An ultrasonic endoscope and an ultrasonic probe therefor
By introducing a heat-conducting structure into the ultrasound probe, combining the probe housing, heat-conducting components, and heat-conducting elements, the problem of excessive probe temperature rise is solved, achieving effective heat dissipation and preventing core damage and patient burns.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SONOSCAPE MEDICAL CORP
- Filing Date
- 2025-06-04
- Publication Date
- 2026-06-09
AI Technical Summary
Ultrasound endoscope probes are prone to overheating during prolonged use, which can lead to core damage and burns to patients.
An ultrasonic probe structure was designed, including a probe housing, an ultrasonic transducer, a first heat-conducting component, a heat-conducting component, and a second heat-conducting component. The heat generated by the ultrasonic transducer layer is transferred to the first heat-conducting component through the heat-conducting component, and then transferred to the second heat-conducting component through the first heat-conducting component. Finally, the heat is dissipated through the probe housing, thus achieving effective heat dissipation.
This effectively prevents the probe from overheating, avoiding damage to the core and burns to the patient, thus ensuring the safety and reliability of the equipment.
Smart Images
Figure CN224330963U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of medical device technology, and more specifically, to an ultrasound endoscope and its ultrasound probe. Background Technology
[0002] Endoscopic ultrasound (EUS) is an electronic endoscope with both diagnostic and therapeutic ultrasound capabilities. An ultrasound probe is placed at the end of the endoscope to perform ultrasound diagnosis of tissues below the body membrane. Guided by the ultrasound images, a puncture needle can be extended through the instrument channel to perform biopsies of internal tissues to obtain information about deeper lesions.
[0003] Typically, endoscopic ultrasound systems need to integrate optical, acoustic, and instrument access functions within a limited space. The probe tip of an endoscopic ultrasound system can use a micro-convex array, and the overall size of the probe is relatively small. However, with prolonged use, it is prone to overheating, which can damage the core and pose a risk of burning the patient. Utility Model Content
[0004] In view of this, the purpose of this application is to provide an ultrasonic endoscope and its ultrasonic probe, the structural design of which can effectively solve the problem of excessive temperature rise of the ultrasonic probe after long-term use.
[0005] To achieve the above objectives, this application provides the following technical solution:
[0006] An ultrasound probe for an endoscopic ultrasound system includes:
[0007] Probe housing;
[0008] An ultrasonic transducer includes an acoustic lens disposed in the probe housing, an ultrasonic transducer layer disposed in the acoustic lens and stacked thereon, and a sound-absorbing backing.
[0009] The first heat-conducting component is located on the side of the sound-absorbing backing away from the ultrasonic transducer layer.
[0010] A heat-conducting component is disposed between the first heat-conducting component and the ultrasonic transducer layer;
[0011] The second heat-conducting component is disposed in the probe housing and is in contact with the first heat-conducting component.
[0012] Optionally, in the above-mentioned ultrasonic probe, the first thermally conductive component includes a supporting body and a contact portion disposed on the supporting body, the sound-absorbing backing is laid on the supporting body, the contact portion is provided with a first mounting through hole, and the second thermally conductive component passes through the first mounting through hole.
[0013] Optionally, in the ultrasonic probe described above, the outer diameter of the second heat-conducting component is smaller than the inner diameter of the first mounting through hole, and a first heat-conducting adhesive layer is provided between the two.
[0014] Optionally, in the above-mentioned ultrasonic probe, the probe housing is provided with housing mounting holes at opposite ends of the second heat-conducting component, at least one of the housing mounting holes is a through hole and an insulating layer is provided at the opening of the hole, so that the second heat-conducting component can be inserted into the probe housing through the through hole and both ends of the second heat-conducting component can be inserted into the corresponding housing mounting holes.
[0015] Optionally, in the ultrasonic probe described above, the outer diameters of both ends of the second heat-conducting component are smaller than the inner diameters of the corresponding housing mounting holes, and a second heat-conducting adhesive layer is provided between the two ends of the second heat-conducting component and the hole walls of the corresponding housing mounting holes.
[0016] Optionally, in the above-mentioned ultrasonic probe, the second heat-conducting component is rod-shaped and there are multiple second heat-conducting components, which are spaced apart from the first heat-conducting component.
[0017] Optionally, the ultrasound probe further includes a plate-shaped third heat-conducting component, which is attached to the inner wall of the probe housing and in contact with the second heat-conducting component.
[0018] Optionally, in the above-mentioned ultrasonic probe, the third heat-conducting component is provided with a second mounting through hole, and the second heat-conducting component passes through the second mounting through hole.
[0019] Optionally, in the above-mentioned ultrasonic probe, the thermal conductivity of the first thermally conductive component, the second thermally conductive component, the third thermally conductive component, and the probe housing is greater than or equal to 2W / (m*K).
[0020] Optionally, in the above-mentioned ultrasonic probe, a circuit board is provided between the ultrasonic transducer layer and the sound-absorbing backing, the sound-absorbing backing has a backing through-hole, the circuit board has a circuit board through-hole, and the thermal conductive component includes the hole wall extending from the ultrasonic transducer layer to the backing through-hole, the hole wall of the circuit board through-hole, and the grounding conductive layer of the first thermal conductive component.
[0021] The ultrasonic probe of the ultrasonic endoscope provided in this application includes a probe housing, an ultrasonic transducer, a first heat-conducting component, a second heat-conducting component, and a heat-conducting element. The ultrasonic transducer includes an acoustic lens disposed in the probe housing, and an ultrasonic transducer layer and a sound-absorbing backing layer disposed in and stacked on the acoustic lens. The first heat-conducting component is disposed on the side of the sound-absorbing backing layer away from the ultrasonic transducer layer. The heat-conducting element is disposed between the first heat-conducting component and the ultrasonic transducer layer. The second heat-conducting component is disposed in the probe housing and in contact with the first heat-conducting component.
[0022] The ultrasound probe of the ultrasound endoscope provided in this application allows the heat generated by the ultrasonic transducer layer during operation to be transferred to the first heat-conducting component via a thermally conductive element. Since the first heat-conducting component is in contact with the second heat-conducting component, the heat from the first heat-conducting component can be transferred to the second heat-conducting component. The second heat-conducting component is located in the probe housing, thereby transferring heat to the probe housing for heat dissipation. In summary, the ultrasound probe provided in this application, through the cooperation of the thermally conductive element, the first heat-conducting component, and the second heat-conducting component, achieves effective heat dissipation during operation, thus avoiding the risk of excessive probe temperature rise and effectively preventing core damage and patient burns.
[0023] To achieve the above objectives, this application also provides an ultrasonic endoscope, which includes any of the aforementioned ultrasonic probes. Since the aforementioned ultrasonic probes possess the aforementioned technical effects, the ultrasonic endoscope having the ultrasonic probe should also possess the corresponding technical effects. Attached Figure Description
[0024] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0025] Figure 1 This is a schematic diagram of the structure of an ultrasound endoscope according to one embodiment of this application;
[0026] Figure 2 This is a schematic diagram of the tip structure of an ultrasound endoscope according to an embodiment of this application;
[0027] Figure 3 This is a front view schematic diagram of an ultrasonic probe according to an embodiment of this application;
[0028] Figure 4 for Figure 3 Schematic diagram of AA section;
[0029] Figure 5 for Figure 3 A schematic diagram of the BB cross section.
[0030] Figure label:
[0031] 1-Operating part; 2-Insertion part; 3-Light guide part; 4-Ultrasonic connector; 21-Insertion tube; 22-Bending part; 23-Head end;
[0032] 10-Ultrasound probe; 20-Headpiece; 21-Instrument channel; 22-Illumination window; 23-Camera;
[0033] 11-Probe housing; 12-Ultrasonic transducer; 13-First heat-conducting component; 14-Heat-conducting component; 15-Second heat-conducting component; 16-Third heat-conducting component;
[0034] 111 - Housing mounting hole; 112 - Insulation layer;
[0035] 121-Acoustic lens; 122-Ultrasonic transducer layer; 123-Sound-absorbing backing; 124-Acoustic matching layer; 125-Circuit board; 126-Backing through-hole; 127-Circuit board through-hole; 128-Ultrasonic cable;
[0036] 131-Support body; 132-Contact part; 133-First mounting through hole;
[0037] 161 - Second mounting through hole. Detailed Implementation
[0038] This application discloses an ultrasonic endoscope and its ultrasonic probe to avoid excessive temperature rise of the ultrasonic probe after prolonged use.
[0039] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0040] The endoscopic ultrasound provided in this application includes, but is not limited to, endoscopic ultrasound bronchoscopy. To meet clinical needs, endoscopic ultrasound bronchoscopy is often quite thin, making the ultrasound probes provided in this application particularly suitable. Please refer to [link to application]. Figure 1An endoscopic ultrasound system typically includes an operating section 1, an insertion section 2, and a light guide section 3. The operating section 1 controls the bending of the flexible tube inserted into the body and provides functions such as suction, water delivery, air delivery, biopsy, and remote operation. It serves as the connecting mechanism between the insertion section 2 and the light guide section 3. The insertion section 2 is the part that enters the body and specifically includes a graduated insertion tube 21, a bending section 22 capable of swinging in different directions, and a rigid tip 23 that provides diagnostic feedback. The tip 23 integrates functions such as illumination, image transmission, ultrasound transducer, water bag delivery, and forceps instrument manipulation. The light guide section 3 is a component connected to the light source, providing light, suction, water delivery, and air delivery functions, and also transmits image signals. The tip 23 includes an ultrasound probe 10, which can be connected to the ultrasound host via wired or wireless means. For example, the ultrasound probe 10 is connected to the ultrasound host via an ultrasound connector 4. The ultrasound probe 10 sends and detects the scanning ultrasound beam to the subject, and displays the scanned information as an ultrasound image on an image display or the display screen of the ultrasound host, thereby enabling real-time observation of the subject.
[0041] Please see Figure 2 The tip of the endoscopic ultrasound includes a tip mount 20 and an ultrasound probe 10 disposed on the tip mount 20. The tip mount 20 has an instrument channel 21 for instruments such as sampling needles to pass through. The tip mount 20 may also have an illumination window 22 and a camera 23. For example, the camera 23 includes optical lenses and a CMOS (Complementary Metal Oxide Semiconductor) chip. The CMOS chip can convert light into electrical signals for further transmission to provide morphological information of locations such as the surface of the respiratory tract on the endoscope processor. The ultrasound probe 10 includes an ultrasound transducer 12, which can emit and receive ultrasound waves to form ultrasound images to provide information on deep lesions in locations such as the human respiratory tract.
[0042] This application provides an ultrasound probe that can effectively dissipate heat at the probe end, suppressing heat rise on the surface of the ultrasound transducer, preventing burns to the patient, and preventing overheating damage to the endoscope element during prolonged use. The following embodiments mainly describe the heat dissipation structure of the ultrasound probe.
[0043] In some embodiments, please refer to Figures 2-5The ultrasonic probe of the ultrasonic endoscope provided in this application includes a probe housing 11, an ultrasonic transducer 12, a first heat-conducting component 13, a heat-conducting component 14, and a second heat-conducting component 15. The probe housing 11 is the external structure of the ultrasonic probe and can be provided with a window for mounting the ultrasonic transducer 12. In this application, the probe housing 11 serves as a heat dissipation element, and it is understood that it is made of a material with good thermal conductivity, i.e., a material with high thermal conductivity, to achieve good heat dissipation. The ultrasonic transducer 12 includes an acoustic lens 121 disposed on the probe housing 11, and an ultrasonic transducer layer 122 and a sound-absorbing backing 123 disposed on and stacked on the acoustic lens 121. The acoustic lens 121 is used to focus the ultrasonic transducer 12 in the width direction, improving lateral resolution, and also serves as insulation and sealing. The ultrasonic transducer layer 122 is used to provide amplitude, converting electrical energy into mechanical energy. The sound-absorbing backing 123 is disposed on the back of the ultrasonic transducer layer 122 to prevent sound waves entering the backing from returning to the ultrasonic transducer layer 122. An acoustic matching layer 124 may be provided on the front side of the ultrasonic transducer layer 122 to provide ultrasonic transmission capability and protect the ultrasonic transducer 12.
[0044] The first thermally conductive component 13 is located on the side of the sound-absorbing backing 123 opposite to the ultrasonic transducer layer 122, i.e., the back side of the sound-absorbing backing 123, so as not to affect the normal function of the sound-absorbing backing 123. The first thermally conductive component 13 is made of a material with a higher thermal conductivity than the sound-absorbing backing 123, such as a metal or ceramic with good thermal conductivity. The second thermally conductive component 15 is located on the probe housing 11 and is in contact with the first thermally conductive component 13. The second thermally conductive component 15 is made of a material with a higher thermal conductivity than the sound-absorbing backing 123, such as a metal or ceramic with good thermal conductivity. It is in contact with the first thermally conductive component 13, so that the heat from the first thermally conductive component 13 can be transferred to the second thermally conductive component 15, and then to the probe housing 11 in contact with the second thermally conductive component 15. The heat conduction element 14 is disposed between the first heat conduction element 13 and the ultrasonic transducer layer 122. That is, the heat conduction element 14 is in contact with the first heat conduction element 13 and the ultrasonic transducer layer 122 respectively, so as to conduct the heat generated by the ultrasonic transducer layer 122 during operation to the first heat conduction element 13, and then dissipate heat through the probe housing 11 via the second heat conduction element 15.
[0045] The ultrasound probe of the endoscopic ultrasound system provided in this application, during operation, generates heat from the ultrasonic transducer layer 122, which is transferred to the first heat-conducting component 13 via the thermal conductive element 14. Since the first heat-conducting component is in contact with the second heat-conducting component 15, the heat from the first heat-conducting component 13 is transferred to the second heat-conducting component 15. The second heat-conducting component 15 is located in the probe housing 11, thereby transferring heat to the probe housing 11 for heat dissipation. In summary, the ultrasound probe provided in this application, through the cooperation of the thermal conductive element 14, the first heat-conducting component 13, and the second heat-conducting component 15, achieves effective heat dissipation during operation, thus avoiding the risk of excessive probe temperature rise and effectively preventing core damage and patient burns.
[0046] In some embodiments, the first thermally conductive component 13 includes a supporting body 131 and a contact portion 132 disposed on the supporting body 131. A sound-absorbing backing 123 is laid on the supporting body 131, and the contact portion 132 contacts the second thermally conductive component 15. It is understood that the supporting body 131 and the contact portion 132 can be either an integral structure or a separate structure connected by a conventional fixing method. The supporting body 131 provides support for the sound-absorbing backing 123, thereby providing good support for the multi-layered structure of the ultrasonic transducer 12, facilitating the encapsulation of the ultrasonic probe. The contact portion 132 is used to contact the second thermally conductive component 15. The cross-sectional area of the contact portion 132 can be smaller than the cross-sectional area of the supporting body 131. For example, the contact portion 132 is rod-shaped, with one end disposed on the supporting body 131. The contact portion 132 is smaller than the support body 131, so it can ensure the support function of the support body 131 on the sound-absorbing backing 123, while reducing the overall space occupied by the first heat-conducting component 13, making it easier for it to be laid out and installed in the probe housing 11.
[0047] Furthermore, the contact portion 132 is provided with a first mounting through hole 133, through which the second heat-conducting component 15 passes. By providing the first mounting through hole 133 on the contact portion 132, the second heat-conducting component 15 can be supported and positioned within the first mounting through hole 133, and at the same time, it can contact the second heat-conducting component 15 to transfer heat. The first heat-conducting component 13 adopts the above structure, which, in addition to achieving the heat dissipation function, also facilitates the encapsulation of the ultrasonic transducer 12 and the installation of the second heat-conducting component 15.
[0048] In some embodiments, the outer diameter of the second heat-conducting component 15 is smaller than the inner diameter of the first mounting through-hole 133, and a first thermally conductive adhesive layer is provided between them. By setting the inner diameter of the first mounting through-hole 133 to be larger than the outer diameter of the second heat-conducting component 15, the second heat-conducting component 15 is clearance-fitted with the first mounting through-hole 133, thereby allowing the second heat-conducting component 15 to be easily inserted into the first mounting through-hole 133. By providing the first thermally conductive adhesive layer in the gap between them, the second heat-conducting component 15 and the first heat-conducting component 13 can be fixedly connected, and efficient heat transfer between them can be achieved. For example, during assembly, the second heat-conducting component 15 is first inserted into the first mounting through-hole 133, and then a thermally conductive adhesive is filled into the gap between them. After the adhesive cures, the first thermally conductive adhesive layer is formed. In other embodiments, the second heat-conducting component 15 can also be transition-fitted or interference-fitted with the first mounting through-hole 133, which can also achieve effective contact heat transfer between them.
[0049] In some embodiments, the probe housing 11 has housing mounting holes 111 at opposite ends corresponding to the second heat-conducting component 15. At least one housing mounting hole 111 is a through hole with an insulating layer 112 at the opening. The second heat-conducting component 15 can be inserted into the probe housing 11 through the through hole 111, with both ends of the second heat-conducting component 15 inserted into the corresponding housing mounting holes 111. The probe housing 11 has housing mounting holes 111 at opposite ends corresponding to the second heat-conducting component 15, and at least one housing mounting hole 111 is a through hole to facilitate the insertion of the second heat-conducting component 15. To ensure reliable insulation of the probe housing 11, an insulating layer 112 is provided at the opening of the through hole to cover the opening. The housing mounting holes 111 facilitate the insertion of the second heat-conducting component 15 into the probe housing 11. During ultrasonic probe assembly, the ultrasonic transducer 12 and other components can be assembled into the ultrasonic housing first, and then the second heat-conducting component 15 can be inserted, making assembly convenient. For example, if the insulating layer 112 is formed of an insulating adhesive, it can provide both good insulation and sealing.
[0050] In one example, the probe housing 11 is provided with housing mounting holes 111 at opposite ends of the second heat-conducting component 15. The housing mounting hole 111 at the first end is a through hole, and the housing mounting hole 111 at the second end is a blind hole. The second heat-conducting component 15 can be inserted into the probe housing 11 through the housing mounting hole 111 at the first end. When one end of the second heat-conducting component 15 is inserted into the housing mounting hole 111 at the second end, the other end of the second heat-conducting component 15 is located in the housing mounting hole 111 at the first end, and an insulating layer 112 is provided at the opening of the hole.
[0051] In another example, the probe housing 11 has housing mounting holes 111 at opposite ends of the second heat-conducting component 15, and both housing mounting holes 111 at both ends are through holes. The second heat-conducting component 15 can be inserted into the probe housing 11 through the housing mounting hole 111 at one end until both ends of the second heat-conducting component 15 are inserted into the corresponding housing mounting holes 111. Insulating layers 112 are respectively provided at the openings of the two housing mounting holes 111. The middle part of the second heat-conducting component 15 contacts the first heat-conducting component 13, such as by passing through the first mounting through hole 133.
[0052] In some embodiments, the outer diameters of both ends of the second heat-conducting component 15 are smaller than the inner diameters of the corresponding housing mounting holes 111, and a second thermally conductive adhesive layer is provided between the two ends of the second heat-conducting component 15 and the hole walls of the corresponding housing mounting holes 111. By setting the hole diameter of the housing mounting holes 111 to be larger than the outer diameters of the two ends of the second heat-conducting component 15, the second heat-conducting component 15 and the housing mounting holes 111 are clearance-fitted, thereby allowing the second heat-conducting component 15 to be easily inserted into the housing mounting holes 111. By providing a second thermally conductive adhesive layer in the gap between the two, the second heat-conducting component 15 and the probe housing 11 can be fixedly connected, and efficient heat transfer between the two can be achieved. For example, during assembly, the second heat-conducting component 15 is first inserted into the housing mounting holes 111, and then a thermally conductive adhesive is filled into the gap between the two. After the adhesive cures, the above-mentioned second thermally conductive adhesive layer is formed. In other embodiments, the second heat-conducting component 15 can also be transition-fitted or interference-fitted with the housing mounting holes 111, which can also achieve effective contact heat transfer between the two.
[0053] In some embodiments, multiple second heat-conducting components 15 are provided. By providing multiple second heat-conducting components 15, the heat from the first heat-conducting component 13 can be transferred to the probe housing 11 respectively, thereby improving heat dissipation efficiency. Specifically, the second heat-conducting components 15 are rod-shaped for easy installation. Further, multiple second heat-conducting components 15 are spaced apart from the first heat-conducting component 13. The spaced arrangement of the second heat-conducting components 15 facilitates assembly with the first heat-conducting component 13. When the first heat-conducting component 13 has a first mounting through hole 133 for the second heat-conducting component 15 to pass through, the first mounting through hole 133 can be distributed at corresponding intervals, thereby reducing the impact of the first mounting through hole 133 on the structural strength of the first heat-conducting component 13 and helping to ensure the supporting effect of the first heat-conducting component 13 on the ultrasonic transducer layer 122. When the probe housing 11 is provided with housing mounting holes 111 corresponding to the second heat-conducting component 15, the number of housing mounting holes 111 is set according to the number of the second heat-conducting components 15. For example, two housing mounting holes 111 are provided for each second heat-conducting component 15 to cooperate with the two ends of the second heat-conducting component 15 respectively.
[0054] In other embodiments, the number of second heat-conducting components 15 may also be set to one as needed. The shape of the second heat-conducting component 15 may also be block-shaped or other shapes.
[0055] In some embodiments, the ultrasonic probe of the ultrasonic endoscope further includes a plate-shaped third heat-conducting component 16, which is attached to the inner wall of the probe housing 11 and in contact with the second heat-conducting component 15. By providing the third heat-conducting component 16, the heat generated by the ultrasonic transducer layer 122 during operation can be transferred via the thermal conductive element 14 to the first heat-conducting component 13, then from the first heat-conducting component 13 to the second heat-conducting component 15, then from the second heat-conducting component 15 to the third heat-conducting component 16, and finally to the probe housing 11 for heat dissipation. The plate-shaped third heat-conducting component 16 increases the contact area with the probe housing 11, thereby improving heat dissipation efficiency.
[0056] In some embodiments, the third heat-conducting component 16 is provided with a second mounting through hole 161, and the second heat-conducting component 15 passes through the second mounting through hole 161. By providing the second mounting through hole 161 on the third heat-conducting component 16, on the one hand, the third heat-conducting component 16 passing through the second mounting through hole 161 can play a supporting and positioning role for the third heat-conducting component 16, and on the other hand, it can contact the third heat-conducting component 16 to transfer heat. With the above structure, the third heat-conducting component 16 not only achieves the heat dissipation function, but also facilitates the encapsulation of the ultrasonic transducer 12 and the installation of the second heat-conducting component 15.
[0057] In some embodiments, the outer diameter of the second heat-conducting component 15 is smaller than the inner diameter of the second mounting through-hole 161, and a third thermally conductive adhesive layer is provided between them. By setting the inner diameter of the second mounting through-hole 161 to be larger than the outer diameter of the second heat-conducting component 15, the second heat-conducting component 15 is clearance-fitted with the first mounting through-hole 133, thereby allowing the second heat-conducting component 15 to be easily inserted into the second mounting through-hole 161. By providing a third thermally conductive adhesive layer in the gap between them, the second heat-conducting component 15 and the third heat-conducting component 161 can be fixedly connected, and efficient heat transfer between them can be achieved. For example, during assembly, the second heat-conducting component 15 is first inserted into the second mounting through-hole 161, and then a thermally conductive adhesive is filled into the gap between them. After the adhesive cures, the aforementioned third thermally conductive adhesive layer is formed. In other embodiments, the second heat-conducting component 15 can also be transition-fitted or interference-fitted with the second mounting through-hole 161, which can also achieve effective contact heat transfer between them.
[0058] For example, two third heat-conducting components 16 are provided and positioned opposite each other on both sides of the probe housing 11. The two ends of the second heat-conducting component 15 pass through the second mounting holes 161 of the corresponding third heat-conducting components 16. This arrangement allows heat from the second heat-conducting component 15 to be transferred from both ends to the two third heat-conducting components 16, and then from the third heat-conducting components 16 to the probe housing 11. This arrangement further improves heat dissipation efficiency.
[0059] In some embodiments, the thermal conductivity of the first heat-conducting component 13 is greater than or equal to 2 W / (m*K) to improve heat dissipation efficiency. For example, the first heat-conducting component 13 is made of metal. The thermal conductivity of the second heat-conducting component 15 is greater than or equal to 2 W / (m*K) to improve heat dissipation efficiency. For example, the second heat-conducting component 15 is made of metal. The thermal conductivity of the third heat-conducting component 16 is greater than or equal to 2 W / (m*K) to improve heat dissipation efficiency. For example, the third heat-conducting component 16 is made of metal. The thermal conductivity of the ultrasonic shell is greater than or equal to 2 W / (m*K) to improve heat dissipation efficiency. For example, the first heat-conducting component 13 is made of metal.
[0060] In some embodiments, a circuit board 125 is disposed between the ultrasonic transducer layer 122 and the sound-absorbing backing 123. The circuit board 125 acts as a connector, connecting the ultrasonic transducer to other devices to ensure the transmission of current and signals. By placing the circuit board 125 between the ultrasonic transducer layer 122 and the sound-absorbing backing 123, the ultrasonic transducer layer 122 can be directly connected to the circuit board 125 without the need for wire connections, thus simplifying the structure and making the overall layout more compact. In other embodiments, the circuit board 125 can also be disposed on one side of the ultrasonic transducer layer 122. Exemplarily, the circuit board 125 is a flexible circuit board to facilitate its placement within the ultrasonic housing. The circuit board 125 can transmit ultrasonic signals via an ultrasonic cable 128.
[0061] In some embodiments, the sound-absorbing backing 123 has a backing through-hole 126, and the circuit board 125 has a circuit board through-hole 127. The heat-conducting component 14 passes through the backing through-hole 126 and the circuit board through-hole 127 and extends to the first heat-conducting component 13. By providing the backing through-hole 126 and the circuit board through-hole 127, the heat-conducting component 14 is avoided. The heat-conducting component 14 passes through them, which can transfer the heat of the ultrasonic transducer layer 122 to the first heat-conducting component 13. At the same time, the structure is compact and easy to assemble.
[0062] In some embodiments, the thermal conductive element 14 includes the wall of the ultrasonic transducer layer 122 extending to the backing through-hole 126, the wall of the circuit board through-hole 127, and the grounded conductive layer of the first thermally conductive component 13. The thermal conductive element 14 employs a grounded conductive layer, which can effectively transfer heat while also serving as a grounding conductor, thereby achieving an electrostatic shielding effect.
[0063] Based on the ultrasound probes provided in the above embodiments, this application also provides an ultrasound endoscope, which includes any one of the ultrasound probes in the above embodiments. Since this ultrasound endoscope uses the ultrasound probes in the above embodiments, the beneficial effects of this ultrasound endoscope are explained in the above embodiments.
[0064] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.
[0065] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. An ultrasonic probe for an endoscopic ultrasound, characterized by, include: Probe housing (11); The ultrasonic transducer (12) includes an acoustic lens (121) disposed in the probe housing (11), an ultrasonic transducer layer (122) disposed in the acoustic lens (121) and stacked thereon, and a sound-absorbing backing (123). The first heat-conducting component (13) is disposed on the side of the sound-absorbing backing (123) away from the ultrasonic transducer layer (122); A heat-conducting component (14) is disposed between the first heat-conducting component (13) and the ultrasonic transducer layer (122); The second heat-conducting component (15) is disposed on the probe housing (11) and is in contact with the first heat-conducting component (13).
2. The ultrasonic endoscope probe according to claim 1, characterized by The first heat-conducting component (13) includes a support body (131) and a contact portion (132) disposed on the support body (131). The sound-absorbing backing (123) is laid on the support body (131). The contact portion (132) is provided with a first mounting through hole (133). The second heat-conducting component (15) passes through the first mounting through hole (133).
3. The ultrasonic endoscope probe according to claim 2, characterized by The outer diameter of the second heat-conducting component (15) is smaller than the inner diameter of the first mounting through hole (133), and a first heat-conducting adhesive layer is provided between the two.
4. The ultrasonic endoscope probe according to claim 1, characterized by The probe housing (11) is provided with housing mounting holes (111) at opposite ends of the second heat-conducting component (15). At least one end of the housing mounting hole (111) is a through hole and an insulating layer (112) is provided at the opening. The two ends of the second heat-conducting component (15) are respectively inserted into the corresponding housing mounting holes (111).
5. The ultrasonic endoscope probe according to claim 4, wherein The outer diameter of the two ends of the second heat-conducting component (15) is smaller than the inner diameter of the corresponding housing mounting hole (111), and a second heat-conducting adhesive layer is provided between the two ends of the second heat-conducting component (15) and the hole wall of the corresponding housing mounting hole.
6. The ultrasonic endoscope probe according to claim 1, wherein The second heat-conducting component (15) is rod-shaped and has multiple components, with multiple second heat-conducting components (15) spaced apart from the first heat-conducting component (13).
7. The ultrasound probe of an endoscopic ultrasound according to any one of claims 1 to 6, wherein It also includes a plate-shaped third heat-conducting component (16), which is attached to the inner wall of the probe housing (11) and in contact with the second heat-conducting component (15).
8. The ultrasonic endoscope probe according to claim 7, characterized by The third heat-conducting component (16) is provided with a second mounting through hole (161), and the second heat-conducting component (15) passes through the second mounting through hole (161).
9. The ultrasonic endoscope probe according to claim 7, wherein The thermal conductivity of the first thermally conductive component (13), the second thermally conductive component (15), the third thermally conductive component (16) and the probe housing (11) is greater than or equal to 2W / (m*K).
10. The ultrasonic endoscope probe according to any one of claims 1 to 6, characterized by A circuit board (125) is provided between the ultrasonic transducer layer (122) and the sound-absorbing backing (123). The sound-absorbing backing (123) is provided with a backing through hole (126), and the circuit board (125) is provided with a circuit board through hole (127). The thermal conductive component (14) includes the hole wall extending from the ultrasonic transducer layer (122) to the backing through hole (126), the hole wall of the circuit board through hole (127), and the grounding conductive layer of the first thermal conductive component (13).
11. An ultrasonic endoscope characterized by comprising: An ultrasonic probe comprising the ultrasonic probe according to any one of claims 1 to 10.