A PCB structure optimizing non-through-hole impedance

By reducing the diameter of the mechanical hole pads in the non-through holes of the PCB substrate, the impedance of the non-through holes is optimized, which solves the problem of poor impedance optimization effect in traditional methods and improves the transmission quality of high-speed signals.

CN224329628UActive Publication Date: 2026-06-05EMDOOR ELECTRONICS TECH
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
EMDOOR ELECTRONICS TECH
Filing Date
2025-04-24
Publication Date
2026-06-05

AI Technical Summary

Technical Problem

Traditional methods for optimizing the impedance of blind and buried vias are not effective in high-density PCB designs, especially for blind and buried vias composed of mechanical holes with large pads. It is difficult to effectively optimize the impedance, which affects the transmission quality of high-speed signals.

Method used

By reducing the diameter of the mechanical hole pads in the non-through holes of the PCB substrate to 0.85D~0.95D, the impedance of the non-through holes is optimized to be close to the characteristic impedance of differential signals, thereby reducing impedance discontinuities and improving signal transmission quality.

Benefits of technology

It effectively reduces signal reflection and impedance discontinuities, thus improving the transmission quality of high-speed signals.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN224329628U_ABST
    Figure CN224329628U_ABST
Patent Text Reader

Abstract

The utility model discloses a kind of PCB structure of optimizing non-through hole impedance, by the mechanical hole pad diameter is reduced from original design value D to 0.85D~0.95D, the impedance of non-through hole is adjusted to close to the differential signal characteristic impedance on PCB board, reduce the deviation degree between differential signal characteristic impedance and the impedance of non-through hole, thereby reduce impedance discontinuity point, reduce the amplitude of signal reflection, so as to be able to improve the transmission quality of high-speed signal.
Need to check novelty before this filing date? Find Prior Art