Cooling plate and power module assembly

Abstract

The utility model discloses a kind of cooling plates, comprising: main body, including upper surface and lower surface, upper surface is equipped with first cooling chamber;First opening, in first cooling chamber, first opening is used for cooling liquid to flow into first cooling chamber, or first opening is used for cooling liquid to flow out cooling plate;Second opening, second opening is used for cooling liquid to flow out first cooling chamber, or second opening is used for cooling liquid to flow into first cooling chamber;Cooling plate is made of extruded aluminum profile.The utility model can effectively reduce cost.The utility model further provides a kind of power module assembly, including above-mentioned cooling plate.

Description

Technical Field

[0001] This utility model relates to the field of power electronics technology, and in particular to a cooling plate and power module assembly. Background Technology

[0002] With the rapid development of new energy technologies, the increasing demands on power electronic devices for high voltage, high current, high power, and small size have rendered the performance of single power electronic devices insufficient. Therefore, numerous electronic devices such as diodes and IGBTs (Insulated-Gate Bipolar Transistors) are connected in series and parallel on a substrate to form power modules. These power modules are then connected to a PCB (Printed Circuit Board) to achieve functions such as energy conversion, power amplification, and circuit protection.

[0003] Power modules generate a significant amount of heat during operation, necessitating cooling systems. Currently, cooling plates for power modules are typically made from die-cast aluminum or injection molded. However, both processes involve costly molds. Furthermore, die-cast parts may contain internal defects such as porosity, affecting the mechanical properties and durability of the cooling plate, while injection-molded parts may experience internal stress, leading to product deformation or performance degradation. Utility Model Content

[0004] The purpose of this invention is to solve the problem of high component and mold costs for cooling plates in current power modules. This invention provides a cooling plate and power module assembly that effectively addresses the issue of high component and mold costs for cooling plates in current power modules.

[0005] To solve the above-mentioned technical problems, an embodiment of this utility model discloses a cooling plate, comprising:

[0006] The main body includes an upper surface and a lower surface, wherein the upper surface is provided with a first cooling chamber;

[0007] A first opening is provided in the first cooling chamber. The first opening is used to allow coolant to flow into the first cooling chamber, or the first opening is used to allow the coolant to flow out of the cooling plate.

[0008] The second opening is used to allow the coolant to flow out of the first cooling chamber, or the second opening is used to allow the coolant to flow into the first cooling chamber;

[0009] The cooling plate is made of extruded aluminum profile.

[0010] By adopting the above technical solution, a first cooling chamber is provided in the main body of the cooling plate, and a first opening and a second opening are provided in the first cooling chamber to allow coolant to flow in and out of the first cooling chamber. Therefore, when the cooling plate is connected to other electronic devices (such as power modules), the coolant flowing into the first cooling chamber can cool the electronic devices, thereby reducing the heat of the electronic devices. The structure is simple and effective.

[0011] Furthermore, the cost of the molds used in the extrusion process to manufacture the cooling plate is lower than that of the die-casting and injection molding processes. Therefore, the cooling plate of this embodiment is less expensive than cooling plates made using die-casting or injection molding. In addition, during the extrusion process, the material is subjected to uniform stretching and pressure, resulting in fewer internal defects. Moreover, since extruded products typically have a continuous fibrous structure, stress concentration is relatively low. Thus, cooling plates made from extruded aluminum profiles have better mechanical properties than those made using die-casting or injection molding.

[0012] According to a specific embodiment of the present invention, the first cooling chamber has a first end and a second end along the length direction;

[0013] The first opening is located at the first end of the first cooling chamber, and the second opening is located at the second end of the first cooling chamber.

[0014] According to a specific embodiment of the present invention, it further includes:

[0015] An extension body is located on one side of the main body along the width direction, and the main body is connected to the extension body. A second cooling chamber is provided inside the extension body, and the second cooling chamber communicates with the first cooling chamber.

[0016] The second opening is located in the second cooling chamber;

[0017] The width direction is perpendicular to the length direction.

[0018] By adopting the above technical solution, by setting an extension on one side of the main body and setting a second cooling chamber in the extension, the cooling plate can have a larger cooling area and can cool more electronic devices at the same time.

[0019] According to a specific embodiment of the present invention, the second cooling chamber includes:

[0020] Multiple flow channels are spaced apart along the width direction, each of the multiple flow channels extends along the length direction, each of the multiple flow channels communicates with the first cooling chamber, and each of the multiple flow channels includes:

[0021] At the first end, along the length direction, the first end and the first opening of each of the plurality of flow channels are respectively located on different sides of the cooling plate;

[0022] Secondly, along the length direction, the second end of each of the plurality of flow channels is located on the same side of the cooling plate as the first opening.

[0023] According to a specific embodiment of the present invention, the second cooling chamber further includes:

[0024] A first connecting portion, along its length, is located on different sides of the cooling plate, and the first connecting portion is connected to the first cooling chamber and the first end of each of the plurality of flow channels;

[0025] The second connecting portion, along its length, has the plurality of flow channels located between the first connecting portion and the second connecting portion, the second connecting portion being connected to the second end of each of the plurality of flow channels, and the second opening being provided in the second connecting portion.

[0026] According to a specific embodiment of the present invention, the dimension of the first connecting portion along the length direction is a first dimension;

[0027] The first dimension increases along the width direction away from the body.

[0028] By employing the above technical solution, the dimension of the first connecting portion increases gradually along its length away from the main body. Consequently, the volume of the first connecting portion increases the further away from the main body along its width, and correspondingly, the larger the volume, the lower the pressure. Since liquid flows from areas of high pressure to areas of low pressure, the coolant tends to flow away from the main body along its width. This effectively prevents a large amount of coolant from flowing into the flow channels closer to the main body along its width, resulting in less coolant flowing into the flow channels further away from the main body. Therefore, the cooling plate of this embodiment can approximately balance the flow rate of coolant flowing into the flow channels further away from the main body along its width with the flow rate flowing into the flow channels closer to the main body along its width, thus making the cooling effect of the cooling plate on the electronic device more even and preventing excessively high local temperatures in the electronic device.

[0029] According to a specific embodiment of the present invention, the second cooling chamber further includes:

[0030] A first connecting portion, along its length, is located on different sides of the cooling plate, and the first connecting portion is connected to the first cooling chamber and the first end of a portion of the plurality of flow channels;

[0031] The second connecting portion, along the length direction, is located on the same side of the cooling plate as the first opening. The second connecting portion is connected to the second end of each of the plurality of flow channels.

[0032] The second opening is located on the side of another portion of the plurality of flow channels away from the second connecting portion, and the second opening is connected to the first end of the other portion of the plurality of flow channels.

[0033] According to a specific embodiment of the present invention, it further includes:

[0034] A sealing groove is provided around the first cooling chamber, and the sealing groove is used to place a sealing ring.

[0035] By adopting the above technical solution, a sealing groove is provided on the outside of the first cooling chamber for placing a sealing ring. Thus, when the main body of the cooling plate is connected to the electronic device, the sealing ring can effectively prevent the coolant from leaking from the gap between the main body and the electronic device.

[0036] A specific embodiment of this utility model also discloses a power module assembly, including:

[0037] Power module;

[0038] A heat sink includes an upper surface and a lower surface. The power module is disposed on the upper surface of the heat sink, and the lower surface of the heat sink is provided with a plurality of heat dissipation fins.

[0039] As described in any of the above specific embodiments, the heat dissipation plate is located between the power module and the cooling plate, and the first cooling chamber accommodates the plurality of heat dissipation fins.

[0040] The above technical solution involves placing a heat sink at the bottom of the power module and connecting it to a cooling plate. The heat sink fins are located within the first cooling chamber of the cooling plate. When the power module is operating, heat is conducted to the heat sink fins, and coolant flows into the first cooling chamber to cool the fins, thus cooling the power module. Furthermore, since the cooling plate is made of extruded aluminum profiles, the cost of the extrusion mold is lower than that of die-casting or injection molding. Therefore, the cooling plate of this embodiment is cheaper than cooling plates made using die-casting or injection molding. Additionally, during the extrusion process, the material is subjected to uniform stretching and pressure, resulting in fewer internal defects. Moreover, since extruded products typically have a continuous fibrous structure, stress concentration is relatively low. Therefore, cooling plates made of extruded aluminum profiles have better mechanical properties than those made using die-casting or injection molding.

[0041] According to a specific embodiment of the present invention, it further includes:

[0042] A sealing ring is disposed in the sealing groove of the cooling plate, and the sealing ring abuts against the sealing groove and the lower surface of the heat sink plate.

[0043] By adopting the above technical solution, a sealing ring is set in the sealing groove of the cooling plate, and the sealing ring abuts against the sealing groove and the lower surface of the heat sink, which can effectively prevent coolant from leaking from the gap between the cooling plate and the heat sink.

[0044] According to a specific embodiment of the present invention, it further includes:

[0045] A capacitor is disposed on the lower surface of the main body of the cooling plate along the thickness direction, the thickness direction being perpendicular to the width and length directions.

[0046] By adopting the above technical solution, a capacitor is set on the lower surface of the main body of the cooling plate, so that the coolant can cool the power module and the capacitor at the same time when flowing through the first cooling chamber, thereby improving the cooling efficiency.

[0047] According to a specific embodiment of the present invention, it further includes:

[0048] A capacitor is disposed on the surface of the extension of the cooling plate along the thickness direction, and the capacitor and the power module are located on the same side of the cooling plate along the thickness direction.

[0049] By adopting the above technical solution, a capacitor is set on the upper surface of the extension of the cooling plate, so that the coolant can cool the power module when flowing through the first cooling chamber, and can cool the capacitor when flowing through the second cooling chamber, thereby improving the cooling efficiency. Attached Figure Description

[0050] Figure 1 A perspective view of a power module assembly according to an embodiment of the present invention is shown.

[0051] Figure 2 This is a side sectional view of the power module, heat sink, and cooling plate in the power module assembly of an embodiment of the present invention.

[0052] Figure 3 This is a perspective view of the cooling plate in the power module assembly of an embodiment of the present invention.

[0053] Figure 4 This is a top view of the cooling plate in the power module assembly of an embodiment of the present invention.

[0054] Figure 5 This diagram illustrates the fabrication process of the cooling plate in the power module assembly according to an embodiment of the present invention.

[0055] Figure 6 A perspective view of a power module assembly according to another embodiment of the present invention is shown.

[0056] Figure 7 This is a top view of a cooling plate in a power module assembly according to another embodiment of the present invention.

[0057] Figure 8 This diagram shows the internal structure of the cooling plate in a power module assembly according to another embodiment of the present invention.

[0058] Figure 9 This diagram shows the internal structure of the cooling plate in a power module assembly according to another embodiment of the present invention.

[0059] Explanation of icon numbers:

[0060] 10. Power module assembly;

[0061] 100. Cooling plate;

[0062] 110. Main body; 1101. Upper surface of the main body; 1102. Lower surface of the main body; 111. First cooling chamber; 112. First opening; 113. Second opening; 114. First end of the first cooling chamber; 115. Second end of the first cooling chamber; 116. Main body connecting part.

[0063] 120. Extension body; 1201. Upper surface of extension body; 121. Second cooling chamber; 122. Flow channel; 1221. First end of flow channel; 1222. Second end of flow channel; 1223. Flow channel wall; 123. First connecting part; 124. Second connecting part;

[0064] 130. Sealing groove;

[0065] 200. Heat sink, 201. Upper surface of heat sink, 202. Lower surface of heat sink, 210. Heat sink fins;

[0066] 300. Power module;

[0067] 400. Capacitor;

[0068] 500. First baffle; 600. Second baffle;

[0069] 700. Sealing ring;

[0070] 800. Extruded aluminum profile; 801. Through hole; 8011. Short channel; 8012. Short channel; 802. Side wall. Detailed Implementation

[0071] The following specific embodiments illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. Although the description of this utility model will be presented in conjunction with preferred embodiments, this does not mean that the features of this utility model are limited to this embodiment. On the contrary, the purpose of describing the utility model in conjunction with the embodiments is to cover other options or modifications that may be derived based on the claims of this utility model. To provide a deep understanding of this utility model, many specific details will be included in the following description. This utility model may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of this utility model, some specific details will be omitted in the description. It should be noted that, without conflict, the embodiments and features in the embodiments of this utility model can be combined with each other.

[0072] It should be noted that in this specification, similar reference numerals and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0073] In the description of this embodiment, it should be noted that the terms "upper", "lower", "inner", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the utility model product is usually placed in during use. They are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the utility model.

[0074] The terms “first”, “second”, etc., are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0075] In the description of this embodiment, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set up," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this embodiment based on the specific circumstances.

[0076] To make the objectives, technical solutions, and advantages of this utility model clearer, the embodiments of this utility model will be described in further detail below with reference to the accompanying drawings.

[0077] refer to Figure 1 This application discloses a power module assembly 10, which includes a cooling plate 100, a heat sink 200, three power modules 300, and a capacitor 400. The number of power modules 300 is not specifically limited in this application and can be adjusted according to actual needs. For example, in some possible implementations, the number of power modules 300 in the power module assembly 10 can be one, two, four, or five, etc.

[0078] To facilitate a detailed description of the specific structure of the power module assembly 10, the length direction X, width direction Y, and thickness direction Z of the power module assembly 10 are defined here. The length direction X, width direction Y, and thickness direction Z are perpendicular to each other. It should be noted that "perpendicular" can mean absolutely perpendicular, i.e., the angle between the length direction X, width direction Y, and thickness direction Z is 90°, but it is not limited to this. In other possible embodiments, "perpendicular" can also be approximately perpendicular, for example, the angle between the length direction X, width direction Y, and thickness direction Z is 89°, 89.6°, 90.5°, or 91°, etc.

[0079] Continue to refer to Figure 1 and combined Figure 2 In this embodiment, the power module assembly 10 is a stacked structure. Specifically, along the thickness direction Z, three power modules 300, a heat sink 200, a cooling plate 100, and a capacitor 400 are arranged sequentially. In other words, along the thickness direction Z, the heat sink 200 is located between the cooling plate 100 and the three power modules 300, and the cooling plate 100 is located between the heat sink 200 and the capacitor 400.

[0080] Specifically, along the thickness direction Z, the heat sink 200 has an upper surface 201 and a lower surface 202. Three power modules 300 are all fixed to the upper surface 201 of the heat sink 200, and the three power modules 300 are spaced apart from each other along the length direction X. The lower surface 202 of the heat sink 200 is provided with multiple heat dissipation fins 210. Along the thickness direction Z, the multiple heat dissipation fins 210 extend in a direction away from the heat sink 200.

[0081] For example, the cooling plate 100 includes a body 110. Along the thickness direction Z, the body 110 has an upper surface 1101 and a lower surface 1102. The upper surface 1101 of the body 110 is provided with a first cooling chamber 111. Specifically, the first cooling chamber 111 is a recess in the upper surface 1101, and the first cooling chamber 111 is exposed on the upper surface 1101. The capacitor 400 is fixed to the lower surface 1102 of the body 110.

[0082] refer to Figure 2 and combined Figure 1 The upper surface 1101 of the main body 110 is in contact with the lower surface 202 of the heat sink 200 so that the lower surface 202 of the heat sink 200 and the first cooling chamber 111 form a closed chamber, and the multiple heat sink fins 210 of the heat sink 200 are accommodated in the first cooling chamber 111.

[0083] refer to Figure 3 and Figure 4 For example, the first cooling chamber 111 has a first end 114 and a second end 115. Specifically, the first end 114 and the second end 115 of the first cooling chamber 111 are located on opposite sides of the first cooling chamber 111 along the length direction X. The first cooling chamber 111 is provided with a first opening 112 and a second opening 113, wherein the first opening 112 is located at the first end 114 of the first cooling chamber 111, and the second opening 113 is located at the second end 115 of the first cooling chamber 111. And along the thickness direction Z, both the first opening 112 and the second opening 113 are located at the bottom of the first cooling chamber 111 and penetrate the body 110 of the cooling plate 100.

[0084] The first opening 112 allows coolant (such as cooling water or other fluids capable of effective heat dissipation) to flow into the first cooling chamber 111, while the second opening 113 allows coolant to flow out of the first cooling chamber 111. Along the length direction X, multiple heat dissipation fins 210 are located between the first opening 112 and the second opening 113, so that after the coolant flows into the first cooling chamber 111 through the first opening 112, it flows past the heat dissipation fins 210 and then out of the first cooling chamber 111 through the second opening 113, thus carrying away the heat from the heat dissipation fins 210 and achieving cooling of the heat dissipation fins 210, thereby cooling the power module 300.

[0085] In other possible implementations, the second opening 113 may be for the coolant to flow into the first cooling chamber 111, and the first opening 112 may be for the coolant flowing through the heat dissipation fins 210 to flow out of the first cooling chamber 111.

[0086] It should be noted that the specific locations of the first opening 112 and the second opening 113 are not specifically limited in the embodiments of this application. For example, in some possible implementations, the first opening 112 is located on the side wall of the first cooling chamber 111, and the second opening 113 is located on the side wall of the first cooling chamber 111. Alternatively, one of the first opening 112 and the second opening 113 may be located on the side wall of the first cooling chamber 111, and the other may be located at the bottom of the first cooling chamber 111.

[0087] Since the capacitor 400 is fixed to the lower surface 1102 of the main body 110 of the cooling plate 100, the coolant can simultaneously carry away the heat of the capacitor 400 when flowing in the first cooling chamber 111. In other words, the cooling plate 100 of this embodiment can simultaneously cool the power module 300 and the capacitor 400, achieving high cooling efficiency.

[0088] For example, the capacitor 400 in this embodiment is a film capacitor, but this embodiment does not impose any special restrictions on the specific type of capacitor 400. In other possible implementations, the capacitor 400 may also be a ceramic capacitor or other types of capacitor.

[0089] refer to Figure 3 and Figure 4 A sealing groove 130 is formed on the upper surface 1101 of the main body 110, and the sealing groove 130 surrounds the first cooling chamber 111. A sealing ring 700 is provided in the sealing groove 130. The sealing ring 700 abuts against the sealing groove 130 and the lower surface 202 of the heat sink 200 to seal the first cooling chamber 111. The sealing ring 700 can effectively prevent coolant from leaking from the gap between the upper surface 1101 of the main body 110 and the lower surface 202 of the heat sink 200.

[0090] refer to Figure 5 and combined Figures 1 to 4 In this embodiment, the cooling plate 100 is made of extruded aluminum profile 800.

[0091] The aluminum extrusion process mainly involves applying pressure to aluminum billets using extrusion equipment, forcing them through a die of a specific shape to obtain aluminum material with the desired cross-sectional shape and size. This process has advantages such as high production efficiency, good product precision, and high material utilization. Specifically, in this embodiment, the aluminum billet is first processed into an extruded aluminum profile 800 using the aluminum extrusion process. The extruded aluminum profile 800 is plate-shaped, and seven through holes 801 are formed inside the extruded aluminum profile 800. Each through hole 801 extends along the length direction X and penetrates through the extruded aluminum profile 800. The seven through holes 801 are spaced apart from each other along the width direction Y. It should be noted that this embodiment does not impose a special limitation on the number of through holes 801 inside the extruded aluminum profile 800, and can be adaptively adjusted according to actual needs.

[0092] Next, a first cooling chamber 111 and a sealing groove 130 are formed by cutting the upper surface 810 of the extruded aluminum profile 800 using a cutting tool such as a milling cutter. A first opening 112 and a second opening 113 are also formed within the first cooling chamber 111 by cutting, to form the main body 110 of the cooling plate 100. During this process, the wall of the middle portion of the seven through holes 801 is cut along the length direction X, meaning that the middle portion of the seven through holes 801 becomes part of the first cooling chamber 111. Furthermore, along the length direction X, the remaining portions on both sides of the seven through holes 801 (i.e., the portions whose hole walls are not cut) form short channels 8011 and 8012. Short channels 8011 and 8012 are located on opposite sides of the first cooling chamber 111 along the length direction X.

[0093] Finally, along the length direction X, a first baffle 500 and a second baffle 600 are respectively provided on opposite sides of the main body 110 to block the end of the short channel 8011 away from the first cooling chamber 111 along the length direction X and the end of the short channel 8012 away from the first cooling chamber 111 along the length direction X, thereby preventing coolant from flowing out of the main body 110 through the short channel 8011 or the short channel 8012, thus preventing coolant leakage. Thus, the cooling plate 100 is completed.

[0094] The cooling plate 100 in this embodiment is made of extruded aluminum profile 800. Since the cost of the mold for the extrusion process is lower than that of the die casting and injection molding processes, the cost of the cooling plate 100 in this embodiment is lower than that of the cooling plate made of die-cast aluminum or injection molding.

[0095] Furthermore, during the extrusion process, the material is subjected to uniform stretching and pressure, resulting in fewer internal defects. Also, because extruded products typically have a continuous fibrous structure, stress concentration is relatively low. Therefore, the cooling plate 100 made from extruded aluminum profile 800 exhibits better mechanical properties compared to cooling plates made from die-cast aluminum or injection molded materials.

[0096] It should be noted that in some possible embodiments, the cooling plate 100 does not have a first baffle 500 and a second baffle 600. Instead, the short channel 8012 serves as the first opening of the first cooling chamber 111, and the short channel 8011 serves as the second opening of the first cooling chamber 111. That is, the first opening 112 is located on the side wall of the first cooling chamber 111, and the second opening 113 is located on the side wall of the first cooling chamber 111. Alternatively, one of the first opening 112 and the second opening 113 may be located on the side wall of the first cooling chamber 111, and the other may be located at the bottom of the first cooling chamber 111.

[0097] refer to Figure 6 , Figure 6 A perspective view of the power module assembly 10 in another possible implementation is shown. Figure 6 The power module assembly 10 shown is Figure 1 and Figure 2 The difference in the power module assembly 10 shown is that, Figure 6 The power module assembly 10 shown has a flat structure. That is, along the thickness direction Z, the capacitor 400 and the heat sink 200 are located on the same side of the cooling plate 100.

[0098] Specifically, refer to Figure 7 and combined Figure 6 The cooling plate 100 in this embodiment further includes an extension 120, which is located on one side of the main body 110 along the width direction Y, and the main body 110 is connected to the extension 120. A second cooling chamber 121 is formed inside the extension 120. Figure 8 (As shown), the second cooling chamber 121 is connected to the first cooling chamber 111. The capacitor 400 is fixed to the upper surface 1201 of the extension 120.

[0099] refer to Figure 7 The main body 110 and the extension 120 are integrally formed. For example, along the width direction Y, the portion above the dashed line a is the extension 120, and the portion below the dashed line a is the main body 110. However, this is not a limitation; in other possible embodiments, the main body 110 and the extension 120 may also be two different components connected together by assembly or other means.

[0100] For example, refer to Figure 8 , Figure 8 for Figure 6 and Figure 7A schematic diagram of the internal structure of the cooling plate 100 is shown in this embodiment. A first opening 112 is located at the first end 114 of the first cooling chamber 111, and a second opening 113 is located inside the second cooling chamber 121. Thus, coolant flows into the first cooling chamber 111 through the first opening 112 and cools the heat dissipation fins 210 located within the first cooling chamber 111. Figure 2 (As shown) Cooling is performed to cool the power module 300, and then the coolant flows from the first cooling chamber 111 into the second cooling chamber 121 to cool the capacitor 400 located on the upper surface 1201 of the extension 120. Finally, the coolant flows out of the cooling plate 100 from the second opening 113.

[0101] In other possible implementations, coolant may flow into the second cooling chamber 121 through the second opening 113 to cool the capacitor 400 located on the upper surface 1201 of the extension 120, and then coolant may flow from the second cooling chamber 121 into the first cooling chamber to cool the heat dissipation fins 210 located in the first cooling chamber 111. Figure 2 (As shown) the cooling process is performed to cool the power module 300, and finally the coolant flows out of the cooling plate 100 from the first opening 112.

[0102] Continue to refer to Figure 8 and combined Figure 6 and Figure 7 The second cooling chamber 121 includes eight flow channels 122, a first connecting portion 123, and a second connecting portion 124. The number of flow channels 122 within the second cooling chamber 121 is not specifically limited in this embodiment and can be adaptively adjusted according to the actual needs of the product. For example, in other possible implementations, the number of flow channels 122 within the second cooling chamber 121 can be seven, nine, or ten, etc.

[0103] Continue to refer to Figure 8 Specifically, the second cooling chamber 121 is further provided with a first sidewall 1202, a second sidewall 1203, and seven flow channel walls 1223. Along the width direction Y, the seven flow channel walls 1223 are located between the first sidewall 1202 and the second sidewall 1203. The seven flow channel walls 1223 are spaced apart along the width direction Y, and each flow channel wall 1223 extends along the length direction X. Along the width direction Y, any two adjacent flow channel walls 1223 define a flow channel 122. Furthermore, along the width direction Y, the flow channel wall 1223a near the first sidewall 1202 defines a flow channel 122 with the first sidewall 1202, and the flow channel wall 1223b near the second sidewall 1203 defines a flow channel 122 with the second sidewall 1203.

[0104] For example, eight flow channels 122 are spaced apart along the width direction Y, and each flow channel 122 extends along the length direction X. Along the length direction X, the eight flow channels 122 are located between the first connecting portion 123 and the second connecting portion 124. A second opening 113 is provided within the second connecting portion 124, and the second opening 113 penetrates the bottom of the extension body 120 along the thickness direction Z. That is, in this embodiment, the first opening 112 and the second opening 113 are located on the same side of the cooling plate 100 along the length direction X. It should be noted that in some other possible embodiments, the second opening 113 may also be provided on the first baffle 500.

[0105] For example, along the length direction X, the main body 110 has a main body connecting portion 116 on the side away from the first opening 112. Along the width direction Y, the main body connecting portion 116 is opposite to the first connecting portion 123, and the main body connecting portion 116 and the first connecting portion 123 are connected by a short channel 8011.

[0106] Continue to refer to Figure 8 Each of the eight flow channels 122 is connected to the first cooling chamber 111 through the first connecting part 123 and the main body connecting part 116.

[0107] Specifically, each of the eight flow channels 122 includes a first end 1221 and a second end 1222. Along the length direction X, the first end 1221 of each flow channel 122 and the first opening 112 are located on different sides of the cooling plate 100. Along the length direction X, the second end 1222 of each flow channel 122 and the first opening 112 are located on the same side of the cooling plate 100. That is, along the length direction X, the first end 1221 of each flow channel 122 is close to and communicates with the first connecting portion 123. The second end 1222 of each flow channel 122 is close to and communicates with the second connecting portion 124.

[0108] refer to Figure 8 and combined Figure 7 During operation, the power module assembly 10 receives coolant flowing from the first opening 112 into the first cooling chamber 111, thereby cooling the heat dissipation fins 210 located within the first cooling chamber 111. Figure 2 (As shown) Cooling is performed to cool the power module 300, and then the coolant flows sequentially through the short channel 8011, the main body connecting portion 116, the first connecting portion 123 and the eight flow channels 122 to cool the capacitor 400. Finally, the coolant flows from the eight flow channels 122 into the second connecting portion 124 and flows out of the cooling plate 100 from the second opening 113.

[0109] In other possible embodiments, the coolant may flow into the second cooling chamber 121 through the second opening 113 and through eight flow channels 122 to cool the capacitor 400. Then, the coolant flows sequentially through the first connecting portion 123, the main connecting portion 116, and the short channel 8011, and flows into the first cooling chamber 111 to cool the heat dissipation fins 210 located within the first cooling chamber 111. Figure 2 (As shown) Cooling is performed to cool the power module 300, and finally the coolant flows out of the cooling plate 100 from the first opening 112.

[0110] Continue to refer to Figure 8 and combined Figure 5 In this embodiment, both the main body 110 and the extension 120 are made of the same extruded aluminum profile 800. Since the extruded aluminum profile 800 itself has a through hole 801, it is only necessary to cut the sidewall 802 of the extruded aluminum profile 800 along the length direction X away from the first opening 112 in the portion corresponding to the main body 110 to form the main body connecting portion 116 and the short channel 8011. Furthermore, the first cooling chamber 111 and the main body connecting portion 116 are connected through the short channel 8011.

[0111] Accordingly, by cutting the sidewalls 802 on both sides of the extruded aluminum profile 800 along the length direction X at the portion corresponding to the extension 120, the first connecting portion 123 and the second connecting portion 124 can be formed. After cutting, the through hole 801 forms the flow channel 122. Finally, a second baffle 600 is provided on the side of the extruded aluminum profile 800 away from the second connecting portion 124 along the length direction X, and a first baffle 500 is provided on the side of the extruded aluminum profile 800 away from the first connecting portion 123 along the length direction X, thus completing the processing of the cooling plate 100.

[0112] For example, in this embodiment of the application, during the processing of the first connecting portion 123, the sidewall 802 of the extruded aluminum profile 800 is obliquely cut, so that the dimension L of the first connecting portion 123 along the length direction X (i.e., the distance from the line b connecting the first ends 1221 of the eight flow channels 122 to the second baffle 600, also called the first dimension) increases in the width direction Y away from the main body 110. Thus, the volume of the first connecting portion 123 increases in the width direction Y away from the main body 110. The larger the volume of the first connecting portion 123, the lower the internal pressure. Therefore, when coolant flows into the first connecting portion 123 from the main body connecting portion 116, since liquid tends to flow from areas of high pressure to areas of low pressure, the coolant tends to flow in the width direction Y away from the main body 110. This effectively prevents a large amount of coolant from flowing into the flow channels 122 along the width direction Y near the main body 110, resulting in less coolant flowing into the flow channels 122 along the width direction Y away from the main body 110.

[0113] Therefore, by adopting the above technical solution, the flow rate of the coolant flowing in the flow channel 122 away from the main body 110 along the width direction Y can be roughly balanced with the flow rate of the coolant flowing in the flow channel 122 close to the main body 110 along the width direction Y, so that the cooling effect of the cooling plate 100 on the capacitor 400 is more balanced and the local temperature of the capacitor 400 is avoided from being too high.

[0114] In another possible implementation, refer to Figure 9 In this embodiment of the application, along the length direction X, the first opening 112 is provided at the first end 114 of the first cooling chamber 111, and the second opening 113 is provided in the second cooling chamber 121, and the first opening 112 and the second opening 113 are located on different sides of the cooling plate 100.

[0115] Specifically, along the length direction X, the first connecting portion 123 and the first opening 112 are located on different sides of the cooling plate 100. Along the length direction X, the first connecting portion 123 communicates with the first cooling chamber 111 and the first ends 1221a of four of the eight flow channels 122a. Along the length direction X, the second connecting portion 124 and the first opening 112 are located on the same side of the cooling plate 100. The second connecting portion 124 communicates with the second ends 1222 of each of the eight flow channels 122 (i.e., the second ends 1222a and 1222b of flow channels 122a and 1222b, respectively). The second opening 113 is located on the side of four of the eight flow channels 122b away from the second connecting portion 124, and communicates with the first ends 1221b of the four flow channels 122b. Exemplarily, the second opening 113 is located at the bottom of the second cooling chamber 121 and extends through the extension 120 along the thickness direction Z. However, in other possible implementations, the second opening 113 may also be provided on the second baffle 600.

[0116] Along the width direction Y, four flow channels 122a are located between four flow channels 122b and the main body 110. And along the length direction X, the flow direction of the coolant in the flow channels 122a is opposite to the flow direction of the coolant in the flow channels 122b.

[0117] In this embodiment, coolant flows into the first cooling chamber 111 through the first opening 112, and cools the heat dissipation fins 210 located in the first cooling chamber 111. Figure 2(As shown) Cooling is performed to cool the power module 300. Then, the coolant enters the four flow channels 122a from the first cooling chamber 111 through the short channel 8011, the main body connecting part 116, and the first connecting part 123, and flows into the second connecting part 124. Then, it flows from the second connecting part 124 into the four flow channels 122b to cool the capacitor 400. Finally, the coolant flows from the four flow channels 122b into the second opening 113 and flows out of the second cooling chamber 121 through the second opening 113.

[0118] In another possible implementation, the coolant flows into the second cooling chamber 121 through the second opening 113, and sequentially flows through four flow channels 122b, the second connecting portion 124, the four flow channels 122a, and the first connecting portion 123 to cool the capacitor 400. Then, the coolant flows from the first connecting portion 123 through the main connecting portion 116 and the short channel 8011 into the first cooling chamber 111 to cool the heat dissipation fins 210 located within the first cooling chamber 111, thereby cooling the power module 300. Finally, the coolant flows out of the first cooling chamber 111 through the first opening 112.

[0119] Continue to refer to Figure 9 and combined Figure 5 For example, in this embodiment of the application, during the processing of the first connecting portion 123, only the portion of the sidewall 802 of the extruded aluminum profile 800 located between the dashed lines a and c is cut to form the first connecting portion 123. As a result, the flow channel wall 1223b located above the dashed line c along the width direction Y will obstruct the coolant flowing within the first connecting portion 123, causing the coolant to flow along the length direction Y away from the first connecting portion 123 through the flow channel 122a and into the second connecting portion 124.

[0120] Since the cooling plate 100 of this application is manufactured by cutting an extruded aluminum profile 800, the liquid inlet and outlet of the cooling plate 100 in this embodiment are set flexibly and can be adapted to the actual needs of the product. For example, in Figure 8 In the cooling plate 100 shown, the first opening 112 and the second opening 113 are located on the same side of the cooling plate 100 along the length direction X. Figure 9 In the cooling plate 100 shown, the first opening 112 and the second opening 113 are located on different sides of the cooling plate 100 along the length direction X.

[0121] Although the present invention has been illustrated and described with reference to certain preferred embodiments, those skilled in the art should understand that the above description is a further detailed explanation of the present invention in conjunction with specific embodiments, and should not be construed as limiting the specific implementation of the present invention to these descriptions. Those skilled in the art can make various changes in form and detail, including some simple deductions or substitutions, without departing from the spirit and scope of the present invention.

Claims

1. A cooling plate, characterized in that, include: The main body includes an upper surface and a lower surface, wherein the upper surface is provided with a first cooling chamber; A first opening is provided in the first cooling chamber. The first opening is used to allow coolant to flow into the first cooling chamber, or the first opening is used to allow the coolant to flow out of the cooling plate. The second opening is used to allow the coolant to flow out of the first cooling chamber, or the second opening is used to allow the coolant to flow into the first cooling chamber; The cooling plate is made of extruded aluminum profile.

2. The cooling plate as described in claim 1, characterized in that, Along its length, the first cooling chamber has a first end and a second end; The first opening is located at the first end of the first cooling chamber, and the second opening is located at the second end of the first cooling chamber.

3. The cooling plate as described in claim 1, characterized in that, Also includes: An extension body is located on one side of the main body along the width direction, and the main body is connected to the extension body. A second cooling chamber is provided inside the extension body, and the second cooling chamber communicates with the first cooling chamber. The second opening is located in the second cooling chamber; The width direction is perpendicular to the length direction.

4. The cooling plate as described in claim 3, characterized in that, The second cooling chamber includes: Multiple flow channels are spaced apart along the width direction, each of the multiple flow channels extends along the length direction, each of the multiple flow channels communicates with the first cooling chamber, and each of the multiple flow channels includes: At the first end, along the length direction, the first end and the first opening of each of the plurality of flow channels are respectively located on different sides of the cooling plate; Secondly, along the length direction, the second end of each of the plurality of flow channels is located on the same side of the cooling plate as the first opening.

5. The cooling plate as described in claim 4, characterized in that, The second cooling chamber also includes: A first connecting portion, along its length, is located on different sides of the cooling plate, and the first connecting portion is connected to the first cooling chamber and the first end of each of the plurality of flow channels; The second connecting portion, along its length, has the plurality of flow channels located between the first connecting portion and the second connecting portion, the second connecting portion being connected to the second end of each of the plurality of flow channels, and the second opening being provided in the second connecting portion.

6. The cooling plate as described in claim 5, characterized in that, The dimension of the first connecting portion along the length direction is a first dimension; The first dimension increases along the width direction away from the body.

7. The cooling plate as described in claim 4, characterized in that, The second cooling chamber also includes: A first connecting portion, along its length, is located on different sides of the cooling plate, and the first connecting portion is connected to the first cooling chamber and the first end of a portion of the plurality of flow channels; The second connecting portion, along the length direction, is located on the same side of the cooling plate as the first opening. The second connecting portion is connected to the second end of each of the plurality of flow channels. The second opening is located on the side of another portion of the plurality of flow channels away from the second connecting portion, and the second opening is connected to the first end of the other portion of the plurality of flow channels.

8. The cooling plate as described in any one of claims 1-7, characterized in that, Also includes: A sealing groove is provided around the first cooling chamber, and the sealing groove is used to place a sealing ring.

9. A power module assembly, characterized in that, include: Power module; A heat sink includes an upper surface and a lower surface. The power module is disposed on the upper surface of the heat sink, and the lower surface of the heat sink is provided with a plurality of heat dissipation fins. The cooling plate as described in any one of claims 1-8, wherein the heat dissipation plate is located between the power module and the cooling plate, and the first cooling chamber accommodates the plurality of heat dissipation fins.

10. The power module assembly as claimed in claim 9, characterized in that, Also includes: A sealing ring is disposed in the sealing groove of the cooling plate, and the sealing ring abuts against the sealing groove and the lower surface of the heat sink plate.

11. The power module assembly as claimed in claim 9 or 10, characterized in that, Also includes: A capacitor is disposed on the lower surface of the main body of the cooling plate along the thickness direction, the thickness direction being perpendicular to the width and length directions.

12. The power module assembly as claimed in claim 9 or 10, characterized in that, Also includes: A capacitor is disposed on the surface of the extension of the cooling plate along the thickness direction, and the capacitor and the power module are located on the same side of the cooling plate along the thickness direction.

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