Wafer film pasting tension control device
By working in concert with the tension control components and the feeding and receiving components, multi-level precise tension adjustment and full-process automation are achieved during the wafer lamination process. This solves the problems of low tension adjustment accuracy and poor coordination in existing technologies, and improves lamination quality and efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUZHOU ASEN SEMICON CO LTD
- Filing Date
- 2025-07-19
- Publication Date
- 2026-06-05
AI Technical Summary
Existing wafer lamination equipment has poor coordination with tension adjustment, lamination, cutting, and material collection processes, resulting in low adjustment accuracy and difficulty in adapting to films of different thicknesses and materials, leading to unstable lamination quality.
The tension control component includes a combination of a tension telescopic rod, a tension pump, and a control frame. The tension telescopic rod drives the tension support to slide, and the tension pump drives the control frame to rise and fall, thereby achieving multi-level precise adjustment of the membrane tension. Through the coordinated work of the material output and collection components, the entire process of membrane output, film application, cutting, and collection is automated.
It achieves tension stability of membrane materials of different thicknesses and materials during the film application process, improves the quality and efficiency of film application, and ensures the stability and accuracy of the membrane material during the film application process.
Smart Images
Figure CN224329871U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor technology, specifically to a wafer bonding tension control device. Background Technology
[0002] In wafer manufacturing, film application is a crucial step in protecting the wafer surface and preventing scratches or contamination during processing. Tension control during film application directly affects the quality of the application. If the tension is too low, air bubbles may form between the film and the wafer surface, resulting in poor adhesion. If the tension is too high, the wafer or film may be stretched and deformed, affecting the accuracy of subsequent processing.
[0003] A search revealed existing technology (application number: CN202323422386.9), which describes "a material tension control device." This utility model features low cost and good usability, offering both low operating costs and high efficiency, thus improving the device's usability.
[0004] However, while existing technologies offer low cost and high usability, resulting in better usability, they still have some shortcomings: traditional devices have poor coordination between tension adjustment and processes such as film application, cutting, and material collection; the actions of various components are not coordinated, further affecting the efficiency and quality of film application; most devices use a single mechanical structure to adjust tension, resulting in low adjustment precision and difficulty in accurately adapting to film materials of different thicknesses and materials, which easily leads to tension fluctuations and unstable film application quality. Utility Model Content
[0005] The purpose of this invention is to address the shortcomings of existing technologies by proposing a wafer bonding tension control device.
[0006] To achieve the above objectives, the present invention adopts the following technical solution: a wafer lamination tension control device, comprising: a lamination assembly, disposed on the ground; a discharge assembly, rotatably connected to the lamination assembly; a tension control assembly, fixedly connected to the lamination assembly; and a receiving assembly, disposed on the lamination assembly; wherein the tension control assembly comprises: a tension telescopic rod, one end of which is fixedly connected to the lamination assembly; a tension guide rod, one end of which is fixedly connected to the lamination assembly; and a tension bracket, fixedly connected to the other end of the tension telescopic rod and slidably connected to the other end of the tension guide rod.
[0007] As a further description of the above technical solution:
[0008] The tension control assembly further includes: a tension pump mounted on a tension bracket; a control frame fixedly connected to the output end of the tension pump; a control shaft rotatably connected to the control frame; a control roller mounted on the control shaft; a tension shaft rotatably connected to the tension bracket; and a tension roller mounted on the tension shaft.
[0009] As a further description of the above technical solution:
[0010] The film application assembly includes: a housing, which is set on the ground; a base, which is set on the housing; a cutting assembly, which is fixedly connected to the housing; and a compaction assembly, which is fixedly connected to the housing.
[0011] As a further description of the above technical solution:
[0012] The cutting assembly includes: a cutting bracket mounted on the housing; a first motor fixedly connected to the cutting bracket; a cutting telescopic rod, one end of which is fixedly connected to the output end of the first motor; a rotating rod fixedly connected to the other end of the cutting telescopic rod; and a cutting needle mounted on the rotating rod.
[0013] As a further description of the above technical solution:
[0014] The compaction assembly includes: a second motor mounted on the housing; a ball screw, one end of which is fixedly connected to the output end of the second motor, and the other end of which is rotatably connected to the housing; a clamping guide rod mounted on the housing; a clamping bracket, one end of which is threadedly connected to the ball screw, and the other end of which is slidably connected to the clamping guide rod; a clamping pump mounted on the clamping bracket; a clamping frame fixedly connected to the output end of the clamping pump; a clamping shaft rotatably connected to the clamping frame; and a clamping roller mounted on the clamping shaft.
[0015] As a further description of the above technical solution:
[0016] The discharge assembly includes: a discharge shaft, rotatably connected to the outer casing; and a discharge roller, disposed on the discharge shaft.
[0017] As a further description of the above technical solution:
[0018] The receiving assembly includes: a third motor, fixedly connected to the housing; a receiving shaft, fixedly connected to the output end of the third motor and rotatably connected to the housing; and a receiving roller, disposed on the receiving shaft.
[0019] This utility model has the following beneficial effects:
[0020] The tension control component drives the tension bracket to slide along the tension guide rod via the tension telescopic rod. Combined with the tension pump driving the control frame to rise and fall, the control roller and tension roller can simultaneously adjust the wrap angle and pressure of the film material, ensuring that the tension of film materials of different thicknesses and materials is stable during the film application process. The material output component, material collection component and film application component work together, and the third motor drives the material collection roller to synchronously collect waste materials, realizing full automation of the film material output, film application, cutting and material collection process. Attached Figure Description
[0021] Figure 1 This is a front view of a wafer bonding tension control device proposed in this utility model;
[0022] Figure 2 This is a schematic diagram of the cutting assembly of a wafer bonding tension control device proposed in this utility model;
[0023] Figure 3 This is a schematic diagram of the compaction component of a wafer bonding tension control device proposed in this utility model;
[0024] Figure 4 This is a schematic diagram of the tension control component of a wafer bonding tension control device proposed in this utility model;
[0025] Legend:
[0026] 1. Film application assembly; 11. Housing; 12. Base; 13. Cutting assembly; 131. First motor; 132. Cutting bracket; 133. Cutting telescopic rod; 134. Rotating rod; 135. Cutting needle; 14. Compacting assembly; 141. Second motor; 142. Ball screw; 143. Pressing guide rod; 144. Pressing bracket; 145. Pressing pump; 146. Pressing frame; 147. Pressing shaft; 148. Pressing roller; 2. Discharge assembly; 21. Discharge shaft; 22. Discharge roller; 3. Tension control assembly; 31. Tension telescopic rod; 32. Tension guide rod; 33. Tension bracket; 34. Tension pump; 35. Control frame; 36. Control shaft; 37. Control roller; 38. Tension shaft; 39. Tension roller; 4. Receiving assembly; 41. Third motor; 42. Receiving shaft; 43. Receiving roller. Detailed Implementation
[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0028] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The utility model will be further described in detail below with reference to the accompanying drawings.
[0029] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0030] Example 1:
[0031] like Figures 1 to 4 As shown, this embodiment provides a wafer lamination tension control device, comprising: a lamination assembly 1, disposed on the ground; a material discharging assembly 2, rotatably connected to the lamination assembly 1; a tension control assembly 3, fixedly connected to the lamination assembly 1; and a material receiving assembly 4, disposed on the lamination assembly 1. The tension control assembly 3 includes: a tension telescopic rod 31, one end of which is fixedly connected to the lamination assembly 1; a tension guide rod 32, one end of which is fixedly connected to the lamination assembly 1; and a tension bracket 33, fixedly connected to the other end of the tension telescopic rod 31 and slidably connected to the other end of the tension guide rod 32.
[0032] In this embodiment, the tension control component and the compaction component constitute a wafer bonding tension control device according to this application.
[0033] It should also be noted that the discharge shaft 21 drives the discharge roller 22 to rotate and output the membrane material, and the tension telescopic rod 31 extends and retracts to drive the tension bracket 33 to slide along the tension guide rod 32 to adjust the membrane material tension, thereby achieving stable output of the membrane material and initial tension adjustment.
[0034] Specifically, the tension control assembly 3 also includes: a tension pump 34, which is mounted on the tension bracket 33; a control frame 35, which is fixedly connected to the output end of the tension pump 34; a control shaft 36, which is rotatably connected to the control frame 35; a control roller 37, which is mounted on the control shaft 36; a tension shaft 38, which is rotatably connected to the tension bracket 33; and a tension roller 39, which is mounted on the tension shaft 38.
[0035] In this embodiment, the tension pump 34 drives the control frame 35 to rise and fall, causing the control roller 37 to move closer to or further away from the tension roller 39, changing the wrap angle of the membrane material. Combined with the position of the tension bracket 33, the tension is precisely controlled, achieving multi-level precise adjustment of the membrane material tension and ensuring stable tension during the film application process.
[0036] Specifically, the film application assembly 1 includes: a housing 11, which is set on the ground; a base 12, which is set on the housing 11; a cutting assembly 13, which is fixedly connected to the housing 11; and a compaction assembly 14, which is fixedly connected to the housing 11.
[0037] In this embodiment, the base 12 supports the wafer, and the cutting component 13 and the compaction component 14 respectively complete the film cutting and compaction functions, providing a working platform and core functional components for wafer film application.
[0038] Specifically, the cutting assembly 13 includes: a cutting bracket 132, which is mounted on the housing 11; a first motor 131, which is fixedly connected to the cutting bracket 132; a cutting telescopic rod 133, one end of which is fixedly connected to the output end of the first motor 131; a rotating rod 134, which is fixedly connected to the other end of the cutting telescopic rod 133; and a cutting needle 135, which is mounted on the rotating rod 134.
[0039] In this embodiment, the first motor 131 drives the cutting telescopic rod 133 to rotate, and the telescopic rod 133 extends and retracts to adjust the position of the cutting needle 135, thereby realizing the cutting of the membrane material and achieving precise cutting of the membrane material.
[0040] Specifically, the compaction assembly 14 includes: a second motor 141, mounted on the housing 11; a ball screw 142, one end of which is fixedly connected to the output end of the second motor 141, and the other end is rotatably connected to the housing 11; a clamping guide rod 143, mounted on the housing 11; a clamping bracket 144, one end of which is threadedly connected to the ball screw 142, and the other end is slidably connected to the clamping guide rod 143; a clamping pump 145, mounted on the clamping bracket 144; a clamping frame 146, fixedly connected to the output end of the clamping pump 145; a clamping shaft 147, rotatably connected to the clamping frame 146; and a clamping roller 148, mounted on the clamping shaft 147.
[0041] With this configuration, the second motor 141 drives the ball screw 142 to rotate, which in turn drives the clamping bracket 144 to move horizontally along the clamping guide rod 143. The clamping pump 145 drives the clamping frame 146 to rise and fall, so that the clamping roller 148 applies pressure to the film material, thereby achieving a tight fit between the film material and the wafer and ensuring the quality of film application.
[0042] Specifically, the discharge assembly 2 includes: a discharge shaft 21, which is rotatably connected to the housing 11; and a discharge roller 22, which is disposed on the discharge shaft 21.
[0043] The discharge shaft 21 drives the discharge roller 22 to rotate, outputting the film material to the film application area, thereby achieving stable output of the film material and providing raw materials for film application.
[0044] Specifically, the receiving assembly 4 includes: a third motor 41, which is fixedly connected to the housing 11; a receiving shaft 42, which is fixedly connected to the output end of the third motor 41 and rotatably connected to the housing 11; and a receiving roller 43, which is disposed on the receiving shaft 42.
[0045] In this embodiment, the third motor 41 drives the receiving shaft 42 to rotate the receiving roller 43, thereby recovering the waste material after film application, realizing automatic waste material recovery and keeping the working area clean.
[0046] In actual use, the operating principle is as follows: The operator first places the material on the discharge assembly 2, stretches the material through the gap between the control roller 37 and the tension roller 39, through the gap between the pressing roller 148 and the base 12, and wraps it around the receiving assembly 4. The third motor 41 is turned on to start the equipment. The wafer is placed on the base 12 and the second motor 141 is turned on to drive the ball screw 142 to rotate, so that the pressing bracket 144 moves parallel to the ball screw 142 and the pressing guide rod 143. The pressing pump 145 is turned on and the pressing frame 146 presses down on the wafer. The pressing shaft 147 rotates to drive the pressing roller 148 to press the film firmly onto the wafer. The upward rotation retracts the compaction component 14 to its original position. The cutting component 13 is activated, causing the cutting telescopic rod 133 to extend and insert the cutting needle 135 into the base 12. The first motor 131 drives the rotating rod 134 to rotate the cutting needle 135 around the cutting telescopic rod 133. After cutting the film, the material is returned to its original position. The finished material is removed, and the remaining material is rotated by the take-up shaft 42 and rolled onto the take-up roller 43. The tension pump 34 is activated, causing the control frame 35 to drive the control shaft 36 and control roller 37 to move downward together with the tension roller 39 to clamp the film. The extension and retraction of the tension telescopic rod 31 drives the tension bracket 33 to move up and down along the tension guide rod 32 to change the film tension.
[0047] It should be noted that all electrical components mentioned in this article are connected to an external main controller and 220V AC mains power. The main controller can be a conventional known device that can be controlled by a computer or other means. The detailed description of known functions and known components is omitted in the specific implementation of this disclosure. In order to ensure the compatibility of the device, the operating methods used are consistent with the parameters of commercially available instruments.
[0048] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A wafer bonding tension control device, characterized in that: include: A film application assembly (1) is installed on the ground; The material discharging component (2) is rotatably connected to the film application component (1); Tension control component (3) is fixedly connected to film application component (1); The receiving component (4) is mounted on the film application component (1); The tension control component (3) includes: Tension telescopic rod (31), one end of which is fixedly connected to the film application assembly (1); Tension guide rod (32), one end of which is fixedly connected to the film application assembly (1); The tension bracket (33) is fixedly connected to the other end of the tension telescopic rod (31) and slidably connected to the other end of the tension guide rod (32).
2. The wafer bonding tension control device according to claim 1, characterized in that: The tension control component (3) also includes: Tension pump (34) is mounted on tension bracket (33); The control box (35) is fixedly connected to the output end of the tension pump (34); The control shaft (36) is rotatably connected to the control frame (35); The control roller (37) is mounted on the control shaft (36); Tension shaft (38) is rotatably connected to tension bracket (33); Tension roller (39) is mounted on tension shaft (38).
3. The wafer bonding tension control device according to claim 2, characterized in that: The film-applying assembly (1) includes: The outer casing (11) is set on the ground; The base (12) is mounted on the outer casing (11); The cutting component (13) is fixedly connected to the outer casing (11); The compaction component (14) is fixedly connected to the outer shell (11).
4. The wafer bonding tension control device according to claim 3, characterized in that: The cutting assembly (13) includes: A cutting bracket (132) is mounted on the outer casing (11); The first motor (131) is fixedly connected to the cutting bracket (132); The cutting telescopic rod (133) is fixedly connected at one end to the output end of the first motor (131); The rotating rod (134) is fixedly connected to the other end of the cutting telescopic rod (133); The cutting needle (135) is mounted on the rotating rod (134).
5. The wafer bonding tension control device according to claim 4, characterized in that: The compaction component (14) includes: The second motor (141) is mounted on the housing (11); The ball screw (142) is fixedly connected at one end to the output end of the second motor (141), and rotatably connected at the other end to the housing (11); The guide rod (143) is pressed and is mounted on the outer casing (11); The clamping bracket (144) is threaded to a ball screw (142) at one end and slidably connected to a clamping guide rod (143) at the other end. A clamping pump (145) is mounted on a clamping bracket (144); The clamping frame (146) is fixedly connected to the output end of the clamping pump (145); The clamping shaft (147) is rotatably connected to the clamping frame (146); A pressure roller (148) is mounted on a pressure shaft (147).
6. The wafer bonding tension control device according to claim 5, characterized in that: The discharge assembly (2) includes: The discharge shaft (21) is rotatably connected to the outer casing (11); The discharge roller (22) is set on the discharge shaft (21).
7. The wafer bonding tension control device according to claim 6, characterized in that: The receiving assembly (4) includes: The third motor (41) is fixedly connected to the outer casing (11); The receiving shaft (42) is fixedly connected to the output end of the third motor (41) and rotatably connected to the outer casing (11); The receiving roller (43) is set on the receiving shaft (42).