Tray sorting device

Abstract

The utility model provides a tray sorting device, including bottom plate, tray assembly, heat abstractor and a plurality of support clamping pieces. The bottom plate includes opposite front and bottom. The tray assembly is equipped with a plurality of clamping grooves. The tray assembly is used for carrying IC, and is positioned through the one end of a plurality of support clamping pieces and clamping groove, and the other end of support clamping piece is installed on the front of bottom plate, so that the tray assembly is installed on the bottom plate. The bottom plate is provided with a through hole, and the heat abstractor is located at the through hole and faces the tray assembly. The heat abstractor is installed on the bottom of bottom plate and is used for generating airflow to the bottom of tray assembly, and the tray assembly and IC in tray assembly are cooled.

Description

Technical Field

[0001] This utility model relates to the field of sorting machine technology, and in particular to a material tray sorting device. Background Technology

[0002] After the IC high-temperature test is completed, it still retains a high residual temperature. If placed in the tray at this time, this high residual temperature can easily cause the tray to deform or even melt after a certain period of time. In addition, when the tray is full, it needs to be manually removed by the operator, and the tray with high residual temperature at this time poses a certain safety hazard to the operator. Utility Model Content

[0003] In view of this, it is necessary to propose a tray sorting device that can rapidly cool down the trays and high-temperature ICs.

[0004] This utility model embodiment provides a material tray sorting device, the material tray sorting device includes:

[0005] The base plate includes the opposite front and bottom surfaces;

[0006] The tray assembly, mounted on the front, is used to carry the IC;

[0007] A heat dissipation device, mounted on the base plate, is used to generate airflow toward the bottom of the tray assembly.

[0008] Furthermore, the base plate is provided with through holes, and the heat dissipation device is located at the corresponding through holes and faces the tray assembly.

[0009] Furthermore, the heat dissipation device is an exhaust fan.

[0010] Furthermore, the exhaust fan is started before the IC is placed into the tray assembly.

[0011] Furthermore, the start and stop times of the exhaust fan are set according to the test temperature of the IC to be placed.

[0012] Furthermore, the material tray assembly is also provided with several slots; the material tray sorting device also includes several supporting clamps, one end of which is installed on the base plate and the other end is engaged with the slots for positioning.

[0013] Furthermore, the tray assembly includes a tray and a base plate, with a slot disposed on the base plate, and the base plate is fixed to the base plate by the cooperation of the slot and a support clamp.

[0014] Furthermore, there is a certain gap between the substrate and the base plate.

[0015] Furthermore, the substrate has multiple openings arranged side by side, and the tray includes multiple integrally formed sub-trays, the bottom of each sub-tray being positioned opposite the substrate through an opening.

[0016] Furthermore, the base plate is a rectangular plate, and one side of the substrate support tray is flat.

[0017] In the aforementioned tray sorting device, the heat dissipation device is activated before the IC is placed into the tray assembly. The generated airflow flows through the through-holes in the base plate corresponding to the heat dissipation device to the bottom of the tray assembly, thereby cooling the tray assembly and the ICs within it. This significantly cools the trays and ICs in the tray assembly, preventing high residual heat from causing high-temperature deformation of the trays and reducing the safety hazards to operators posed by hot trays. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0019] Figure 1 An exploded perspective view of the material tray sorting device provided in an embodiment of the utility model.

[0020] Figure 2 A schematic diagram of a material tray sorting device provided in an embodiment of the utility model.

[0021] Figure 3 A schematic diagram of the bottom surface of the material tray sorting device provided in the embodiment of the utility model.

[0022] Figure 4 A schematic diagram of the material tray assembly and support clamp provided in the embodiment of the utility model.

[0023] Component designations

[0024] Material tray sorting device - 100 Notch - 2221

[0025] Base plate-1 Opening-2223

[0026] Front of base plate -11 First support unit -222a

[0027] Bottom surface of base plate -12 Second support unit -222b

[0028] Through Hole-13 Third Support Unit-222c

[0029] Material tray assembly-2 Heat dissipation device-3

[0030] Material tray-21, support clamping parts-4

[0031] Sub-material tray-210 Installation part-41

[0032] Substrate-22 Card Section-42

[0033] Card slot-220 Connector-43

[0034] Support unit-222 gap-50

[0035] Support bar - 2220

[0036] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0037] In the description of this utility model, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0038] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0039] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0040] To provide a clearer and more accurate understanding of the present invention, a detailed description will now be provided in conjunction with the accompanying drawings. The accompanying drawings illustrate examples of embodiments of the present invention, wherein the same reference numerals denote the same elements. It is to be understood that the scale shown in the accompanying drawings is not the actual scale of the present invention, and is for illustrative purposes only, and is not a drawing based on the original dimensions.

[0041] Please refer to Figure 1-3This utility model provides a tray sorting device 10, which includes a base plate 1, a tray assembly 2, a heat dissipation device 3, and several supporting clamps 4. The tray assembly 2 and the heat dissipation device 3 are both mounted on the base plate 1. The tray assembly 1 is mounted on the base plate 1 via the supporting clamps 4 and is used to support ICs that have undergone high-temperature testing. The heat dissipation device 3 generates airflow through the bottom of the tray assembly 1 to cool down the tray assembly 1 and the ICs in the tray assembly 2.

[0042] In this embodiment, the base plate 1 is a rectangular plate-shaped object, including a front surface 11 and a bottom surface 12 facing away from each other. The base plate 1 is also provided with a through hole 13 penetrating the front surface 11 and the bottom surface 12.

[0043] Please refer to Figure 1 and Figure 4 In this embodiment, the tray assembly 2 further includes a tray 21 and a substrate 22. The substrate 22 is disposed facing the front side 11. Several slots 220 are provided at intervals along the edge of the substrate 22, and a plurality of continuous support units 222 are provided in the middle position of the substrate 22. Each support unit 222 includes a support strip 2220 and notches 2221 located on both sides of the support strip 2220. Among them, each of the two support units 222 located on both sides of the substrate 22 has a notch 2221 opening from the corresponding sides, while the other support units 222 form an opening 2223 for every two adjacent notches 2221. The tray 21 includes a plurality of integrally formed sub-trays 210. Each sub-tray 210 is respectively connected to a support unit 22, wherein the support strip 2220 is used to support the middle position of the corresponding sub-tray 210, and the two notches 2221 are used to expose the two sides of each sub-tray 210 to directly face the base plate 1. In this embodiment, the support unit 222 includes three support units: a first support unit 222a, a second support unit 222b, and a third support unit 222c. Specifically, the first support unit 222a and the third support unit 222c are located on opposite sides of the substrate 22. A notch 2221a in the first support unit 222a and a notch 2221b in the third support unit 222c are respectively opened from the opposite edges of the substrate 22. The other notch 2221b in the first support unit 222a connects with a notch 2221a in the second support unit 222b to form an opening 2223a. The other notch 2221b in the second support unit 222b connects with another notch 2221a in the third support unit 222c to form an opening 2223b.

[0044] Please refer to it again. Figure 1 and Figure 4Several supporting clamping members 4 have one end engaged with the slot 220 for positioning, while the other end of the supporting clamping members 4 is mounted on the front side 11 of the base plate 1, so that the tray assembly 2 is mounted on the base plate 1. The supporting clamping member 4 includes a mounting part 41, a locking part 42, and a connecting part 43 connecting the mounting part 41 and the locking part 42. The mounting part 41 is fixed to the base plate 1, and the locking part 42 is engaged with the slot 220, so that the substrate 22 is mounted on the base plate 1 through the supporting clamping member 4, and there is a certain gap 50 between the substrate 22 and the base plate 1.

[0045] In this embodiment, the heat dissipation device 3 is an exhaust fan, installed on the bottom surface 12 of the base plate 1 and directly facing the tray assembly 1 through the through hole 13, so that the airflow generated by the exhaust fan flows directly to the bottom of the tray assembly 1 or the bottom of the tray 21. The heat dissipation device 3 can accelerate the flow of gas through the gap 50, thereby accelerating the cooling of the tray 21 and the ICs in the tray 21. In this embodiment, the heat dissipation device 3 is activated before the ICs that have been tested and sorted are placed into the tray assembly 2. The generated airflow flows through the through hole provided on the base plate 1 corresponding to the heat dissipation device 3 to the bottom of the tray assembly 2, thereby cooling the tray assembly 2 and the ICs in the tray assembly 2. In addition, the start and stop time of the exhaust fan is set according to the test temperature of the IC to be placed. For example, if the IC test temperature is high, the start and stop time of the exhaust fan is extended; conversely, the start and stop time of the exhaust fan is shortened.

[0046] Furthermore, once the IC has completed the high-temperature test, it is transported by a robotic arm (not shown) to the corresponding tray 21.

[0047] The tray sorting device in this embodiment can significantly cool down the tray and IC of the tray assembly, avoid high temperature deformation of the tray caused by high residual temperature, and reduce the safety hazards to the operator caused by the tray with high residual temperature.

[0048] Obviously, those skilled in the art can make various modifications and variations to this utility model without departing from the spirit and scope of this application. Therefore, if these modifications and variations of this utility model fall within the scope of the claims of this utility model and their equivalents, this utility model is also intended to include these modifications and variations.

[0049] The above-listed embodiments are merely preferred embodiments of the present utility model and should not be construed as limiting the scope of the present utility model. Therefore, any equivalent variations made in accordance with the claims of the present utility model shall still fall within the scope of the present utility model.

Claims

1. A tray sorting device for holding ICs after high-temperature testing, characterized in that, The tray sorting device includes: The base plate includes the opposite front and bottom surfaces; A tray assembly, mounted on the front side, is used to carry the IC; A heat dissipation device, installed on the base plate, is used to generate airflow toward the bottom of the tray assembly.

2. The material tray sorting device as described in claim 1, characterized in that, The base plate is provided with through holes, and the heat dissipation device is located at the corresponding through holes and faces the tray assembly.

3. The material tray sorting device as described in claim 2, characterized in that, The heat dissipation device is an exhaust fan.

4. The material tray sorting device as described in claim 3, characterized in that, The exhaust fan is started before the IC is placed into the tray assembly.

5. The material tray sorting device as described in claim 4, characterized in that, The start and stop times of the exhaust fan are set according to the test temperature of the IC to be placed.

6. The material tray sorting device as described in claim 1, characterized in that, The material tray assembly is also provided with several slots; the material tray sorting device also includes several supporting clamps, one end of which is installed on the base plate and the other end is engaged with the slots for positioning.

7. The material tray sorting device as described in claim 6, characterized in that, The tray assembly includes a tray and a base plate. The slot is disposed on the base plate, and the base plate is fixed to the bottom plate by the cooperation of the slot and the support clamp.

8. The material tray sorting device as described in claim 7, characterized in that, There is a certain gap between the substrate and the base plate.

9. The material tray sorting device as described in claim 7, characterized in that, The substrate has multiple openings arranged side by side, and the tray includes multiple integrally formed sub-trays, with the bottom of each sub-tray positioned opposite the substrate through the openings.

10. The tray sorting device as described in claim 7, characterized in that, The base plate is a rectangular plate, and the side of the base plate that supports the tray is flat.

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