power MOSFET (MOS1) to control the MOSFET's switching. Its AIN0 pin is connected to the ADC0 pin of the temperature sensor (NTC) to monitor temperature. Its DOUT1 pin is connected to the CTRL1 pin of the first relay (RELAY1) to control the main power supply path. Its XTAL1_IN and XTAL1_OUT pins are connected to the first crystal oscillator (XTAL1) to provide clock signals. The backup controller (RCU)'s DOUT2 pin is connected to the CTRL2 pin of the second relay (RELAY2) to control the backup power supply path. Its XTAL2_IN and XTAL2_OUT pins are connected to the second crystal oscillator (XTAL2) to provide independent clock signals. The temperature sensor (NTC)'s ADC0 pin is connected to the AIN0 pin of the main controller (ADCU) to transmit temperature data to the main controller.

[0008] Furthermore, the G pin of the power MOSFET is controlled by PWM1 of the main controller ADCU; the VCC pin of the power MOSFET is connected to the main power supply VCC_MAIN and the backup power supply VCC_RED via relays RELAY1 and RELAY2. The GND pin is connected to ground GND.

[0009] Furthermore, the main power supply VCC_MAIN and the backup power supply VCC_RED are connected to the common terminal of the relays RELAY1 and RELAY2 respectively via their COM terminals, and then connected to the VCC pin of the MOSFET via their NO terminals, thus switching the power path. The first relay RELAY1 is controlled by the DOUT1 of the main controller ADCU to switch the main power path, and the second relay RELAY2 is controlled by the DOUT2 of the main controller RCU to switch the backup power path. The first crystal oscillator is connected to the main controller ADCU, and the second crystal oscillator is connected to the backup controller RCU. The first crystal oscillator provides an independent clock signal to the main controller ADCU, and the second crystal oscillator provides an independent clock signal to the backup controller RCU, ensuring the clock independence of the redundant system.

[0010] Compared with existing technologies, the beneficial effects of this invention are: It improves system availability by switching the power path via relays, enhances system stability through clock redundancy design, and improves functional safety through a redundant control architecture. This invention, through relay switching, clock redundancy, and other design features, ensures stable system operation even in the event of a single point of failure, meeting the high reliability requirements of industrial control scenarios. It is highly practical. Attached Figure Description

[0011] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0012] Figure 1 This is a schematic diagram of the structure of this utility model. Detailed Implementation

[0013] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this utility model, not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model. Therefore, the following detailed description of the embodiments of this utility model provided in the accompanying drawings is not intended to limit the scope of the claimed utility model, but merely represents selected embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0014] Please see Figure 1A redundant control unit connection structure includes a main controller (ADCU), a backup controller (RCU), a temperature sensor (NTC), a power MOSFET, a main power supply, a backup power supply, a first relay, a second relay, a first crystal oscillator, and a second crystal oscillator. The main controller (ADCU) is responsible for the core control logic. Its PWM1 pin is connected to the G pin of the power MOSFET (MOS1) to control the MOSFET's switching. Its AIN0 pin is connected to the ADC0 pin of the temperature sensor (NTC) to monitor temperature. Its DOUT1 pin is connected to the CTRL1 pin of the first relay (RELAY1) to control the main power supply path. Its XTAL1_IN and XTAL1_OUT pins are connected to the first crystal oscillator (XTAL1) to provide clock signals. The backup controller (RCU)'s DOUT2 pin is connected to the CTRL2 pin of the second relay (RELAY2) to control the backup power supply path. Its XTAL2_IN and XTAL2_OUT pins are connected to the second crystal oscillator (XTAL2) to provide independent clock signals. The temperature sensor (NTC)'s ADC0 pin is connected to the AIN0 pin of the main controller (ADCU) to transmit temperature data to the main controller. The G pin of the power MOSFET is controlled by PWM1 of the main controller ADCU; the VCC pin of the power MOSFET is connected to the main power supply VCC_MAIN and the backup power supply VCC_RED through relays RELAY1 and RELAY2. The GND pin is connected to ground GND.

[0015] In this embodiment, the main power supply VCC_MAIN and the backup power supply VCC_RED are connected to the common terminal of the relays RELAY1 and RELAY2 respectively via their COM terminals, and then connected to the VCC pin of the MOSFET via their NO terminals, thus achieving power path switching. The first relay RELAY1 is controlled by the DOUT1 of the main controller ADCU to switch the main power path, and the second relay RELAY2 is controlled by the DOUT2 of the main controller RCU to switch the backup power path. The first crystal oscillator is connected to the main controller ADCU, and the second crystal oscillator is connected to the backup controller RCU. The first crystal oscillator provides an independent clock signal to the main controller ADCU, and the second crystal oscillator provides an independent clock signal to the backup controller RCU, ensuring the clock independence of the redundant system.

[0016] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A redundant design control unit connection structure, characterized in that: Includes main controller ADCU, backup controller RCU, temperature sensor NTC, power MOSFET, main power supply, backup power supply, first relay, second relay, first crystal oscillator and second crystal oscillator; The PWM1 pin of the main controller ADCU is connected to the G pin of the power MOSFET MOS1, the AIN0 pin of the main controller ADCU is connected to the ADC0 pin of the temperature sensor NTC, and the DOUT1 pin of the main controller ADCU is connected to the CTRL1 pin of the first relay RELAY1. The XTAL1_IN and XTAL1_OUT pins of the main controller ADCU are connected to the first crystal oscillator XTAL1. The DOUT2 pin of the standby controller RCU is connected to the CTRL2 pin of the second relay RELAY2; the XTAL2_IN and XTAL2_OUT pins of the standby controller RCU are connected to the second crystal oscillator XTAL2; and the ADC0 pin of the temperature sensor NTC is connected to the AIN0 pin of the main controller ADCU.

2. The redundant design control unit connection structure according to claim 1, characterized in that, The G pin of the power MOSFET is controlled by PWM1 of the main controller ADCU; The VCC pin of the power MOSFET is connected to the main power supply VCC_MAIN and the backup power supply VCC_RED via relays RELAY1 and RELAY2, and the GND pin is connected to the ground GND.

3. The redundant design control unit connection structure according to claim 1, characterized in that, The main power supply VCC_MAIN and the backup power supply VCC_RED are connected to the common terminal of the relays RELAY1 and RELAY2 respectively through the COM terminal, and then connected to the VCC pin of the MOSFET through the NO terminal.

4. The redundant design control unit connection structure according to claim 1, characterized in that, The first relay RELAY1 is controlled by DOUT1 of the main controller ADCU to switch the main power supply path, and the second relay RELAY2 is controlled by DOUT2 of the main controller RCU to switch the backup power supply path.

5. The redundant design control unit connection structure according to claim 1, characterized in that, The first crystal oscillator is connected to the main controller ADCU, and the second crystal oscillator is connected to the backup controller RCU. The first crystal oscillator provides an independent clock signal to the main controller ADCU, and the second crystal oscillator provides an independent clock signal to the backup controller RCU.

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